A gas water heater
By installing semiconductor cooling fins on the combustion chamber wall of a gas water heater and utilizing external air cooling, the problem of poor cooling effect of the combustion chamber wall is solved, achieving a more efficient cooling effect and cost optimization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHONGQING HAIER WATER HEATER
- Filing Date
- 2025-06-17
- Publication Date
- 2026-08-04
AI Technical Summary
In existing gas water heaters, the cooling effect of the combustion chamber walls is poor, and the cost is high.
A semiconductor cooling chip assembly is used to set the cold end on the wall of the combustion chamber and connect it to the wall. The hot end is located outside the combustion chamber and is cooled by airflow from the outside. The cooling power is optimized by combining a temperature sensor and a controller.
It significantly improves the cooling effect of the combustion chamber wall, reduces costs, and enhances the overall performance of the gas water heater.
Smart Images
Figure CN224593429U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of water heater technology, and in particular to a gas water heater. Background Technology
[0002] A gas water heater consists of a combustion chamber and a water tank. The flame generated in the combustion chamber heats the water flowing through the tank to produce hot water. The walls of the combustion chamber are cooled by water cooling, air cooling, or insulation cotton, but the cooling effect is poor, the materials are numerous, and the cost is high.
[0003] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention
[0004] In view of the problems pointed out in the background art, this utility model proposes a gas water heater that improves the cooling effect of the combustion chamber wall.
[0005] To achieve the above-mentioned objectives, the present invention employs the following technical solution:
[0006] In some embodiments of this application, a gas water heater is provided, comprising:
[0007] A housing, the interior of which has an installation space;
[0008] A water tank is installed within the installation space;
[0009] A combustion chamber, disposed within the installation space, is configured to heat water flowing through the water tank;
[0010] A first semiconductor refrigeration chip assembly is disposed on the wall of the combustion chamber, with the cold end of the first semiconductor refrigeration chip assembly connected to the wall of the combustion chamber and the hot end of the first semiconductor refrigeration chip assembly located outside the combustion chamber.
[0011] In some embodiments of this application, the cold end of the first semiconductor cooling chip assembly is connected to the outer wall of the combustion chamber.
[0012] In some embodiments of this application, the combustion chamber includes a circumferential wall on which the first semiconductor cooling chip group is disposed.
[0013] In some embodiments of this application, the hot end of the first semiconductor cooling chip assembly is connected to a first heat dissipation part, which is located outside the combustion chamber.
[0014] In some embodiments of this application, a gas flow gap is formed between the circumferential wall of the combustion chamber and the housing, and the first heat dissipation part is located within the gas flow gap.
[0015] In some embodiments of this application, the circumferential wall of the combustion chamber is composed of four side walls, and the first semiconductor cooling chip group is disposed on any one of the side walls.
[0016] In some embodiments of this application, a first temperature sensor is provided on the wall of the combustion chamber.
[0017] In some embodiments of this application, the top of the housing is provided with an air inlet and a smoke outlet, and a smoke guide hood is provided at the top position in the installation space. An air inlet channel is formed between the smoke guide hood and the housing, and the air inlet channel is connected to the air inlet. A smoke outlet channel is formed inside the smoke guide hood, and the smoke outlet channel is connected to the smoke outlet.
[0018] A second semiconductor cooling chip assembly is provided on the wall of the housing that forms the air intake channel.
[0019] In some embodiments of this application, a second temperature sensor is provided on the wall of the housing that forms the air intake channel.
[0020] In some embodiments of this application, the hot end of the second semiconductor cooling chip assembly is connected to a second heat dissipation part, which is located on the outside of the housing.
[0021] Compared with the prior art, the advantages and positive effects of this utility model are:
[0022] When a gas water heater is working, the flame in the combustion chamber burns, causing the temperature inside the combustion chamber and the temperature of the combustion chamber wall to rise. By placing a first semiconductor cooling chip assembly on the combustion chamber wall, with the cold end of the first semiconductor cooling chip assembly connected to the combustion chamber wall and the hot end located on the outside of the combustion chamber, the combustion chamber wall can be cooled effectively.
