A circuit board gripping device
By adjusting the layout of the suction plate and suction cups, the flexibility and stability issues of the circuit board gripping device are solved, enabling efficient gripping and handling of circuit boards of different models, reducing component damage, and improving production efficiency and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU BAOLIN PRINTING CIRCUIT
- Filing Date
- 2025-09-29
- Publication Date
- 2026-08-04
AI Technical Summary
The existing fixed-layout multi-adsorption point structure cannot be flexibly adjusted and is difficult to adapt to the actual size and layout differences of different models and specifications of circuit boards, resulting in unstable gripping and component damage.
The system employs an adjustable adsorption plate and suction cup layout. Through the linkage of a cylinder, a motor-driven lead screw, and a hinge rod, the position and spacing of the suction cups can be precisely adjusted. Combined with the design of clamping plates and buffer pads, it ensures stable adsorption and handling of circuit boards.
It improves the flexibility and stability of the circuit board gripping device, reduces component damage, enhances the versatility and operational accuracy of the equipment, and improves production efficiency and stability.
Smart Images
Figure CN224590187U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic manufacturing equipment technology, and in particular to a circuit board gripping device. Background Technology
[0002] In today's booming electronics manufacturing industry, circuit boards, as core components of electronic devices, are experiencing continuous expansion in both production and application. With ongoing technological advancements, electronic devices are becoming increasingly integrated and miniaturized, making circuit board design and manufacturing more precise and complex. Efficient handling and precise positioning of circuit boards play a crucial role in ensuring the production quality of electronic devices, improving production efficiency, and reducing production costs. It not only automates the production process and reduces errors caused by manual operation but also enhances production stability and reliability, offering significant advantages in large-scale production.
[0003] Existing technologies employ a fixed-layout multi-adsorption point structure. This structure uses multiple adsorption units (such as vacuum nozzles) arranged in a specific pattern on the suction cup device to apply adsorption force simultaneously from multiple locations on the circuit board, dispersing the adsorption force to multiple key support points of the circuit board, thereby enhancing the stability of gripping to a certain extent.
[0004] Regarding the aforementioned technologies, in actual production scenarios, circuit boards, as core components of electronic products, have diverse characteristics. Different models and specifications of circuit boards may have different actual sizes, and the component layout on the circuit board is also extremely complex and diverse. Fixed-layout multi-suction cup combinations lack flexibility and cannot be adjusted in a timely and effective manner according to the actual size and layout of the circuit board, making it difficult to meet the increasingly diversified and personalized production needs of the modern electronics manufacturing industry. Utility Model Content
[0005] To improve the flexibility of using the gripping device, this application provides a circuit board gripping device.
[0006] This application provides a circuit board gripping device, which adopts the following technical solution: A circuit board gripping device includes a frame with two connecting frames at the upper end, which are slidably connected to the frame vertically. A movable plate is located below the connecting frames and is slidably connected to the connecting frames along their width. Several suction plates are located below the movable plate and are detachably connected to it. Several sliding rods are fixed below the suction plates and are arranged horizontally. Several connecting blocks are located below the sliding rods and are evenly distributed along the length of the sliding rods. The connecting blocks are slidably connected to the sliding rods along their length. Suction cups are located at both ends of each connecting block for adsorbing the circuit board. An adjustment component is located within each connecting block for adjusting the distance between the two suction cups. Two clamping plates are located on the side of the movable plate near the suction plates. These clamping plates are retractable and are arranged along the length of the circuit board, limiting its position.
[0007] By adopting the above technical solution, the two connecting frames slide vertically along the frame. By adjusting the vertical position of the connecting frames on the frame, the suction plate can be adjusted to a suitable height for accurate suction and handling of circuit boards, improving the versatility and applicability of the equipment. The suction plate and the moving plate are detachably connected, facilitating the replacement of suction cups of different sizes. A retractable clamping plate on the side of the moving plate near the suction plate is set along the length of the circuit board. During the suction process, the clamping plate limits the circuit board, reducing the probability of horizontal displacement and ensuring the positional stability of the circuit board during handling. The connecting block slides along the length of the slide rod, allowing the position of the suction cups to be adjusted according to the actual layout of the circuit board. The adjustment component inside the connecting block can precisely adjust the distance between the two suction cups. For circuit boards with different component layouts, the suction cup spacing can be adjusted to prevent the suction cups from adhering to components on the circuit board, reducing damage to the components. At the same time, this adjustable suction cup layout can better adapt to circuit boards of different shapes and sizes, improving the flexibility of the device.
