An internal heat exchanger for a sealed box

Abstract

This utility model discloses an internal heat exchange device for a sealed enclosure in the field of electronic equipment. It includes a sealed cavity and a liquid cooling assembly disposed within the sealed cavity. The liquid cooling assembly includes a liquid cooling plate module and a heat exchanger assembly. The liquid cooling plate module includes a flat liquid cooling plate with liquid cooling channels laid flat inside. Several spaced-apart cooling windows are formed on the surface of the liquid cooling plate. Electronic components of the electronic equipment are installed at the cooling windows. The heat exchanger assembly includes a heat exchanger module and a fan. The piping of the heat exchanger module is connected to the liquid cooling channels, and the fan's outlet faces the internal space of the sealed cavity. This utility model achieves power control using only an external water pump, reducing the number of valves inside the enclosure and lowering equipment costs. Furthermore, the design of the liquid flow path allows for better control of the cooling effect to meet the cooling needs of different locations. Simultaneously, the setting of a safe electrical distance ensures the safe use of the electronic equipment.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, specifically, to the design of an internal heat exchange device for a sealed enclosure. Background Technology

[0002] When electronic equipment faces harsh environments, to achieve IP65 or higher protection levels, the enclosure must be completely sealed to prevent the intrusion of external impurities. This renders traditional open-ventilation heat exchange methods unusable. While existing technologies employ methods that enhance airflow through internal fans to achieve temperature uniformity, the heat dissipation effect is poor, severely impacting device performance and lifespan. Liquid cooling solutions, on the other hand, suffer from complex structures and high costs, requiring components such as two internal and external water pumps and T-joints, increasing system complexity and the risk of failure.

[0003] For example, utility model patent CN 215872417 U discloses a liquid-cooled chassis with an internal and external dual-circulation system. To achieve heat dissipation of the internal structure, a liquid-cooled plate connected to both the internal circulation system and the external cold source system is installed inside the chassis. The internal circulation system includes a water pump, a heat exchanger, and other components. However, this structure suffers from complexity and numerous components. The design incorporates two water pumps, one external and one internal, and uses a T-joint to connect the liquid cooling plate and the heat exchanger in parallel. This design increases system complexity and failure rate, while also raising costs.

[0004] In addition, in this type of liquid cooling device, the liquid circuits on the liquid cooling plate are distributed in a sheet-like pattern to achieve overall cooling of the electronic equipment. However, since electronic equipment needs to maintain a certain electrical safety distance, the existing sheet-like circuits are prone to causing damage to the electronic equipment.

[0005] The aforementioned shortcomings deserve improvement. Utility Model Content

[0006] To overcome the shortcomings of existing technologies, this utility model provides an internal heat exchange device for a sealed enclosure, which can achieve power control using only an external water pump and reduces the number of valves inside the enclosure, thus reducing equipment costs. Furthermore, this utility model utilizes the design of a liquid flow path to better control the cooling effect and meet the cooling needs of different locations. At the same time, the setting of a safe electrical distance ensures the safe use of electronic equipment.

[0007] The technical solution of this utility model is as follows:

[0008] An internal heat exchange device for a sealed enclosure includes a sealed cavity and a liquid cooling assembly disposed within the sealed cavity, characterized in that the liquid cooling assembly comprises:

[0009] A liquid cooling plate module includes a flat liquid cooling plate, the interior of which is covered with liquid cooling channels communicating with the outside of the sealed cavity, and the surface of the liquid cooling plate is provided with a number of mutually spaced cooling windows. Electronic components of an electronic device are installed at the positions of the cooling windows, so as to be close to the liquid cooling channels and spaced from the electronic components.

[0010] A heat exchanger assembly includes a heat exchanger module and a fan. The piping in the heat exchanger module is connected to the liquid cooling channel. The air inlet of the fan faces the heat exchanger module, and its air outlet faces the internal space of the sealed cavity.

[0011] According to the above-described scheme, the present utility model is characterized in that the cooling window includes a chip cooling window and a module cooling window, the chip cooling window includes a plurality of small windows spaced apart from each other for connecting to the chip of the power board, and the module cooling window is connected to the inductor box.

