Optical package structure

Abstract

An optical packaging structure includes disposing optical elements and electronic elements on a first circuit structure, forming a second circuit structure on the optical elements and electronic elements, and disposing semiconductor elements on the second circuit structure, so that the optical elements and electronic elements can be electrically connected to the semiconductor elements through the second circuit structure to improve signal transmission efficiency.

Description

Technical Field

[0001] This application relates to a semiconductor packaging structure, and more particularly to an optical packaging structure. Background Technology

[0002] With the booming development of the electronics industry, electronic products are gradually moving towards multifunctionality and high performance. The application of fifth-generation (5G) communication technology has expanded to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), cloud computing, artificial intelligence (AI), autonomous vehicles, and medical care. As applications expand, a massive amount of data needs to be efficiently transmitted, processed, and stored. The demand for data transmission, in particular, is surging, leading the industry to replace electricity with light as the data transmission medium to improve transmission capacity, efficiency, and distance, while reducing energy consumption. Against this backdrop, co-packaged optical devices have become a future trend in semiconductor and packaging technology.

[0003] Please see Figure 1 The diagram shows a cross-sectional view of an existing co-packaged optical device 1. It mainly consists of an optoelectronic module 11 mounted on a circuit board 10. The optoelectronic module 11 includes a semiconductor chip 112 formed in the packaging structure 111 and an optical chip 113 mounted on the packaging structure 111. One end of the optical chip 113 is connected to an optical fiber 14, and a shelf 15 is provided below the junction of the optical chip 113 and the optical fiber 14 to allow optical signals to be transmitted to the optoelectronic module 11 for communication. In addition, a switching chip 12 needs to be mounted on the circuit board 10 to be used in the terminal product. The switching chip 12 is first mounted on a substrate 13 and then mounted on the circuit board 10 through the substrate 13.

[0004] However, in the aforementioned co-packaged optical devices, the semiconductor chip is embedded in the package structure. Electrical connection between the semiconductor chip and the optical chip requires multiple circuit layers, and the optoelectronic module needs to be connected to the conversion chip via a substrate and circuit board. Therefore, for future high-speed computing and data-intensive applications requiring the transmission of large amounts of information, information delays will occur. Furthermore, signal transmission over long lines will generate significant heat due to poor transmission efficiency. In addition, the optical chip and conversion chip must transmit signals through circuits within the circuit board and substrate, resulting in an excessively large and thick overall device size, hindering the miniaturization of electronic products. The excessively long signal transmission path also easily leads to signal loss, causing problems in end-product applications.

[0005] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content

[0006] In view of the various deficiencies of the prior art, this application provides an optical packaging structure, including: a first circuit structure; an electronic component disposed on the first circuit structure; an optical component disposed on the first circuit structure; a second circuit structure disposed on the electronic component and the optical component, and exposing the side of the optical component; and a semiconductor component disposed on the second circuit structure.

[0007] This application also provides a method for manufacturing an optical packaging structure, comprising: disposing electronic components and optical components on a first circuit structure; forming a second circuit structure on the electronic components and the optical components, and exposing the side of the optical components; and disposing a semiconductor component on the second circuit structure.

[0008] The aforementioned optical packaging structure and its manufacturing method further include forming a first resistive layer on a portion of the surface of the first circuit structure.

[0009] In the aforementioned optical packaging structure and its manufacturing method, the first barrier layer is adjacent to the side of the optical element, and exposes the electronic element and the optical element to the outside of the first barrier layer.

[0010] The aforementioned optical packaging structure and its manufacturing method further include forming the second circuit structure on the electronic component and the optical component, and forming a second resistive layer on the first resistive layer.

[0011] The aforementioned optical packaging structure and its manufacturing method further include removing the first resist layer and the second resist layer after the semiconductor element is disposed on the second circuit structure.

[0012] The aforementioned optical packaging structure and its manufacturing method also include removing the first circuit structure located below the first resistive layer.

[0013] In the aforementioned optical packaging structure and its manufacturing method, the electronic component is an electronic integrated circuit component, and is electrically connected to the circuit layer of the first circuit structure through multiple conductive elements.

[0014] In the aforementioned optical packaging structure and its manufacturing method, the optical element has a first surface and a second surface opposite to each other and a side surface adjacent to the first surface and the second surface, and forms a plurality of conductive vias that conduct through the first surface and the second surface. A plurality of conductive bumps are formed on the first surface, and a plurality of conductive elements are formed on the second surface, so that the plurality of conductive bumps are electrically connected to the plurality of conductive elements through the plurality of conductive vias, and the optical element is electrically connected to the circuit layer of the first circuit structure through the plurality of conductive elements.