[0008] Optionally, a cylinder is fixedly mounted on the upper end of the frame, and a fixing plate is fixedly mounted on the upper end of the two connecting frames. The output end of the cylinder is fixedly connected to the fixing plate. Several guide rods are fixedly mounted on the upper end of the frame. The guide rods are arranged vertically, pass through the fixing plate, and the fixing plate is slidably connected to the guide rods along the length of the guide rods.
[0009] By adopting the above technical solution, cylinder one can provide a stable and adjustable driving force to drive the fixed plate to rise and fall, thereby enabling the suction cup to adsorb the circuit board. The guide rod provides a precise guide track for the movement of the fixed plate and the connecting frame, ensuring that the connecting frame can only move in a straight line in the vertical direction under the drive of cylinder one, without any horizontal deviation or rotation. During the adsorption and transportation of the circuit board, it is ensured that the suction cup can always accurately reach the predetermined adsorption position, thus improving the operating accuracy and stability of the equipment.
[0010] Optionally, a motor is provided on one side of the connecting frame, and a lead screw is provided inside the connecting frame. The lead screw is rotatably connected to the connecting frame. The output shaft of the motor is fixed coaxially with the lead screw. A movable plate is located at one end of the lead screw, and the movable plate is threadedly connected to the lead screw.
[0011] By adopting the above technical solution, after the circuit board is adsorbed, the motor drives the lead screw to rotate, and the connecting frame limits the moving plate, thereby causing the suction cup to move the circuit board in the horizontal direction, thus improving the convenience of using the device.
[0012] Optionally, the upper end of the connecting block is provided with hinge rod one and hinge rod two, both of which are rotatably connected to the connecting block. Hinges rod one and hinge rod two are arranged crosswise, and hinge rod one and hinge rod two of adjacent connecting blocks are hinged together. Cylinder two is fixedly provided at the lower end of the moving plate, and the output end of cylinder two is fixedly connected to the adjacent connecting block.
[0013] By adopting the above technical solution, when the output end of cylinder two extends or retracts, it will drive the adjacent connecting block fixed thereto to move. Due to the hinge relationship between the hinge rods, the movement of one connecting block will be transmitted to other connecting blocks through the hinge rods, so that all connecting blocks can move closer or further away synchronously. This linkage method allows the distance between multiple suction cups under the adsorption plate to be adjusted evenly, quickly adapting to circuit boards of different widths and improving the flexibility of the device.
[0014] Optionally, the adjustment assembly includes a second motor, a bidirectional lead screw, and two suction cup brackets. The second motor is fixed at one end of the connecting block, the bidirectional lead screw is located inside the connecting block and is rotatably connected to the connecting block, the output shaft of the second motor is coaxially fixed with the bidirectional lead screw, and the two suction cup brackets are located at both ends of the bidirectional lead screw respectively. The suction cup brackets are threadedly connected to the bidirectional lead screw, and the suction cups are located at the lower end of the bidirectional lead screw.
[0015] By adopting the above technical solution, motor 2 drives the bidirectional lead screw to rotate as a power source, and the connecting block limits the suction cup bracket. This causes the two suction cup brackets to move in opposite directions or in a straight line along the axis of the bidirectional lead screw, thereby adjusting the position of the two suction cup brackets and precisely controlling the distance between the two suction cups to meet the adsorption requirements of circuit boards of different sizes and improve the convenience of using the device.
[0016] Optionally, the side of the clamp closest to the circuit board is provided with a cushioning pad, which is made of elastic material.
[0017] By adopting the above technical solution, the buffer pad has good flexibility and cushioning during the clamping process of the circuit board, which can form a protective layer between the clamp and the circuit board, reduce the probability of the circuit board surface being directly impacted and worn, and improve the stability of the device.
[0018] Optionally, a number of limiting plates are fixed at the upper end of the frame, and a cavity is formed between the limiting plates. The circuit board is located in the cavity, and the limiting plates are attached to the circuit board.
