PCB board cutting device with powder adsorption

Abstract

This utility model discloses a PCB board cutting device with powder adsorption, relating to the field of PCB board cutting technology. The utility model includes a body: a support component, a placement component, a snap-fit ​​component, and a connecting component are respectively arranged on the body; the support component is fixedly installed at its bottom end to the moving end of the body, allowing the body to drive the support component to move; the placement component has its outer surface slidably disposed inside the support component, so that when the support component moves, it cooperates with the placement component to move the board material; the utility model uses downward pressing of the connecting component to move the snap-fit ​​component fixed on one side downward, allowing the snap-fit ​​component to move out of the placement component's interior, thus releasing the restriction on the placement component. Then, pulling the placement component along the interior of the support component allows the placement component to move the cut board material out of the support component's interior. Flipping the placement component allows the board material to be removed, saving time and effort.

Description

Technical Field

[0001] This utility model belongs to the field of PCB board cutting technology, and specifically relates to a PCB board cutting device with powder adsorption. Background Technology

[0002] During the PCB cutting process, the entire panel to be divided is placed on the operating table of the splitting machine and firmly fixed by vacuum adsorption or clamps to prevent movement during the cutting process. Then, with the help of a high-speed rotating carbide milling cutter, the panel is precisely cut according to the pre-programmed path, dividing the multi-panel panel into individual small boards.

[0003] In existing technologies, placement grooves and material removal grooves are generally opened on the mold to restrict the sheet material, and the material removal groove is used to remove the cut sheet material. However, when removing the cut sheet material, it is necessary to remove the cut sheet material one by one, which is time-consuming and labor-intensive. Utility Model Content

[0004] To address the problem that removing cut boards by opening placement and picking slots on the mold to restrict the boards and using the picking slots to remove them is time-consuming and labor-intensive, this invention proposes a PCB board cutting device with powder adsorption to overcome the aforementioned technical problems in existing related technologies.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model relates to a PCB board cutting device with powder adsorption, comprising a body:

[0007] The machine body is equipped with a support component, a placement component, a snap-fit ​​component, and a connection component.

[0008] The support component is fixedly installed at its bottom end to the moving end of the machine body, so that the machine body can drive the support component to move.

[0009] The placement component has its outer surface slidingly disposed with the interior of the support component, so that when the support component moves, it cooperates with the placement component to move the plate.

[0010] A snap-fit ​​component, the outer surface of which snaps into the interior of the component to restrict the position of the component;

[0011] A connecting component, one side of which is fixedly connected to the outer surface of the snap-fit ​​component, so that the connecting component can move the snap-fit ​​component to release the position restriction of the placement component when the snap-fit ​​component moves.

[0012] Furthermore, the support assembly includes an adsorption plate, the bottom end of which is fixedly installed to the moving end of the machine body, and a support mold is fixedly installed on the top end of the adsorption plate.

[0013] Furthermore, the placement component includes a sliding groove, which is formed inside the supporting mold. A placement plate is slidably disposed on the outer surface of the sliding groove, and a connecting frame is fixedly connected to one side of the placement plate.

[0014] Furthermore, the placement assembly also includes a placement slot, which is located at the top of the placement plate, and the interior of the placement slot has suction holes.

[0015] Furthermore, the snap-fit ​​assembly includes a spring groove, which is formed inside the support mold. A spring is fixedly connected inside the spring groove, and a connecting plate is fixedly connected to the top of the spring. The outer surface of the connecting plate is slidably disposed with the inside of the spring groove.

[0016] Furthermore, the snap-fit ​​assembly also includes a snap-fit ​​groove, which is opened inside the placement plate. A snap-fit ​​block is snap-fitted inside the snap-fit ​​groove, and the bottom end of the snap-fit ​​block is fixedly connected to the top end of the connecting plate.

[0017] Furthermore, the connecting assembly includes a connecting groove, which is formed inside the supporting mold. A connecting block is slidably arranged inside the connecting groove. A pressure plate is fixedly connected to one side of the connecting block. One side of the pressure plate is fixedly connected to the outer surface of the connecting plate. A guide rod is slidably arranged inside the pressure plate. Both ends of the guide rod are fixedly connected to the inner wall of the connecting groove.

