Electrically conductive sponge of a multilayer composite structure

Abstract

The utility model discloses a multilayer composite structure's conductive sponge relates to conductive sponge technical field, by from top to bottom includes nanometer silver coating, first conductive sponge layer, metal grid layer, second conductive sponge layer, first conductive acrylic adhesive layer, conductive cloth layer, second conductive acrylic layer and release paper layer, nanometer silver coating lower surface and first conductive sponge layer upper surface fit fixed, first conductive sponge layer lower surface and metal grid layer upper surface fit fixed, metal grid layer lower surface and second conductive sponge layer upper surface fit fixed, second conductive sponge layer lower surface and first conductive acrylic adhesive layer upper surface fit fixed, first conductive acrylic adhesive layer lower surface and conductive cloth layer upper surface fit fixed, conductive cloth layer lower surface and second conductive acrylic adhesive layer upper surface fit fixed, effectively solved the problem that traditional conductive sponge antibacterial performance is missing, and the unstable problem of conductive performance.

Description

Technical Field

[0001] This utility model relates to the field of conductive sponge technology, specifically to a multi-layer composite conductive sponge. Background Technology

[0002] In fields such as electronic equipment manufacturing, medical instrument protection, and precision component packaging, conductive sponges have become key materials due to their simultaneous conductivity and cushioning properties, primarily serving important functions such as electromagnetic shielding, electrostatic discharge, and conductive connections. In existing technologies, the preparation of conductive sponges often employs single-structure designs or simple composite methods. For example, carbon-based or metallic conductive fillers are incorporated into the sponge substrate to impart conductivity, or conductive cloth or metal foil is laminated to the surface to enhance conductivity.

[0003] However, existing conductive sponges suffer from two major problems in practical applications: First, they lack antibacterial properties. Traditional conductive sponges are mostly used in the internal environments of closed or semi-closed electronic devices. These environments are prone to bacterial growth due to suitable temperature and humidity, and the porous structure of the sponge itself makes it easier to absorb dust and microorganisms. Long-term use may lead to bacterial growth and spread, especially in scenarios with high hygiene requirements such as medical electronics and food testing equipment. Second, their conductivity is not stable enough. The structure that relies solely on internal conductive fillers often suffers from unstable conductivity due to uneven distribution or insufficient amount of fillers, and the surface conductivity is weak, making it difficult to meet the requirements of high-precision conductive contact.

[0004] Therefore, it is necessary to propose a new technical solution to address the above problems. Utility Model Content

[0005] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the above problems.

[0006] A multi-layered composite conductive sponge comprises, from top to bottom, a nano-silver coating, a first conductive sponge layer, a metal mesh layer, a second conductive sponge layer, a first conductive acrylic adhesive layer, a conductive cloth layer, a second conductive acrylic layer, and a release paper layer. The lower surface of the nano-silver coating is bonded and fixed to the upper surface of the first conductive sponge layer, the lower surface of the first conductive sponge layer is bonded and fixed to the upper surface of the metal mesh layer, the lower surface of the metal mesh layer is bonded and fixed to the upper surface of the second conductive sponge layer, the lower surface of the second conductive sponge layer is bonded and fixed to the upper surface of the first conductive acrylic adhesive layer, the lower surface of the first conductive acrylic adhesive layer is bonded and fixed to the upper surface of the conductive cloth layer, the lower surface of the conductive cloth layer is bonded and fixed to the upper surface of the second conductive acrylic adhesive layer, and the lower surface of the second conductive acrylic adhesive layer is bonded and fixed to the upper surface of the release paper layer.

[0007] As a further embodiment of this invention: the nano-silver coating is applied to the upper surface of the first conductive sponge layer by a spraying process.

[0008] As a further embodiment of this utility model: the nano-silver coating is bonded to the upper surface of the first conductive sponge layer, and a portion of the nano-silver coating fills the surface voids of the upper surface of the first conductive sponge layer.

[0009] As a further embodiment of this utility model: the metal mesh layer is bonded and fixed to the first conductive sponge layer and the second conductive sponge layer respectively by hot pressing composite process or conductive adhesive.

[0010] As a further embodiment of this utility model: both the first conductive sponge layer and the second conductive sponge layer are elastic sponges containing conductive fillers.

[0011] As a further embodiment of this utility model: the metal mesh layer is a woven metal mesh or a etched metal mesh.

[0012] As a further embodiment of this utility model: both the first conductive acrylic adhesive layer and the second conductive acrylic layer are pressure-sensitive adhesives containing a conductive medium.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: Through a multi-layered structural design, the nano-silver coating provides surface antibacterial and conductive enhancement functions, while the metal mesh layer and conductive adhesive layer work together to ensure the stability of the overall conductive path. The tight bonding between each layer ensures that the structure is not prone to delamination during long-term use, effectively solving the problems of lack of antibacterial properties and unstable conductivity of traditional conductive sponges.

[0014] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the hierarchical distribution structure of this utility model.

[0017] The reference numerals and names in the figure are as follows: 1. Nano silver coating; 2. First conductive sponge layer; 3. Metal mesh layer; 4. Second conductive sponge layer; 5. First conductive acrylic adhesive layer; 6. Conductive cloth layer; 7. Second conductive acrylic layer; 8. Release paper layer. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1-2 In this embodiment of the utility model, a multi-layered composite conductive sponge is a layered composite structure, which includes, from top to bottom, a nano-silver coating 1, a first conductive sponge layer 2, a metal mesh layer 3, a second conductive sponge layer 4, a first conductive acrylic adhesive layer 5, a conductive cloth layer 6, a second conductive acrylic layer 7, and a release paper layer 8. Each adjacent layer is bonded and fixed to form a continuous overall structure.