[0019] By adopting the above technical solution, the cavity formed by the limiting plate provides a clear and fixed position reference for the circuit board, reducing the probability of circuit board stacking and displacement, and facilitating the subsequent gripping and handling of the circuit board.
[0020] Optionally, the clamping plate includes an inner plate and an outer plate. The inner plate is inserted into the outer plate and is slidably connected to the outer plate in the transverse direction. The outer plate has several through holes in the transverse direction. A screw is provided on one side of the outer plate. The screw passes through any of the through holes and is threadedly connected to the inner plate.
[0021] By adopting the above technical solution, the inner plate and the outer plate are connected by a lateral sliding connection, allowing the overall length of the clamping plate to freely extend and retract within a certain range. Several through holes opened laterally along the upper edge of the outer plate provide multiple fixed points for adjusting the clamping size. The length of the clamping plate can be precisely adjusted according to actual needs, thereby adapting to the size requirements of circuit boards, workpieces, and other objects to be clamped with different widths or diameters. After adjustment, screws are passed through the corresponding through holes and tightened to connect with the threads of the inner plate to position the length and reduce the probability of accidental slippage of the inner plate.
[0022] Optionally, an infrared sensor is provided at the upper end of the frame to monitor the movement direction of the movable plate in real time.
[0023] By adopting the above technical solution, the infrared sensor can continuously emit and receive infrared rays. By detecting the reflection or blockage of infrared rays, it can capture the positional changes of the movable plate in real time, thereby accurately determining its direction of movement. This real-time monitoring function allows operators or control systems to understand the dynamics of the movable plate at any time, providing detailed data support for the normal operation of the equipment.
[0024] In summary, this application includes at least one of the following beneficial technical effects of the circuit board gripping device: 1. The connecting block slides along the length of the slide bar, allowing the position of the suction cups to be adjusted according to the actual layout of the circuit board. The adjustment mechanism within the connecting block can precisely adjust the distance between the two suction cups. For circuit boards with different component layouts, adjusting the suction cup spacing prevents the suction cups from adhering to components on the circuit board, reducing damage. Simultaneously, this adjustable suction cup layout better adapts to circuit boards of different shapes and sizes, improving the flexibility of the device. 2. The buffer pad has good flexibility and cushioning properties, and can form a protective layer between the clamping plate and the circuit board, reducing the probability of the circuit board surface being directly impacted and worn, and improving the stability of the device. 3. After the circuit board is adsorbed, the motor drives the lead screw to rotate, and the connecting frame limits the moving plate, so that the suction cup drives the circuit board to move in the horizontal direction to transport the circuit board and improve the convenience of using the device. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the overall structure of a circuit board gripping device.
[0026] Figure 2 This is a schematic diagram designed to highlight the connection structure of the moving plate.
[0027] Figure 3 This is a cross-sectional schematic diagram designed to highlight the connecting structure of the connecting frame.
[0028] Figure 4 This is a schematic diagram designed to highlight the connection structure of the adsorption plate.
[0029] Figure 5 This is a cross-sectional schematic diagram designed to highlight the connection structure of the moving blocks.
[0030] Figure 6 This is a schematic diagram designed to highlight the connection structure of the inner panel.
[0031] Explanation of reference numerals in the attached drawings: 1. Frame; 11. Cylinder 1; 111. Guide rod; 112. Fixed plate; 12. Moving plate; 121. Connecting frame; 122. Motor 1; 123. Lead screw; 13. Adsorption plate; 131. Hinge rod 1; 132. Hinge rod 2; 133. Cylinder 2; 134. Slide rod; 14. Connecting block; 141. Motor 2; 142. Bidirectional lead screw; 143. Suction cup bracket; 144. Suction cup; 15. Clamping plate; 151. Inner plate; 152. Outer plate; 153. Screw; 16. Infrared sensor; 17. Limiting plate. Detailed Implementation
[0032] The present application will be further described in detail below with reference to all the accompanying drawings.
