Infrared module and thermal imager

Abstract

The application discloses an infrared module and an infrared thermal imager, the infrared module comprises a lens, a shutter and a circuit board assembly; the circuit board assembly comprises a detector circuit board, a circuit board support and an image processing circuit board; the detector circuit board and the image processing circuit board are respectively arranged on opposite sides of the circuit board support; a first mounting hole is arranged on one side of the circuit board support close to the image processing circuit board, a second mounting hole matched with the first mounting hole is arranged on the image processing circuit board, and the circuit board support and the image processing circuit board are connected through a first fixing member arranged in the first mounting hole and the second mounting hole; the detector circuit board and the circuit board support are connected through a first adhesive layer.

Description

Technical Field

[0001] This application relates to the field of infrared technology, and in particular to an infrared module and an infrared thermal imager. Background Technology

[0002] In current module design, to better protect the detector from external damage and achieve miniaturization of the module, the industry generally adopts a full glue fixing solution. However, the full glue design has significant drawbacks in mass production, such as increasing product assembly process time and significantly reducing product yield.

[0003] Therefore, how to develop a solution that can improve product assembly efficiency, reduce defect rates during mass production, and meet the requirements of module miniaturization design has become an urgent problem for the industry. Utility Model Content

[0004] To address the existing technical problems, this application provides an infrared module and an infrared thermal imager. The technical solution applied here can improve product assembly efficiency, reduce mass production defect rate, and meet the miniaturization design requirements of the module.

[0005] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows:

[0006] An infrared module includes a lens, a shutter, and a circuit board assembly. The circuit board assembly includes a detector circuit board, a circuit board bracket, and an image processing circuit board. The detector circuit board and the image processing circuit board are respectively disposed on opposite sides of the circuit board bracket. The circuit board bracket has a first mounting hole on the side closest to the image processing circuit board, and the image processing circuit board has a second mounting hole that cooperates with the first mounting hole. The circuit board bracket and the image processing circuit board are connected by a first fixing member passing through the first mounting hole and the second mounting hole. The detector circuit board and the circuit board bracket are connected by a first adhesive layer.

[0007] Optionally, the first adhesive layer is distributed in the edge region of the circuit board support near the detector circuit board side surface.

[0008] Optionally, there are at least two first mounting holes and two second mounting holes, and two of the first mounting holes and two of the second mounting holes are arranged diagonally.

[0009] Optionally, the first fastener includes a first screw, the first screw being inserted from the second mounting hole to the first mounting hole.

[0010] Optionally, the shutter and the detector circuit board are connected by a second adhesive layer.

[0011] Optionally, the second adhesive layer is distributed in the edge region of the detector circuit board surface near the shutter side.

[0012] Optionally, the shutter has a third mounting hole on the side near the lens, and the lens has a fourth mounting hole that cooperates with the third mounting hole. The lens and the shutter are connected by a second fixing member passing through the third mounting hole and the fourth mounting hole.

[0013] Optionally, there are at least two third mounting holes and two fourth mounting holes, and two of the third mounting holes and two of the fourth mounting holes are arranged diagonally.

[0014] Optionally, the second fastener includes a second screw, the second screw being inserted from the fourth mounting hole to the third mounting hole.

[0015] The infrared module provided in the above embodiments includes a lens, a shutter, and a circuit board assembly. These components work together to achieve infrared detection and signal processing functions. The circuit board assembly, as the core functional module, includes a detector circuit board, a circuit board bracket, and an image processing circuit board. From a positional layout perspective, the detector circuit board and the image processing circuit board are respectively mounted on opposite sides of the circuit board bracket. This layout optimizes the utilization of the module's internal space. Regarding connection and fixation, for the assembly of the circuit board bracket and the image processing circuit board, a first mounting hole is provided on the side of the circuit board bracket closest to the image processing circuit board. The image processing circuit board has a second mounting hole that corresponds to the position of the first mounting hole and has a completely matching diameter. During assembly, a first fixing component, such as a fastening screw or a locating pin, is simply passed through the corresponding first and second mounting holes to achieve a secure connection. For fixing the detector circuit board to the circuit board bracket, an adhesive fixing method is used. By placing a first adhesive layer between the two mating surfaces, the detector circuit board is tightly and stably fixed to the circuit board bracket, while also providing a certain degree of sealing. This design simplifies the infrared module assembly process and reduces its size.

[0016] An infrared thermal imager includes the infrared module described in any embodiment of this application.

