A graphics card cooling module capable of increasing air intake

Abstract

The embodiment of the present disclosure provides a graphics card heat dissipation module capable of improving air inlet volume, comprising: a radiator main body configured to contact a graphics card chip and conduct heat; an air inlet guide plate configured at a front portion of the radiator main body and configured to guide air flow into the radiator main body; a base fixing support connected to a bottom portion of the radiator main body and configured to fix the radiator main body on a graphics card body, wherein the base fixing support comprises a groove structure, the groove structure is located at a middle portion of the base fixing support; a protruding reinforcing rib is arranged on both sides of the groove structure; and an inclined air guide surface is arranged on a side wall of the groove structure and configured to guide air flow below the base fixing support. Through the scheme of the embodiment of the present disclosure, the obstruction of the radiator bottom fixing support to the air inlet flow can be reduced.

Description

Technical Field

[0001] This application relates to the field of electronic heat dissipation technology, specifically to a graphics card heat dissipation module that improves airflow. Background Technology

[0002] Graphics card cooling modules that improve airflow aim to increase the airflow into the cooling system by optimizing fan layout, increasing air intake area, or using high-efficiency, low-noise fans, thereby enhancing the cooling effect and ensuring that the graphics card maintains a low operating temperature under high load. However, there is a problem in practical applications: the mounting bracket at the bottom of the heatsink may partially block the airflow, affecting the air intake efficiency and limiting the cooling effect. Summary of the Invention

[0003] In view of this, the present disclosure provides a graphics card cooling module that increases airflow, at least partially solving the problems existing in the prior art.

[0004] This application discloses a graphics card cooling module for improving airflow, comprising: a heatsink body for contacting the graphics card chip and dissipating heat; an air inlet guide plate disposed at the front of the heatsink body for guiding airflow into the heatsink body; a base fixing bracket connected to the bottom of the heatsink body for fixing the heatsink body to the graphics card body, wherein the base fixing bracket includes a groove structure located in the middle of the base fixing bracket; raised reinforcing ribs disposed on both sides of the groove structure; and an inclined air guide surface disposed on the side wall of the groove structure for guiding airflow through the area below the base fixing bracket.

[0005] According to one embodiment, the groove structure is located at the front of the base fixing bracket and forms an airflow channel with the air inlet guide plate.

[0006] According to one embodiment, the groove structure is a through structure, with its opening facing the air inlet guide plate.

[0007] According to one embodiment, the bottom of the groove structure is provided with reinforcing ribs.

[0008] According to one embodiment, the raised reinforcing ribs have a wave-shaped structure and are arranged along the width direction of the base fixing bracket.

[0009] According to one embodiment, the raised reinforcing ribs are disposed on both sides of the base fixing bracket.

[0010] According to one embodiment, the inclined air guide surface is an inclined structure, and the inclination angle of the inclined structure is 15° to 45°.

[0011] According to one embodiment, the surface of the air inlet guide plate is provided with a spiral guide groove to guide the airflow through evenly.

[0012] According to one embodiment, the base fixing bracket is connected to the radiator body by a snap-fit ​​connection.

[0013] According to one embodiment, an elastic pad is provided between the base fixing bracket and the graphics card body.

[0014] This disclosure provides a graphics card cooling module for improving airflow, comprising: a heatsink body for contacting the graphics card chip and dissipating heat; an air inlet guide plate disposed at the front of the heatsink body for guiding airflow into the heatsink body; a base mounting bracket connected to the bottom of the heatsink body for fixing the heatsink body to the graphics card body, wherein the base mounting bracket includes a groove structure located in the middle of the base mounting bracket; raised reinforcing ribs disposed on both sides of the groove structure; and an inclined air guide surface disposed on the side wall of the groove structure for guiding airflow through the area below the base mounting bracket. The solution of this disclosure addresses how to reduce the obstruction of airflow by the bottom mounting bracket of the heatsink. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the exemplary embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a front view of the overall structure of this utility model;

[0017] Figure 2 This is a bottom view of the structure of this utility model;

[0018] Figure 3 This utility model Figure 2 Enlarged view of point A in the middle;

[0019] Figure 4 This is an exploded view of the present invention.