[0023] The hot end of the first semiconductor refrigeration unit is located outside the combustion chamber. The hot end of the first semiconductor refrigeration unit is cooled by the airflow outside the combustion chamber, which helps to improve the cooling effect of the first semiconductor refrigeration unit and thus improve the cooling effect of the combustion chamber wall.
[0024] Other features and advantages of this utility model will become clearer after reading the detailed embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a structural diagram of a gas water heater according to some embodiments;
[0027] Figure 2 This is another structural diagram of a gas water heater according to some embodiments;
[0028] Figure 3 This is a control principle diagram of a gas water heater according to some embodiments;
[0029] Figure 4 This is a structural diagram of a semiconductor cooling chip assembly according to some embodiments.
[0030] Figure label:
[0031] 100. Housing; 110. Installation space; 120. Air inlet; 130. Smoke outlet; 140. Gas flow gap;
[0032] 200. Water tank; 210. Inlet pipe; 220. Outlet pipe;
[0033] 300. Combustion chamber; 310. Circumferential wall;
[0034] 410. First semiconductor refrigeration unit; 420. Second semiconductor refrigeration unit; 431. Cold end; 432. Hot end; 433. Semiconductor;
[0035] 500. Smoke hood; 510. Smoke exhaust duct; 520. Air intake duct;
[0036] 610. First temperature sensor; 620. Second temperature sensor;
[0037] 700, Controller. Detailed Implementation
[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0039] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0040] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0041] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0042] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0043] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0044] In some embodiments of this application, a gas water heater is provided, as shown in the reference... Figure 1 It includes a housing 100, which constitutes the outer shell of the gas water heater, and an installation space 110 is formed inside the housing 100.
[0045] The gas water heater also includes a water tank 200, which is disposed within the installation space 110. The water tank 200 can be a coiled water tank or a non-coiled water tank. The water tank 200 is connected to an inlet pipe 210 and an outlet pipe 220. The inlet pipe 210 and the outlet pipe 220 extend from the housing 100 for connection to external piping.
[0046] The gas water heater also includes a combustion chamber 300 disposed within the installation space 110. The combustion chamber 300 is configured to heat water flowing through the water tank 200. For example, the combustion chamber 300 is located below the water tank 200, and the flame generated by the combustion chamber 300 heats the water tank 200, thereby heating the water flowing through the water tank 200 to produce hot water.
[0047] The gas water heater also includes a first semiconductor cooling chip assembly 410, which is disposed on the wall of the combustion chamber 300. The cold end 431 of the first semiconductor cooling chip assembly 410 is connected to the wall of the combustion chamber 300, and the hot end 432 of the first semiconductor cooling chip assembly 410 is located outside the combustion chamber 300.
[0048] Structural reference of semiconductor cooling chip assembly Figure 4 It includes N-type and P-type semiconductors 433, one end of the semiconductor cooling chip is the cold end 431, and the other two ends are the hot ends 432.
[0049] When the gas water heater is working, the flame in the combustion chamber 300 burns, causing the temperature inside the combustion chamber 300 to rise, and the temperature of the wall of the combustion chamber 300 to rise as well. A first semiconductor cooling chip assembly 410 is installed on the wall of the combustion chamber 300, with the cold end 431 of the first semiconductor cooling chip assembly 410 connected to the wall of the combustion chamber 300 and the hot end 432 located outside the combustion chamber 300. This achieves cooling of the wall of the combustion chamber 300, resulting in a good cooling effect.
[0050] The hot end 432 of the first semiconductor cooling chip assembly 410 is located outside the combustion chamber 300. The hot end 432 of the first semiconductor cooling chip assembly 410 is cooled by the air flowing outside the combustion chamber 300, which helps to improve the cooling effect of the first semiconductor cooling chip assembly 410 and thus improve the cooling effect of the wall of the combustion chamber 300.
[0051] In some embodiments of this application, the cold end 431 of the first semiconductor cooling chip group 410 is connected to the outer wall of the combustion chamber 300 to achieve fixed installation of the first semiconductor cooling chip group 410 on the wall of the combustion chamber 300.