[0018] This utility model has the following beneficial effects:

[0019] 1. This utility model uses downward pressing of the connecting component to drive the fixed snap-fit ​​component on one side to move downward, so that the snap-fit ​​component can be moved out of the interior of the placement component when it moves downward, so as to release the restriction on the placement component. Then, the placement component is pulled to move along the interior of the support component, and the placement component can move the cut plate inside out of the interior of the support component. Then, the placement component can be flipped over to take out the plate inside, which is more time-saving and labor-saving.

[0020] 2. This utility model moves the pressure plate downward along the direction of the guide rod that is slidably set inside, so that the pressure plate drives the connecting plate fixed on one side to move, thereby causing the connecting plate to move the snap block out of the snap groove, which makes it easier to release the inside of the placement plate, so that the placement plate can be pulled out of the sliding groove. Then, the placement plate can be flipped over to take out the plate inside the placement groove at its top, which is more time-saving and labor-saving.

[0021] Of course, any product implementing this utility model does not necessarily need to achieve all of the above advantages at the same time. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the utility model embodiments, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of this utility model from a right-side view.

[0025] Figure 3 This is a schematic diagram of the internal structure of the support component of this utility model;

[0026] Figure 4 For the present utility model Figure 3 Enlarged schematic diagram of the local structure at point A;

[0027] Figure 5 This is an exploded view of the placement component of this utility model;

[0028] Figure 6 For the present utility model Figure 5 An enlarged schematic diagram of the local structure at point B.

[0029] The attached diagram lists the components represented by each number as follows:

[0030] 1. Body; 2. Support assembly; 201. Adsorption plate; 202. Support mold; 3. Placement assembly; 301. Sliding groove; 302. Placement plate; 303. Connecting frame; 304. Placement groove; 305. Adsorption hole; 4. Snap-fit ​​assembly; 401. Spring groove; 402. Spring; 403. Connecting plate; 404. Snap-fit ​​groove; 405. Snap-fit ​​block; 5. Connecting assembly; 501. Connecting groove; 502. Connecting block; 503. Pressure plate; 504. Guide rod. Detailed Implementation

[0031] The technical solutions of the utility model embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the utility model, and not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the utility model.

[0032] In the description of this utility model, it should be understood that the terms "opening", "upper", "lower", "top", "middle", "inner", etc., which indicate orientation or positional relationship, are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0033] Please see Figures 1-6 As shown, this utility model is a PCB board cutting device with powder adsorption, including a body 1:

[0034] The main body 1 is respectively provided with a support component 2, a placement component 3, a snap-fit ​​component 4, and a connection component 5;

[0035] Support component 2, the bottom end of which is fixedly installed to the moving end of body 1, so that body 1 drives support component 2 to move;

[0036] The placement component 3 is slidably disposed with its outer surface in relation to the interior of the support component 2, so that when the support component 2 moves, it cooperates with the placement component 3 to move the plate.

[0037] The snap-fit ​​component 4 has its outer surface snap-fitted into the interior of the placement component 3, so that the snap-fit ​​component 4 restricts the position of the placement component 3;

[0038] The connecting component 5 is fixedly connected to the outer surface of the snap-fit ​​component 4 on one side, so that the connecting component 5 can drive the snap-fit ​​component 4 to move, so as to release the position restriction of the placement component 3 when the snap-fit ​​component 4 moves.

[0039] In use, the board is placed on top of the placement component 3, and then the machine body 1 is started to move the support component 2. The support component 2, together with the internally sliding placement component 3, moves the board into the machine body 1 for cutting. After cutting, the connecting component 5 is pressed down to move the locking component 4 fixed on one side downward, so that the locking component 4 can be moved out of the placement component 3 to release the restriction on the placement component 3. Then, the placement component 3 is pulled along the inside of the support component 2, so that the placement component 3 can move the board that has been cut inside the support component 2. Then, the placement component 3 is flipped over to take out the board inside, and the whole board is placed back into the placement component 3. Then, the placement component 3 is inserted into the support component 2 to complete the locking, and the whole board can be cut again.

[0040] This invention uses downward pressing of the connecting component 5 to move the fixed snap-fit ​​component 4 downward, so that the snap-fit ​​component 4 can be moved out of the interior of the placement component 3 when it moves downward, so as to release the restriction on the placement component 3. Then, the placement component 3 is pulled to move along the interior of the support component 2, and the placement component 3 can move the cut plate inside out of the interior of the support component 2. Then, the placement component 3 can be flipped over to take out the plate inside, which is more time-saving and labor-saving.

