High efficiency optical device solder structure
By using titanium alloy fixtures and positioning posts, the problems of precision and stability in the welding of optical components in optical modules were solved, achieving high-efficiency welding of optical components, improving welding yield and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 深圳市兆驰瑞谷科技有限公司
- Filing Date
- 2025-08-26
- Publication Date
- 2026-08-04
AI Technical Summary
In high data rate optical modules, the welding quality of optical transmitting and receiving components is difficult to guarantee, resulting in defects such as warping, displacement, poor soldering, and bridging. Furthermore, traditional fixtures are prone to deformation at high temperatures and cannot meet precision requirements.
By using titanium alloy fixtures and positioning posts, combined with a flat optical device housing and a precise welding structure, the system achieves automated pick-up and positioning of the light emitting and receiving components. With the help of reflow solder paste, the welding accuracy and stability are ensured.
It improved the welding yield by 8%–12%, shortened the welding cycle, reduced labor costs, and reduced the risk of static electricity and contamination, thus achieving high-efficiency welding of optical devices.
Smart Images
Figure CN224587147U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical communication technology, and in particular to a high-efficiency optical device welding structure for reflow soldering of optical modules and optical devices. Background Technology
[0002] Optical modules typically consist of a structural housing, optical components, and a PCBA (Printed Circuit Board Assembly) circuit board. The connection between the optical components and the PCB is generally achieved through component pin soldering or flexible board soldering. In optical modules with speeds of 10G and above, the optical transmitter assembly (TOSA) and optical receiver assembly (ROSA) are core components, and their soldering quality directly determines the module's optoelectronic performance and long-term reliability. During batch reflow soldering of optical modules, PCB panels are prone to warping and displacement, leading to uneven solder paste thickness, component misalignment, and defects such as cold solder joints and bridging. Simultaneously, traditional synthetic stone fixtures are prone to deformation at high temperatures, and the large gaps between the positioning holes and the PCB cannot meet the ±0.05mm mounting accuracy requirements for products with speeds of 10G and above. Utility Model Content
[0003] A brief overview of embodiments of the present invention is provided below to provide a basic understanding of certain aspects of the invention. It should be understood that this overview is not an exhaustive summary of the invention. It is not intended to identify key or essential parts of the invention, nor is it intended to limit the scope of the invention. Its purpose is merely to present certain concepts in a simplified form as a prelude to the more detailed description that follows.
[0004] Specifically, this utility model provides a high-efficiency optical device welding structure, including a PCB board, a pad assembly, a reflow solder paste layer, a light emitting component (TOSA), a light receiving component (ROSA), and a titanium alloy fixture. The pad assembly is disposed on the PCB board, and the reflow solder paste layer covers the pad assembly. The light emitting component (TOSA) and the light receiving component (ROSA) are welded to the PCB board through the pad assembly. The pins of the light emitting component (TOSA) and the light receiving component (ROSA) are arranged in the same direction. The titanium alloy fixture includes a body, on which a mounting position for placing the PCB board is provided, and positioning posts are provided around the mounting position. The PCB board is provided with corresponding positioning holes, which interfere with the positioning posts of the titanium alloy fixture.
[0005] Furthermore, the top of the housings of the optical emitting component TOSA and the optical receiving component ROSA are designed as flat, clean surfaces, allowing the vacuum nozzle of the pick-and-place machine to directly pick up and precisely place them onto the pad assembly without the need for manual clamping.
[0006] Furthermore, the body of the titanium alloy fixture has U-shaped clearance grooves at the corresponding positions of the optical ports of the optical emitting component TOSA and the optical receiving component ROSA, which can conveniently fix the PCB board and the optical emitting component TOSA and the optical receiving component ROSA during the reflow soldering process.
[0007] Furthermore, the positioning post is a cross-shaped positioning post. Even further, the cross-shaped positioning post consists of a cylindrical section and a cross-shaped rib section, the diameter of the cylindrical section being smaller than the positioning hole on the PCB board by a preset value (e.g., 0.02mm), and the maximum outer diameter of the cross-shaped rib section being larger than the positioning hole on the PCB board by a preset value (e.g., 0.05mm).
[0008] The PCB board can be FR-4 or a high-frequency mixed-voltage PCB panel.
[0009] Furthermore, the thickness of the reflow solder paste layer is 0.20mm–0.30mm.