[0017] The infrared thermal imager provided in the above embodiments belongs to the same concept as the corresponding infrared module embodiments, and thus has the same technical effect as the corresponding infrared module embodiments, which will not be repeated here. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of an infrared module in one embodiment;

[0019] Figure 2This is a schematic diagram of the infrared module in another embodiment;

[0020] Figure 3 This is a schematic diagram of the exploded structure of an infrared module in one embodiment;

[0021] Figure 4 This is a schematic diagram of the front structure of the circuit board bracket in one embodiment;

[0022] Figure 5 This is a schematic diagram of the structure on the back of the circuit board bracket in one embodiment;

[0023] Figure 6 This is a front view of an infrared module in one embodiment;

[0024] Figure 7 This is a left view of the infrared module in one embodiment;

[0025] Figure 8 This is a right view of the infrared module in one embodiment;

[0026] Figure 9 This is a rear view of the infrared module in one embodiment;

[0027] Figure 10 This is a top view of an infrared module in one embodiment;

[0028] Figure 11 This is a bottom view of an infrared module in one embodiment.

[0029] Component Symbol Explanation

[0030] Lens 10, shutter 20, circuit board assembly 30, detector circuit board 31, circuit board bracket 32, image processing circuit board 33, first mounting hole 41, second mounting hole 42, third mounting hole 43, fourth mounting hole 44, first fixing member 51, second fixing member 52 Detailed Implementation

[0031] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the ways in which the invention may be implemented. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] In the description of this utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0034] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0035] In the following description, the phrase "some embodiments" refers to a subset of all possible embodiments. It should be noted that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0036] In the following description, the terms "first, second, and third" are used merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, and third" may be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0037] Please refer to the following: Figures 1 to 5 This is a schematic diagram of the structure of an infrared module provided in an embodiment of this application. An infrared module includes a lens 10, a shutter 20, and a circuit board assembly 30. The circuit board assembly 30 includes a detector circuit board 31, a circuit board support, and an image processing circuit board 33. The detector circuit board 31 and the image processing circuit board 33 are respectively disposed on opposite sides of the circuit board support. The circuit board support has a first mounting hole 41 on the side near the image processing circuit board 33, and the image processing circuit board 33 has a second mounting hole 42 that cooperates with the first mounting hole 41. The circuit board support and the image processing circuit board 33 are connected by a first fixing member 51 passing through the first mounting hole 41 and the second mounting hole 42. The detector circuit board 31 and the circuit board support are connected by a first adhesive layer.

[0038] In the above embodiments, the infrared module includes a lens 10, a shutter 20, and a circuit board assembly 30. These components work together to achieve infrared detection and signal processing functions. The circuit board assembly 30, as the core functional module, includes a detector circuit board 31, a circuit board support 32, and an image processing circuit board 33. From a positional layout perspective, the detector circuit board 31 and the image processing circuit board 33 are respectively mounted on opposite sides of the circuit board support 32. This layout optimizes the utilization of the module's internal space. Regarding the connection and fixation, for the assembly of the circuit board bracket 32 ​​and the image processing circuit board 33, the circuit board bracket 32 ​​has a first mounting hole 41 on the side near the image processing circuit board 33, while the image processing circuit board 33 has a second mounting hole 42 that corresponds to the position of the first mounting hole 41 and has a completely matching diameter. During assembly, the first fixing component 51, such as a fastening screw or a positioning pin, is simply passed through the corresponding first mounting hole 41 and second mounting hole 42 to achieve a firm connection between the two. For the fixation of the detector circuit board 31 and the circuit board bracket 32, glue is used for fixation. By setting a first adhesive layer between the two mating surfaces, the detector circuit board 31 is tightly and stably fixed on the circuit board bracket 32, while also providing a certain sealing effect. This design simplifies the infrared module assembly process and reduces its size.

[0039] In some embodiments, in the structure where the detector circuit board 31 and the circuit board support 32 are connected by a first adhesive layer, the first adhesive layer is specifically distributed on the edge area of ​​the surface of the circuit board support 32 facing the detector circuit board 31. That is, adhesive is applied at the edge of the mating surface between the circuit board support 32 and the detector circuit board 31. The adhesive force generated after the adhesive layer cures fixes the detector circuit board 31 to the corresponding side of the circuit board support 32. At the same time, the edge adhesive design can play an auxiliary protective role in dust and moisture prevention, and optimize the reliability of the overall assembly structure. It can be seen that, compared with the traditional screw and screw hole assembly method, the size of the circuit board support 32 can be minimized by using the edge adhesive fixing method. Specifically, since there is no need to reserve the additional installation space required for screw holes at the edge of the circuit board support 32, the outer perimeter of the circuit board support 32 only needs to be consistent with the outer perimeter of the detector circuit board 31, thereby achieving a compact structure and optimizing the space utilization inside the infrared module.