[0020] A nano-silver coating 1 is applied to the upper surface of the first conductive sponge layer 2, and can be prepared and completely cover the upper surface of the first conductive sponge layer 2 through a spraying process. During the formation process, a portion of the nano-silver coating 1 penetrates and fills the surface pores of the upper surface of the first conductive sponge layer 2, thereby increasing the contact area between the two, improving the bonding strength, and ensuring the conductive continuity between the nano-silver coating 1 and the first conductive sponge layer 2. Because silver itself has antibacterial properties, the nano-silver coating 1 can inhibit the growth of microorganisms on the surface of the conductive sponge and in its surface pores, solving the problem of bacterial growth in traditional conductive sponges in enclosed environments.

[0021] The first conductive sponge layer 2 and the second conductive sponge layer 4 are both elastic sponges containing conductive fillers. The conductive fillers are evenly distributed in the sponge substrate, forming a basic conductive path. The elastic properties allow the sponge to deform under force and return to its original shape after the external force is removed, maintaining its cushioning performance. The metal mesh layer 3 is located between the first conductive sponge layer 2 and the second conductive sponge layer 4. It is made of metal woven mesh or metal etched mesh and is bonded and fixed to the upper and lower sponge layers through a hot-pressing composite process or conductive adhesive. When using the hot-pressing composite process, the first conductive sponge layer 2 and the second conductive sponge layer 4 are partially embedded in the gaps of the metal mesh under hot pressing, forming a mechanical interlocking structure. When using conductive adhesive, the conductive adhesive fills the contact surface and the gaps between the mesh, achieving both physical fixation and ensuring conductive continuity. The setting of the metal mesh layer 3 can compensate for the uneven distribution of conductive fillers in a single sponge layer. Through its continuous metal structure, it forms a stable main conductive channel, improving the overall stability of conductivity.

[0022] The lower surface of the second conductive sponge layer 4 is bonded to the upper surface of the first conductive acrylic adhesive layer 5, the lower surface of the first conductive acrylic adhesive layer 5 is bonded to the upper surface of the conductive cloth layer 6, and the lower surface of the conductive cloth layer 6 is then bonded to the upper surface of the second conductive acrylic adhesive layer. Both the first conductive acrylic adhesive layer 5 and the second conductive acrylic layer 7 are pressure-sensitive adhesives containing a conductive medium. The conductive medium is uniformly dispersed in the adhesive layer, allowing the adhesive layer to maintain conductivity while providing adhesion, ensuring uninterrupted conductive pathways between layers. The conductive cloth layer 6 further strengthens the overall conductive network through its own conductive properties, while the flexibility of the fabric enhances the structure's tear resistance.

[0023] Release paper layer 8 is attached to the lower surface of the second conductive acrylic adhesive layer. When the conductive sponge is not in use, it can protect the adhesiveness of the second conductive acrylic adhesive layer from contamination. When in use, it can be directly peeled off, which facilitates the bonding and installation of the conductive sponge with other components.

[0024] Through the above multi-layer structure design, the nano-silver coating 1 provides surface antibacterial and conductive reinforcement functions, the metal mesh layer 3 and the conductive adhesive layer work together to ensure the stability of the overall conductive path, and the tight bonding between each layer ensures that the structure is not prone to delamination during long-term use, effectively solving the problems of lack of antibacterial performance and unstable conductivity of traditional conductive sponges.

[0025] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention.

Claims

1. A conductive sponge of a multilayer composite structure, characterized in that, From top to bottom, it includes a nano silver coating, a first conductive sponge layer, a metal mesh layer, a second conductive sponge layer, a first conductive acrylic adhesive layer, a conductive cloth layer, a second conductive acrylic layer, and a release paper layer. The lower surface of the nano-silver coating is bonded and fixed to the upper surface of the first conductive sponge layer, the lower surface of the first conductive sponge layer is bonded and fixed to the upper surface of the metal mesh layer, the lower surface of the metal mesh layer is bonded and fixed to the upper surface of the second conductive sponge layer, the lower surface of the second conductive sponge layer is bonded and fixed to the upper surface of the first conductive acrylic adhesive layer, the lower surface of the first conductive acrylic adhesive layer is bonded and fixed to the upper surface of the conductive cloth layer, the lower surface of the conductive cloth layer is bonded and fixed to the upper surface of the second conductive acrylic adhesive layer, and the lower surface of the second conductive acrylic adhesive layer is bonded and fixed to the upper surface of the release paper layer.

2. The electrically conductive sponge of a multi-layer composite structure according to claim 1, wherein, The nano-silver coating is applied to the upper surface of the first conductive sponge layer via a spraying process.

3. The electrically conductive sponge of a multi-layer composite structure according to claim 1 or 2, characterized in that, The nano-silver coating is bonded to the upper surface of the first conductive sponge layer, and a portion of the nano-silver coating fills the surface voids of the upper surface of the first conductive sponge layer.

4. The electrically conductive sponge of a multi-layer composite structure according to claim 1, wherein, The metal mesh layer is bonded and fixed to the first conductive sponge layer and the second conductive sponge layer respectively by hot pressing composite process or conductive adhesive.

5. The electrically conductive sponge of a multi-layer composite structure according to claim 1, wherein, Both the first conductive sponge layer and the second conductive sponge layer are elastic sponges containing conductive fillers.

6. The electrically conductive sponge of a multi-layer composite structure according to claim 1, wherein, The metal mesh layer is a woven metal mesh or an etched metal mesh.

7. The electrically conductive sponge of a multi-layer composite structure according to claim 1, wherein, Both the first conductive acrylic adhesive layer and the second conductive acrylic layer are pressure-sensitive adhesives containing a conductive medium.

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