A solder paste dispensing device

Abstract

This utility model discloses a solder paste dispensing device, relating to the technical field of solder paste dispensing devices. It includes a mounting frame and a solder paste cylinder. The solder paste cylinder is located on one side of the mounting frame. A piston plate is slidably connected inside the solder paste cylinder, and solder paste is disposed between the bottom end of the piston plate and the inside of the solder paste cylinder. A pressing rod is fixedly connected to the top end of the piston plate, and a round hole is drilled at the inner top end of the solder paste cylinder. This utility model, through a sealing and cleaning mechanism, allows for the scraping and cleaning of residual solder paste at the bottom outlet of the solder paste cylinder after dispensing, using a scraper. A sealing sleeve seals the bottom outlet, reducing contact with air, preventing solidification, and lowering the possibility of blockage. A vibration-assisted removal mechanism uses vibration during the scraping and cleaning process to dislodge solder paste adhering to the scraper, reducing adhesion and minimizing interference with the scraper's cleaning process, thus ensuring effective cleaning.

Description

Technical Field

[0001] This utility model belongs to the technical field of solder paste dispensing devices, and in particular relates to a solder paste dispensing device. Background Technology

[0002] Solder paste is a gray paste-like substance. It's a new type of soldering material that emerged with the development of SMT (Surface Mount Technology). It's a paste-like mixture of solder powder, flux, and other surfactants and thixotropic agents, primarily used for soldering electronic components such as resistors, capacitors, and ICs on PCBs in the SMT industry. Solder paste dispensing devices are mainly used to mechanically extrude solder paste from a container and apply it to the pads of the PCB (Printed Circuit Board).

[0003] For example, CN218340222U discloses a solder paste metering extrusion mechanism, comprising: a fixed frame for supporting a connecting frame; a connecting frame with an extrusion component for extruding solder paste, a graduated metering tube connected below the extrusion component, and a limiting component for limiting the amount of solder paste inside the metering tube; and a storage container with a one-way valve component on one side, which communicates with the metering tube for injecting solder paste into the metering tube. This invention, by setting up the extrusion component, can effectively control the amount of solder paste to be applied under the action of two limiting blocks and the graduations on the surface of the metering tube, preventing waste. Simultaneously, the one-way valve component allows for the opening and closing of two baffles, ensuring that the solder paste can only flow unidirectionally into the metering tube and is not drawn back into the storage container, thus preventing errors in the metering of solder paste.

[0004] The above-mentioned patent has the following defects in use:

[0005] After the solder paste is extruded, solder paste often remains at the outlet of the metering tube. However, the outlet of the metering tube lacks a corresponding sealing and cleaning structure. The residual solder paste at the outlet is prone to solidification after contact with air, causing blockage. Therefore, this utility model proposes a solder paste dispensing device. Utility Model Content

[0006] This utility model provides a solder paste dispensing device. Through a sealing and cleaning mechanism, after the solder paste cartridge has finished dispensing, a scraper is used to scrape and clean the residual solder paste at the bottom outlet. A sealing sleeve seals the bottom outlet, reducing contact with air, preventing solidification, and lowering the possibility of blockage. Through a vibration-assisted mechanism, the scraper is vibrated during the cleaning process to dislodge any solder paste adhering to it, reducing adhesion and minimizing interference with the scraper's cleaning process, thus ensuring effective cleaning. In summary, this device solves the problems in the prior art.

[0007] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0008] This utility model discloses a solder paste dispensing device, comprising:

[0009] A mounting bracket and a solder paste cartridge are provided. The solder paste cartridge is located on one side of the mounting bracket. A piston plate is slidably connected inside the solder paste cartridge, and solder paste is provided between the bottom end of the piston plate and the inside of the solder paste cartridge. An extrusion rod is fixedly connected to the top end of the piston plate, and a round hole is drilled at the top end of the inner part of the solder paste cartridge. The top end of the extrusion rod passes through the round hole and is fixedly connected to a connecting plate. A threaded lifting plate is threadedly connected to the outer wall of the connecting plate, and the outer wall of the threaded lifting plate is slidably connected to the inner wall of the mounting bracket.

[0010] A sealing and cleaning mechanism is provided at the bottom of the solder paste tube and is used for cleaning and sealing the bottom outlet of the solder paste tube;

[0011] A vibration detachment mechanism is provided on the inner wall of the mounting frame and is used to assist in cleaning the bottom outlet of the solder paste tube.

