Solid state disk packaging structure combined with electromagnetic shielding function

Abstract

The application relates to the solid state disk packaging technical field, in particular to a solid state disk packaging structure combined with an electromagnetic shielding function, which comprises a packaging shell, an internal shielding component and an interface shielding device. The inner wall of the packaging shell is provided with a conductive coating, the internal shielding component forms a shielding network with a shielding partition plate and a conductive elastic piece, and the interface shielding device adopts a shielding cover, a conductive adhesive tape and a signal filter to realize double shielding protection. Through the design of the conductive cloth layer, the conductive elastic piece and the conductive adhesive tape, external electromagnetic interference is effectively blocked, internal component layout changes are adapted, meanwhile, the signal transmission stability and the heat dissipation performance are enhanced, and the equipment operation reliability is improved.

Description

Technical Field

[0001] This utility model belongs to the field of solid-state storage devices and electromagnetic compatibility technology, specifically a solid-state hard drive packaging structure that incorporates electromagnetic shielding function. Background Technology

[0002] Solid-state drives (SSDs) are electronic storage devices that use flash memory as the storage medium. They are characterized by high-speed read / write speeds, strong shock resistance, and small size, and are widely used in computers, servers, and other electronic devices. Their packaging structure not only needs to provide physical protection but also meet electromagnetic compatibility (EMC) requirements to ensure the stability and security of data transmission. As electronic devices become increasingly higher-frequency and smaller, electromagnetic interference issues are becoming more prominent, especially in high-density integrated environments. External electromagnetic waves can affect the performance of SSDs, making the introduction of electromagnetic shielding in the packaging design particularly important.

[0003] Existing solid-state drive (SSD) packaging structures typically achieve electromagnetic shielding through metal casings or additional shielding layers. However, this approach often requires additional materials and processes, leading to increased costs and complex assembly. Furthermore, traditional shielding designs often focus on overall coverage, failing to precisely shield critical internal components, potentially leaving localized areas vulnerable to electromagnetic leakage. For instance, during high-frequency signal transmission, the interface area can easily become a major entry point for electromagnetic interference; inadequate shielding can cause data transmission errors or performance degradation.

[0004] For example, some solid-state drives (SSDs) experience reduced read / write speeds or even data loss due to insufficient shielding during operation, especially when exposed to external electromagnetic interference. Furthermore, some packaging structures use a single-material shielding layer, which, while reducing electromagnetic interference to some extent, has limited shielding effectiveness at high frequencies and cannot fully meet the demands of high-performance devices. Additionally, an insufficiently tight connection between the shielding layer and the drive body can lead to unstable shielding, affecting the long-term reliability of the device. Therefore, designing a solid-state drive packaging structure that effectively shields against electromagnetic interference while also considering cost and assembly efficiency has become a pressing issue. Utility Model Content

[0005] This utility model relates to the field of solid-state drive (SSD) packaging technology, specifically to a SSD packaging structure incorporating electromagnetic shielding. It includes a packaging shell, an internal shielding assembly, and an interface shielding device. The packaging shell is made of a metal substrate, and its inner wall is provided with a conductive coating layer. The internal shielding assembly includes multiple shielding partitions, which are connected to the inner wall of the packaging shell via slots, and are electrically connected to each other via conductive elastic elements. The interface shielding device is installed at the interface end of the SSD and is connected to the packaging shell via conductive adhesive strips.

[0006] The encapsulation shell includes a main body shell made of a metal substrate. The inner wall of the main body shell is coated with a conductive coating layer with a thickness of 0.1 mm to 0.3 mm. Multiple heat dissipation holes are provided on the side wall of the main body shell. The inner wall of the heat dissipation holes is coated with nickel to form a shielding layer. A positioning groove is provided at the bottom of the main body shell for installing a shielding partition.

[0007] The shielding partition includes a rectangular frame with snap-fit ​​protrusions on the outer side of the rectangular frame that engage with slots on the inner wall of the encapsulation shell; a conductive cloth layer is provided on the inner side of the rectangular frame and is fixed to the rectangular frame by adhesive; adjacent shielding partitions are connected by a conductive elastic element, one end of which is inserted into a spring hole on one shielding partition and the other end is inserted into a spring hole on the other shielding partition.