[0020] In the diagram: 1. Radiator body; 2. Air inlet guide plate; 3. Base mounting bracket; 31. Groove structure; 32. Raised reinforcing rib; 33. Inclined air guide surface; 4. Reinforcing rib; 5. Spiral air guide groove; 6. Clip; 7. Elastic gasket Detailed Implementation

[0021] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0022] The following specific examples illustrate the implementation of this disclosure. Those skilled in the art can easily understand other advantages and effects of this disclosure from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. This disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this disclosure. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0023] like Figure 1 and Figure 2 As shown, a graphics card cooling module for improving airflow according to this application includes a heatsink body 1, which is used to contact the graphics card chip and dissipate heat; an air inlet guide plate 2, which is disposed at the front of the heatsink body 1, for guiding airflow into the heatsink body 1; a base fixing bracket 3, which is connected to the bottom of the heatsink body 1, for fixing the heatsink body 1 to the graphics card body, wherein the base fixing bracket 3 includes a groove structure 31, which is located in the middle of the base fixing bracket 3 to reduce obstruction of airflow; raised reinforcing ribs 32, which are disposed on both sides of the groove structure 31, for enhancing the structural strength of the base fixing bracket 3; and an inclined air guide surface 33, which is disposed on the side wall of the groove structure 31, for guiding airflow smoothly through the area below the base fixing bracket 3.

[0024] The heatsink body 1, as the core component of the entire heat dissipation module, is typically made of a high thermal conductivity material and is directly attached to the surface of the GPU chip on the graphics card. It rapidly conducts the heat generated by the chip to the heatsink fins or heat pipes, and then dissipates the heat through convection or radiation. This body is usually elongated or stepped to better cover the chip's heat dissipation area and ensure good heat distribution and cooling efficiency.

[0025] The air inlet guide plate 2 is located at the front end of the radiator body 1, which optimizes the direction of airflow. By reasonably designing the tilt angle and shape of the guide plate, it can effectively guide the external cooling airflow smoothly into the radiator body 1, avoiding turbulence or eddies in the airflow during the entry process, thereby improving airflow efficiency and heat dissipation performance.

[0026] The base mounting bracket 3 is connected to the bottom of the heatsink body 1 and is mainly used to securely fix it to the graphics card body. The base mounting bracket 3 is manufactured by one-piece molding or separate welding, which can provide good mechanical support and prevent the heatsink from shifting or loosening due to vibration or external force, thus ensuring the stability of the entire cooling system.

[0027] The groove structure 31 is located in the middle of the base fixing bracket 3. Its shape can be V-shaped, U-shaped or similar structure. It is used to effectively reduce the obstruction of the airflow from below the heat sink by the fixing bracket without reducing the structural strength, thereby ensuring that more air can pass through smoothly and improving the air intake of the whole system.

[0028] The raised reinforcing ribs 32 are located on both sides of the groove structure 31. Their main function is to reduce airflow resistance while enhancing the overall structural strength of the base fixing bracket 3, preventing deformation or breakage during long-term operation or external impact, and ensuring the long-term reliable operation of the heat dissipation system.

[0029] An inclined air guide surface 33 is provided on the side wall of the groove structure 31. This surface is specially designed to guide and direct airflow, so that the airflow remains stable when passing through the groove structure 31, reducing turbulence and pressure drop, thereby further improving air intake efficiency and improving the airflow circulation effect inside the entire radiator.

[0030] like Figure 1 and Figure 2 As shown, in one embodiment, the groove structure 31 of the graphics card cooling module for improving airflow is located at the front of the base mounting bracket 3 and forms an airflow channel with the air inlet guide plate 2. The air inlet guide plate 2 is disposed at the front of the heatsink body 1, and it cooperates with the groove structure 31 of the base mounting bracket 3, allowing airflow to enter the interior of the heatsink body 1 along a set path. The groove structure 31 at the front of the base mounting bracket 3 avoids direct obstruction of airflow, which helps to improve airflow efficiency. At the same time, the design of the groove structure 31 allows airflow to flow smoothly to the bottom area of ​​the heatsink body 1, enhancing the overall heat dissipation capacity.

