A carrier device and thermal processing device for a thermal processing chamber

Abstract

The application provides a carrier device and a heat treatment device for a heat treatment chamber, comprising: a carrier vehicle, the carrier vehicle comprising a base and wheels, the wheels being connected to the base and located below the base; a support seat, the support seat being arranged on the base and used for placing a semiconductor workpiece; a partition plate, the partition plate being arranged on the base and being perpendicular to the running direction of the carrier vehicle and used for partitioning the heat treatment chamber; and a rotary drive, the rotary drive being arranged below the base and connected to the support seat to drive the support seat to rotate about the axis thereof. The carrier device of the application comprises the carrier vehicle, the support seat, the partition plate and the rotary drive, when the carrier device carries a crystal bar through the heat treatment chamber, the partition plate is used for partitioning the heat treatment chamber, and the rotary drive drives the support seat to rotate so that the crystal bar is uniformly heated, the crystal bar is less likely to be polluted and deformed due to the small contact area and uniform heating, the number and size of oxygen precipitates are regulated, and the performance of the device is improved.

Description

Technical Field

[0001] This application relates to the field of heat treatment equipment technology, and more specifically to a transport device and a heat treatment device for a heat treatment chamber. Background Technology

[0002] In semiconductor manufacturing processes, the quality of single-crystal silicon directly affects the performance and reliability of devices. In Czochralski-grown single-crystal silicon, there is a high concentration of supersaturated oxygen atoms within the silicon lattice. During high-temperature heat treatment, these supersaturated oxygen atoms aggregate to form nanoscale SiO2 clusters, known as oxygen precipitates. In subsequent device fabrication processes, oxygen precipitates can act as intrinsic getter centers, attracting and capturing metallic impurities, relieving stress, and improving crystal defects, thereby enhancing device performance. Therefore, precisely controlling the quantity, size, and distribution of oxygen precipitates is one of the key technologies for improving the quality of semiconductor materials. The density and spatial distribution of oxygen precipitates are influenced by factors such as heat treatment processes.

[0003] To better control the formation of oxygen deposits, the heat treatment chamber is typically divided into a heating zone, a isothermal zone, and a cooling zone, thereby enabling the regulation of the quantity, size, and distribution of oxygen deposits in single-crystal silicon materials. In related technologies, the heat treatment chamber and heating zone are fixed, preventing the crystal rod from moving within the hot zone during heat treatment. This would affect the density and spatial distribution of oxygen deposits. Furthermore, the stationary crystal rod poses a risk of uneven heating, leading to defects and ultimately impacting device performance.

[0004] Therefore, improvements are needed to at least partially address the aforementioned problems. Utility Model Content

[0005] The utility model description section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This utility model description section is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] To at least partially solve the above problems, this utility model provides a transport device for a heat treatment chamber, comprising: a transport vehicle including a base and wheels, the wheels being connected to and located below the base; a support seat disposed on the base for placing semiconductor workpieces; a dividing plate disposed on the base, the dividing plate being perpendicular to the running direction of the transport vehicle for dividing the heat treatment chamber; and a rotation drive component disposed below the base, the rotation drive component being connected to the support seat to drive the support seat to rotate around its axis.

[0007] For example, an insulation layer is further provided between the support and the base, wherein the partition plate is detachably disposed on the insulation layer.

[0008] For example, the base has an internal tooth groove on the side away from the wheel, the internal tooth groove cooperating with the drive component of the heat treatment chamber, the drive component being configured to drive the vehicle to move within the heat treatment chamber.

[0009] For example, the sidewall of the dividing plate and the sidewall of the heat treatment chamber corresponding to the sidewall are shaped to match, and the sidewall of the dividing plate at least partially contacts the sidewall of the heat treatment chamber, or there is a gap between the sidewall of the dividing plate and the sidewall of the heat treatment chamber.

[0010] For example, the heat treatment chamber includes a first heat treatment chamber and / or a second heat treatment chamber, wherein the first heat treatment chamber is a tunnel-type treatment chamber and the second heat treatment chamber is an annular treatment chamber. When the transport device is applied to the first heat treatment chamber, the base is a rectangular structure and the dividing plate is a rectangular plate; when the transport device is applied to the second heat treatment chamber, the base is a fan-shaped annular structure and the dividing plate is an arc-shaped plate.