[0008] The interface shielding device includes a shielding cover, which is fixed to the interface end of the solid-state drive by bolts; a conductive velvet layer is provided on the inner wall of the shielding cover, which is fixed to the shielding cover by adhesive; a conductive adhesive strip is provided on the outer edge of the shielding cover, which is connected to the opening end of the packaging shell by pressing; a signal filter is provided on the top of the shielding cover, which is connected to the shielding cover by soldering.

[0009] The conductive elastic element includes a helical spring, with conductive caps at both ends of the helical spring, which are fixed to the ends of the helical spring by riveting. Conductive contacts are provided on the outer side of the conductive caps, and the conductive contacts are in contact with the conductive cloth layer on the shielding plate. An insulating sleeve is provided in the middle of the helical spring, and the insulating sleeve is wrapped around the outside of the helical spring by injection molding.

[0010] The conductive adhesive strip includes a silicone substrate, with multiple conductive fibers embedded inside the silicone substrate, the conductive fibers being arranged along the length of the silicone substrate; a conductive coating is provided on the outer side of the silicone substrate, the conductive coating being formed by a spraying process; positioning protrusions are provided at both ends of the conductive adhesive strip, the positioning protrusions cooperating with the positioning grooves of the encapsulation shell.

[0011] The signal filter includes a filter circuit board with multiple filter capacitors and filter inductors. The input end of the filter circuit board is connected to the interface of the solid-state drive via wires, and the output end is connected to the shielding cover via wires. A thermal pad is provided on the bottom of the filter circuit board and is fixed to the inner wall of the shielding cover by adhesive.

[0012] The inner wall of the shielding cover is provided with multiple conductive pillars, which are fixed to the shielding cover by threaded connection; one end of the conductive pillar is provided with a conductive sheet, which is connected to the conductive pillar by welding; the outer side of the conductive sheet is provided with a conductive coating, which is formed by spraying process.

[0013] The conductive fabric layer includes a base fabric layer, the surface of which is coated with a conductive polymer layer with a thickness of 0.05 mm to 0.1 mm; conductive edge strips are provided at the edges of the base fabric layer, and the conductive edge strips are fixed to the base fabric layer by sewing; a conductive coating is provided on the outer side of the conductive edge strips, and the conductive coating is formed by a spraying process.

[0014] Compared with existing technologies, the advantages of this utility model are as follows: 1. A conductive coating layer is provided on the inner wall of the encapsulation shell, and the interior of the solid-state drive is divided into multiple independent shielding areas by shielding partitions. The shielding partitions are electrically connected by conductive elastic elements, thereby forming a complete shielding network that can effectively block external electromagnetic waves from interfering with the internal components of the solid-state drive. 2. The interface shielding device provides double shielding protection for the interface end through a combination design of a shielding cover and a signal filter. The conductive velvet layer on the inner wall of the shielding cover can absorb high-frequency electromagnetic waves, while the signal filter filters the data transmission signal, reducing signal noise. 3. The conductive adhesive strip design not only realizes the electrical connection between the shielding cover and the encapsulation shell, but also enhances conductivity by embedding conductive fibers. At the same time, the positioning protrusion cooperates with the positioning groove of the encapsulation shell to ensure installation stability. 4. The shielding partition adopts a combination design of conductive cloth layer and conductive elastic elements, which can not only achieve the shielding function, but also adapt to the layout changes of the internal components of the solid-state drive, improving assembly flexibility. 5. The signal filter processes the signal through the filter capacitors and filter inductors on the filter circuit board, reducing the impact of electromagnetic interference on data transmission. At the same time, the thermal pad design can effectively dissipate heat and improve the reliability of equipment operation. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the present invention, showing the layout relationship of the encapsulation shell, the internal shielding components, and the interface shielding device. The encapsulation shell is connected to the shielding partition through a conductive coating layer, and the interface shielding device is installed at the opening end of the encapsulation shell.

[0016] Figure 2 This is a partial cross-sectional view of the enclosure, showing the conductive coating layer on the inner wall of the main housing, the nickel-plated shielding layer of the heat dissipation holes, and the positioning groove at the bottom for mounting the shielding partition.

[0017] Figure 3 This is a structural diagram of a shielding partition, showing the snap-fit ​​protrusions, conductive fabric layer, and spring holes on the rectangular frame. Adjacent shielding partitions are electrically connected through conductive elastic elements.