[0010] Furthermore, the optical emitting component TOSA is a single-row pin optical device with a row of four gold-plated copper alloy pins.
[0011] Furthermore, the optical receiver component ROSA is a single-row pin optical device with a row of 5 gold-plated copper alloy pins.
[0012] Furthermore, the titanium alloy fixture is also provided with a pressure plate buckle, which is hinged to both sides of the titanium alloy fixture and is used to press the edge of the PCB board for a second time.
[0013] Furthermore, the PCB board is provided with vent holes that penetrate the PCB board. The vent holes can be located between the light emitting component TOSA and the light receiving component ROSA for thermal balance during reflow soldering.
[0014] This invention achieves a high-efficiency optical device welding structure through the above solution, which has the following beneficial effects: it eliminates the pin forming process, and a single row of pins can be directly reflow soldered synchronously with the PCB pads, improving the yield by 8%–12%; at the same time, it can share an SMT line with conventional surface mount devices, reducing the cycle time from 180s / pcs to 45s / pcs; it reduces labor costs by more than 30% and significantly reduces the risk of static electricity and contamination caused by manual handling. Attached Figure Description
[0015] This invention can be better understood by referring to the following description taken in conjunction with the accompanying drawings, in which the same or similar reference numerals are used throughout the drawings to denote the same or similar parts. These drawings, together with the following detailed description, are incorporated in and form part of this specification, and are used to further illustrate preferred embodiments of the invention and explain the principles and advantages of the invention. In the drawings: Figure 1 This is a schematic diagram of the welding structure for optical devices; Figure 2 This is a schematic diagram of the PCB board, the optical emitting component TOSA, and the optical receiving component ROSA in the optical device welding structure; Figure 3 This is a perspective view of the welding structure of an optical device.
[0016] In the diagram: 1-PCB board, 2-TOSA optical transmitter, 3-ROSA optical receiver, 4-titanium alloy fixture, 41-pressure plate buckle, 5-housing. Detailed Implementation
[0017] Embodiments of the present invention will now be described with reference to the accompanying drawings. Elements and features described in one drawing or embodiment of the present invention may be combined with elements and features shown in one or more other drawings or embodiments. It should be noted that, for clarity, representations and descriptions of components and processes unrelated to the present invention and known to those skilled in the art have been omitted from the drawings and description.
[0018] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0019] This embodiment implements a rapid assembly and soldering structure suitable for optical modules and optical devices. Through structural improvements and SMT reflow soldering, it achieves the simultaneous soldering of optical devices and other components to the PCB. The structure mainly consists of three parts: the first part is the optical transmitter assembly (TOSA), the main component of the optical transmitter module, which primarily converts electrical signals to optical signals; the second part is the optical receiver assembly (ROSA); and the third part is the PCBA board structure, which is also the main component of the module. In high-data-rate optical modules, PIN or ADP photodiodes and TIAs are typically assembled in a sealed metal casing to form the optical receiver assembly. The assembly of these three parts, plus the casing structure, forms the optical module commonly used in fiber optic communication.
[0020] For details, see Figures 1-3 This embodiment provides a high-efficiency optical device welding structure, including a PCB board 1, a pad group, a reflow solder paste layer, an optical emitting component TOSA 2, an optical receiving component ROSA 3, a titanium alloy fixture 4, and a housing 5. The pad group is disposed on the PCB board, and the reflow solder paste layer covers the pad group. The optical emitting component TOSA and the optical receiving component ROSA are welded to the PCB board through the pad group. The pin arrangement direction of the optical emitting component TOSA and the optical receiving component ROSA is consistent. The titanium alloy fixture includes a body, on which a mounting position for placing the PCB board is provided, and positioning posts are provided around the mounting position. The PCB board is provided with corresponding positioning holes, which interfere with the positioning posts of the titanium alloy fixture.
[0021] The top of the housings of the light emitting module TOSA2 and the light receiving module ROSA3 are designed with a flat, clean surface. The vacuum nozzle of the pick-and-place machine can directly pick up and accurately place the components onto the pads without manual clamping. In actual design, the flat surface of the top of the housings of the light emitting module TOSA2 and the light receiving module ROSA3 can be brushed or mirrored to prevent air leakage; the flatness is generally ≤0.05 mm to ensure vacuum stability; in addition, small steps or chamfers can be added to the edges of the flat surface to prevent the nozzle from slipping.