[0011] For example, the semiconductor workpiece is a crystal rod, the included angle of the fan-ring structure is less than or equal to 120 degrees, and the width of the fan-ring structure is greater than the diameter of the crystal rod.

[0012] For example, the height of the dividing plate is greater than the length of the crystal rod.

[0013] For example, the wheel is a grooved wheel, which operates in conjunction with the transport track of the heat treatment chamber.

[0014] For example, the thickness of the insulation layer is 50mm-200mm.

[0015] According to another aspect of the present invention, a heat treatment apparatus is provided, comprising: the aforementioned transport device.

[0016] The present invention discloses a transport device for a heat treatment chamber, comprising a transport vehicle, a support base, a dividing plate, and a rotary drive. When the transport device carries a crystal rod movable through the heat treatment chamber, the dividing plate is used to divide the heat treatment chamber, and the rotary drive drives the support base to rotate so that the crystal rod is heated evenly. Due to the small contact area and uniform heating of the crystal rod, the risk of contamination and deformation is effectively reduced, and the amount and size of oxygen deposits in the crystal rod are controlled, thereby improving the performance of the device. Attached Figure Description

[0017] The following drawings, which are incorporated herein by reference as part of this invention, are provided for understanding the invention. The drawings illustrate embodiments of the invention and their descriptions, serving to explain the principles of the invention.

[0018] In the attached image:

[0019] Figure 1 A schematic diagram of the structure of a transport device for a heat treatment chamber according to a specific embodiment of the present invention is shown.

[0020] Figure 2 A schematic diagram of the structure of a transport device for a heat treatment chamber according to another specific embodiment of the present invention is shown;

[0021] Figure 3 A front view of a transport device for a heat treatment chamber according to a specific embodiment of the present invention is shown;

[0022] Figure 4 A top view of a transport device for a heat treatment chamber according to a specific embodiment of the present invention is shown;

[0023] Figure 5 This diagram shows a structural schematic of a tandem transport device according to a specific embodiment of the present invention;

[0024] Figure 6 A schematic diagram of the structure of a tandem transport device according to another specific embodiment of the present invention is shown. Detailed Implementation

[0025] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0026] It should be understood that this invention can be embodied in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of this invention to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated. The same reference numerals denote the same elements throughout.

[0027] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this utility model, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion.

[0028] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “under” the other element or feature will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0029] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0030] To address at least one of the aforementioned technical problems, this application provides a transport device for a heat treatment chamber, comprising:

[0031] A carrier vehicle, comprising a base and wheels, with the wheels connected to and located below the base;

[0032] Support base, which is set on the base and used to place semiconductor workpieces;

[0033] A dividing plate is mounted on the base and is perpendicular to the direction of travel of the transport vehicle. It is used to divide the heat treatment chamber.

[0034] A rotary drive component is located below the base and is connected to the support base to drive the support base to rotate around its axis.

[0035] According to the present application, a transport device for a heat treatment chamber includes a transport vehicle, a support base, a dividing plate, and a rotary drive. When the transport device carries a crystal rod movable through the heat treatment chamber, the dividing plate is used to divide the heat treatment chamber, and the rotary drive drives the support base to rotate so that the crystal rod is heated evenly. Because the crystal rod has a small contact area and is heated evenly, the risk of contamination and deformation is effectively reduced, and the amount and size of oxygen deposits in the crystal rod can be controlled, thereby improving the performance of the device.

[0036] To fully understand this application, a detailed structure will be presented in the following description to illustrate the technical solutions proposed in this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0037] The following is for reference. Figure 1 and Figure 2 A transport device for a heat treatment chamber according to an embodiment of this application is described, such as... Figure 1 and Figure 2 As shown, the transport device includes: a transport vehicle 10, which includes a base 11 and wheels 12, the wheels 12 being connected to the base 11 and located below the base 11; a support base 13, which is disposed on the base 11 and used to place semiconductor workpieces; a dividing plate 14, which is disposed on the base 11 and perpendicular to the running direction of the transport vehicle 10, used to divide the heat treatment chamber; and a rotary drive 15, which is disposed below the base 11 and connected to the support base 13 to drive the support base 13 to rotate around its axis.