[0012] Furthermore, a ceramic sheet is laid on the small window, and the chip is connected to the small window through the ceramic sheet.

[0013] Furthermore, the module cooling window is filled with insulating adhesive, and the inductor box is connected to the module cooling window through the insulating adhesive.

[0014] Furthermore, the liquid cooling channel includes a liquid inlet channel, several module cooling channels, a transition channel, several chip cooling channels, and a liquid return channel connected in sequence. The module cooling channels correspond to the positions of the module cooling windows, and the chip cooling channels correspond to the positions of the chip cooling windows.

[0015] Furthermore, several module cooling channels are arranged side by side, and each module cooling channel includes several module cooling screens connected in sequence, with several cooling tubes arranged side by side inside each module cooling screen.

[0016] Furthermore, several of the chip cooling channels are arranged side by side, and each of the chip cooling channels includes several cooling capacities arranged side by side.

[0017] According to the above-described scheme, the present utility model is characterized in that the heat exchanger module includes a heat exchanger body, and the heat exchanger body is provided with a plurality of heat exchange pipes arranged side by side, and the heat exchange pipes are connected to the liquid cooling channel.

[0018] Furthermore, the heat exchanger body is also provided with heat exchange fins, which are laid between adjacent heat exchange pipes.

[0019] According to the above-described scheme, the present utility model is characterized in that a mounting bracket is further provided inside the sealed cavity, and the liquid cooling plate is installed inside the sealed cavity through the mounting bracket to realize the assembly of the liquid cooling component.

[0020] According to the above-mentioned solution, the beneficial effects of this utility model are that it can quickly reduce the internal air temperature by conducting heat inside the sealed device in combination with a liquid cooling heat sink, thereby ensuring the heat dissipation efficiency of electronic equipment in high-protection environments and ensuring the normal operation of electronic equipment. Furthermore, this utility model can ensure a safe distance between electronic components by utilizing cooling windows, and can also be brought closer to the liquid cooling circuit to achieve cooling.

[0021] This invention eliminates the need for a water pump or a three-way valve inside the housing, significantly simplifying the structural design and reducing the number of components required. This not only lowers costs but also reduces system complexity and failure rate.

[0022] This invention, through the design of grooves on the liquid cooling plate and the liquid flow path, can effectively exchange heat and cool down components such as chips in a targeted manner, thereby improving the heat dissipation effect. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of this utility model;

[0024] Figure 2 This is an exploded view of the structure of this utility model;

[0025] Figure 3 This is a schematic diagram of the liquid cooling component in this utility model;

[0026] Figure 4 This is a front view of the liquid cooling plate in this utility model;

[0027] Figure 5 This is a planar sectional view of the liquid cooling plate in this utility model;

[0028] Figure 6 This is a schematic diagram of the heat exchanger in this utility model;

[0029] Figure 7 This is a schematic diagram of the heat exchanger structure in this utility model with the heat exchange fins removed.

[0030] In the diagram, the labels for each item are as follows:

[0031] 100. Sealed cavity; 110. Box body; 120. Box cover; 130. Mounting bracket;

[0032] 210. Liquid inlet connector; 220. Liquid return connector;

[0033] 300. Liquid cooling components;

[0034] 310. Liquid-cooled plate module; 311. Liquid-cooled plate; 312. Liquid inlet; 313. Liquid return outlet; 314. Chip cooling window; 315. Module cooling window; 3161. Liquid inlet channel; 3162. Heat exchanger liquid inlet end; 3163. Heat exchanger liquid return end; 3164. Module cooling channel; 3165. Transition channel; 3166. Chip cooling channel; 3167. Liquid return channel;

[0035] 320. Heat exchanger assembly; 321. Heat exchanger module; 3211. Heat exchanger inlet pipe; 3212. Heat exchanger body; 3213. Heat exchanger through pipe; 3214. Heat exchanger fins; 3215. Heat exchanger return pipe; 322. Heat exchanger support; 323. Fan. Detailed Implementation

[0036] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0037] like Figures 1 to 7 As shown, to overcome the shortcomings of existing sealed enclosure heat exchange structures, such as system complexity, high failure rate, and high cost, this utility model provides an internal heat exchange device for a sealed enclosure. Through the design of the liquid cooling circuit, it reduces the use of internal water pumps and three-way valves, simplifies the structure, and ensures the electrical safety of electronic equipment. This internal heat exchange device for the sealed enclosure includes a sealed cavity and a liquid cooling component disposed within the sealed cavity. The sealed cavity provides a sealed environment, ensuring IP65 or higher protection and guaranteeing the sealing performance of the enclosure; the liquid cooling component is used to liquid cool the electronic equipment within the sealed cavity.

