3D VC heat spreader

Abstract

The utility model discloses a 3D VC even temperature plate, even temperature plate includes lower cover, upper cover, heat pipe, and upper cover is covered on lower cover and forms evaporation cavity, and the upper cover is provided with through -hole, and the upper cover is equipped with sleeve at corresponding through -hole department, and the heat pipe bottom passes through sleeve and through -hole, and is linked together with evaporation cavity, and the evaporation cavity bottom surface and top surface are equipped with first capillary and third capillary respectively, and is equipped with second capillary between first capillary and third capillary, and is equipped with fourth capillary in heat pipe, the fourth capillary of heat pipe is reliable with second capillary and overlaps and is connected, and has strengthened even temperature plate evaporation condensation effect, has promoted the heat dissipation efficiency and product performance, and product consistency will stability better, the preparation process of the utility model is simple and reliable, is suitable for batch production, and the cost is low.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, and in particular to a 3D VC vapor chamber. Background Technology

[0002] As server computing power increases, the heat flux density of server CPUs also increases, making traditional vapor chambers and heat pipes insufficient for heat dissipation. Compared to traditional vapor chambers, 3D vapor chambers transform heat dissipation from a two-dimensional surface to a three-dimensional heat conduction system, significantly improving the heat dissipation capabilities of electronic components.

[0003] 3D VC (Vapor Chamber) Heatsink Working Principle: 3D VC heatsinks are an advanced heat dissipation technology that improves heat dissipation efficiency. Through phase change thermal conductivity, it transfers heat generated inside electronic devices to the surrounding environment, effectively solving the heat dissipation problem of electronic devices. Due to the high performance requirements of various heat dissipation products and changes in application environments, the requirements for heatsinks have greatly increased. 3D VC heatsinks can increase the heat flux density of the heatsink.

[0004] Traditional heat sinks and vapor chambers (VCs) have the following shortcomings: 1. Traditional heatsinks consist of a flat vapor chamber (VC) + solder paste + heat pipes + fins. To transfer heat from a heat source, the heat source needs to transfer heat to the VVC, which then transfers it to the heat pipes. The heat from the heat pipes is then transferred to the fins. Finally, the fan starts, and the airflow carries the heat away from the fins. Heat cannot be dissipated through the liquid phase conversion within the gas.

[0005] 2. Traditional 3D structures for heat dissipation cannot achieve phase change heat conduction within the entire structure, and traditional heat dissipation is far from meeting the needs of high-performance heat dissipation.

[0006] 3. Traditional heat dissipation applications require multiple individual components to be soldered, and solder paste is needed to connect the solder joints to ensure heat dissipation capacity. At the same time, this also increases the overall thermal resistance of the product, affecting its heat dissipation efficiency. Utility Model Content

[0007] The technical problem to be solved by this utility model embodiment is to provide a 3D VC heat dissipation plate to improve heat dissipation efficiency.

[0008] To address the aforementioned technical problems, this utility model provides a 3D VC vapor chamber, comprising a lower cover, an upper cover, and a heat pipe. The upper cover is fitted onto the lower cover to form an evaporation chamber. A through hole is provided on the upper cover, and a sleeve is provided on the upper cover corresponding to the through hole. The bottom of the heat pipe passes through the sleeve and the through hole and communicates with the evaporation chamber. A first capillary and a third capillary are respectively provided on the bottom and top surfaces of the evaporation chamber. A second capillary is provided between the first and third capillary, and a fourth capillary is provided inside the heat pipe.

[0009] Furthermore, the sleeve is inverted T-shaped.

[0010] Furthermore, the second capillary is cylindrical.

[0011] Furthermore, there are several second capillaries.

[0012] Furthermore, the fourth capillary inside the heat pipe overlaps with the second capillary below the heat pipe.

[0013] Furthermore, there are multiple sets of heat pipes, sleeves, and through holes.