[0018] Figure 4 This is an exploded view of the interface shielding device, which includes a shielding cover, a conductive velvet layer, conductive adhesive strips, and a signal filter. The shielding cover is connected to the encapsulation shell via the conductive adhesive strips, and the signal filter processes the data transmission signal.

[0019] Figure 5 This is a schematic diagram of a conductive elastic element, showing the combined design of a helical spring, a conductive cap, and an insulating sleeve. The conductive contacts on the conductive cap are in contact with the conductive fabric layer of the shielding partition.

[0020] The attached figures are labeled as follows:

[0021] 1. Encapsulation shell; 2. Conductive coating layer; 3. Shielding partition; 4. Conductive cloth layer; 5. Conductive elastic element; 6. Interface shielding device; 7. Shielding cover; 8. Conductive fleece layer; 9. Conductive adhesive strip; 10. Signal filter; 11. Helical spring; 12. Conductive cap; 13. Conductive contact; 14. Insulating sleeve; 15. Heat dissipation hole; 16. Positioning groove. Detailed Implementation

[0022] This utility model relates to a solid-state drive packaging structure that incorporates electromagnetic shielding function, the overall structure of which is as follows: Figure 1 As shown, the device includes a housing 1, an internal shielding assembly, and an interface shielding device 6. The housing 1 is made of a metal substrate, and its inner wall is provided with a conductive coating layer 2. The internal shielding assembly includes multiple shielding partitions 3, which are connected to the inner wall of the housing 1 through slots and electrically connected to adjacent shielding partitions 3 through conductive elastic elements 5. The interface shielding device 6 is installed at the interface end of the solid-state drive and is connected to the housing 1 through conductive adhesive strips 9.

[0023] The specific structure of the packaging shell 1 is as follows Figure 2 As shown, the main body shell is made of a metal substrate, and the inner wall is sprayed with a conductive coating layer 2. The thickness of the conductive coating layer 2 is 0.1 mm to 0.3 mm to ensure good conductivity. Multiple heat dissipation holes 15 are provided on the side wall of the main body shell. The inner wall of the heat dissipation holes 15 is nickel-plated to form a shielding layer, which effectively prevents external electromagnetic waves from entering the package interior through the heat dissipation holes 15. A positioning groove 16 is provided at the bottom of the main body shell for installing the shielding partition 3. The design of the positioning groove 16 not only facilitates the fixed installation of the shielding partition 3, but also ensures a reliable electrical connection between the shielding partition 3 and the package shell 1.

[0024] The specific structure of the shielding partition 3 is as follows: Figure 3As shown, it includes a rectangular frame with snap-fit ​​protrusions on the outer side. These protrusions engage with slots on the inner wall of the encapsulation housing 1, thereby fixing the shielding partition 3 inside the encapsulation housing 1. A conductive fabric layer 4 is provided on the inner side of the rectangular frame and is fixed to the rectangular frame by adhesive. Adjacent shielding partitions 3 are electrically connected by a conductive elastic element 5. One end of the conductive elastic element 5 is inserted into a spring hole on one shielding partition 3, and the other end is inserted into a spring hole on the other shielding partition 3. The structure of the conductive elastic element 5 is as follows... Figure 5 As shown, the device includes a helical spring 11, with conductive caps 12 at both ends. The conductive caps 12 are fixed to the ends of the helical spring 11 by riveting. Conductive contacts 13 are provided on the outer side of the conductive caps 12, and these contacts 13 contact the conductive cloth layer 4 on the shielding partition 3, thereby achieving electrical connection between the shielding partitions 3. An insulating sleeve 14 is provided in the middle of the helical spring 11. The insulating sleeve 14 is wrapped around the outside of the helical spring 11 by injection molding to prevent short circuits between the conductive elastic element 5 and other components.

[0025] The specific structure of the interface shielding device 6 is as follows: Figure 4 As shown, the system includes a shielding cover 7, which is bolted to the interface of the solid-state drive (SSD). A conductive felt layer 8 is provided on the inner wall of the shielding cover 7, and is attached to the shielding cover 7 by adhesive. A conductive adhesive strip 9 is provided on the outer edge of the shielding cover 7, and is connected to the opening of the encapsulation shell 1 by pressing. The conductive adhesive strip 9 comprises a silicone substrate with multiple conductive fibers embedded within it, arranged along the length of the silicone substrate to enhance conductivity. A conductive coating is provided on the outer side of the silicone substrate, formed by a spraying process. Positioning protrusions are provided at both ends of the conductive adhesive strip 9, which engage with positioning grooves 16 in the encapsulation shell 1 to ensure installation stability. A signal filter 10 is provided on the top of the shielding cover 7, and is connected to the shielding cover 7 by soldering. The signal filter 10 includes a filter circuit board with multiple filter capacitors and filter inductors. The input end of the filter circuit board is connected to the interface of the SSD via wires, and the output end is connected to the shielding cover 7 via wires. A thermal pad is installed at the bottom of the filter circuit board. The thermal pad is fixed to the inner wall of the shielding cover 7 by adhesive to dissipate heat.

