Automatic heating and storing device for silicon wafer

Abstract

The utility model relates to semiconductor manufacturing testing device technical field, especially a kind of automatic heating storage device for silicon wafer, including workbench, silicon wafer stage, heating table and storage box are set up with interval on the workbench;Mechanical arm mechanism is set up between the silicon wafer stage and heating table on the workbench, the mechanical arm mechanism receives the silicon wafer on the silicon wafer stage, and the silicon wafer is transferred to the heating table;Suction assembly is set between the heating table and the storage box, the suction assembly adsorbs the silicon wafer on the heating table, and silicon wafer is transferred to the storage box.In electrical property test to silicon wafer, silicon wafer can be automatically transferred, automatic heating and storage are realized, and error and pollution risk caused by manual intervention are reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing testing equipment technology, and in particular to an automatic heating and storage device for silicon wafers. Background Technology

[0002] In the production process of semiconductor silicon wafers, it is necessary to perform electrical testing and defect identification on the dies on the silicon wafers, mark them with ink dots, heat and dry them, and finally store them. Currently, these steps in the production process are independent of each other, and the operation relies on manual labor, which is inefficient and prone to human error, mechanical breakage, and increased risk of silicon wafer contamination.

[0003] After electrical testing, the silicon wafers are manually transferred to the oven. This involves guiding them from the testing platform to the heating stage; improper handling can damage the wafers, affecting product yield. Furthermore, after heating, the wafers need to be removed from the oven and placed in a storage box for cooling. The wafer storage process lacks automation and orderliness.

[0004] With the rapid development of the semiconductor industry, the requirements for automation, integration and precision of production equipment are constantly increasing, necessitating an automatic heating and storage device for silicon wafers. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides an automatic heating and storage device for silicon wafers. After electrical testing of the silicon wafers, it can automatically transfer the wafers, achieving automatic heating and storage, thus reducing errors and contamination risks caused by manual intervention.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, this application provides an automatic heating and storage device for silicon wafers, including a worktable. A silicon wafer carrier, a heating stage, and a storage box are spaced apart on the worktable. A robotic arm mechanism is disposed on the worktable and located between the silicon wafer carrier and the heating stage. The robotic arm mechanism receives silicon wafers from the silicon wafer carrier and transfers the silicon wafers to the heating stage. An adsorption component is disposed between the heating stage and the storage box. The adsorption component adsorbs silicon wafers from the heating stage and transfers the silicon wafers into the storage box.

[0009] Preferably, the silicon wafer stage is circular, and air supply holes are provided on the silicon wafer stage. Multiple air supply holes are arranged at equal angles around the center of the silicon wafer stage. An air supply unit is provided on the lower side of the silicon wafer stage, and the air outlet of the air supply unit is connected to the air supply holes. When the air supply holes spray air outward, the silicon wafers on the silicon wafer stage can be suspended above the silicon wafer stage.

[0010] Preferably, the robotic arm mechanism includes a linear conveying assembly, a mounting plate, a rotary motor, and a tray; the linear conveying assembly is fixedly installed between the silicon wafer stage and the heating stage, the moving end of the linear conveying assembly is connected to the mounting plate, and drives the mounting plate to move closer to one end of the silicon wafer stage or closer to one end of the heating stage; a rotary motor is fixed on the mounting plate, and the tray is fixed on the output shaft of the rotary motor; the height of the tray is higher than the height of the silicon wafer stage and the heating stage, and the height of the tray is lower than the height of the suspended silicon wafer.

[0011] Preferably, the linear conveying assembly includes a first guide rail, a first pulley, a second pulley, a belt, and a drive motor; the first guide rail is fixed to the worktable, with one end of the first guide rail close to the silicon wafer stage and the other end close to the heating stage; a guide block is provided on one side of the mounting plate near the worktable, and the guide block is slidably connected to the first guide rail; the first pulley and the second pulley are both rotatably connected to the upper side of the worktable, and both the first pulley and the second pulley are located on one side of the first guide rail; the belt is connected to the first pulley and the second pulley, and the belt conveying direction is parallel to the length direction of the first guide rail; the end of the mounting plate away from the rotary motor is fixedly connected to the belt; the drive motor is connected to the first pulley or the second pulley.

[0012] Preferably, a heating wire is provided inside the heating table; a rectangular frame is provided on the worktable and outside the heating table; a lifting assembly is provided on the worktable and outside the rectangular frame, the lifting end of the lifting assembly is connected to a protective box, the lower end of the protective box forms an opening, and when the protective box descends, the protective box and the rectangular frame are engaged.