[0031] For example, the groove structure 31 provided at the front of the base fixing bracket 3 forms a continuous airflow guiding channel through the space between it and the air inlet guide plate 2. The air inlet guide plate 2 extends to the front of the base fixing bracket 3 and connects with the groove structure 31, allowing airflow to pass smoothly between the two without causing eddies or increased airflow resistance due to structural abrupt changes.

[0032] like Figure 4As shown, in one embodiment, the groove structure 31 of the graphics card cooling module for improving airflow is located in the middle of the base mounting bracket 3, extending through the entire base mounting bracket 3, with its opening facing the air inlet guide plate 2. This arrangement helps to form a smoother flow channel when airflow enters the heatsink body 1, avoiding local airflow blockage or turbulence caused by the direct obstruction of airflow by the base mounting bracket 3. The design of the groove structure 31 not only improves airflow efficiency but also enhances the airflow synergy between the guide plate and the base mounting bracket 3 through a reasonable opening direction, thereby improving the overall heat dissipation performance.

[0033] Specifically, the groove structure 31 is a through-type design, extending along the length of the base fixing bracket 3 and forming an opening on the top surface of the base fixing bracket 3. This opening corresponds to the position of the air inlet guide plate 2, allowing airflow to flow along the inside of the groove structure 31 and reducing flow resistance. The side wall of the groove structure 31 is provided with an inclined air guide surface 33 to guide the airflow from the inside of the groove structure 31 to turn upwards into the radiator body 1, thereby optimizing the airflow path and improving heat dissipation efficiency.

[0034] like Figure 4 As shown, in one embodiment, the groove structure 31 of the graphics card cooling module for improving airflow is located in the middle of the base mounting bracket 3. This structure is formed by stamping to ensure its precise and stable geometry. The groove structure 31 is designed to reduce airflow resistance under the base mounting bracket 3, thereby optimizing overall airflow efficiency. A reinforcing rib 4 is provided at the bottom of the structure to improve overall structural strength and prevent deformation due to external impact or prolonged use.

[0035] Specifically, the groove structure 31 is integrally formed on the base fixing bracket 3 by stamping. The reinforcing ribs 4 are evenly distributed along the bottom of the groove and form an integral connection with the base fixing bracket 3, thereby enhancing its load-bearing capacity and resistance to deformation, while not affecting the smooth passage of airflow.

[0036] like Figure 2 As shown, in one embodiment, the raised reinforcing ribs 32 of the graphics card cooling module for improving airflow are of a wave-shaped structure and are arranged along the width direction of the base fixing bracket 3. This structure is disposed on both sides of the groove structure 31 to improve the overall rigidity of the base fixing bracket 3. The wave-shaped design, while ensuring structural strength, can effectively reduce the resistance when airflow passes through, thereby improving heat dissipation efficiency. Its arrangement allows the airflow to be guided more evenly when passing under the base fixing bracket 3, which helps to achieve more efficient heat dissipation performance.

[0037] Specifically, the raised reinforcing ribs 32 are fixed to both sides of the base mounting bracket 3 by welding or stamping, and their wavy cross-section extends along the width of the base mounting bracket 3. The undulating structure with the wavy shape is integrated with the base mounting bracket 3, ensuring a stable connection and providing additional structural support. This arrangement ensures that the reinforcing ribs do not obstruct airflow while possessing good mechanical strength, thus meeting the stability requirements of the graphics card cooling module under high load.

[0038] like Figure 4 As shown, in one embodiment, the raised reinforcing ribs 32 of the graphics card cooling module for improving airflow are disposed on both sides of the base fixing bracket 3 to enhance its bending strength. This structural design ensures the overall rigidity of the base fixing bracket 3 while preventing deformation due to external forces, thereby ensuring a stable connection between the heatsink body 1 and the graphics card body. The base fixing bracket 3 guides airflow through the groove structure 31, and the raised reinforcing ribs 32 added to both sides of the groove structure 31 further stabilize the structure. The raised reinforcing ribs 32 are integrally formed with the base fixing bracket 3 or connected by welding or other methods, further improving structural reliability.