[0012] The sealing and cleaning mechanism includes a sealing sleeve fitted onto the bottom outlet of the solder paste tube. A collection box is fixedly connected to one side of the sealing sleeve, and a scraper is fixedly connected to the inner wall of the collection box. An L-shaped plate is fixedly connected between the bottom of the sealing sleeve and the collection box, and a T-shaped rod is fixedly connected to one side of the L-shaped plate. A pair of sliding cylinders are fixedly connected to the inner wall of the mounting bracket, and a lifting cylinder is fixedly connected to the output end of each pair of sliding cylinders. The output end of each pair of lifting cylinders is fixedly connected to the top end of the T-shaped rod.

[0013] Furthermore, a partition is fixedly connected to the inner wall of the mounting frame, and a lead screw is rotatably connected between the top of the partition and the inner top of the mounting frame via a bearing. A threaded through hole is drilled on the outer wall of the threaded lifting plate, and the threaded lifting plate is sleeved on the outer wall of the lead screw through the threaded through hole and threadedly connected to the lead screw. A motor is fixedly connected to the top of the mounting frame, and the output end of the motor is threadedly connected to the top of the lead screw. A U-shaped plate is fixedly connected to the side of the threaded lifting plate near the connecting plate, and the U-shaped plate is sleeved on the outer wall of the connecting plate. The connecting plate and the U-shaped plate are connected by bolts and nuts.

[0014] Furthermore, a pair of sliding plates are fixedly connected to the outer wall of the threaded lifting plate, and a pair of sliding grooves are chiseled into the inner wall of the mounting bracket. The side of the sliding plate away from the threaded lifting plate is located in the sliding groove and is slidably connected to it.

[0015] Furthermore, a pair of electric telescopic rods are fixedly connected to the inner wall of the mounting bracket, and a clamp is fixedly connected to one end of each pair of electric telescopic rods that is close to each other. The inner walls of the pair of clamps are in contact with the outer wall of the solder paste tube.

[0016] Furthermore, the top of the scraper is triangular, and the surface of the scraper is coated with polytetrafluoroethylene.

[0017] Furthermore, the vibration detachment mechanism includes a pair of cylinders. The ends of the two cylinders that are close to each other are fixedly connected to the outer wall of the T-shaped rod. The inner walls of the two cylinders are slidably connected to circular plates, and a movable protrusion is fixedly connected to one side of the circular plates. A spring is sleeved on the outer wall of the movable protrusion. A through hole is drilled in the inner wall of the cylinder, and one end of the movable protrusion passes through the through hole and extends to the outer side of the cylinder. One end of the movable protrusion contacts the inner wall of the mounting frame. Multiple barrier strips are fixedly connected to the inner wall of the mounting frame, and the movable protrusion is located between the multiple barrier strips.

[0018] Furthermore, one end of the spring is fixedly connected to the inner wall of the cylinder, and the other end of the spring is fixedly connected to one side of the circular plate.

[0019] The present invention has the following advantages over the prior art:

[0020] 1. This technical solution, through the set sealing and cleaning mechanism, enables the moving scraper to scrape and clean the residual solder paste at the bottom outlet after the solder paste tube has finished dispensing, removing the residual solder paste and reducing adhesion. At the same time, after cleaning, the bottom outlet is sealed by the sealing sleeve to reduce contact with the outside air, making it less likely to solidify and reducing the possibility of blockage.

[0021] 2. This technical solution uses a sealed cleaning mechanism to generate vibration during the cleaning process of the scraper by contacting and colliding the movable protrusion with the barrier strip and the inner wall of the mounting bracket. The vibration is used to shake off the solder paste adhering to the surface of the scraper during the cleaning process, so as to avoid interfering with the cleaning of the scraper 1303 and ensure its cleaning effect.

[0022] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1This is a three-dimensional structural diagram of a solder paste dispensing device according to the present invention;

[0025] Figure 2 This is a schematic diagram of the internal cross-sectional structure of the solder paste cartridge in this utility model;

[0026] Figure 3 This is a partial three-dimensional structural diagram of a solder paste dispensing device according to the present invention;

[0027] Figure 4 This is a partial cross-sectional view of a solder paste dispensing device according to the present invention;

[0028] Figure 5 This utility model Figure 4 Enlarged structural diagram at point A;

[0029] Figure 6 This utility model Figure 4 A magnified structural diagram at point B in the middle.