[0041] In one embodiment, the support component 2 includes an adsorption plate 201, the bottom end of which is fixedly installed with the moving end of the body 1, and a support mold 202 is fixedly installed on the top end of the adsorption plate 201.

[0042] By connecting the interior of the adsorption plate 201 with the adsorption device installed inside the body 1, and since the support mold 202 is installed on the top of the adsorption plate 201 and the interiors of the adsorption plate 201 and the support mold 202 are connected, outside air can continuously flow into the support mold 202 and the interior of the adsorption plate 201, so that the air pressure can apply pressure to the surface of the plate.

[0043] In one embodiment, the placement component 3 includes a sliding groove 301, which is formed inside the support mold 202. A placement plate 302 is slidably disposed on the outer surface of the sliding groove 301, and a connecting frame 303 is fixedly connected to one side of the placement plate 302.

[0044] The placement component 3 also includes a placement groove 304, which is located at the top of the placement plate 302, and an adsorption hole 305 is provided inside the placement groove 304.

[0045] By placing the sheet material inside the placement groove 304 and using the air flowing inside the suction hole 305 and the support mold 202 to compress the sheet material, the sheet material is tightly attached to the inside of the placement groove 304, which facilitates the machine body 1 to cut the sheet material. Furthermore, by pulling the connecting frame 303, the placement plate 302 fixed on one side is moved, and the placement plate 302 moves along the direction of the sliding groove 301, so as to facilitate the loading and unloading of the sheet material inside the placement groove 304.

[0046] In one embodiment, the snap-fit ​​assembly 4 includes a spring groove 401, which is formed inside the support mold 202. A spring 402 is fixedly connected inside the spring groove 401, and a connecting plate 403 is fixedly connected to the top of the spring 402. The outer surface of the connecting plate 403 is slidably disposed with the inside of the spring groove 401.

[0047] The snap-fit ​​assembly 4 also includes a snap-fit ​​groove 404, which is opened inside the placement plate 302. A snap-fit ​​block 405 is snap-fitted inside the snap-fit ​​groove 404, and the bottom end of the snap-fit ​​block 405 is fixedly connected to the top end of the connecting plate 403.

[0048] Because the outer surface of the snap-fit ​​block 405 is snapped into the interior of the snap-fit ​​groove 404, and the snap-fit ​​block 405 is wedge-shaped with one side of the placement plate 302, when the placement plate 302 is inserted into the sliding groove 301, the placement plate 302, in conjunction with the wedge-shaped surface, pushes the snap-fit ​​block 405 downward, causing the snap-fit ​​block 405 to move the connecting plate 403 fixed at the bottom. This causes the connecting plate 403 to compress the spring 402 fixed at the bottom. Simultaneously, when the placement plate 302 moves, it causes the snap-fit ​​groove 404 inside to move. When the snap-fit ​​groove 404 moves to the upper side of the snap-fit ​​block 405, the spring 402 releases its compressive stress, allowing the spring 402, in conjunction with the connecting plate 403, to drive the snap-fit ​​block 405 into the interior of the snap-fit ​​groove 404. This allows the snap-fit ​​block 405, in conjunction with the snap-fit ​​groove 404, to restrict the position of the placement plate 302.

[0049] In one embodiment, the connecting component 5 includes a connecting groove 501, which is formed inside the supporting mold 202. A connecting block 502 is slidably disposed inside the connecting groove 501. A pressure plate 503 is fixedly connected to one side of the connecting block 502. One side of the pressure plate 503 is fixedly connected to the outer surface of the connecting plate 403. A guide rod 504 is slidably disposed inside the pressure plate 503. Both ends of the guide rod 504 are fixedly connected to the inner wall of the connecting groove 501.

[0050] By pressing down on the pressure plate 503 and moving it along the direction of the internally slidable guide rod 504, the pressure plate 503 drives the fixed connecting plate 403 to move, thereby causing the connecting plate 403 to move the snap-fit ​​block 405 out of the snap-fit ​​groove 404. This facilitates the release of the placement plate 302 and allows it to be pulled out of the sliding groove 301, making it easier to remove the material inside the placement plate 302. Since one side of the pressure plate 503 is fixedly connected to one side of the connecting block 502, and the outer surface of the connecting block 502 is slidably disposed with the inside of the connecting groove 501, when the pressure plate 503 moves, it can cooperate with the connecting block 502 along the direction of the connecting groove 501, thereby improving the stability of the pressure plate 503 during movement.