[0040] In other embodiments, there are at least two first mounting holes 41 and two second mounting holes 42, and two of the first mounting holes 41 and two of the second mounting holes 42 are diagonally arranged. Specifically, at least two first mounting holes 41 are provided on the side of the circuit board bracket 32 ​​near the image processing circuit board 33, and any two holes are arranged diagonally based on the regular shape of their mounting surfaces; correspondingly, second mounting holes 42 are provided on the image processing circuit board 33 in a number and position matching the first mounting holes 41. When the first fastener 51 passes through the diagonally arranged first mounting holes 41 and second mounting holes 42, this diagonal arrangement can evenly distribute the fixing force on the connection interface, effectively avoiding skewing or uneven force during component installation, and improving the structural stability and reliability of the connection between the circuit board bracket 32 ​​and the image processing circuit board 33.

[0041] In some embodiments, the first fixing member 51 includes a first screw, the first screw passing through from the second mounting hole 42 to the first mounting hole 41. In the connection structure between the circuit board bracket 32 ​​and the image processing circuit board 33, the first fixing member 51 can be implemented using the first screw. Specifically, during component assembly, the first screw starts from the side of the image processing circuit board 33 with the second mounting hole 42, passes through the hole of the second mounting hole 42 in sequence, extends in a direction perpendicular to the plane of the image processing circuit board 33, and finally enters the first mounting hole 41 at the corresponding position of the circuit board bracket 32, achieving a rigid connection between the two through threaded engagement or other fastening methods. This path of passing through from the second mounting hole 42 to the first mounting hole 41 allows the screw head to fit against the surface of the outermost image processing circuit board 33 of the infrared module, while the screw shaft penetrates deep into the hole of the circuit board bracket 32. This not only meets the layout requirements of the internal space of the module, but also facilitates product assembly and disassembly operations, ensuring the stability of the connection structure and the operability of the assembly process.

[0042] In other embodiments, please refer to [reference needed]. Figures 6 to 11 The shutter 20 and the detector circuit board 31 are connected by a second adhesive layer. Specifically, a uniformly distributed second adhesive layer is provided between the corresponding mounting surfaces of the shutter 20 and the detector circuit board 31. This adhesive layer is applied to the bonding interface between the shutter 20 and the detector circuit board 31 by a dispensing process. After curing, it forms a stable adhesive structure and also plays a certain role in sealing.

[0043] In some embodiments, in the structure where the shutter 20 and the detector circuit board 31 are connected by a second adhesive layer, this second adhesive layer is specifically distributed on the edge region of the surface of the detector circuit board 31 facing the shutter 20. That is, adhesive is evenly applied to the edge of the mounting surfaces of the detector circuit board 31 and the shutter 20. After the adhesive layer cures, the shutter 20 is fixed to the corresponding side of the detector circuit board 31 by the adhesive force of the edge region. The edge adhesive layer can form a protective boundary between the shutter 20 and the detector circuit board 31, effectively preventing external impurities such as dust and moisture from entering the module, further optimizing the reliability and environmental adaptability of the infrared module. At the same time, by using the edge-applied adhesive fixing method, there is no need to reserve the additional installation space required for screw holes at the edge of the shutter 20, thereby achieving a certain degree of size reduction.

[0044] In other embodiments, during the assembly of the optical components of the infrared module, the connection between the lens 10 and the shutter 20 is achieved through precise hole fitting and the second fixing member 52. Specifically, the shutter 20 has a third mounting hole 43 on the corresponding mounting surface near the lens 10, and the third mounting hole 43 is positioned according to the assembly precision requirements of the lens 10 and the shutter 20. Adapted to the third mounting hole 43, the lens 10 has a fourth mounting hole 44, which corresponds to the third mounting hole 43 on the shutter 20, and the hole diameter is perfectly matched to ensure that the shutter 20 and the lens 10 form a stable mating relationship. During assembly, the second fixing member 52, such as a fastening screw or a positioning pin, only needs to be passed through the corresponding third mounting hole 43 and fourth mounting hole 44 to achieve a firm connection between the shutter 20 and the lens 10.