[0030] The attached diagram lists the components represented by each number as follows:

[0031] 1. Mounting bracket; 2. Solder paste cartridge; 3. Piston plate; 4. Extrusion rod; 5. Connecting plate; 6. Lead screw; 7. Motor; 8. Threaded lifting plate; 801. Sliding plate; 802. Slide groove; 9. U-shaped plate; 10. Partition plate; 11. Electric telescopic rod; 12. Clamping plate; 13. Sealing and cleaning mechanism; 1301. Sealing sleeve; 1302. Collection box; 1303. Scraper; 1304. L-shaped plate; 1305. T-shaped rod; 1306. Lifting cylinder; 1307. Slide rod cylinder; 14. Vibration detachment mechanism; 1401. Cylinder; 1402. Circular plate; 1403. Movable protruding rod; 1404. Spring; 1405. Obstruction strip. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0033] In the description of this utility model, it should be understood that the terms "relative", "one end", "inner", "lateral", "end", "both ends", "both sides", "front", "one end face", "the other end face", etc., which indicate orientation or positional relationship, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Specific Implementation Example 1:

[0035] Please see Figures 1-6 As shown, the present invention provides a solder paste dispensing device, comprising:

[0036] Mounting bracket 1 and solder paste cylinder 2. Solder paste cylinder 2 is located on one side of mounting bracket 1. A piston plate 3 is slidably connected inside the solder paste cylinder 2. Solder paste is provided between the bottom end of the piston plate 3 and the inside of the solder paste cylinder 2. An extrusion rod 4 is fixedly connected to the top end of the piston plate 3. A round hole is drilled at the top end of the inner part of the solder paste cylinder 2. The top end of the extrusion rod 4 passes through the round hole and is fixedly connected to a connecting plate 5. A threaded lifting plate 8 is threadedly connected to the outer wall of the connecting plate 5. The outer wall of the threaded lifting plate 8 is slidably connected to the inner wall of the mounting bracket 1.

[0037] A sealing and cleaning mechanism 13 is provided at the bottom of the solder paste cylinder 2 and is used for cleaning and sealing the bottom outlet of the solder paste cylinder 2.

[0038] Vibration detachment mechanism 14 is installed on the inner wall of the mounting frame 1 and is used to assist in cleaning the bottom outlet of the solder paste tube 2.

[0039] The sealing and cleaning mechanism 13 includes a sealing sleeve 1301 fitted onto the bottom outlet of the solder paste tube 2. A collection box 1302 is fixedly connected to one side of the sealing sleeve 1301, and a scraper 1303 is fixedly connected to the inner wall of the collection box 1302. An L-shaped plate 1304 is fixedly connected between the bottom ends of the sealing sleeve 1301 and the collection box 1302, and a T-shaped rod 1305 is fixedly connected to one side of the L-shaped plate 1304. A pair of sliding cylinders 1307 are fixedly connected to the inner wall of the mounting bracket 1, and a lifting cylinder 1306 is fixedly connected to the output end of each pair of sliding cylinders 1307. The output ends of each pair of lifting cylinders 1306 are fixedly connected to the top end of the T-shaped rod 1305.

[0040] In the specific implementation process, the extrusion connecting plate 5 drives the extrusion rod 4 to move downward, and the extrusion piston plate 3 moves downward, so that the solder paste inside the solder paste cylinder 2 is squeezed out through the bottom outlet and coated onto the solder pads of the PCB printed circuit board. After the solder paste output is completed, a pair of sliding cylinders 1307 drive the scraper 1303 and the sealing sleeve 1301 to move towards the solder paste cylinder 2. During the movement, the scraper 1303 scrapes off the residual solder paste at the bottom outlet of the solder paste cylinder 2, causing it to fall into the collection box 1302, thus cleaning the residual solder paste at the bottom outlet. After the sealing sleeve 1301 moves to directly below the bottom outlet of the solder paste cylinder 2, it stops moving. A pair of lifting cylinders 1306 move upward through the T-shaped rod 1305 and the L-shaped plate 1304, so that the sealing sleeve 1301 is fitted onto the bottom outlet of the solder paste cylinder 2 to seal it, reduce contact with the outside air, prevent solidification, and reduce the possibility of blockage.