[0051] Through the above technical solution, 1. By pressing down on the connecting component 5, the locking component 4 fixed on one side moves downward, so that the locking component 4 can move out of the interior of the placement component 3 when it moves downward, so as to release the restriction on the placement component 3. Then, the placement component 3 is pulled to move along the interior of the support component 2, and the placement component 3 can move the cut board inside out of the interior of the support component 2. Then, the placement component 3 can be flipped over to take out the board inside, which is more time-saving and labor-saving.

[0052] 2. By pressing down on the pressure plate 503 and moving it along the direction of the internally sliding guide rod 504, the pressure plate 503 drives the fixed connecting plate 403 on one side to move, thereby causing the connecting plate 403 to move the snap-fit ​​block 405 out of the snap-fit ​​groove 404. This facilitates the release of the placement plate 302, making it easier to pull the placement plate 302 out of the sliding groove 301. Then, by flipping the placement plate 302, the plate material inside the placement groove 304 at its top can be removed, which is more time-saving and labor-saving.

[0053] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0054] The preferred embodiments of the utility model disclosed above are merely illustrative of the utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the utility model, thereby enabling those skilled in the art to better understand and utilize it. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A PCB board cutting device with powder adsorption, comprising a body (1), characterized in that: The body (1) is provided with a support component (2), a placement component (3), a snap-fit ​​component (4), and a connection component (5); The support component (2) is fixedly installed at its bottom end to the moving end of the body (1) so that the body (1) drives the support component (2) to move. The placement component (3) is slidably disposed with its outer surface in relation to the interior of the support component (2) so that when the support component (2) moves, it works in conjunction with the placement component (3) to move the plate. The snap-fit ​​component (4) has its outer surface snap-fitted into the interior of the placement component (3) so that the snap-fit ​​component (4) restricts the position of the placement component (3); The connecting component (5) is fixedly connected to the outer surface of the snap-fit ​​component (4) on one side, so that the connecting component (5) can move the snap-fit ​​component (4) to release the position restriction of the placement component (3) when the snap-fit ​​component (4) moves.

2. The PCB board cutting device with powder adsorption according to claim 1, characterized in that, The support assembly (2) includes an adsorption plate (201), the bottom end of which is fixedly installed with the moving end of the body (1), and a support mold (202) is fixedly installed on the top end of the adsorption plate (201).

3. The PCB board cutting device with powder adsorption according to claim 2, characterized in that, The placement component (3) includes a sliding groove (301), which is opened inside the support mold (202). A placement plate (302) is slidably disposed on the outer surface of the sliding groove (301), and a connecting frame (303) is fixedly connected to one side of the placement plate (302).

4. The PCB board cutting device with powder adsorption according to claim 3, characterized in that, The placement component (3) also includes a placement groove (304), which is located at the top of the placement plate (302), and an adsorption hole (305) is provided inside the placement groove (304).

5. The PCB board cutting device with powder adsorption according to claim 2, characterized in that, The snap-fit ​​assembly (4) includes a spring groove (401), which is opened inside the support mold (202). A spring (402) is fixedly connected inside the spring groove (401), and a connecting plate (403) is fixedly connected to the top of the spring (402). The outer surface of the connecting plate (403) is slidably disposed with the inside of the spring groove (401).

6. A PCB board cutting device with powder adsorption according to claim 3 or 5, characterized in that, The snap-fit ​​assembly (4) also includes a snap-fit ​​groove (404), which is opened inside the placement plate (302). A snap-fit ​​block (405) is snap-fitted inside the snap-fit ​​groove (404), and the bottom end of the snap-fit ​​block (405) is fixedly connected to the top end of the connecting plate (403).

7. A PCB board cutting device with powder adsorption according to claim 5, characterized in that, The connecting component (5) includes a connecting groove (501), which is opened inside the support mold (202). A connecting block (502) is slidably arranged inside the connecting groove (501). A pressure plate (503) is fixedly connected to one side of the connecting block (502). One side of the pressure plate (503) is fixedly connected to the outer surface of the connecting plate (403). A guide rod (504) is slidably arranged inside the pressure plate (503). Both ends of the guide rod (504) are fixedly connected to the inner wall of the connecting groove (501).

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