[0039] Specifically, the raised reinforcing ribs 32 are located at the two side edges of the base fixing bracket 3, extending along the longitudinal direction of the base fixing bracket 3 to form a certain height difference. By fixing the raised reinforcing ribs 32 to the sides of the base fixing bracket 3, not only can the overall load-bearing capacity be enhanced, but the mechanical properties of the component can also be improved without affecting airflow. For example, during the manufacturing process, the raised reinforcing ribs 32 and the base fixing bracket 3 can be formed together through stamping or casting processes, thereby ensuring the integrity of the structure and the stability of the connection.

[0040] like Figure 2 As shown, in one embodiment, the inclined air guide surface 33 of a graphics card cooling module for improving airflow is disposed on the side wall of the groove structure 31 in the middle of the base fixing bracket 3. It adopts an inclined surface design to optimize the airflow channel. The angle of this inclined surface ranges from 15° to 45°, allowing the airflow to pass smoothly through the groove area, thereby effectively reducing airflow disturbance below the base fixing bracket 3. The inclined air guide surface 33 avoids airflow separation and vortices caused by traditional right-angle structures, helping to improve overall airflow efficiency.

[0041] Specifically, the inclined air guide surface 33 is connected to the side wall of the groove structure 31 by integral molding, and its inclined surface extends towards the air inlet, forming an airflow guiding path with the air inlet guide plate 2. Specifically, the inclined air guide surface 33 is made of aluminum alloy material and is integrated with the structure of the base fixing bracket 3 to ensure that the airflow flows stably along the inclined surface.

[0042] like Figure 4 As shown, in one embodiment, the air inlet guide plate 2 of a graphics card cooling module for improving airflow is provided with a spiral guide groove 5 on its surface to guide airflow evenly. The spiral guide groove 5 is located in the top region of the air inlet guide plate 2, aligned with the airflow inlet direction. This structure, by forming continuous spiral grooves on the guide plate, enables the airflow to rotate before entering the heatsink body 1, thereby optimizing airflow distribution and improving cooling efficiency. The extension direction of the spiral guide groove 5 matches the airflow direction, ensuring uniform airflow within the guide plate and reducing local turbulence or dead zones caused by uneven airflow.

[0043] Specifically, a spiral-shaped groove structure 31 is machined onto the surface of the air inlet guide plate 2. This groove is continuously distributed along the length of the guide plate and matches its overall shape. The width and depth of the spiral guide groove 5 are adjusted according to actual airflow requirements to achieve optimal airflow guidance. This structure is directly installed on the windward side of the guide plate and connected to the airflow channel, ensuring that the airflow is guided and maintains a stable flow as it passes through.

[0044] like Figure 4 As shown, in one embodiment, the base mounting bracket 3 of the graphics card cooling module for improving airflow is connected to the heatsink body 1 via a snap-fit ​​connection (6). This structural design effectively improves assembly efficiency and ensures a stable connection. The base mounting bracket 3 is installed at the bottom of the heatsink body 1 and reliably engages with it through the snap-fit ​​structure (6), facilitating quick assembly and disassembly during production and maintenance. This method reduces the operational complexity associated with traditional screw fixings while improving the overall ease and stability of assembly.

[0045] Specifically, the buckle 6 connection structure of the base fixing bracket 3 consists of an elastic fastening part located at the bottom edge of the radiator body 1 and a fastening part located at the corresponding position of the base fixing bracket 3. The two parts interlock to form a fixed connection. The base fixing bracket 3 is installed at the bottom of the radiator body 1, with its groove structure 31 located in the middle, raised reinforcing ribs 32 located on both sides of the groove, and inclined air guiding surface 33 located on the side wall of the groove. The overall structure achieves stable fixation without affecting airflow.