[0045] In some embodiments, there are at least two third mounting holes 43 and at least two fourth mounting holes 44, and two of the third mounting holes 43 and two of the fourth mounting holes 44 are diagonally arranged. Specifically, at least two first mounting holes 41 are provided on the side of the shutter 20 near the lens 10, and any two holes are arranged diagonally based on the regular shape of their mounting surfaces; correspondingly, fourth mounting holes 44 are provided on the lens 10 in a number and position matching the third mounting holes 43. When the second fastener 52 passes through the diagonally arranged third mounting holes 43 and fourth mounting holes 44, this diagonal arrangement allows the fixing force to be evenly distributed along the mounting surfaces of the lens 10 and the shutter 20, effectively avoiding skewing or uneven force during component installation. This ensures the coaxiality of the lens 10 and the shutter 20 in the optical path of the infrared module and further improves the structural stability and assembly accuracy of their connection.

[0046] In some embodiments, the second fixing member 52 includes a second screw, which passes through from the fourth mounting hole 44 to the third mounting hole 43. During the connection and assembly of the lens 10 and the shutter 20, the second fixing member 52 can use the second screw to achieve rigid fixation between the two. Specifically, since the fourth mounting hole 44 is located on the lens 10 and the third mounting hole 43 is located on the side of the shutter 20 near the lens 10, during assembly, the second screw is inserted into the fourth mounting hole 44 with the fourth mounting hole 44 of the lens 10 as the starting point, perpendicular to the assembly plane of the lens 10 and the shutter 20. The screw is then pushed continuously through the hole until its screw portion is completely inserted into the third mounting hole 43 of the shutter 20. Through the thread engagement between the second screw and the inner wall of the third mounting hole 43, or other suitable fastening structures, the lens 10 and the shutter 20 are finally tightly locked together. This directional insertion method matches the assembly sequence of the lens 10 to the shutter 20 inside the infrared module, ensuring that the screw head fits against the surface of the lens 10 and the screw is stably embedded in the shutter 20. It effectively guarantees the coaxiality and positional accuracy of the lens 10 and the shutter 20 in the optical path of the infrared module, avoiding component misalignment caused by deviation in insertion direction. It also facilitates product assembly and disassembly operations, further ensuring the coaxiality of the lens 10 and the shutter 20 in the optical path, and improving the stability of the connection structure and the overall optical performance stability of the module.

[0047] In another aspect, this application provides an infrared thermal imager, including the infrared module of any of the foregoing embodiments.

[0048] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An infrared module, characterized in that, The device includes a lens (10), a shutter (20), and a circuit board assembly (30). The circuit board assembly (30) includes a detector circuit board (31), a circuit board bracket (32), and an image processing circuit board (33). The detector circuit board (31) and the image processing circuit board (33) are respectively disposed on opposite sides of the circuit board bracket (32). The circuit board bracket (32) has a first mounting hole (41) on the side near the image processing circuit board (33), and the image processing circuit board (33) has a second mounting hole (42) that cooperates with the first mounting hole (41). The circuit board bracket (32) and the image processing circuit board (33) are connected by a first fixing member (51) passing through the first mounting hole (41) and the second mounting hole (42). The detector circuit board (31) and the circuit board bracket (32) are connected by a first adhesive layer.

2. The infrared module according to claim 1, characterized in that, The first adhesive layer is distributed in the edge region of the surface of the circuit board support (32) near the detector circuit board (31).

3. The infrared module according to claim 1, characterized in that, There are at least two of the first mounting holes (41) and the second mounting holes (42), and two of the first mounting holes (41) and two of the second mounting holes (42) are diagonally arranged.

4. The infrared module according to claim 1, characterized in that, The first fastener (51) includes a first screw, which is inserted from the second mounting hole (42) to the first mounting hole (41).

5. The infrared module according to claim 1, characterized in that, The shutter (20) is connected to the detector circuit board (31) by a second adhesive layer.

6. The infrared module according to claim 5, characterized in that, The second adhesive layer is distributed on the edge region of the detector circuit board (31) near the shutter (20).

7. The infrared module according to claim 1, characterized in that, The shutter (20) has a third mounting hole (43) on the side near the lens (10), and the lens (10) has a fourth mounting hole (44) that works in conjunction with the third mounting hole (43). The lens (10) and the shutter (20) are connected by a second fixing member (52) passing through the third mounting hole (43) and the fourth mounting hole (44).

8. The infrared module according to claim 7, characterized in that, There are at least two of the third mounting holes (43) and the fourth mounting holes (44), and two of the third mounting holes (43) and two of the fourth mounting holes (44) are arranged diagonally.

9. The infrared module according to claim 7, characterized in that, The second fastener (52) includes a second screw, which is inserted from the fourth mounting hole (44) to the third mounting hole (43).

10. An infrared thermal imager, characterized in that, Including the infrared module as described in any one of claims 1-9.

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