[0015] In the aforementioned optical packaging structure and its manufacturing method, the optical element is a photonic integrated circuit element or an optical module.

[0016] In the aforementioned optical packaging structure and its manufacturing method, the semiconductor element is a conversion-type application-specific integrated circuit.

[0017] In the aforementioned optical packaging structure and its manufacturing method, multiple conductive pillars are formed on the first circuit structure.

[0018] The aforementioned optical packaging structure and its manufacturing method further include forming a first covering layer on the first circuit structure to cover the electronic component and the optical component.

[0019] The aforementioned optical packaging structure and its manufacturing method further include forming a second coating layer on the second circuit structure to cover the semiconductor element.

[0020] In the aforementioned optical packaging structure and its manufacturing method, the side of the optical element is flush with the side of the first circuit structure and the second circuit structure.

[0021] In the aforementioned optical packaging structure and its manufacturing method, the side of the optical element is used to connect to the optical fiber.

[0022] In the aforementioned optical packaging structure and manufacturing method, the side of the optical element is used to set optical components.

[0023] In the aforementioned optical packaging structure and its manufacturing method, a barrier structure is formed below the edge of the optical element in the first circuit structure.

[0024] In the aforementioned optical packaging structure and its manufacturing method, the barrier structure is composed of multiple stacked conductive blind holes.

[0025] As can be seen from the above, the optical packaging structure of this application mainly places the optical element and the semiconductor element on the first circuit structure, and then forms a second circuit structure on the optical element and the semiconductor element, and connects the electronic element on the second circuit structure, so that the optical element and the semiconductor element can be electrically connected to the electronic element through the second circuit structure, without having to go through the substrate and circuit board as in the existing structure, thereby improving the signal transmission efficiency. At the same time, the optical working surface of the optical element can be exposed on the side of the optical packaging structure to facilitate the transmission of optical signals. Attached Figure Description

[0026] Figure 1 This is a cross-sectional schematic diagram of an existing co-packaged optical device.

[0027] Figures 2A to 2D This is a cross-sectional schematic diagram of the manufacturing method of the first embodiment of the optical packaging structure of this application.

[0028] Figure 3 This is a cross-sectional schematic diagram of the second embodiment of the optical packaging structure of this application.

[0029] Figure 4 This is a cross-sectional schematic diagram of the third embodiment of the optical packaging structure of this application.

[0030] Explanation of reference numerals in the attached figures

[0031] 1. Co-packaged optical devices

[0032] 10 Circuit Boards

[0033] 11 Optoelectronic Modules

[0034] 111 Package Structure

[0035] 112 Semiconductor Chips

[0036] 113 Optical Chip

[0037] 12 conversion chips

[0038] 13 substrate

[0039] 14 optical fibers

[0040] 15 brackets

[0041] 2,3,4 Optical Packaging Structure

[0042] 20 Load-bearing components

[0043] 21 First Line Structure

[0044] 21a First side

[0045] 21b Second side

[0046] 210 Insulation Layer

[0047] 211 Line Layer

[0048] 212 Retaining Wall Structure

[0049] 213 Conductive Post

[0050] 22 Electronic components

[0051] 221 Conductive components

[0052] 23 Optical Components

[0053] 23a First Surface

[0054] 23b Second Surface

[0055] 23c Side View

[0056] 230 conductive via

[0057] 231 Conductive bump

[0058] 232 Conductive components

[0059] 24a First barrier layer

[0060] 24b Second barrier layer

[0061] 25a First cladding layer

[0062] 25b Second cladding layer

[0063] 26 Second Line Structure

[0064] 260 Insulation Layer

[0065] 261 Line Layer

[0066] 27 Semiconductor Components

[0067] 271 Conductive components

[0068] 28 Conductive elements

[0069] 40 Optical Components

[0070] S-shaped cutting line. Detailed Implementation

[0071] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0072] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," "third," and "one" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0073] Please see Figures 2A to 2D This is a cross-sectional schematic diagram of the optical packaging structure and its manufacturing method of this application.

[0074] like Figure 2A As shown, a first circuit structure 21 is formed on a carrier 20, and electronic components 22 and optical components 23 are disposed on the first circuit structure 21, and a first resistive layer 24a is formed on the first circuit structure 21.

[0075] The carrier 20 is, for example, a temporary carrier plate for a glass substrate.

[0076] The first circuit structure 21 has opposing first sides 21a and second sides 21b, and includes an insulating layer 210 and a circuit layer 211 bonded to the insulating layer 210. The insulating layer 210 is made of dielectric materials such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP). The circuit layer 211 is, for example, a fan-out type redistributed circuit layer, and its material is, for example, metallic copper.