[0026] The inner wall of the shielding cover 7 is further provided with multiple conductive posts, which are fixed to the shielding cover 7 by threaded connections. A conductive sheet is provided at one end of each conductive post, and the conductive sheet is connected to the conductive post by welding. A conductive coating is provided on the outer side of the conductive sheet, and the conductive coating is formed by a spraying process. The conductive fabric layer 4 specifically includes a base fabric layer, the surface of which is coated with a conductive polymer layer with a thickness of 0.05 mm to 0.1 mm. Conductive edge strips are provided at the edges of the base fabric layer, and the conductive edge strips are fixed to the base fabric layer by sewing. A conductive coating is provided on the outer side of the conductive edge strips, and the conductive coating is formed by a spraying process.

[0027] In the actual assembly process, the main body of the encapsulation shell 1 is first assembled, and a conductive coating layer 2 is sprayed onto its inner wall. Simultaneously, the inner wall of the heat dissipation holes 15 is nickel-plated. Then, the shielding partitions 3 are installed by engaging the slots on the inner wall of the encapsulation shell 1 using snap-fit ​​protrusions. Adjacent shielding partitions 3 are connected by conductive elastic elements 5. The installation process of the conductive elastic elements 5 involves inserting both ends of the coil spring 11 into the spring holes on the two shielding partitions 3, ensuring that the conductive contacts 13 on the conductive cap 12 are in contact with the conductive cloth layer 4 on the shielding partition 3. Next, the interface shielding device 6 is installed on the interface end of the solid-state drive. After the shielding cover 7 is fixed with bolts, it is connected to the encapsulation shell 1 using conductive adhesive strips 9. The positioning protrusions of the conductive adhesive strip 9 engage with the positioning grooves 16 of the encapsulation shell 1 to ensure accurate installation. Finally, the signal filter 10 is soldered to the top of the shielding cover 7, and relevant wires are connected to complete the assembly of the entire encapsulation structure.

[0028] During operation, the conductive coating layer 2 of the enclosure 1 and the shielding partition 3 together form a complete shielding network, effectively blocking external electromagnetic waves from interfering with the internal components of the solid-state drive. The interface shielding device 6 provides dual protection for the interface end through the combined design of the shielding cover 7 and the signal filter 10. The conductive fleece layer 8 on the inner wall of the shielding cover 7 absorbs high-frequency electromagnetic waves, while the signal filter 10 filters the data transmission signal, reducing signal noise. The conductive adhesive strip 9 not only achieves the electrical connection between the shielding cover 7 and the enclosure 1, but also enhances conductivity by embedding conductive fibers. At the same time, the positioning protrusion cooperates with the positioning groove 16 of the enclosure 1 to ensure installation stability. The shielding partition 3 adopts a combined design of conductive cloth layer 4 and conductive elastic element 5, which can not only achieve the shielding function, but also adapt to the layout changes of the internal components of the solid-state drive, improving assembly flexibility. The signal filter 10 processes the signal through the filter capacitor and filter inductor on the filter circuit board, reducing the impact of electromagnetic interference on data transmission. At the same time, the design of the thermal pad can effectively dissipate heat and improve the reliability of equipment operation.

[0029] To enable those skilled in the art to fully understand and implement this utility model, the following supplementary explanation of the implementation principle of this utility model is provided in conjunction with specific application scenarios.

[0030] In real-world operating environments, solid-state drives (SSDs) are typically installed in high-density integrated devices, such as server racks or high-performance computing equipment. These environments often contain strong sources of electromagnetic interference, such as high-frequency signal transmission lines, power modules, and other electronic devices. Therefore, the packaging structure of this invention, through its multi-layered shielding design, can effectively address interference issues in complex electromagnetic environments.