[0038] In this embodiment, the transport device includes a transport vehicle 10, a support base 13, a dividing plate 14, and a rotary drive component 15. The transport vehicle 10 consists of wheels 12 and a base 11. The wheels 12 are positioned below and connected to the base 11, enabling the transport device to move within the heat treatment chamber. The support base 13 is mounted on the base 11 of the transport vehicle 10 and is used to place semiconductor workpieces, specifically crystal rods. The dividing plate 14 is positioned perpendicular to the running direction of the transport vehicle 10 on the base 11. During heat treatment, when the transport device enters the heat treatment chamber, the dividing plate 14 divides the chamber into relatively independent temperature zones, reducing temperature crosstalk between different zones and allowing for gradual temperature changes as the transport device traverses different temperature zones within the heat treatment chamber. This enables control over the quantity and size of oxygen deposits in the crystal rod. The rotary drive 15 is disposed below the base 11 and connected to the support 13. During heat treatment, the rotary drive 15 drives the support to rotate around its axis at a certain speed, ensuring that the crystal rod placed on the support is heated evenly, avoiding localized overheating or undercooling of the crystal rod, reducing crystal defects, and improving device performance. In other examples, the semiconductor workpiece can also be a wafer, etc., without specific limitation.

[0039] In some embodiments, the transport vehicle 10 includes wheels 12 and a base 11, with the wheels 12 connected to and located below the base 11. Exemplarily, the wheels 12 are grooved wheels, with a grooved structure on their outer edge to match the transport track inside the heat treatment chamber, ensuring the transport device is less prone to derailment during operation and maintaining operational stability. The shape of the base 11 is designed according to the type of heat treatment chamber to ensure stable operation within heat treatment chambers of different structural forms. Specifically, the wheels 12 are installed at the four corners of the base 11 or other suitable locations to support the entire transport device in smooth operation on the transport track within the heat treatment chamber. The materials of the base 11 and the wheels 12 include, but are not limited to, high-temperature resistant alloy materials, and are not specifically limited thereto.

[0040] In some embodiments, an internal toothed groove 16 is provided on the side of the base 11 away from the wheels. The internal toothed groove 16 cooperates with a drive component of the heat treatment chamber, which is configured to drive the transport vehicle to move within the heat treatment chamber. Specifically, the internal toothed groove 16 meshes with a drive component located in the low-temperature zone of the heat treatment chamber. The drive component can be a drive gear or a drive rack, etc., and is not specifically limited thereto. By driving the internal toothed groove 16 through the drive component, the transport device moves at a certain speed, improving the stability and synchronization of the transport device's operation. When the transport devices form a series group and traverse the heat treatment chamber, the internal toothed groove 16 helps to achieve coordinated control of multiple transport devices, ensuring that each transport device enters and exits the heat treatment chamber at a predetermined rhythm.

[0041] In some embodiments, the heat treatment chamber includes a first heat treatment chamber and / or a second heat treatment chamber. The first heat treatment chamber is a tunnel-type treatment chamber, and the second heat treatment chamber is an annular treatment chamber. Specifically, the tunnel-type treatment chamber has a linear, elongated cavity structure. The transport device enters the chamber along a linear track at the bottom of the heat treatment chamber and sequentially passes through multiple temperature zones (e.g., a heating zone, a isothermal zone, and a cooling zone) to complete different stages of heat treatment. Specifically, the annular treatment chamber has an annular closed cavity structure, typically with a circular or elliptical layout. The transport device circulates along the annular track at the bottom of the heat treatment chamber, sequentially passing through different temperature zones to complete different stages of heat treatment, such as heating, isothermal, and cooling.