[0077] The electronic component 22 is, for example, an electronic integrated circuit (EIC), and is placed on the first side 21a of the first circuit structure, and is electrically connected to the circuit layer 211 of the first circuit structure 21 through a plurality of conductive elements 221 such as solder bumps or copper bumps.

[0078] The optical element 23 has a first surface 23a and a second surface 23b opposite to each other and a side surface 23c adjacent to the first surface 23a and the second surface 23b. The side surface 23c is provided with an optical working surface and is disposed on the first side 21a of the first circuit structure 21 with the second surface 23b.

[0079] The optical element 23 has a plurality of conductive vias 230 that connect the first surface 23a and the second surface 23b, and a plurality of conductive bumps 231 are formed on the first surface 23a and a plurality of conductive elements 232 are formed on the second surface 23b, so that the plurality of conductive bumps 231 are electrically connected to the plurality of conductive elements 232 through the plurality of conductive vias 230. The optical element 23 is electrically connected to the circuit layer 211 of the first circuit structure 21 through the plurality of conductive elements 232.

[0080] The optical element 23 is, for example, a photonic integrated circuit (PIC) element or an optical module, wherein the optical module may include a photonic integrated circuit element, a total internal reflection glass (TIR glass) or other optical components.

[0081] Furthermore, multiple conductive posts 213 may be formed on the first circuit structure 21, and the multiple conductive posts 213 may be electrically connected to the first circuit structure 21.

[0082] The first resist layer 24a, for example, is a photoresist, formed on a portion of the first side 21a of the first circuit structure 21 and adjacent to the side 23c of the optical element 23, and exposes the electronic element 22, the optical element 23 and the plurality of conductive pillars 213 to the outside of the first resist layer 24a.

[0083] like Figure 2B As shown, a first cladding layer 25a is formed on the first circuit structure 21 to cover the electronic component 22, the optical component 23, and the plurality of conductive pillars 213. Then, a second circuit structure 26 is formed on the first cladding layer 25a, and a second resistive layer 24b is formed on the first resistive layer 24a.

[0084] The first resisting layer 24a and the second resisting layer 24b are adjacent to the optical element 23, the first cladding layer 25a and the second circuit structure 26, and the materials of the first resisting layer 24a and the second resisting layer 24b may be the same or different.

[0085] The second circuit structure 26 includes an insulating layer 260 and a circuit layer 261 bonded to the insulating layer 260, and the circuit layer 261 of the second circuit structure 26 electrically connects the electronic component 22, the optical component 23, and the plurality of conductive pillars 213. The insulating layer 260 is made of dielectric materials such as poly(p-diazolebenzene) (PBO), polyimide (PI), or prepreg (PP). The circuit layer 261 is, for example, a fan-out type redistributed circuit layer, and its material is, for example, metallic copper.

[0086] In other embodiments, a first barrier layer 24a of sufficient height can be provided without stacking a second barrier layer 24b on top of the first barrier layer 24a.

[0087] like Figure 2C As shown, a semiconductor element 27 is disposed on the second line structure 26, and a second covering layer 25b is formed on the second line structure 26 to cover the semiconductor element 27.

[0088] The semiconductor element 27 is, for example, a switch ASIC, and is electrically connected to the second circuit structure 26 via a plurality of conductive elements 271, such as solder bumps or copper bumps.

[0089] Next, the first blocking layer 24a and the second blocking layer 24b are removed to expose the optical working surface of the side 23c of the optical element 23, wherein the optical working surface of the side 23c of the optical element 23 can be connected to an optical fiber to transmit optical signals.

[0090] like Figure 2D As shown, a portion of the first line structure 21 is removed, for example, by using a cutting tool along the cutting line S (e.g., Figure 2C Remove the first circuit structure 21 located below the first resist layer 24a, so that the side 23c of the optical element 23 is flush with the sides of the first circuit structure 21, the second circuit structure 26, the first cladding layer 25a and the second cladding layer 25b, to obtain the optical packaging structure 2 of this application.

[0091] In other embodiments, the first barrier layer 24a, the second barrier layer 24b, and the first circuit structure 21 covered thereon can also be removed directly with a cutting tool in one go.

[0092] Additionally, after removing the carrier 20, a plurality of conductive elements 28 may be provided on the second side 21b of the first line structure 21 to provide a power connection to an external device.

[0093] Through the aforementioned manufacturing method, this application also discloses an optical packaging structure 2, including: a first circuit structure 21, an electronic component 22 and an optical component 23 disposed on the first circuit structure 21, a second circuit structure 26 disposed on the electronic component 22 and the optical component 23, and a semiconductor component 27 disposed on the second circuit structure 26.