[0013] Preferably, the lifting assembly includes a second guide rail, a movable seat, a drive screw, and a lifting motor; the second guide rail is vertically fixed to the worktable, and two second guide rails are spaced apart and parallel to each other, with an end plate fixed to the end of the second guide rail away from the worktable; the movable seat is slidably arranged between the two second guide rails, and the movable seat is fixedly connected to the protective box; the drive screw is located between the two second guide rails and parallel to the second guide rails, and both ends of the drive screw are rotatably connected to the worktable and the end plate, respectively; the drive screw passes through the movable seat and is threadedly connected to the movable seat; the lifting motor is connected to the drive screw and drives the drive screw to rotate forward or backward.

[0014] Preferably, the adsorption assembly includes a rodless cylinder, a dual-row cylinder, a connecting arm, and first suction cups; the rodless cylinder is fixed to one side between the heating platform and the storage box, with one end of the rodless cylinder close to the heating platform and the other end close to the storage box; the moving end of the rodless cylinder is fixedly connected to the dual-row cylinder, and the piston end of the dual-row cylinder is connected to the connecting arm, controlling the connecting arm to move vertically; the end of the connecting arm away from the dual-row cylinder is located above the heating platform or the storage box; a plurality of first suction cups are fixedly spaced on the side of the connecting arm close to the heating platform and the storage box, and the first suction cups are connected to control air pipes.

[0015] Preferably, a limiting member is provided inside the protective box to limit the silicon wafer on the tray.

[0016] Preferably, the limiting component includes a second suction cup located inside the protective box, the height of the second suction cup being higher than the opening. A negative pressure unit is provided on the worktable. When the pallet moves directly above the heating table, the negative pressure unit provides negative pressure to the second suction cup. When the pallet moves out of the heating table, the negative pressure unit stops providing negative pressure to the second suction cup.

[0017] Preferably, the limiting component includes a lifting component and a limiting ring. The lifting component is fixed inside the protective box, and the lifting end of the lifting component is fixedly connected to the limiting ring. The diameter of the limiting ring is larger than the diameter of the silicon wafer. When the pallet moves directly above the heating platform, the lifting component controls the limiting ring to descend and cover the silicon wafer, and abuts against the pallet.

[0018] (III) Beneficial Effects

[0019] This invention provides an automatic heating and storage device for silicon wafers. By incorporating a robotic arm mechanism and an adsorption assembly between the silicon wafer carrier and the heating platform storage box, the device can automatically transfer the silicon wafers after electrical testing, achieving automatic heating and storage. This significantly improves production efficiency and reduces errors and contamination risks caused by manual intervention. It ensures the quality of silicon wafer heating while meeting process requirements; the safe and reliable storage method effectively avoids silicon wafer damage, improves product yield, reduces production costs, and enhances the company's market competitiveness. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of an automatic heating and storage device for silicon wafers according to the present invention;

[0021] Figure 2 This is a schematic diagram of the protruding robotic arm mechanism of this utility model;

[0022] Figure 3 This is a cross-sectional view of the protruding guide block of this utility model;

[0023] Figure 4 This is a schematic diagram of the heating platform of this utility model;

[0024] Figure 5 This is a schematic diagram of the lifting component of this utility model;

[0025] Figure 6 This is a schematic diagram of the adsorption component of this utility model;

[0026] Figure 7 This is a schematic diagram showing the first suction cup of this utility model.

[0027] Figure 8 This is a schematic diagram of the prominent limiting member in the second embodiment of this utility model.

[0028] Marked in the attached diagram:

[0029] 100. Workbench; 200. Silicon wafer stage; 210. Air supply port; 300. Heating table; 310. Rectangular frame; 320. Protective box; 330. Limiting component; 331. Second suction cup; 332. Lifting component; 333. Limiting ring; 400. Storage box; 500. Robotic arm mechanism; 510. Linear transmission assembly; 511. First guide rail; 512. First pulley; 513. Second pulley; 514. Belt 515. Drive motor; 520. Mounting plate; 521. Guide block; 522. Mounting port; 530. Rotary motor; 540. Support plate; 600. Adsorption assembly; 610. Rodless cylinder; 620. Double exhaust cylinder; 630. Connecting arm; 640. First suction cup; 700. Lifting assembly; 710. Second guide rail; 720. Moving seat; 730. Drive screw; 740. Lifting motor; 750. End plate. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] First Embodiment

[0032] This utility model provides an automatic heating and storage device for silicon wafers, see [link]. Figures 1-7 The system includes a worktable 100, on which a silicon wafer carrier 200, a heating stage 300, and a storage box 400 are spaced apart. After the silicon wafers are inspected on the silicon wafer carrier 200, they are placed on the heating stage 300 for heating. After a set heating time, the silicon wafers are transferred to the storage box 400 for cooling.