[0041] The inner wall of the mounting frame 1 is fixedly connected to a partition plate 10, and a lead screw 6 is rotatably connected between the top of the partition plate 10 and the inner top of the mounting frame 1 through a bearing. The outer wall of the threaded lifting plate 8 is drilled with a threaded through hole, and the threaded lifting plate 8 is sleeved on the outer wall of the lead screw 6 through the threaded through hole and threadedly connected to the lead screw 6. The top of the mounting frame 1 is fixedly connected to a motor 7, and the output end of the motor 7 is threadedly connected to the top of the lead screw 6. A U-shaped plate 9 is fixedly connected to the side of the threaded lifting plate 8 near the connecting plate 5, and the U-shaped plate 9 is sleeved on the outer wall of the connecting plate 5. The connecting plate 5 and the U-shaped plate 9 are connected by bolts and nuts.

[0042] The connecting plate 5 and the U-shaped plate 9 are connected by bolts and nuts, which can drive the threaded lifting plate 8 to connect with the connecting plate 5. Then, under the drive of the motor 7, the screw 6 is driven to rotate, so that the threaded lifting plate 8 moves downward with the rotation of the screw 6, so as to drive the connecting plate 5 to move downward, thereby causing the connecting plate 5 to drive the extrusion rod 4 and the piston plate 3 to expel the solder paste inside the solder paste cylinder 2.

[0043] Among them, a pair of sliding plates 801 are fixedly connected to the outer wall of the threaded lifting plate 8, and a pair of sliding grooves 802 are carved in the inner wall of the mounting bracket 1. The side of the sliding plate 801 away from the threaded lifting plate 8 is located in the sliding groove 802 and is slidably connected to it.

[0044] When the threaded lifting plate 8 moves up and down, it drives a pair of sliding plates 801 to slide synchronously along a pair of sliding grooves 802, so as to assist the movement of the threaded lifting plate 8, keep it in linear motion and prevent it from deviating.

[0045] The mounting bracket 1 has a pair of electric telescopic rods 11 fixedly connected to its inner wall, and each pair of electric telescopic rods 11 has a clamping plate 12 fixedly connected to one end of each pair of electric telescopic rods 11 that is close to each other. The inner walls of the clamping plates 12 are in contact with the outer wall of the solder paste tube 2.

[0046] A pair of electric telescopic rods 11 drive a pair of clamping plates 12 to move towards each other until they come into contact with the outer wall of the solder paste cylinder 2, thereby clamping and fixing the solder paste cylinder 2 and keeping it stable.

[0047] The top of the scraper 1303 is triangular, and the surface of the scraper 1303 is coated with polytetrafluoroethylene.

[0048] By setting the top of the scraper 1303 to be triangular, the symmetrical angles on both sides of the triangular scraper 1303 allow it to work in both directions without the need for frequent adjustments or changes to the direction of the scraper 1303. In addition, it is coated with polytetrafluoroethylene, which can reduce the adhesion of solder paste. Specific Implementation Example 2:

[0050] Please see Figure 1 , Figure 3 , Figure 4 and Figure 6 As shown, in a preferred embodiment, the vibration detachment mechanism 14 includes a pair of cylinders 1401. The ends of the pair of cylinders 1401 that are close to each other are fixedly connected to the outer wall of the T-shaped rod 1305. The inner walls of the pair of cylinders 1401 are slidably connected to circular plates 1402, and a movable protrusion 1403 is fixedly connected to one side of the circular plate 1402. A spring 1404 is sleeved on the outer wall of the movable protrusion 1403. A through hole is drilled in the inner wall of the cylinder 1401, and one end of the movable protrusion 1403 passes through the through hole and extends to the outer side of the cylinder 1401. One end of the movable protrusion 1403 contacts the inner wall of the mounting frame 1. A plurality of barrier strips 1405 are fixedly connected to the inner wall of the mounting frame 1, and the movable protrusion 1403 is located between the plurality of barrier strips 1405.