[0042] In some embodiments, such as Figure 1 and Figure 3 As shown, when the transport device is applied to the first heat treatment chamber (i.e., the tunnel-type treatment chamber), the base of the transport device has a rectangular structure to match the linear track and the spatial layout of the chamber. Figure 2 and Figure 3 As shown, when the carrier device is applied to the second heat treatment chamber (i.e., the annular treatment chamber), the base of the carrier device has a fan-shaped annular structure. The fan-shaped annular structure is composed of two concentric arcs (inner arc edge and outer arc edge) and two side edges. The included angle of the fan-shaped annular structure is ( Figure 4 The included angle A is less than or equal to 120 degrees, such as 120 degrees, 90 degrees, 60 degrees, or 40 degrees. The included angle of the fan-shaped annular structure determines the number of transport devices. If the included angle is too large, the number of transport devices will be too small, resulting in fewer crystal rods that can be processed simultaneously, thus reducing the space utilization rate of the heat treatment chamber. For example, the width of the fan-shaped annular structure ( Figure 4 The radial distance between the inner and outer arcs (R2-R1) is greater than the diameter of the crystal rod, meaning the radial distance between the inner and outer arcs is greater than the diameter of the crystal rod. A suitable base width provides sufficient support area for the crystal rod, preventing it from tilting and slipping. For example, if the diameter of the crystal rod is 300mm, the width of the fan-shaped ring structure is 400mm.

[0043] In some embodiments, the transport device further includes a dividing plate 14, which is disposed on the base 11 and perpendicular to the running direction of the transport vehicle 10, for dividing the heat treatment chamber. The height of the dividing plate 14 is greater than the length of the crystal rod. Exemplarily, the transport device also includes a heat insulation layer 17, which is disposed on the base 11 of the transport vehicle 10, and the dividing plate 14 is detachably disposed on the heat insulation layer 17. Specifically, the dividing plate 14 is perpendicular to the running direction of the transport vehicle and detachably disposed on the heat insulation layer 17. The detachable placement of the dividing plate 14 above the heat insulation layer 17 facilitates subsequent cleaning, replacement, and adaptation to different process requirements. For example, the dividing plate can be fixed to the heat insulation layer 17 by bolts, slots, or detachable connectors; this is not specifically limited. Exemplarily, the thickness of the heat insulation layer 17 is 50mm-200mm, for example, 50mm, 80mm, 100mm, 150mm, 180mm, or 200mm, etc., and this is not specifically limited. For example, the insulation layer 17 is a graphite hard felt or graphite soft felt, which effectively isolates high-temperature heat from being conducted downwards from the support base, reduces the risk of thermal deformation of the transport vehicle structure, improves thermal energy utilization, and enables the crystal rod to absorb the required heat more efficiently.

[0044] For example, multiple heaters are installed on the outer side of the heat treatment chamber. Each heater can independently control its power and temperature output. The heat treatment chamber is divided into a heating zone, a constant temperature zone, and a cooling zone (i.e., a "statically" arranged temperature range) through the heaters. Each temperature zone has independent temperature control capabilities, thereby achieving precise management of the crystal rod heat treatment process. The heating zone gradually heats the crystal rod from its initial temperature to the required process temperature, laying the foundation for the subsequent formation of oxygen precipitation. The constant temperature zone provides a constant high-temperature environment, allowing supersaturated oxygen atoms in the crystal rod to further aggregate and form nanoscale SiO2 clusters (i.e., oxygen precipitation). By precisely controlling the temperature range and residence time in the constant temperature zone, the number and size of oxygen precipitation cores can be effectively controlled, thereby optimizing the internal gettering effect, mechanical strengthening performance, and device electrical characteristics. The cooling zone is responsible for gradually cooling the crystal rod, which has completed oxygen precipitation control, from a high-temperature state to a safe operating temperature.