[0033] A robotic arm mechanism 500 is provided on the worktable 100 and located between the silicon wafer stage 200 and the heating stage 300. The robotic arm mechanism 500 receives the silicon wafers on the silicon wafer stage 200 and transfers the silicon wafers to the heating stage 300. An adsorption component 600 is provided between the heating stage 300 and the storage box 400. The adsorption component 600 adsorbs the silicon wafers on the heating stage 300 and transfers the silicon wafers into the storage box 400.

[0034] The silicon wafer stage 200 is circular, and air supply holes 210 are provided on the silicon wafer stage 200. Multiple air supply holes 210 are arranged at equal angles around the center of the silicon wafer stage 200. An air supply unit is provided on the lower side of the silicon wafer stage 200, and the air outlet of the air supply unit is connected to the air supply holes 210. When air is expelled from the air supply holes 210, the silicon wafer on the silicon wafer stage 200 can be suspended above the silicon wafer stage 200. When the silicon wafer is suspended on the silicon wafer stage 200, the robotic arm mechanism 500 can receive the suspended silicon wafer.

[0035] The robotic arm mechanism 500 includes a linear transmission assembly 510, a mounting plate 520, a rotary motor 530, and a pallet 540.

[0036] The linear conveyor assembly 510 is fixedly installed between the silicon wafer stage 200 and the heating stage 300. The moving end of the linear conveyor assembly 510 is connected to the mounting plate 520 and drives the mounting plate 520 to move closer to one end of the silicon wafer stage 200 or closer to one end of the heating stage 300.

[0037] The linear transmission assembly 510 includes a first guide rail 511, a first pulley 512, a second pulley 513, a belt 514, and a drive motor 515.

[0038] The first guide rail 511 is fixed on the worktable 100, with one end of the first guide rail 511 close to the silicon wafer stage 200 and the other end close to the heating stage 300. A guide block 521 is provided on the side of the mounting plate 520 near the worktable 100, and the guide block 521 and the first guide rail 511 are slidably connected. Specifically, a limiting groove is formed at the lower end of the guide block 521, through which the first guide rail 511 passes and is limited, so that the mounting plate 520 can move linearly along the first guide rail 511.

[0039] The first pulley 512 and the second pulley 513 are both rotatably connected to the upper side of the worktable 100, and both are located on one side of the first guide rail 511. A belt 514 is connected to the first pulley 512 and the second pulley 513, and the belt 514 is driven in a direction parallel to the length of the first guide rail 511. The end of the mounting plate 520 away from the rotary motor 530 is fixedly connected to the belt 514. The drive motor 515 is connected to either the first pulley 512 or the second pulley 513. When the drive motor 515 drives the belt 514 in the forward or reverse direction, it will move the mounting plate 520 towards the end closer to the silicon wafer stage 200 or towards the end closer to the heating stage 300.

[0040] A rotary motor 530 is fixed on the mounting plate 520. Specifically, a mounting opening 522 is provided at the end of the mounting plate 520 away from the first guide rail 511. The rotary motor 530 is fitted into the mounting opening 522, with the output shaft of the rotary motor 530 facing upwards, and a support plate 540 is fixed thereon. The height of the support plate 540 is higher than the height of the silicon wafer stage 200 and the heating stage 300, and the height of the support plate 540 is lower than the height of the suspended silicon wafer.

[0041] When the mounting plate 520 moves to one end of the silicon wafer stage 200, the rotary motor 530 drives the tray 540 to rotate directly above the silicon wafer stage 200, and the air supply unit stops supplying air, causing the silicon wafer to fall onto the tray 540. When the mounting plate 520 moves towards the heating stage 300, the rotary motor 530 drives the tray 540 to rotate to the end closest to the heating stage 300 until the silicon wafer is directly above the heating stage 300.

[0042] A heating wire is installed inside the heating table 300; the heating wire may be ring-shaped, but is not shown in the attached drawing. The heating table 300 is heated by the heating wire. A rectangular frame 310 is installed on the worktable 100 and outside the heating table 300; a lifting assembly 700 is installed on the worktable 100 and outside the rectangular frame 310. The lifting end of the lifting assembly 700 is connected to a protective box 320. The lower end of the protective box 320 forms an opening. When the protective box 320 descends, the protective box 320 and the rectangular frame 310 are engaged.