[0022] The body of the titanium alloy fixture 4 has a U-shaped clearance groove at the corresponding position of the optical port of the optical emitting component TOSA2 and the optical receiving component ROSA3, which can conveniently fix the PCB board 1 and the optical emitting component TOSA2 and the optical receiving component ROSA3 during the reflow soldering process.
[0023] PCB board 1 can be FR-4 or a high-frequency mixed-voltage PCB panel. The positioning posts are cross-shaped, specifically composed of a cylindrical section and a cross-shaped rib section. The diameter of the cylindrical section is smaller than the positioning hole on PCB board 1 by a preset value (e.g., 0.02mm), and the maximum outer diameter of the cross-shaped rib section is larger than the positioning hole on PCB board 1 by a preset value (e.g., 0.05mm). The thickness of the reflow solder paste layer is 0.20mm–0.30mm.
[0024] The optical transmitter component TOSA2 is a single-row pin optical device with four gold-plated copper alloy pins in one row. The optical receiver component ROSA3 is a single-row pin optical device with five gold-plated copper alloy pins in one row.
[0025] The titanium alloy fixture 4 is also provided with a pressure plate buckle 41, which is hinged to both sides of the titanium alloy fixture 4 and is used to press the edge of the PCB board 1 for a second time.
[0026] The PCB board 1 has an exhaust hole that extends through the PCB board 1. The exhaust hole can be located between the light emitting component TOSA2 and the light receiving component ROSA3 for thermal balance during reflow soldering.
[0027] In use, the PCB board 1 is pressed into the cross-shaped positioning post of the titanium alloy fixture 4 through the positioning hole to achieve zero shaking; after the TOSA and ROSA are picked up by the pick-and-place machine, they fall onto the pad group on the PCB board 1, and the pins contact the solder paste. After the soldering is completed, they are installed into the bottom shell to form the high-efficiency optical device soldering structure of this application.
[0028] Although the present invention has been disclosed above through the description of specific embodiments, it should be understood that all the embodiments and examples described above are exemplary and not restrictive. Those skilled in the art can design various modifications, improvements, or equivalents to the present invention within the spirit and scope of the appended claims. These modifications, improvements, or equivalents should also be considered to be included within the protection scope of the present invention.
Claims
1. A high-efficiency optical device welding structure, characterized in that: The device includes a PCB board, pad assembly, reflow solder paste layer, optical emitting component (TOSA), optical receiving component (ROSA), and titanium alloy fixture. The pad assembly is located on the PCB board, and the reflow solder paste layer covers the pad assembly. The TOSA and ROSA are soldered to the PCB board via the pad assembly. The pins of the TOSA and ROSA are arranged in the same direction. The titanium alloy fixture includes a body with a mounting position for placing the PCB board, and positioning posts are provided around the mounting position. The PCB board has corresponding positioning holes that interfere with the positioning posts of the titanium alloy fixture.
2. The high-efficiency optical device welding structure according to claim 1, characterized in that: The top of the housings of the optical emitting component TOSA and the optical receiving component ROSA are designed with flat surfaces so that the vacuum nozzle of the pick-and-place machine can pick them up directly.
3. The high-efficiency optical device welding structure according to claim 1, characterized in that: The titanium alloy fixture is also provided with a pressure plate buckle, which is hinged to both sides of the titanium alloy fixture body and is used to press the edge of the PCB board for a second time.
4. The high-efficiency optical device welding structure according to claim 1, characterized in that: The PCB board is provided with an exhaust hole, which is set through the PCB board.
5. The high-efficiency optical device welding structure according to claim 1, characterized in that: The positioning post is a cross-shaped positioning post, which is composed of a cylindrical section and a cross rib section. The diameter of the cylindrical section is smaller than the positioning hole on the PCB board, and the maximum outer diameter of the cross rib section is larger than the positioning hole on the PCB board.
6. The high-efficiency optical device welding structure according to claim 1, characterized in that: The thickness of the reflow solder paste layer is 0.20mm–0.30mm.
7. The high-efficiency optical device welding structure according to claim 1, characterized in that: The optical emitting component TOSA is a single-row pin optical device with a row of four gold-plated copper alloy pins.
8. The high-efficiency optical device welding structure according to claim 1, characterized in that: The optical receiver component ROSA is a single-row pin optical device with a row of 5 gold-plated copper alloy pins.