[0031] First, after the solid-state drive is assembled, the conductive coating layer 2 of the package shell 1 and the shielding partition 3 work together to form a complete shielding network. Specifically, the metal substrate of the package shell 1 acts as the first barrier, reflecting most external electromagnetic waves. The conductive coating layer 2 further enhances the shielding effect; its thickness is 0.1mm to 0.3mm, ensuring good conductivity and guiding external electromagnetic waves to the ground wire, preventing them from entering the package. Although the heat dissipation holes 15 are necessary heat dissipation channels, the shielding layer formed by nickel plating on their inner walls effectively prevents electromagnetic waves from penetrating through the heat dissipation holes 15. The high conductivity and oxidation resistance of the nickel plating layer make the shielding effect more stable without affecting heat dissipation performance.

[0032] Secondly, the shielding partition 3 is installed by engaging with the slots on the inner wall of the encapsulation shell 1 via snap-fit ​​protrusions, and the electrical connection between adjacent shielding partitions 3 is achieved through the conductive elastic element 5. This design not only facilitates assembly but also allows for flexible adjustment of the shielding area according to the layout of the internal components of the solid-state drive. The helical spring 11 in the conductive elastic element 5 contacts the conductive cloth layer 4 on the shielding partition 3 through conductive caps 12 at both ends, achieving electrical connection. The tight contact between the conductive contact 13 and the conductive cloth layer 4 ensures the conductive continuity between the shielding partitions 3, while the insulating sleeve 14 prevents the helical spring 11 from short-circuiting with other components. This combined design can form a stable low-impedance path between the shielding partitions 3, thereby effectively blocking the propagation of electromagnetic waves between different shielding areas.

[0033] The interface shielding device 6 is designed to provide dual protection for the critical solid-state drive interface. The shielding cover 7 is connected to the encapsulation shell 1 via a conductive adhesive strip 9. The conductive fibers within the conductive adhesive strip 9 are arranged along its length, enhancing conductivity. Simultaneously, its silicone matrix possesses a degree of elasticity, allowing it to adapt to minor deformations during assembly. The positioning protrusions of the conductive adhesive strip 9 engage with the positioning grooves 16 of the encapsulation shell 1, ensuring a reliable and stable electrical connection between the shielding cover 7 and the encapsulation shell 1. The conductive fleece layer 8 on the inner wall of the shielding cover 7 absorbs high-frequency electromagnetic waves, reducing their impact on the interface. Furthermore, the signal filter 10 processes the data transmission signal through filter capacitors and filter inductors on the filter circuit board, reducing signal noise and thus improving the stability and reliability of data transmission. The thermal pad at the bottom of the filter circuit board conducts heat to the inner wall of the shielding cover 7, which is then dissipated through the heat dissipation holes 15, preventing performance degradation due to overheating.

[0034] During actual operation, when external electromagnetic waves attempt to penetrate the solid-state drive, the conductive coating layer 2 of the enclosure 1 and the conductive cloth layer 4 of the shielding partition 3 work together to guide the electromagnetic waves to the ground wire, thereby preventing them from interfering with the internal components. For high-frequency electromagnetic waves, the conductive felt layer 8 on the inner wall of the shielding cover 7 can absorb some energy, while the signal filter 10 filters the data transmission signal through filter capacitors and filter inductors, further reducing the impact of electromagnetic interference on signal quality. The design of conductive pillars and conductive sheets provides additional conductive paths for the shielding cover 7, ensuring the integrity of the shielding network.

[0035] Through the above design, the packaging structure of this utility model can not only effectively shield external electromagnetic interference, but also adapt to changes in the layout of internal components of the solid-state drive, improving assembly flexibility. Simultaneously, its multiple shielding and filtering design significantly improves the stability of data transmission and the reliability of device operation, meeting the needs of high-performance devices. The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A solid state disk package structure combined with electromagnetic shielding function, comprising a package shell (1), an internal shielding assembly and an interface shielding device (6), characterized in that: The encapsulation shell (1) is made of a metal substrate, and the inner wall of the encapsulation shell (1) is provided with a conductive coating layer (2); the internal shielding assembly includes multiple shielding partitions (3), the shielding partitions (3) are connected to the inner wall of the encapsulation shell (1) through slots, and adjacent shielding partitions (3) are electrically connected through conductive elastic elements (5); the interface shielding device (6) is installed on the interface end of the solid-state drive, and the interface shielding device (6) is connected to the encapsulation shell (1) through conductive adhesive strips (9).