[0043] The lifting assembly 700 includes a second guide rail 710, a movable seat 720, a drive screw 730, and a lifting motor 740.

[0044] The second guide rail 710 is vertically fixed on the workbench 100. Two second guide rails 710 are arranged at intervals and in parallel. An end plate 750 is fixed at the end of the second guide rail 710 away from the workbench 100. A movable seat 720 is slidably arranged between the two second guide rails 710. The movable seat 720 is fixedly connected to the protective box 320.

[0045] The drive screw 730 is located between two second guide rails 710 and is parallel to the second guide rails 710. The two ends of the drive screw 730 are rotatably connected to the worktable 100 and the end plate 750, respectively. The drive screw 730 passes through the movable seat 720 and is threadedly connected to the movable seat 720. The lifting motor 740 is connected to the drive screw 730 and drives the drive screw 730 to rotate forward or in reverse.

[0046] A limiting member 330 is provided inside the protective box 320 to limit the silicon wafer on the tray 540. When the tray 540 carrying the silicon wafer enters the heating stage 300, the protective box 320 descends a certain distance. At this time, the protective box 320 is above the tray 540, and the silicon wafer is limited by the limiting member 330. At this time, the tray 540 can be removed, and the silicon wafer will fall onto the heating stage 300.

[0047] In one embodiment, the limiting member 330 includes a second suction cup 331 located inside the protective box 320. The height of the second suction cup 331 is higher than the opening. A negative pressure unit is provided on the worktable 100. When the tray 540 moves directly above the heating table 300, the negative pressure unit provides negative pressure to the second suction cup 331. The second suction cup 331 approaches the silicon wafer and generates suction on the silicon wafer. When the tray 540 moves out of the heating table 300, the silicon wafer can stay below the protective box 320. After the tray 540 moves out of the heating table 300, the negative pressure unit stops providing negative pressure to the second suction cup 331, and the silicon wafer falls onto the heating table 300 for heating.

[0048] After the heating time is set, the protective box 320 is opened, and the adsorption component 600 transfers the silicon wafer.

[0049] The adsorption assembly 600 includes a rodless cylinder 610, a dual-exhaust cylinder 620, a connecting arm 630, and a first suction cup 640.

[0050] A rodless cylinder 610 is fixed to one side between the heating platform 300 and the storage box 400, with one end of the rodless cylinder 610 close to the heating platform 300 and the other end close to the storage box 400. The end of the rodless cylinder 610 near the storage box 400 is fixedly connected to the worktable 100, while the end near the heating platform 300 is suspended. Therefore, when the pallet 540 transports silicon wafers, the rodless cylinder 610 can pass underneath it. After the pallet 540 leaves the heating platform 300, the adsorption assembly 600 can normally transfer the silicon wafers without interfering with each other.

[0051] The moving end of the rodless cylinder 610 is fixedly connected to the double-row cylinder 620. The piston end of the double-row cylinder 620 is connected to a connecting arm 630, which controls the vertical movement of the connecting arm 630. The end of the connecting arm 630 away from the double-row cylinder 620 is located above the heating platform 300 or the storage box 400. Multiple first suction cups 640 are fixedly spaced on the side of the connecting arm 630 closest to the heating platform 300 or the storage box 400. Each first suction cup 640 is connected to a control air pipe, the other end of which can be equipped with a control valve or a positive / negative pressure air supply unit. When a control valve is used alone, when the control valve is closed, the first suction cups 640 can lift the silicon wafer when pressed against it. When it is necessary to release the wafer, the control valve is opened to allow air to pass through, and the silicon wafer falls under gravity. When the positive and negative pressure air supply unit is set, when the first suction cup 640 is pressed on the silicon wafer, the positive and negative pressure air supply unit provides negative pressure, so that the first suction cup 640 clamps the silicon wafer tightly. When it is necessary to release the silicon wafer, positive and negative pressure air is supplied to the first suction cup 640, so that the first suction cup 640 releases the silicon wafer.