[0014] The beneficial effects of this invention are as follows: Compared with previous radiators, this invention has a continuous internal structure and conducts heat through the phase change of water, eliminating the influence of contact thermal resistance. This invention can distribute heat flux density, allowing the heat flux density of the entire heat source to be diverted to different areas, ensuring consistent heat transfer and solving the high-power problem. The interior of this invention is filled with a highly thermally conductive working fluid. When heated by the heat source, the working fluid evaporates into a gas, carrying heat away from the heat source. Then, the gas condenses into a liquid in the cold zone of the heat pipe, releasing heat. In this way, heat can be quickly and efficiently conducted from the heat source to the heat dissipation fins. The sleeve design of this invention ensures the height and welding consistency of the overlap between the heat pipe and the capillary. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the 3D VC heat spreader from one angle, according to an embodiment of this utility model.

[0016] Figure 2 This is a three-dimensional structural diagram of the 3D VC heat spreader from another angle, according to an embodiment of this utility model.

[0017] Figure 3 This is a side view of the 3D VC heat spreader according to an embodiment of the present invention.

[0018] Figure 4 yes Figure 3 Sectional view at point BB.

[0019] Figure 5 This is an exploded view of the 3D VC heat spreader according to an embodiment of the present invention.

[0020] Explanation of icon numbers 1. Bottom cover, 2. Top cover, 3. Heat pipe, 4. Sleeve, 5. First capillary, 6. Second capillary, 7. Third capillary. Detailed Implementation

[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of this application can be combined with each other. The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] In this embodiment of the invention, directional indicators (such as up, down, left, right, front, back, etc.) are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the attached figure). If the specific posture changes, the directional indicators will also change accordingly.

[0023] Furthermore, in this utility model, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0024] Please refer to Figures 1-5 The 3D VC heat spreader of this utility model embodiment includes a lower cover, an upper cover, and a heat pipe.

[0025] The upper cover fits onto the lower cover to form an evaporation chamber. A through-hole is provided on the upper cover, and a sleeve is provided corresponding to the through-hole. The sleeve can be cylindrical, conical, or other stepped shapes; preferably, it is an inverted T-shape. The bottom of the heat pipe passes through the sleeve and the through-hole, communicating with the evaporation chamber. A fourth capillary is provided inside the heat pipe. The fourth capillary inside the heat pipe overlaps with the second capillary below the heat pipe. The heat pipe can be a 110-tooth oxygen-free copper grooved tube as the main body, with 1 / 3 of its length (0.5mm thick) of copper powder sintered inside as the fourth capillary.

[0026] The bottom and top surfaces of the evaporation chamber are respectively equipped with a first capillary and a third capillary. A second capillary is provided between the first and third capillary. The two ends of the second capillary overlap the first and third capillary, respectively. The second capillary is cylindrical. In specific implementation, it can be obtained by sintering copper pillars and copper powder. There are several second capillaries.

[0027] As one implementation method, there are multiple sets of heat pipes, sleeves, and through holes.

[0028] The preparation method of the 3D VC vapor chamber in this embodiment includes steps 1 to 6.

[0029] Step 1: Prepare the lower cover and upper cover. The lower cover and upper cover are sintered using electrolytic copper powder to form the first capillary and the third capillary on the lower cover and upper cover, respectively. For example, the lower cover can be formed by oxygen-free copper forging (cold forging) process, and the upper cover can be formed by oxygen-free copper stamping process, forming the lower cover and upper cover in one piece; 80-100 mesh electrolytic copper powder can be spread on the lower cover and upper cover respectively, and then sintered at 860℃ in a bell furnace for 2 hours to form 0.4mm to 0.7mm copper powder capillaries. The capillaries on the lower cover are the first capillaries, and the capillaries on the upper cover are the third capillaries.

[0030] Step 2: Sinter to obtain the second capillary, install the second capillary onto the lower cover, and assemble the upper cover onto the lower cover. Weld the upper and lower covers together using diffusion welding. For example, use diffusion welding equipment to weld the upper and lower covers at a high temperature of 860℃ for 2 hours and a pressure of 20T.

[0031] Step 3: Assemble the heat pipe and sleeve and then weld them together. After welding, assemble them onto the top cover.

[0032] Step 4: Weld the sleeve to the top cover, and simultaneously overlap the heat pipe with the second capillary. Various welding methods can be used between the heat pipe and the sleeve, and between the sleeve and the top cover, including diffusion welding, high-frequency induction welding, brazing, and high-temperature welding. For example, a copper-phosphorus brazing ring with 2% silver can be used to weld them together in a brazing furnace at 600℃ in the low-temperature zone, 840℃ in the high-temperature zone, and a furnace speed of 200mm / min.