2. The solid state hard disk package structure with electromagnetic shielding function according to claim 1, characterized in that: The encapsulation shell (1) includes a main shell, and a conductive coating layer (2) is formed on the inner wall of the main shell by a spraying process. The thickness of the conductive coating layer (2) is 0.1 mm to 0.3 mm. Multiple heat dissipation holes (15) are opened on the side wall of the main shell. The inner wall of the heat dissipation holes (15) is formed by nickel plating. A positioning groove (16) is provided at the bottom of the main shell. The positioning groove (16) is used to install the shielding partition (3).

3. The solid state hard disk package structure with electromagnetic shielding function according to claim 1, characterized in that: The shielding partition (3) includes a rectangular frame, and a snap-fit ​​protrusion is provided on the outside of the rectangular frame. The snap-fit ​​protrusion cooperates with the slot on the inner wall of the encapsulation shell (1). A conductive cloth layer (4) is provided on the inside of the rectangular frame. The conductive cloth layer (4) is fixed to the rectangular frame by adhesive. Two adjacent shielding partitions (3) are connected by a conductive elastic element (5). One end of the conductive elastic element (5) is inserted into a spring hole on one shielding partition (3), and the other end is inserted into a spring hole on another shielding partition (3).

4. The solid state hard disk package structure with electromagnetic shielding function according to claim 1, characterized in that: The interface shielding device (6) includes a shielding cover (7), which is fixed to the interface end of the solid-state drive by bolts; a conductive velvet layer (8) is provided on the inner wall of the shielding cover (7), which is fixed to the shielding cover (7) by adhesive; a conductive adhesive strip (9) is provided on the outer edge of the shielding cover (7), which is connected to the encapsulation shell (1) by pressing; a signal filter (10) is provided on the top of the shielding cover (7), which is connected to the shielding cover (7) by welding.

5. A solid-state drive packaging structure incorporating electromagnetic shielding function according to claim 3, characterized in that: The conductive elastic element (5) includes a helical spring (11), with conductive caps (12) provided at both ends of the helical spring (11). The conductive caps (12) are fixed to the ends of the helical spring (11) by riveting. Conductive contacts (13) are provided on the outside of the conductive caps (12), and the conductive contacts (13) are in contact with the conductive cloth layer (4) on the shielding partition (3). An insulating sleeve (14) is provided in the middle of the helical spring (11), and the insulating sleeve (14) is wrapped around the outside of the helical spring (11) by injection molding.

6. The solid state hard disk package structure with electromagnetic shielding function according to claim 4, characterized in that: The conductive adhesive strip (9) includes a silicone substrate, with multiple conductive fibers embedded inside the silicone substrate, the conductive fibers being arranged along the length of the silicone substrate; a conductive coating is provided on the outside of the silicone substrate, the conductive coating being formed by a spraying process; positioning protrusions are provided at both ends of the conductive adhesive strip (9), the positioning protrusions cooperating with the positioning grooves (16) of the encapsulation shell (1).

7. The solid state hard disk package structure with electromagnetic shielding function according to claim 4, characterized in that: The signal filter (10) includes a filter circuit board, on which multiple filter capacitors and filter inductors are provided; the input end of the filter circuit board is connected to the interface end of the solid-state drive through a wire, and the output end is connected to the shielding cover (7) through a wire; a heat-conducting pad is provided at the bottom of the filter circuit board, and the heat-conducting pad is fixed to the inner wall of the shielding cover (7) by adhesive. 8.The solid state hard disk package structure with electromagnetic shielding function of claim 4, wherein: The inner wall of the shield (7) is provided with multiple conductive pillars, which are fixed to the shield (7) by threaded connection; a conductive sheet is provided at one end of the conductive pillar, which is connected to the conductive pillar by welding; a conductive coating is provided on the outside of the conductive sheet, which is formed by spraying process.

9. The solid state hard disk package structure with electromagnetic shielding function according to claim 3, characterized in that: The conductive fabric layer (4) includes a base fabric layer, the surface of which is coated with a conductive polymer layer, the thickness of which is 0.05 mm to 0.1 mm; a conductive edge strip is provided at the edge of the base fabric layer, and the conductive edge strip is fixed to the base fabric layer by sewing; a conductive coating is provided on the outside of the conductive edge strip, and the conductive coating is formed by spraying.

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