[0033] This application discloses a circuit board gripping device. Example
[0034] Reference Figure 1 and Figure 2A circuit board gripping device includes a frame 1, a fixed plate 112 at the upper end of the frame 1, the fixed plate 112 being slidably connected to the frame 1 vertically, two connecting frames 121 fixed at the lower end of the fixed plate 112, a plurality of adsorption plates 13 below the connecting frames 121, a plurality of connecting plates below the adsorption plates 13, suction cups 144 at both ends of a connecting block 14, a cylinder 11 at the upper end of the frame 1, the output end of the cylinder 11 being connected to the fixed plate 112, the cylinder 11 providing a stable and adjustable driving force to drive the fixed plate 112 to rise and fall, thereby causing the suction cups 144 to descend, a vacuum assembly at the upper end of the frame 1 to adsorb the circuit board after the descending suction cups 144 come into contact with it, or a hydraulic cylinder may be used as the driving component.
[0035] Reference Figure 1 and Figure 2 A number of guide rods 111 are fixed at the upper end of the frame 1. The guide rods 111 are arranged vertically and pass through the fixed plate 112. The fixed plate 112 is slidably connected to the guide rods 111 along the length of the guide rods 111. The guide rods 111 provide guidance for the movement of the fixed plate 112, ensuring that the connecting frame 121 can only move in a straight line in the vertical direction under the drive of the cylinder 11. This reduces the probability of the fixed plate 112 shaking during movement. During the adsorption and handling of the circuit board, it ensures that the suction cup 144 can always accurately reach the predetermined adsorption position, thereby improving the operating accuracy and stability of the equipment.
[0036] Reference Figure 3 A motor 122 is provided on one side of the connecting frame 121, and a lead screw 123 is provided inside the connecting frame 121. The lead screw 123 is rotatably connected to the connecting frame 121. The output shaft of the motor 122 is coaxially fixed with the lead screw 123. After the suction cup 144 adsorbs the circuit board, the motor 122 drives the lead screw 123 to rotate. A movable plate 12 is provided at one end of the lead screw 123. Several adsorption plates 13 are located at the lower end of the movable plate 12. The adsorption plates 13 are detachably connected to the movable plate 12, and the movable plate 12 is threadedly connected to the lead screw 123. The connecting frame 121 limits the movable plate 12, thereby causing the suction cup 144 to move the circuit board in the horizontal direction to transport the circuit board and improve the convenience of using the device.
[0037] Reference Figure 4 The adsorption plate 13 is inserted into the movable plate 12. A bolt is fixed on one side of the adsorption plate 13, and a nut is provided at one end of the bolt. The bolt passes through the adsorption plate 13 and the movable plate 12 and is threadedly connected to the nut. During equipment maintenance, if it is necessary to inspect, clean or repair the adsorption plate 13 or the movable plate 12, simply loosen the nut and remove the bolt to easily pull the adsorption plate 13 out of the movable plate 12. This detachable design makes maintenance work more convenient and quick, and also facilitates the replacement of adsorption plates 13 with different sizes of suction cups 144.
[0038] Reference Figure 4 Several sliding rods 134 are fixedly installed below the adsorption plate 13. The sliding rods 134 are arranged in a horizontal direction. The connecting blocks 14 are evenly distributed along the length direction of the sliding rods 134, and the connecting blocks 14 are slidably connected to the sliding rods 134 along the length direction of the sliding rods 134. The upper end of the connecting block 14 is provided with a first hinge rod 131 and a second hinge rod 132. Both the first hinge rod 131 and the second hinge rod 132 are rotatably connected to the connecting block 14. The first hinge rod 131 and the second hinge rod 132 are arranged crosswise. The first hinge rod 131 and the second hinge rod 132 of adjacent connecting blocks 14 are hinged. The lower end of the moving plate 12 is fixedly provided with a second cylinder 133. The output end of the second cylinder 133 is fixedly connected to the adjacent connecting block 14.
[0039] Reference Figure 4 and Figure 5 When it is necessary to adjust the distance between the connecting blocks 14, cylinder 2 133 is activated, causing the adjacent connecting blocks 14 to move. Due to the hinge relationship between the hinge rods, the movement of one connecting block 14 will be transmitted to other connecting blocks 14 through the hinge rods, so that all connecting blocks 14 can move closer or further away synchronously. This linkage method allows the distance between the multiple suction cups 144 below the adsorption plate 13 to be adjusted evenly, quickly adapting to circuit boards of different widths and improving the flexibility of the device.