[0094] The first circuit structure 21 has opposing first sides 21a and second sides 21b, and includes an insulating layer 210 and a circuit layer 211 bonded to the insulating layer 210.

[0095] The electronic component 22 is, for example, an electronic integrated circuit (EIC) component, and the electronic component 22 is placed on the first side 21a of the first circuit structure 21 and electrically connected to the first circuit structure 21.

[0096] The optical element 23 is, for example, a photonic integrated circuit element (PIC) and has a first surface 23a and a second surface 23b opposite to each other and a side surface 23c adjacent to the first surface 23a and the second surface 23b. The side surface 23c is provided with an optical working surface to connect to an optical fiber, and the second surface 23b is disposed on the first side 21a of the first circuit structure 21 and electrically connected to the first circuit structure 21.

[0097] The semiconductor element 27 is, for example, a switching application-specific integrated circuit, which is disposed on and electrically connected to the second circuit structure 26.

[0098] The optical packaging structure 2 may also include a first covering layer 25a covering the electronic component 22 and the optical component 23, and a second covering layer 25b covering the semiconductor component 27.

[0099] Please see Figure 3 This is a cross-sectional schematic diagram of the second embodiment of the optical packaging structure 3 of this application. This embodiment is largely the same as the previous embodiment, with the main difference being that a barrier structure 212 is formed in the first circuit structure 21. The barrier structure 212 can be composed of multiple conductive blind vias stacked together and correspondingly disposed below the edge of the optical element 23 and adjacent to the cutting line S. This is to prevent the cutting crack from extending to the first circuit structure 21 below the optical element 23 or even the optical element 23 when the first circuit structure 21 on which the optical element 23 is not located is cut and removed, thus affecting the electrical connection quality between the optical element 23 and the first circuit structure 21. In addition, the multiple conductive blind vias of the barrier structure 212 can be formed simultaneously with the fabrication of the circuit layer of the first circuit structure 21.

[0100] Please see Figure 4 This is a cross-sectional schematic diagram of the third embodiment of the optical packaging structure 4 of this application. This embodiment is largely the same as the previous embodiments, with the main difference being that an optical component 40 is provided on the side 23c of the optical element 23, such as an optical fiber module, optical fiber slot, optical fiber array unit, waveguide array, or reflector, to facilitate subsequent connection of optical fibers.

[0101] In summary, the optical packaging structure of this application mainly places optical elements and semiconductor elements on a first circuit structure, then forms a second circuit structure on the optical elements and semiconductor elements, and connects electronic elements on the second circuit structure. This allows the optical elements and semiconductor elements to be electrically connected to the electronic elements through the second circuit structure, without the need for a substrate and circuit board as in existing structures, thereby improving signal transmission efficiency. At the same time, it allows the optical working surface of the optical element to be exposed on the side of the optical packaging structure to facilitate the transmission of optical signals.

[0102] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. An optical packaging structure, characterized in that, include: First line structure; Electronic components are disposed on the first circuit structure; An optical element is disposed on the first circuit structure; The second circuit structure is disposed on the electronic component and the optical component, and is exposed on the side of the optical component; as well as Semiconductor elements are disposed on the second circuit structure.

2. The optical packaging structure as described in claim 1, characterized in that, The electronic component is an electronic integrated circuit component, and is electrically connected to the first circuit structure through multiple conductive elements.

3. The optical packaging structure as described in claim 1, characterized in that, The optical element has a first surface and a second surface opposite to each other, as well as a side surface adjacent to the first surface and the second surface. It has a plurality of conductive vias that conduct through the first surface and the second surface. A plurality of conductive bumps are formed on the first surface, and a plurality of conductive elements are formed on the second surface, so that the plurality of conductive bumps are electrically connected to the plurality of conductive elements through the plurality of conductive vias, and the optical element is electrically connected to the first circuit structure through the plurality of conductive elements.

4. The optical packaging structure as described in claim 1, characterized in that, The optical element is a photonic integrated circuit element or an optical module.

5. The optical packaging structure as described in claim 1, characterized in that, Multiple conductive pillars are formed on the first circuit structure.

6. The optical packaging structure as described in claim 1, characterized in that, The optical packaging structure also includes a first covering layer formed on the first circuit structure and covering the electronic component and the optical component.

7. The optical packaging structure as described in claim 1, characterized in that, The optical packaging structure also includes a second cladding layer formed on the second circuit structure and covering the semiconductor element.

8. The optical packaging structure as described in claim 1, characterized in that, The side of the optical element is flush with the side of the first circuit structure and the second circuit structure.

9. The optical packaging structure as described in claim 1, characterized in that, The side of the optical element is used to connect optical fibers.

10. The optical packaging structure as described in claim 1, characterized in that, The side of the optical element is used to mount optical components.

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