[0045] For example, such as Figure 5As shown, when multiple carrier devices are connected in series and enter the heat treatment chamber, they sequentially pass through the heating zone, isothermal zone, and cooling zone of the heat treatment chamber. Adjacent partition plates 14 and the sidewalls of the heat treatment chamber enclose an independent, movable sub-chamber (i.e., a relatively independent temperature zone). The partition plates 14 of the multiple carrier devices can divide the entire heat treatment chamber into multiple relatively independent, movable sub-chambers. The partition plates on each carrier device are used to separate airflow and heat transfer between different temperature zones, maintaining a stable thermal field between each zone. Simultaneously, based on the proportion of space occupied by the carrier devices in adjacent temperature zones, the temperature of the sub-chambers is dynamically adjusted, thereby achieving precise control of the temperature gradient. This can effectively control the quantity and size of oxygen deposits in the crystal rod, improving device performance.

[0046] In some embodiments, when the transport device is applied to the first heat treatment chamber (i.e., the tunnel-type treatment chamber), the dividing plate 14 is a rectangular plate, and its extension direction is perpendicular to the running direction of the transport vehicle 10. When the transport device is applied to the second heat treatment chamber (i.e., the annular treatment chamber), the dividing plate 14 is an arc-shaped plate. In this case, the radius of curvature of the dividing plate 14 matches the inner diameter of the annular treatment chamber, so that it can fit tightly against the side wall of the chamber during the operation of the transport device, forming a good sealing and isolation effect.

[0047] In some embodiments, the sidewall of the dividing plate 14 and the sidewall of the corresponding heat treatment chamber are shaped to match, and the sidewall of the dividing plate 14 at least partially contacts the sidewall of the heat treatment chamber, or there is a gap between the sidewall of the dividing plate 14 and the sidewall of the heat treatment chamber. Specifically, the sidewall of the dividing plate 14 at least partially contacts the sidewall of the heat treatment chamber, so that the dividing plate 14 can fit against the sidewall of the chamber during operation, thereby isolating airflow and separating temperature zones; or, a gap is left between the sidewall of the dividing plate 14 and the sidewall of the heat treatment chamber to accommodate thermal expansion, prevent frictional damage, or facilitate cleaning and maintenance.

[0048] For example, the material of the partition plate 14 can be high-purity graphite, ceramic fiber board or high-temperature resistant alloy and other high-temperature resistant heat insulation materials, without specific limitation.

[0049] In some embodiments, the transport device further includes a support base 13, which is located on the insulation layer 17 and is used to place the crystal rod. Specifically, the support base 13 can be adapted to various types of carriers, such as quartz boats, tubular carriers, clamps, etc., improving the device's adaptability to crystal rods of different materials and sizes, and thus having a wide range of applications. Exemplarily, the material of the support base 13 can be high-purity graphite, ceramic composite materials, or high-temperature resistant alloys, etc., without specific limitations.

[0050] In some embodiments, the transport device further includes a rotary drive 15, which is disposed below the base 11 and connected to a support 13 to drive the support 13 to rotate about its axis. Exemplarily, the rotary drive 15 is connected to the support 13 via a transmission device to drive the support 13 to rotate. Exemplarily, the rotary drive 15 includes, but is not limited to, a servo motor, and the transmission device includes, but is not limited to, a chain. During heat treatment, if the crystal rod remains stationary, uneven heating will lead to crystal structure defects. By using the rotary drive 15 below the base to drive the support 13 to rotate about its axis via a transmission device, and placing the crystal rod on the support 15, the rotation can achieve uniform heating of the crystal rod, avoid crystal structure defects, and improve device performance.

[0051] like Figure 6 As shown, the following is a specific operation method of this application. Other operation methods are also possible and are not specifically limited:

[0052] Multiple carrier devices are assembled into a carrier device series group. Each carrier device has a cross-section of 500mm x 500mm. A 300mm crystal rod is placed on the support base of the carrier device. The length of the crystal rod is 300mm to 500mm. The crystal rod rotates 1 to 10 revolutions per minute.