[0038] like Figure 1 , Figure 2 As shown, the sealed cavity 100 of this utility model includes a box body 110 and a box cover 120, which form a completely sealed cavity. The box body 110 and the box cover 120 are detachably connected, and a sealing ring is provided at the connection position, which can not only ensure the sealing performance, but also facilitate the assembly and fixation of internal electronic equipment.

[0039] A liquid inlet connector 210 and a liquid return connector 220 are sealed and installed on the holes opened on the sealed cavity 100. The liquid inlet connector 210 is connected to the liquid inlet 312 at one end of the liquid cooling assembly 300 (specifically, the liquid cooling plate), and the liquid return connector 220 is connected to the liquid return port 313 at the other end of the liquid cooling assembly 300 (specifically, the liquid cooling plate). The airtightness of the sealed cavity is ensured by the sealed connection.

[0040] The sealed cavity 100 is also provided with a mounting bracket 130. The liquid cooling component 300 (specifically the liquid cooling plate) is installed in the sealed cavity 100 through the mounting bracket 130 to realize the assembly of the liquid cooling component 300. On the one hand, it can isolate the liquid cooling plate 311 from the inner wall of the sealed cavity 100, reducing the waste of cold energy caused by contact. On the other hand, it can ensure the installation stability of the liquid cooling component 300.

[0041] In this utility model, the liquid cooling assembly 300 includes a liquid cooling plate module 310 and a heat exchanger assembly 320. The liquid cooling plate module 310 is used to directly contact and cool the electronic equipment, and the heat exchanger assembly 320 is used to blow cold air into the sealed cavity 100 through airflow to cool the internal space of the sealed cavity 100.

[0042] like Figures 1 to 5 As shown, the liquid cooling plate module 310 includes a flat liquid cooling plate 311. High-heat components are attached to the surface of the liquid cooling plate 311 and dissipate heat through conduction. Specifically, the interior of the liquid cooling plate 311 has a liquid cooling channel that communicates with the outside of the sealed cavity 100. The surface of the liquid cooling plate 311 has several spaced-apart cooling windows. Electronic components of the electronic device are installed at the positions of the cooling windows, close to the liquid cooling channels and spaced apart from the electronic components.

[0043] The cooling opening includes a chip cooling opening 314 and a module cooling opening 315. The chip cooling opening 314 includes several small windows spaced apart from each other for connection to the chips on the power board (not shown in the figure, the same below). The module cooling opening 315 is connected to the inductor box (not shown in the figure, the same below). The spacing between the small windows ensures the electrical safety distance between the chips and facilitates chip assembly. Since the inductor box does not require strict cooling, only a complete module cooling opening 315 needs to be formed, making the opening production more convenient.

[0044] Taking the installation of 4 power boards (each power board includes 12 chips) and 4 inductor boxes as an example, in Figure 4 In the diagram, the dashed area A forms a set of chip cooling windows 314, corresponding to the position of a power board. Each set of chip cooling windows 314 includes 12 small windows. The dashed area B corresponds to the position of the module cooling windows 315, forming a whole. In this invention, to facilitate the installation of the power board and inductor box, ceramic sheets are laid on the small windows. The chips are connected to the small windows through the ceramic sheets, which facilitates heat transfer through the ceramic sheets and ensures electrical safety. The module cooling windows 315 are filled with insulating glue, and the inductor box is connected to the module cooling windows 315 through the insulating glue, ensuring the stability of the connection.

[0045] like Figures 3 to 5As shown, the liquid cooling channel includes a liquid inlet channel 3161, several module cooling channels 3164, a transition channel 3165, several chip cooling channels 3166, and a liquid return channel 3167 connected in sequence. The module cooling channels 3164 correspond to the module cooling window 315, and the chip cooling channels 3166 correspond to the chip cooling window 314.