[0040] Reference Figure 5 A motor 141 is fixed at one end of the connecting block 14. A bidirectional lead screw 142 is provided inside the connecting block 14. The bidirectional lead screw 142 is rotatably connected to the connecting block 14, and the output shaft of the motor 141 is coaxially fixed with the connecting block 14. The motor 141 serves as a power source to drive the bidirectional lead screw 142 to rotate. The two ends of the bidirectional lead screw 142 are provided with suction cup brackets 143 corresponding to the suction cups 144. The suction cup brackets 143 are threadedly connected to the bidirectional lead screw 142. The connecting block 14 limits the suction cup brackets 143, which allows the two suction cup brackets 143 to move closer or further away from each other, thereby adjusting the position of the two suction cup brackets 143 and precisely controlling the distance between the two suction cups 144 to meet the adsorption requirements of circuit boards of different sizes and improve the convenience of using the device.
[0041] Reference Figure 6Two clamping plates 15 are provided on the side of the movable plate 12 near the adsorption plate 13. The clamping plates 15 are telescopic and are set along the length of the circuit board. During the adsorption of the circuit board, the clamping plates 15 limit the circuit board and reduce the probability of horizontal displacement of the circuit board during transportation, ensuring the positional stability of the circuit board during transportation. A buffer pad made of elastic material is provided on the side of the clamping plate 15 near the circuit board. The buffer pad has good flexibility and cushioning during the clamping process and can form a protective layer between the clamping plate 15 and the circuit board, reducing the probability of direct impact and wear on the surface of the circuit board and improving the stability of the device.
[0042] Reference Figure 6 The clamping plate 15 includes an inner plate 151 and an outer plate 152. The inner plate 151 is inserted into the outer plate 152, and the inner plate 151 is slidably connected to the outer plate 152 in the transverse direction. The transverse sliding connection between the inner plate 151 and the outer plate 152 allows the overall length of the clamping plate 15 to freely extend and retract within a certain range. Several through holes are opened in the outer plate 152 in the transverse direction, providing multiple fixing points for adjusting the clamping size. The length of the clamping plate 15 can be precisely adjusted according to actual needs, thereby adapting to the size requirements of objects such as circuit boards of different widths or diameters. Several through holes are opened in the outer plate 152 in the transverse direction. A screw 153 is provided on one side of the outer plate 152. The screw 153 passes through any of the through holes and is threaded to the inner plate 151. After adjustment, the screw 153 is passed through the corresponding through hole and tightened to thread onto the inner plate 151 to position the length and reduce the probability of the inner plate 151 slipping accidentally.
[0043] Reference Figure 1 An infrared sensor 16 is installed at the upper end of the frame 1. The infrared sensor 16 can continuously emit and receive infrared rays. By detecting the reflection or blockage of infrared rays, it can capture the positional changes of the movable plate 12 in real time, and thus accurately determine its direction of movement. This real-time monitoring function allows operators or control systems to understand the dynamics of the movable plate 12 at any time, providing detailed data support for the normal operation of the equipment. Several limiting plates 17 are fixed at the upper end of the frame 1, forming a cavity between the limiting plates 17. The circuit board is located in the cavity. The cavity formed by the limiting plates 17 provides a clear and fixed positional reference for the circuit board, reducing the probability of circuit board stacking and displacement, and facilitating the subsequent gripping and handling of the circuit board.
[0044] The implementation principle of the circuit board gripping device in this application embodiment is as follows: Cylinder 11 is activated to drive the suction cup 144 to move down and adsorb the circuit board. For circuit boards of different sizes, cylinder 2 133 is activated to drive the connected connecting block 14 to move. The movement of the connecting block 14 is transmitted to other connecting blocks 14 through the hinge rod, so that all connecting blocks 14 can move closer or further away at the same time. The distance between the suction cups 144 can be adjusted evenly. The spacing of the suction cups 144 on the same connecting block 14 can also be adjusted by activating motor 2 141 to adapt to circuit boards of different shapes and sizes, thereby improving the flexibility of the device.