[0051] In the specific implementation process, a pair of cylinders 1401 move synchronously with the T-shaped rod 1305, and drive a pair of movable protrusions 1403 to move synchronously along the inner wall of the mounting frame 1. During the movement of the pair of movable protrusions 1403, they come into contact with multiple barrier strips 1405 in sequence, and move towards the cylinders 1401 under the pressure of the barrier strips, separating from the inner wall of the mounting frame 1. At the same time, they drive the circular plate 1402 to move into the cylinders 1401, stretching the spring 1404. When the movable protrusions 1403 separate from the barrier strips 1405, the movable protrusions 1403, which have lost the pressure, return to their original position under the elastic action of the spring 1404 and come into contact with the inner wall of the mounting frame 1. This process is repeated, generating vibration, and using the vibration to shake off the solder paste adhering to the surface of the scraper 1303 during the cleaning process, avoiding interference with the cleaning of the scraper 1303 and ensuring its cleaning effect.

[0052] One end of the spring 1404 is fixedly connected to the inner wall of the cylinder 1401, and the other end of the spring 1404 is fixedly connected to one side of the circular plate 1402.

[0053] The elastic tension of the spring 1404 causes the circular plate 1402 and the movable protrusion 1403 to move into the cylinder 1401 after being compressed, and stretches the spring 1404. After the compression is released, the elastic tension of the spring 1404 causes the circular plate 1402 and the movable protrusion 1403 to return to their original position.

[0054] The circuits, electronic components, and chip modules involved in this utility model are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve any improvement to the software and methods.

[0055] All standard parts used in the application documents can be purchased from the market. All components in this application document can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. The electrical components mentioned in this document are all electrically connected to the external main controller and power supply, and the main controller is a conventional known device that can play a control role.

[0056] The working principle of this utility model is as follows:

[0057] In use, this invention drives a pair of electric telescopic rods 11 to move a pair of clamping plates 12 toward each other until they contact the outer wall of the solder paste cylinder 2, clamping and fixing the solder paste cylinder 2. Simultaneously, it drives the U-shaped plate 9 to fit onto the outer wall of the connecting plate 5, and tightens the bolts and nuts for connection and fixation. This connects the threaded lifting plate 8 to the connecting plate 5. Then, the drive motor 7 drives the lead screw 6 to rotate, causing the threaded lifting plate 8 to move downwards with the rotation of the lead screw 6, which in turn causes the connecting plate 5 and the extrusion rod 4 to move downwards, compressing the solder paste. Piston plate 3 moves downward, causing solder paste inside solder paste cylinder 2 to be squeezed out through the bottom outlet and applied to the pads of the PCB printed circuit board. After the solder paste discharge is complete, a pair of sliding cylinders 1307 drive scraper 1303 and sealing sleeve 1301 to move towards solder paste cylinder 2. During the movement, scraper 1303 scrapes off the residual solder paste at the bottom outlet of solder paste cylinder 2. At the same time, a pair of cylinders 1401 move synchronously with T-shaped rod 1305, and drive a pair of movable protrusions 1403 along the inner side of mounting bracket 1. The wall moves synchronously, and during the movement of a pair of movable protrusions 1403, they sequentially contact multiple barrier bars 1405. Upon contact, they are squeezed and move towards the cylinder 1401, separating from the inner wall of the mounting frame 1. Simultaneously, they drive the circular plate 1402 to move into the cylinder 1401, stretching the spring 1404. When the movable protrusions 1403 separate from the barrier bars 1405, the movable protrusions 1403, no longer squeezed, return to their original position under the elastic action of the spring 1404, and reconnect with the mounting frame 1. The inner wall of the tube is in contact with the solder paste, and this process is repeated to generate vibration. The vibration is used to shake off the solder paste adhering to the surface of the scraper 1303 during the cleaning process, so that it falls into the collection box 1302. This scrapes and cleans the residual solder paste at the bottom outlet. After the sealing sleeve 1301 moves to the bottom outlet of the solder paste tube 2, it stops moving. A pair of lifting cylinders 1306 move upward through the T-shaped rod 1305 and the L-shaped plate 1304, so that the sealing sleeve 1301 is fitted onto the bottom outlet of the solder paste tube 2 for sealing.