[0046] Corresponding to the four power boards (each power board includes 12 chips) and four inductor boxes described in this embodiment, several module cooling channels 3164 are arranged side by side. Each module cooling channel 3164 includes several sequentially connected module cooling screens, and each module cooling screen is provided with several parallel cooling tubes. Several chip cooling channels are arranged side by side, and each chip cooling channel 3166 includes several parallel cooling tubes. This embodiment utilizes capillary tubes to increase the heat exchange rate, thereby achieving rapid cooling of the power boards and inductor boxes.

[0047] To achieve the connection of the liquid circuit between the liquid cooling plate 311 and the heat exchanger module 321, a protruding heat exchanger inlet end 3162 is provided at the connection between the liquid inlet channel 3161 and the module cooling channel 3164 in this embodiment. The heat exchanger inlet end is connected to one end of the pipeline inside the heat exchanger module 321. A protruding heat exchanger return end 3162 is also provided at the connection between the module cooling channel 3164 and the transition channel 3165. The heat exchanger return end is connected to the other end of the pipeline inside the heat exchanger module 321. In this way, the present invention realizes the parallel connection between the heat exchanger module 321 and the module cooling channel 3164. Neither of them requires accurate temperature cooling, nor does it require electrical isolation. The sequential connection method simplifies the structure.

[0048] like Figure 2 , Figure 3 , Figures 5 to 7 As shown, the heat exchanger assembly 320 includes a heat exchanger module 321 and a fan 323. The pipes inside the heat exchanger module 321 are connected to the liquid cooling channel. The air inlet of the fan 323 faces the heat exchanger module 321, and its air outlet faces the internal space of the sealed cavity 100. The fan 323 blows hot air through the heat exchanger module 321 to reduce its temperature, and then blows the cold air to the front of the cavity. This cycle of exchange forces the air temperature inside the sealed cavity 100 to continuously decrease, thereby ensuring that the overall temperature of the cavity is close to the temperature of the liquid cooling plate.

[0049] The heat exchanger module 321 includes a heat exchanger body 3212, within which several heat exchanger pipes 3213 are arranged side-by-side and connected to a liquid cooling channel. The heat exchanger pipes 3213 in this invention are flat, effectively increasing the cross-section of the passage and the heat exchange area with the outside environment. The two ends of the heat exchanger pipes 3213 are respectively connected to a heat exchanger inlet pipe 3211 and a heat exchanger return pipe 3215. The heat exchanger pipes 3213 are connected to the liquid cooling channel through the heat exchanger inlet pipe 3211 and the heat exchanger return pipe 3215, allowing several heat exchanger pipes 3213 to be connected in parallel.

[0050] The heat exchanger body 3212 is also provided with heat exchange fins 3214, which are laid between adjacent heat exchange pipes 3213. Preferably, the heat exchange fins 3214 are wavy, which can further increase the heat exchange area, thereby rapidly cooling the flowing air.

[0051] The heat exchanger assembly 320 of this utility model also includes a heat exchanger bracket 322. The heat exchanger module 321 is mounted on the liquid cooling plate 311 through the heat exchanger bracket 322. The heat exchanger module 321 is mounted vertically on the liquid cooling plate 311, which not only ensures the stability of the connection position between the heat exchanger inlet pipe 3211 and the heat exchanger return pipe 3215, but also ensures that the fan 323 is facing the internal space of the sealed cavity 100 so as to blow air into the sealed cavity 100.

[0052] This utility model has the following advantages:

[0053] (1) High efficiency heat exchange and precise temperature control: This utility model adds a heat exchanger to the liquid cooling plate and combines it with a fan to force air circulation, which can effectively remove the heat from the sealed box. Compared with the traditional method of relying solely on the fan to equalize the temperature, it greatly improves the heat dissipation efficiency and can make the temperature inside the box close to the temperature of the liquid cooling plate, thus achieving precise temperature control.