[0045] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A circuit board gripping device comprising a frame (1), characterized in that: The upper end of the frame (1) is provided with two connecting frames (121), which are slidably connected to the frame (1) vertically. A movable plate (12) is provided below the connecting frame (121), which is slidably connected to the connecting frame (121) along the width direction of the connecting frame (121). Several adsorption plates (13) are provided below the movable plate (12), which are detachably connected to the movable plate (12). Several sliding rods (134) are fixed below the adsorption plates (13), which are arranged horizontally. Several connecting blocks (14) are provided below the sliding rods (134). (14) Evenly distributed along the length of the slide bar (134), the connecting block (14) is slidably connected to the slide bar (134) along the length of the slide bar (134), and both ends of the connecting block (14) are provided with suction cups (144). The suction cups (144) are used to adsorb the circuit board. The connecting block (14) is provided with an adjustment component. The adjustment component is used to adjust the distance between the two suction cups (144). The moving plate (12) is provided with two clamping plates (15) on the side close to the adsorption plate (13). The clamping plates (15) are telescopically set. The clamping plates (15) are set along the length of the circuit board and limit the circuit board.
2. A circuit board gripping device according to claim 1, characterized in that: A cylinder (11) is fixedly mounted on the upper end of the frame (1), and a fixing plate (112) is fixedly mounted on the upper end of the two connecting frames (121). The output end of the cylinder (11) is fixedly connected to the fixing plate (112). Several guide rods (111) are fixedly mounted on the upper end of the frame (1). The guide rods (111) are arranged vertically and pass through the fixing plate (112). The fixing plate (112) is slidably connected to the guide rods (111) along the length of the guide rods (111).
3. The circuit board gripper of claim 1, wherein: A motor (122) is provided on one side of the connecting frame (121), and a lead screw (123) is provided inside the connecting frame (121). The lead screw (123) is rotatably connected to the connecting frame (121). The output shaft of the motor (122) is coaxially fixed with the lead screw (123). A connecting plate is located at one end of the lead screw (123), and the connecting plate is threadedly connected to the lead screw (123).
4. The circuit board gripper of claim 1, wherein: The upper end of the connecting block (14) is provided with a hinge rod one (131) and a hinge rod two (132). Both the hinge rod one (131) and the hinge rod two (132) are rotatably connected to the connecting block (14). The hinge rod one (131) and the hinge rod two (132) are arranged crosswise. The hinge rod one (131) and the hinge rod two (132) of the adjacent connecting blocks (14) are hinged. The lower end of the moving plate (12) is fixedly provided with a cylinder two (133). The output end of the cylinder two (133) is fixedly connected to the adjacent connecting block (14).
5. The circuit board gripper of claim 1, wherein: The adjustment assembly includes a second motor (141), a bidirectional lead screw (142), and two suction cup brackets (143). The second motor (141) is fixed at one end of the connecting block (14). The bidirectional lead screw (142) is located inside the connecting block (14) and is rotatably connected to the connecting block (14). The output shaft of the second motor (141) is coaxially fixed with the bidirectional lead screw (142). The two suction cup brackets (143) are located at both ends of the bidirectional lead screw (142) respectively. The suction cup brackets (143) are threadedly connected to the bidirectional lead screw (142). The suction cup (144) is located at the lower end of the bidirectional lead screw (142).
6. The circuit board gripper of claim 1, wherein: The clamp (15) has a cushioning pad on the side near the circuit board, and the cushioning pad is made of elastic material.
7. The circuit board gripper of claim 1, wherein: The upper end of the frame (1) is fixed with several limiting plates (17), and a cavity is formed between the several limiting plates (17). The circuit board is located in the cavity, and the limiting plates (17) are attached to the circuit board.
8. The circuit board gripper of claim 1, wherein: The clamping plate (15) includes an inner plate (151) and an outer plate (152). The inner plate (151) is inserted into the outer plate (152) and is slidably connected to the outer plate (152) in the transverse direction. The outer plate (152) has several through holes in the transverse direction. A screw (153) is provided on one side of the outer plate (152). The screw (153) passes through any through hole and is threadedly connected to the inner plate (151).
9. The circuit board gripper of claim 1, wherein: The upper end of the frame (1) is provided with an infrared sensor (16), which is used to monitor the movement direction of the movable plate (12) in real time.