[0033] Step 5: Annealing and reduction. After confirming there are no leaks, inject the working fluid into the evaporation chamber. For example, a bell furnace can be used for annealing and reduction at a constant temperature of 610℃ for 1.5 hours. Ultrapure water can be used as the working fluid.

[0034] Step 6: Degas and seal the plate to obtain a 3D VC vapor chamber.

[0035] In one implementation method, in step 6, vacuum degassing is performed first, followed by secondary degassing using a degassing machine and sealing.

[0036] The preparation method of the 3D VC vapor chamber in this embodiment includes steps 1 to 6.

[0037] Step 1: Prepare the lower cover and upper cover. The lower cover and upper cover are sintered using electrolytic copper powder to form the first capillary and the third capillary on the lower cover and upper cover, respectively. For example, the lower cover can be formed by oxygen-free copper forging (cold forging) process, and the upper cover can be formed by oxygen-free copper stamping process, forming the lower cover and upper cover in one piece; 80-100 mesh electrolytic copper powder can be spread on the lower cover and upper cover respectively, and then sintered at 860℃ in a bell furnace for 2 hours to form 0.4mm to 0.7mm copper powder capillaries. The capillaries on the lower cover are the first capillaries, and the capillaries on the upper cover are the third capillaries.

[0038] Step 2: Sinter to obtain the second capillary, install the second capillary onto the lower cover, and assemble the upper cover onto the lower cover. Weld the upper and lower covers together using diffusion welding. For example, use diffusion welding equipment to weld the upper and lower covers at a high temperature of 860℃ for 2 hours and a pressure of 20T.

[0039] Step 3: Weld the sleeve to the top cover accordingly.

[0040] Step 4: Insert the heat pipe into the sleeve, overlapping it with the second capillary, and then weld the heat pipe and sleeve together. Various welding methods can be used between the heat pipe and sleeve, and between the sleeve and the top cover, including diffusion welding, high-frequency induction welding, brazing, and high-temperature welding. For example, a copper-phosphorus brazing ring with 2% silver can be used to weld them together in a brazing furnace at 600℃ in the low-temperature zone, 840℃ in the high-temperature zone, and a furnace speed of 200mm / min.

[0041] Step 5: Annealing and reduction. After confirming there are no leaks, inject the working fluid into the evaporation chamber. For example, a bell furnace can be used for annealing and reduction at a constant temperature of 610℃ for 1.5 hours. Ultrapure water can be used as the working fluid.

[0042] Step 6: Degas and seal the plate to obtain a 3D VC vapor chamber.

[0043] In one implementation method, in step 6, vacuum degassing is performed first, followed by secondary degassing using a degassing machine and sealing.

[0044] The fourth capillary in the heat pipe of this invention has a reliable overlap with the second capillary, which enhances the evaporation and condensation effect of the heat spreader, improves heat dissipation efficiency and product performance, and results in better product consistency and stability. The manufacturing process is simple and reliable, suitable for mass production, and has low cost.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A 3D VC vapor chamber, comprising a lower cover, an upper cover, and heat pipes, wherein the upper cover is fitted onto the lower cover to form an evaporation chamber, and the upper cover has a through hole, characterized in that, A sleeve is provided at the corresponding through hole on the top cover; the bottom of the heat pipe passes through the sleeve and the through hole and communicates with the evaporation chamber; a first capillary and a third capillary are respectively provided on the bottom and top surfaces of the evaporation chamber; a second capillary is provided between the first capillary and the third capillary, and a fourth capillary is provided inside the heat pipe.

2. The 3D VC heat spreader as described in claim 1, characterized in that, The sleeve is inverted T-shaped.

3. The 3D VC heat spreader as described in claim 1, characterized in that, The second capillary is cylindrical.

4. The 3D VC heat spreader as described in claim 3, characterized in that, There are several second capillaries.

5. The 3D VC heat spreader as described in claim 1, characterized in that, The fourth capillary inside the heat pipe overlaps with the second capillary below the heat pipe.

6. The 3D VC heat spreader as described in claim 1, characterized in that, There are multiple sets of heat pipes, sleeves, and through holes.

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