[0046] like Figure 3As shown, in one embodiment, an elastic pad 7 is provided between the base mounting bracket 3 of the graphics card cooling module for improving airflow and the graphics card body to buffer vibration and reduce airflow interference. The elastic pad 7 is located in the area where the base mounting bracket 3 contacts the graphics card body to prevent direct contact between the two, thereby reducing structural stress caused by vibration. The elastic pad 7 can absorb some vibration energy, preventing relative displacement between the cooling components and the graphics card body due to vibration, thus ensuring the stability of the cooling module and the continuity of the airflow channel. At the same time, the elastic pad 7 can also play a certain sealing role, preventing external dust or other debris from entering the cooling system.

[0047] Specifically, the elastic pad 7 can be made of rubber or silicone, and its shape is adapted to the mating surface of the base mounting bracket 3 and the graphics card body. Its thickness and compression ratio are selected according to the actual application to ensure that vibration transmission is effectively suppressed while meeting installation requirements. The elastic pad 7 is fixed to the bottom of the base mounting bracket 3 or the top of the graphics card body by adhesive or embedding, ensuring that a good buffer layer is formed on the contact surface.

[0048] In actual operation, when this device is in use, the heat generated by the graphics card chip is discharged through the heat sink body 1. The air inlet guide plate 2 guides the external airflow into the heat sink body 1. When the airflow passes under the base fixing bracket 3, the design of the groove structure 31 reduces the obstruction of the airflow. At the same time, the inclined air guide surface 33 guides the airflow smoothly through the side wall of the base fixing bracket 3. The raised reinforcing ribs 32 on both sides maintain the structural strength of the base fixing bracket 3, thereby ensuring that the airflow can effectively flow into the heat sink body 1, improving the overall airflow and heat dissipation efficiency.

[0049] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0050] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A graphics card cooling module for improving airflow, characterized in that, include: The heat sink body (1) is used to contact the graphics card chip and dissipate heat; An air inlet guide plate (2) is provided at the front of the heat sink body (1) to guide airflow into the heat sink body (1); a base fixing bracket (3) is connected to the bottom of the heat sink body (1) to fix the heat sink body (1) to the graphics card body, wherein the base fixing bracket (3) includes a groove structure (31) located in the middle of the base fixing bracket (3); raised reinforcing ribs (32) are provided on both sides of the groove structure (31); and an inclined air guide surface (33) is provided on the side wall of the groove structure (31) to guide airflow through the bottom of the base fixing bracket (3).

2. The graphics card cooling module for improving airflow according to claim 1, characterized in that: The groove structure (31) is located at the front of the base fixing bracket (3) and forms an airflow channel with the air inlet guide plate (2).

3. The graphics card cooling module for improving airflow according to claim 1, characterized in that: The groove structure (31) is a through structure, and its opening faces the air inlet guide plate (2).

4. A graphics card cooling module for improving airflow according to claim 1, characterized in that: The bottom of the groove structure (31) is provided with reinforcing ribs (4).

5. A graphics card cooling module for improving airflow according to claim 1, characterized in that: The raised reinforcing ribs (32) have a wave-shaped structure and are arranged along the width direction of the base fixing bracket (3).

6. A graphics card cooling module for improving airflow according to claim 1, characterized in that: The raised reinforcing ribs (32) are provided on both sides of the base fixing bracket (3).

7. A graphics card cooling module for improving airflow according to claim 1, characterized in that: The inclined air guide surface (33) is an inclined structure, and the inclination angle of the inclined structure is 15° to 45°.

8. A graphics card cooling module for improving airflow according to claim 1, characterized in that: The air inlet guide plate (2) is provided with a spiral guide groove (5) on its surface to guide the airflow through evenly.

9. A graphics card cooling module for improving airflow according to claim 1, characterized in that: The base fixing bracket (3) is connected to the radiator body (1) by a buckle (6).

10. A graphics card cooling module for improving airflow according to claim 1, characterized in that: An elastic pad (7) is provided between the base fixing bracket (3) and the graphics card body.

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