[0054] (2) Simplified structure and reduced cost: Unlike the existing technology with built-in water pump and T-joint, this utility model does not require a built-in water pump. It directly draws part of the water from the internal flow channel of the liquid cooling plate to the heat exchanger, reducing the number of T-joints and other components, simplifying the system structure, and reducing production and maintenance costs.

[0055] (3) Good temperature uniformity: The flow channels of the liquid cooling plate were optimized to accommodate the layout of the four power boards and four inductor boxes fixed on the liquid cooling plate. The 48 heat-generating chips contact the liquid cooling plate via ceramic plates. To ensure electrical safety distances, 48 ​​small slots are cut into the liquid cooling plate to house the chips. The inductor section has relatively lower temperature requirements, and each box is filled with insulating glue, so a large slot can be cut for the entire section. This design ensures that the temperature of the 48 chips is relatively uniform, improving the stability of the equipment operation.

[0056] (4) Large heat exchange area and high efficiency: The heat exchanger adopts a structure of multiple sets of parallel flat tubes and corrugated fins, which greatly increases the heat exchange area, allowing the flowing air to cool down quickly and further improving the heat exchange efficiency.

[0057] (5) High reliability: The simplified structure reduces the number of components and the probability of failure. At the same time, the reasonable layout and heat dissipation design ensure that the device works in a suitable temperature environment, which extends the service life of the device and improves the reliability of the whole equipment.

[0058] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0059] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.

Claims

1. An internal heat exchange device for a sealed enclosure, comprising a sealed cavity and a liquid cooling assembly disposed within the sealed cavity, characterized in that, The liquid cooling assembly includes: A liquid cooling plate module includes a flat liquid cooling plate, the interior of which is covered with liquid cooling channels communicating with the outside of the sealed cavity, and the surface of the liquid cooling plate is provided with a number of mutually spaced cooling windows. Electronic components of an electronic device are installed at the positions of the cooling windows, so as to be close to the liquid cooling channels and spaced from the electronic components. A heat exchanger assembly includes a heat exchanger module and a fan. The piping in the heat exchanger module is connected to the liquid cooling channel. The air inlet of the fan faces the heat exchanger module, and its air outlet faces the internal space of the sealed cavity.

2. The internal heat exchange device of the sealed box according to claim 1, characterized in that, The cooling opening includes a chip cooling opening and a module cooling opening. The chip cooling opening includes several small windows spaced apart from each other for connecting to the chips on the power board. The module cooling opening is connected to the inductor box.

3. The internal heat exchange device of the sealed box according to claim 2, characterized in that, A ceramic sheet is laid on the small window, and the chip is connected to the small window through the ceramic sheet.

4. The internal heat exchange device of the sealed box according to claim 2, characterized in that, The module cooling window is filled with insulating adhesive, and the inductor box is connected to the module cooling window through the insulating adhesive.

5. The internal heat exchange device of the sealed box according to claim 2, characterized in that, The liquid cooling channel includes a liquid inlet channel, several module cooling channels, a transition channel, several chip cooling channels, and a liquid return channel connected in sequence. The module cooling channels correspond to the positions of the module cooling windows, and the chip cooling channels correspond to the positions of the chip cooling windows.

6. The internal heat exchange device of the sealed box according to claim 5, characterized in that, Several module cooling channels are arranged side by side, and each module cooling channel includes several module cooling screens connected in sequence. Each module cooling screen is provided with several cooling tubes arranged side by side.

7. The internal heat exchange device of the sealed box according to claim 5, characterized in that, Several chip cooling channels are arranged side by side, and each chip cooling channel includes several cooling tubes arranged side by side.

8. The internal heat exchange device of the sealed box according to claim 1, characterized in that, The heat exchanger module includes a heat exchanger body, and the heat exchanger body is provided with a plurality of heat exchange pipes arranged side by side, and the heat exchange pipes are connected to the liquid cooling channel.

9. The internal heat exchange device of the sealed box according to claim 8, characterized in that, The heat exchanger body is also provided with heat exchange fins, which are laid between adjacent heat exchange pipes.

10. The internal heat exchange device of the sealed box according to claim 1, characterized in that, The sealed cavity is also provided with a mounting bracket, and the liquid cooling plate is installed in the sealed cavity through the mounting bracket to realize the assembly of the liquid cooling component.

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