[0058] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A solder paste dispensing device characterized by comprising: include: Mounting bracket (1) and solder paste tube (2), the solder paste tube (2) is located on one side of mounting bracket (1), the inside of the solder paste tube (2) is slidably connected to a piston plate (3), and solder paste is provided between the bottom end of the piston plate (3) and the inside of the solder paste tube (2), the top end of the piston plate (3) is fixedly connected to an extrusion rod (4), and a round hole is drilled at the top end of the inner part of the solder paste tube (2), the top end of the extrusion rod (4) passes through the round hole and is fixedly connected to a connecting plate (5), the outer wall of the connecting plate (5) is threadedly connected to a threaded lifting plate (8), and the outer wall of the threaded lifting plate (8) is slidably connected to the inner wall of mounting bracket (1); A sealing and cleaning mechanism (13) is provided at the bottom of the solder paste tube (2) and is used for cleaning and sealing the bottom outlet of the solder paste tube (2); Vibration detachment mechanism (14) is provided on the inner wall of the mounting frame (1), and the vibration detachment mechanism (14) is used to assist in cleaning the bottom outlet of the solder paste tube (2); The sealing and cleaning mechanism (13) includes a sealing sleeve (1301) fitted onto the bottom outlet of the solder paste tube (2). A collection box (1302) is fixedly connected to one side of the sealing sleeve (1301), and a scraper (1303) is fixedly connected to the inner wall of the collection box (1302). An L-shaped plate (1304) is fixedly connected between the bottom ends of the sealing sleeve (1301) and the collection box (1302), and a T-shaped rod (1305) is fixedly connected to one side of the L-shaped plate (1304). A pair of sliding cylinders (1307) are fixedly connected to the inner wall of the mounting bracket (1), and a lifting cylinder (1306) is fixedly connected to the output end of each pair of sliding cylinders (1307). The output ends of each pair of lifting cylinders (1306) are fixedly connected to the top end of the T-shaped rod (1305).

2. The solder paste dispensing device according to claim 1, wherein The inner wall of the mounting frame (1) is fixedly connected to a partition plate (10), and a lead screw (6) is rotatably connected between the top of the partition plate (10) and the inner top of the mounting frame (1) through a bearing. The outer wall of the threaded lifting plate (8) is drilled with a threaded through hole, and the threaded lifting plate (8) is sleeved on the outer wall of the lead screw (6) through the threaded through hole and threadedly connected to the lead screw (6). The top of the mounting frame (1) is fixedly connected to a motor (7), and the output end of the motor (7) is threadedly connected to the top of the lead screw (6). A U-shaped plate (9) is fixedly connected to the side of the threaded lifting plate (8) near the connecting plate (5), and the U-shaped plate (9) is sleeved on the outer wall of the connecting plate (5). The connecting plate (5) and the U-shaped plate (9) are connected by bolts and nuts.

3. The solder paste dispensing device of claim 1, wherein A pair of sliding plates (801) are fixedly connected to the outer wall of the threaded lifting plate (8), and a pair of sliding grooves (802) are chiseled in the inner wall of the mounting bracket (1). The side of the sliding plate (801) away from the threaded lifting plate (8) is located in the sliding groove (802) and is slidably connected to it.

4. The solder paste dispensing device of claim 1, wherein The inner wall of the mounting bracket (1) is fixedly connected to a pair of electric telescopic rods (11), and the ends of the pair of electric telescopic rods (11) that are close to each other are fixedly connected to clamps (12). The inner walls of the pair of clamps (12) are in contact with the outer wall of the solder paste tube (2).

5. The solder paste dispensing device of claim 1, wherein The top of the scraper (1303) is triangular, and the surface of the scraper (1303) is coated with polytetrafluoroethylene.

6. The solder paste dispensing device of claim 1, wherein The vibration detachment mechanism (14) includes a pair of cylinders (1401). The ends of the two cylinders (1401) that are close to each other are fixedly connected to the outer wall of the T-shaped rod (1305). The inner walls of the two cylinders (1401) are slidably connected to circular plates (1402). A movable protrusion (1403) is fixedly connected to one side of the circular plate (1402). A spring (1404) is sleeved on the outer wall of the movable protrusion (1403). A through hole is drilled in the inner wall of the cylinder (1401). One end of the movable protrusion (1403) passes through the through hole and extends to the outside of the cylinder (1401). One end of the movable protrusion (1403) contacts the inner wall of the mounting frame (1). A plurality of barrier strips (1405) are fixedly connected to the inner wall of the mounting frame (1). The movable protrusion (1403) is located between the plurality of barrier strips (1405).

7. The solder paste dispensing device according to claim 6, characterized in that, One end of the spring (1404) is fixedly connected to the inner wall of the cylinder (1401), and the other end of the spring (1404) is fixedly connected to one side of the circular plate (1402).

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