[0052] This invention provides an automatic heating and storage device for silicon wafers. The working process is as follows: After the silicon wafer completes the previous testing on the wafer stage 200, it is received by a robotic arm mechanism 500 and moved to the heating stage 300. During this process, the air supply unit supplies air to the air supply port 210, causing the air supply port 210 to expel air, thus suspending the silicon wafer above the wafer stage 200. The drive motor 515 controls the belt 514 to drive the mounting plate 520 towards one end closer to the wafer stage 200. Simultaneously, the rotary motor 530 controls the tray 540 to rotate towards the wafer stage 200. The tray 540 eventually moves to a position below the suspended silicon wafer and stops. At this point, the air supply unit stops supplying air, and the silicon wafer falls onto the tray 540, completing the receiving action.

[0053] The rotary motor 530 controls the tray 540 to rotate to the end facing the heating platform 300, and at the same time the drive motor 515 drives the belt 514 to move the tray 540 above the heating platform 300. At this time, the lifting assembly 700 controls the protective box 320 to descend for the first time, descending until the limit piece 330 abuts against the tray 540. At this time, the control tray 540 is pulled out of the heating platform 300, and the silicon wafer falls on the heating platform 300 for heating. The lifting assembly 700 controls the protective box 320 to descend for the second time, descending until it is engaged with the rectangular frame 310 and stops.

[0054] After the set heating time, the lifting assembly 700 controls the protective box 320 to lift, and the adsorption assembly 600 transfers the silicon wafer to the storage box 400. Specifically: the rodless cylinder 610 drives the double-row cylinder 620 to move to one end near the heating platform 300. At this time, the first suction cup 640 is located directly above the heating platform 300. The double-row cylinder 620 controls the connecting arm 630 to descend, causing multiple first suction cups 640 to pick up the silicon wafer. When it moves above the storage box 400, the first suction cups 640 release the silicon wafer, causing it to fall into the storage box 400.

[0055] Second Embodiment

[0056] See Figure 8 The difference between this embodiment and the first embodiment is the limiting member 330.

[0057] The limiting component 330 includes a lifting component 332 and a limiting ring 333. The lifting component 332 is fixed inside the protective box 320. The lifting end of the lifting component 332 is fixedly connected to the limiting ring 333. The diameter of the limiting ring 333 is larger than the diameter of the silicon wafer. When the tray 540 moves directly above the heating platform 300, the lifting component 332 controls the limiting ring 333 to descend and cover the silicon wafer, abutting against the tray 540. At this time, when the tray 540 moves outward, the limiting ring 333 can limit the silicon wafer, causing the silicon wafer to separate from the tray 540. The end of the limiting ring 333 near the tray 540 is made of flexible material, which will not damage the silicon wafer during the limiting process.

[0058] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "front," and "rear," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0059] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Without conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0060] The embodiments described above are merely illustrative of the implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An automatic heating and storage device for silicon wafers, characterized in that: Includes a worktable (100), on which a silicon wafer stage (200), a heating stage (300) and a storage box (400) are spaced apart. A robotic arm mechanism (500) is provided on the worktable (100) and between the silicon wafer stage (200) and the heating stage (300). The robotic arm mechanism (500) receives the silicon wafer on the silicon wafer stage (200) and transfers the silicon wafer to the heating stage (300). An adsorption component (600) is provided between the heating platform (300) and the storage box (400). The adsorption component (600) adsorbs the silicon wafer on the heating platform (300) and transfers the silicon wafer into the storage box (400).

2. The automatic heating and storage device for silicon wafers according to claim 1, characterized in that: The silicon wafer stage (200) is circular, and air supply holes (210) are provided on the silicon wafer stage (200). Multiple air supply holes (210) are provided at equal angles around the center of the silicon wafer stage (200). An air supply unit is provided on the lower side of the silicon wafer stage (200). The air outlet of the air supply unit is connected to the air supply hole (210). When the air supply hole (210) sprays air outward, the silicon wafer on the silicon wafer stage (200) can be suspended above the silicon wafer stage (200).

3. The automatic heating and storage device for silicon wafers according to claim 1, characterized in that: The robotic arm mechanism (500) includes a linear conveyor assembly (510), a mounting plate (520), a rotary motor (530), and a pallet (540). The linear conveying assembly (510) is fixedly installed between the silicon wafer stage (200) and the heating stage (300). The movable end of the linear conveying assembly (510) is connected to the mounting plate (520) and drives the mounting plate (520) to move closer to one end of the silicon wafer stage (200) or closer to one end of the heating stage (300). A rotary motor (530) is fixed on the mounting plate (520), and a support plate (540) is fixed on the output shaft of the rotary motor (530); the height of the support plate (540) is higher than the height of the silicon wafer stage (200) and the heating stage (300), and the height of the support plate (540) is lower than the height of the suspended silicon wafer.