[0052] The first semiconductor cooling chip assembly 410 is disposed on the outer wall of the combustion chamber 300. This facilitates the fixed installation of the first semiconductor cooling chip assembly 410 on the combustion chamber 300 and also prevents the high temperature inside the combustion chamber 300 from affecting the normal cooling of the first semiconductor cooling chip assembly 410. The cold end 431 of the first semiconductor cooling chip assembly 410 is in close contact with the outer wall of the combustion chamber 300, thereby improving the cooling effect on the wall of the combustion chamber 300.
[0053] In some embodiments of this application, the hot end 432 of the first semiconductor cooling chip group 410 is connected to a first heat dissipation part (not shown), which is located outside the combustion chamber 300.
[0054] For example, the first heat dissipation part is a heat sink. The flowing air outside the combustion chamber 300 can dissipate heat from the first heat dissipation part, which helps to improve the cooling effect of the first semiconductor cooling chip group 410 and further improves the cooling effect of the wall of the combustion chamber 300.
[0055] In some embodiments of this application, the combustion chamber 300 includes a circumferential wall 310, on which a first semiconductor cooling chip group 410 is disposed.
[0056] The circumferential wall 310 surrounds the combustion chamber and the flame. The temperature rise of the circumferential wall 310 is relatively high. The circumferential wall 310 has a large area. The first semiconductor cooling chip group 410 is placed on the circumferential wall 310. By utilizing the large area of the circumferential wall 310, the area of the first semiconductor cooling chip group 410 can be made as large as possible, which helps to further improve the cooling effect of the combustion chamber 300 wall.
[0057] In some embodiments of this application, a gas flow gap 140 is formed between the circumferential wall 310 and the housing 100, and the first heat dissipation part is located within the gas flow gap 140.
[0058] The gas flow gap 140 serves as a channel for gas flow. The first heat dissipation part faces the side of the gas flow gap 140, which helps the flowing gas to dissipate heat from the first heat dissipation part and improve the heat dissipation effect of the first heat dissipation part, so as to further improve the cooling effect of the first semiconductor cooling chip group 410 and improve the cooling effect.
[0059] In some embodiments of this application, the circumferential wall 310 of the combustion chamber 300 is composed of four side walls, and a first semiconductor cooling chip group 410 is disposed inside any one side wall.
[0060] That is, the circumferential wall 310 of the combustion chamber 300 forms a rectangular structure, and a first semiconductor cooling chip group 410 is provided in any side wall. By making full use of the mounting wall surface of each side wall, the number of first semiconductor cooling chip groups 410 is increased, thereby improving the cooling effect.
[0061] In some embodiments of this application, a first temperature sensor 610 is disposed on the wall of the combustion chamber 300, and the first temperature sensor 610 is disposed close to the first semiconductor cooling chip group 410. (Refer to...) Figure 3 The gas water heater also includes a controller 700. The first semiconductor cooling chip group 410 and the first temperature sensor 610 are connected to the controller 700.
[0062] The first temperature sensor monitors the temperature of the wall of the combustion chamber 300 and feeds the temperature data back to the controller 700. The controller 700 controls the cooling power of the first semiconductor cooling chip group 410 according to the received temperature data to ensure that the wall of the combustion chamber 300 is cooled down to the set temperature.
[0063] In some embodiments of this application, Figure 2 The diagram shows a structural schematic of a balanced gas water heater. The top of the housing 100 is provided with an air inlet 120 and a smoke outlet 130. A smoke guide hood 500 is provided near the top of the installation space 110. An air inlet channel 520 is formed between the smoke guide hood 500 and the housing 100. The air inlet channel 520 is connected to the air inlet 120. A smoke outlet channel 510 is formed inside the smoke guide hood 500. The smoke outlet channel 510 is connected to the smoke outlet 130.
[0064] A second semiconductor cooling chip assembly 420 is provided on the wall of the housing 100 that forms the air intake channel 520. The cold end 431 of the second semiconductor cooling chip assembly 420 is connected to the wall of the housing 100, and the hot end 432 of the second semiconductor cooling chip assembly 420 is located on the outside of the housing 100.