[0053] The heat treatment chamber consists of nine independent temperature zones, each 500 mm in size, with a total length of approximately 4500 mm. The heating and cooling zones are comprised of 2-4 independently controlled sections, with the middle section forming the constant-temperature zone. Temperature zones 1-3 are the heating zones, with temperatures set sequentially to 100°C, 300°C, and 500°C. Temperature zones 4-6 are the constant-temperature zones, set at 700°C. Temperature zones 7-9 are the cooling zones, with temperatures set sequentially to 500°C, 300°C, and 100°C. The transport device, arranged in series, moves at a speed of 500 mm / hour, and completes its passage through the heat treatment chamber in approximately 10 hours. This includes approximately 4 hours in the heating zone, 2 hours in the constant-temperature zone, and 4 hours in the cooling zone. Finally, the crystal rod is removed, completing the heat treatment process.

[0054] In summary, the transport device for a heat treatment chamber according to the embodiments of this application includes a transport vehicle, a support base, a dividing plate, and a rotary drive. When the transport device carries the crystal rod movable through the heat treatment chamber, the dividing plate is used to divide the heat treatment chamber, and the rotary drive drives the support base to rotate so that the crystal rod is heated evenly. Because the crystal rod has a small contact area and is heated evenly, the risk of contamination and deformation is effectively reduced, and the amount and size of oxygen deposits in the crystal rod can be controlled, thereby improving the performance of the device.

[0055] This application also provides a heat treatment apparatus, including the aforementioned transport device for a heat treatment chamber.

[0056] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of this application. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of this application. All such changes and modifications are intended to be included within the scope of this application as claimed in the appended claims.

[0057] Similarly, it should be understood that, in order to simplify this application and aid in understanding one or more aspects of the application, various features of this application may sometimes be grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of this application. However, this approach should not be construed as reflecting an intention that the claimed application requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, the point of application is that the corresponding technical problem can be solved with fewer features than all of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of this application.

[0058] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0059] It should be noted that the above embodiments are illustrative of this application and not limiting of it, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

Claims

1. A transport device for a heat treatment chamber, characterized in that, include: A transport vehicle, the transport vehicle including a base and wheels, the wheels being connected to the base and located below the base; A support base, which is disposed on the base, is used to place a semiconductor workpiece; A dividing plate is disposed on the base and is perpendicular to the running direction of the transport vehicle, for dividing the heat treatment chamber; A rotary drive component is disposed below the base and is connected to the support base to drive the support base to rotate about its axis.

2. The transport device as described in claim 1, characterized in that, An insulation layer is provided between the support base and the base, wherein the partition plate is detachably mounted on the insulation layer.

3. The transport device as described in claim 1, characterized in that, The base has an internal tooth groove on the side away from the wheel. The internal tooth groove cooperates with the drive component of the heat treatment chamber. The drive component is configured to drive the transport vehicle to move within the heat treatment chamber.

4. The transport device as described in claim 1, characterized in that, The sidewall of the dividing plate matches the shape of the sidewall of the heat treatment chamber corresponding to the sidewall, and the sidewall of the dividing plate at least partially contacts the sidewall of the heat treatment chamber, or there is a gap between the sidewall of the dividing plate and the sidewall of the heat treatment chamber.

5. The transport device as described in claim 1, characterized in that, The heat treatment chamber includes a first heat treatment chamber and / or a second heat treatment chamber, wherein the first heat treatment chamber is a tunnel-type treatment chamber, and the second heat treatment chamber is an annular treatment chamber. When the transport device is applied to the first heat treatment chamber, the base is a rectangular structure and the dividing plate is a rectangular plate; when the transport device is applied to the second heat treatment chamber, the base is a fan-shaped structure and the dividing plate is an arc-shaped plate.

6. The transport device as described in claim 5, characterized in that, The semiconductor workpiece is a crystal rod, the included angle of the fan-ring structure is less than or equal to 120 degrees, and the width of the fan-ring structure is greater than the diameter of the crystal rod.

7. The transport device as described in claim 6, characterized in that, The height of the dividing plate is greater than the length of the crystal rod.

8. The transport device as claimed in claim 1, characterized in that, The wheel is a grooved wheel, and the grooved wheel works in conjunction with the transport track of the heat treatment chamber.

9. The transport device as described in claim 2, characterized in that, The thickness of the insulation layer is 50mm-200mm.

10. A heat treatment apparatus, characterized in that, Includes the transport device as described in any one of claims 1-9.

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