4. The automatic heating and storage device for silicon wafers according to claim 3, characterized in that: The linear transmission assembly (510) includes a first guide rail (511), a first pulley (512), a second pulley (513), a belt (514), and a drive motor (515). The first guide rail (511) is fixed on the worktable (100), and one end of the first guide rail (511) is close to the silicon wafer stage (200), and the other end is close to the heating stage (300); a guide block (521) is provided on one side of the mounting plate (520) near the worktable (100), and the guide block (521) and the first guide rail (511) are slidably connected; The first pulley (512) and the second pulley (513) are both rotatably connected to the upper side of the worktable (100), and the first pulley (512) and the second pulley (513) are both located on one side of the first guide rail (511); the belt (514) is connected to the first pulley (512) and the second pulley (513), and the belt (514) is driven in a direction parallel to the length direction of the first guide rail (511); The end of the mounting plate (520) away from the rotary motor (530) is fixedly connected to the belt (514); the drive motor (515) is connected to the first pulley (512) or the second pulley (513).

5. The automatic heating and storage device for silicon wafers according to claim 3, characterized in that: A heating wire is provided inside the heating table (300); a rectangular frame (310) is provided on the workbench (100) and outside the heating table (300). A lifting assembly (700) is provided on the workbench (100) and outside the rectangular frame (310). The lifting end of the lifting assembly (700) is connected to a protective box (320). The lower end of the protective box (320) forms an opening. When the protective box (320) descends, the protective box (320) and the rectangular frame (310) are fastened together.

6. The automatic heating and storage device for silicon wafers according to claim 5, characterized in that: The lifting assembly (700) includes a second guide rail (710), a movable seat (720), a drive screw (730), and a lifting motor (740). The second guide rail (710) is vertically fixed on the worktable (100). Two second guide rails (710) are arranged at intervals and in parallel. An end plate (750) is fixed at the end of the second guide rail (710) away from the worktable (100). The movable seat (720) is slidably arranged between two second guide rails (710), and the movable seat (720) and the protective box (320) are fixedly connected; The drive screw (730) is located between two second guide rails (710) and is parallel to the second guide rails (710). The two ends of the drive screw (730) are rotatably connected to the worktable (100) and the end plate (750) respectively. The drive screw (730) passes through the movable seat (720) and is threadedly connected to the movable seat (720). The lifting motor (740) is connected to the drive screw (730) and drives the drive screw (730) to rotate forward or in reverse.

7. The automatic heating and storage device for silicon wafers according to claim 1, characterized in that: The adsorption assembly (600) includes a rodless cylinder (610), a dual-exhaust cylinder (620), a connecting arm (630), and a first suction cup (640). The rodless cylinder (610) is fixed on one side between the heating platform (300) and the storage box (400), with one end of the rodless cylinder (610) close to the heating platform (300) and the other end close to the storage box (400). The moving end of the rodless cylinder (610) is fixedly connected to the double-row cylinder (620), the piston end of the double-row cylinder (620) is connected to the connecting arm (630), and the connecting arm (630) is controlled to move in the vertical direction; the end of the connecting arm (630) away from the double-row cylinder (620) is located above the heating table (300) or the storage box (400); The connecting arm (630) has multiple first suction cups (640) fixed at intervals on one side near the heating table (300) and the storage box (400), and the first suction cups (640) are connected to control air pipes.

8. The automatic heating and storage device for silicon wafers according to claim 6, characterized in that: The protective box (320) is provided with a limiting member (330) inside, which limits the silicon wafer on the tray (540).

9. The automatic heating and storage device for silicon wafers according to claim 8, characterized in that: The limiting component (330) includes a second suction cup (331), which is located inside the protective box (320). The height of the second suction cup (331) is higher than the opening. A negative pressure unit is provided on the worktable (100). When the tray (540) moves directly above the heating table (300), the negative pressure unit provides negative pressure to the second suction cup (331). When the tray (540) moves out of the heating table (300), the negative pressure unit stops providing negative pressure to the second suction cup (331).

10. The automatic heating and storage device for silicon wafers according to claim 9, characterized in that: The limiting component (330) includes a lifting component (332) and a limiting ring (333). The lifting component (332) is fixed inside the protective box (320). The lifting end of the lifting component (332) is fixedly connected to the limiting ring (333). The diameter of the limiting ring (333) is larger than the diameter of the silicon wafer. When the tray (540) moves directly above the heating platform (300), the lifting component (332) controls the limiting ring (333) to descend and cover the silicon wafer, and abut against the tray (540).

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