[0065] When the gas water heater is working, outside air flows into the air intake channel 520 through the air inlet 120, and the flue gas generated by combustion in the combustion chamber 300 is discharged through the exhaust channel 510 and the exhaust port 130. The second semiconductor cooling chip group 420 is installed on the wall of the housing 100 surrounding the air intake channel 520 to cool the air flowing into the air intake channel 520.
[0066] The intake passage 520 communicates with the gas flow gap 140, and the air in the intake passage 520 flows through the gas flow gap 140. When the external air flowing in from the intake port 120 flows through the intake passage 520, it is first cooled by the second semiconductor cooling chip group 420. The cooled gas then flows through the gas flow gap 140 to provide air cooling for the first heat dissipation part, thereby further improving the cooling effect of the first semiconductor cooling chip group 410 and helping to improve the cooling effect of the combustion chamber 300 wall.
[0067] In some embodiments of this application, a second temperature sensor 620 is disposed on the wall of the housing 100 that forms the air intake channel 520. The second temperature sensor 620 is disposed near the second semiconductor cooling chip assembly 420. (Refer to...) Figure 3 The gas water heater also includes a controller 700. A second semiconductor cooling chip assembly 420 and a second temperature sensor 620 are connected to the controller 700.
[0068] The second temperature sensor monitors the temperature of the top wall of the housing 100 and feeds the temperature data back to the controller 700. The controller 700 controls the cooling power of the second semiconductor cooling chip group 420 according to the received temperature data to ensure that the intake air is cooled to the set temperature.
[0069] In some embodiments of this application, the hot end 432 of the second semiconductor cooling chip group 420 is connected to a second heat dissipation part, which is located on the outside of the housing 100.
[0070] For example, the second heat dissipation part is a heat sink. The flowing air outside the housing 100 can dissipate heat from the second heat dissipation part, which helps to improve the cooling effect of the second semiconductor cooling chip group 420, and thus improves the cooling effect on the intake air.
[0071] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
[0072] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.
Claims
1. A gas water heater, characterized in that, Including: A housing, the interior of which has an installation space; A water tank is installed within the installation space; A combustion chamber, disposed within the installation space, is configured to heat water flowing through the water tank; A first semiconductor refrigeration chip assembly is disposed on the wall of the combustion chamber, with the cold end of the first semiconductor refrigeration chip assembly connected to the wall of the combustion chamber and the hot end of the first semiconductor refrigeration chip assembly located outside the combustion chamber.
2. The gas water heater according to claim 1, characterized in that, The cold end of the first semiconductor cooling chip assembly is connected to the outer wall of the combustion chamber.
3. The gas water heater according to claim 1, characterized in that, The combustion chamber includes a circumferential wall, on which the first semiconductor cooling chip group is disposed.
4. The gas water heater according to claim 1, characterized in that, The hot end of the first semiconductor cooling chip assembly is connected to a first heat dissipation part, which is located outside the combustion chamber.
5. The gas water heater according to claim 4, characterized in that, A gas flow gap is formed between the circumferential wall of the combustion chamber and the shell, and the first heat dissipation part is located within the gas flow gap.
6. The gas water heater according to any one of claims 1 to 5, characterized in that, The circumferential wall of the combustion chamber is composed of four side walls, and the first semiconductor cooling chip group is disposed on any one of the side walls.
7. The gas water heater according to any one of claims 1 to 5, characterized in that, A first temperature sensor is installed on the wall of the combustion chamber.
8. The gas water heater according to any one of claims 1 to 5, characterized in that, The top of the housing is provided with an air inlet and a smoke outlet. A smoke guide hood is provided near the top of the installation space. An air intake channel is formed between the smoke guide hood and the housing. The air intake channel is connected to the air inlet. An exhaust channel is formed inside the smoke guide hood. The exhaust channel is connected to the smoke outlet. A second semiconductor cooling chip assembly is provided on the wall of the housing that forms the air intake channel.
9. The gas water heater according to claim 8, characterized in that, A second temperature sensor is provided on the wall of the housing that forms the air intake channel.
10. The gas water heater according to claim 8, characterized in that, The hot end of the second semiconductor cooling chip assembly is connected to a second heat dissipation part, which is located on the outside of the housing.