A laminated structure of a buried inductance PCB

Abstract

The utility model is suitable for printed circuit production and processing field, provides a kind of buried inductance PCB's compression structure, including PCB body and be located on the blind slot of PCB body, the blind slot is used to accommodate inductive component device;The periphery of the blind slot is equipped with blind slot edge clamping point, and the blind slot edge clamping point is used to limit the inductive component device;The bottom of the blind slot is equipped with blind slot bottom protrusion in the middle, and the blind slot bottom protrusion is the structure of ladder, is used to support the inductive component device.The utility model improves the compression precision and reliability of buried inductance PCB by optimizing blind slot structure design, solves the problem of uneven glue filling and device deviation, has remarkable economic value and market prospect.

Description

Technical Field

[0001] This utility model belongs to the field of printed circuit manufacturing and processing, and particularly relates to a lamination structure for a PCB with embedded inductors. Background Technology

[0002] With the rapid development of AI servers, power supplies, as a core component of these devices, face increasingly higher design requirements. Currently, inductors are typically mounted directly on the surface of printed circuit boards (PCBs), occupying a significant amount of space and limiting the overall compactness of the layout. Embedding inductors inside the PCB has become an important solution for improving the space utilization of power modules and achieving miniaturization.

[0003] However, during the lamination process, due to the flow of the prepreg resin and gravity, embedded inductor components are prone to displacement, leading to insufficient filling at the bottom of the component, forming voids, and subsequently causing reliability issues such as poor connection or even board failure. Therefore, in view of the above situation, there is an urgent need to develop a lamination structure for embedded inductor PCBs to overcome the shortcomings in current practical applications. Summary of the Invention

[0004] The purpose of this invention is to provide a lamination structure for embedded inductor PCBs, aiming to solve the problems mentioned in the background art.

[0005] This utility model is implemented as follows: a lamination structure for a PCB with embedded inductors includes a PCB body and a blind slot provided on the PCB body. The blind slot is used to accommodate inductor components. Blind slot edge locking points are provided around the blind slot to limit the inductor components. A bottom protrusion is provided in the middle of the bottom of the blind slot. The bottom protrusion has a stepped structure to support the inductor components.

[0006] In a further technical solution, the blind slot is rectangular, and the size of the blind slot is 0.1-0.2mm larger than the corresponding single-side dimension of the inductor component.

[0007] In a further technical solution, the thickness of the edge locking point of the blind slot is 20-50μm; the thickness of the PCB body corresponding to the blind slot is 0.05-0.2mm; and the thickness of the bottom protrusion of the blind slot is 5-30μm.

[0008] In a further technical solution, the blind groove is manufactured by depth-controlled milling.

[0009] In a further technical solution, the blind groove edge locking points are symmetrically arranged along the midpoint of the side edge of the blind groove.

[0010] The lamination structure of the embedded inductor PCB provided by this utility model has the following beneficial effects: By setting locking points around the blind slot and a stepped protrusion at the center of the bottom of the blind slot, the alignment accuracy and fixing stability of the inductor components are significantly improved. This effectively solves the problems of insufficient filling, voids and misalignment of inductor components caused by uneven resin flow and gravity during the lamination process, thereby improving the yield and electrical performance of the PCB board.

[0011] This design not only reduces production defects and maintenance costs, but also aligns with the trend of miniaturization in electronic devices, demonstrating significant economic value and broad market application prospects. Attached Figure Description

[0012] Figure 1 A top view of the lamination structure of the embedded inductor PCB provided in an embodiment of this utility model; Figure 2 A top view of the embedded inductor PCB lamination structure provided in this embodiment of the utility model, showing the embedded inductor device. Figure 3 A schematic diagram of the stacked structure of the embedded inductor PCB provided in this embodiment of the utility model; In the diagram: 1-Blind slot, 2-Blind slot edge locking point, 3-Blind slot bottom protrusion, 4-Inductor component, 5-PCB body, 6-Prepreg. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0014] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0015] like Figure 1-3 As shown, this invention provides a lamination structure for a PCB with embedded inductors, comprising a blind slot 1 on the PCB body 5, which can be positioned in different designated areas of the PCB body 5. The bottom center of the blind slot 1 has a bottom protrusion 3 for supporting the inductor component 4, which is a stepped structure. The blind slot 1 has edge locking points 2 around its perimeter for limiting the inductor component 4, and these edge locking points 2 are symmetrically arranged along the midpoint of the side edge of the blind slot 1. The structure of the blind slot 1 provides support and limiting for the embedded inductor component 4, solving the problems of insufficient glue flow at the bottom of the inductor component 4 during lamination, leading to voids and board bursting quality issues, and component misalignment causing poor connections. This improves the yield and electrical performance of the PCB, and has significant economic value and market potential.

[0016] The blind slot 1 is rectangular, and its size is 0.1-0.2 mm larger on one side than that of the inductor 4.

[0017] The thickness of the blind slot edge locking point 2 is 20-50μm, the thickness of the PCB body 5 corresponding to the blind slot 1 is 0.05-0.2mm, and the thickness of the bottom protrusion 3 of the blind slot is 5-30μm. Furthermore, the blind slot 1 is obtained through depth-controlled milling.

[0018] The specific operating procedure is as follows: 1) The PCB body 5 has a thickness of 1.5mm, the inductor component 4 has a size of 2.6×3.3mm, the depth-controlled blind slot 1 has a size of 2.9×3.6mm, and the depth-controlled blind slot 1 is fabricated on the PCB body 5 according to the inductor component 4. The PCB body 5 has a thickness of 0.1mm, the blind slot edge locking point 2 has a thickness of 50μm, and the bottom protrusion 3 of the blind slot has a size of Φ0.5×0.01mm. 2) The outer surfaces of the inductor components 4 and the PCB body 5 are pretreated by browning. 3) Place the inductor 4 in the blind slot 1 of the PCB body 5, stack the prepreg 6 above the opening of the blind slot 1, and obtain the stack structure required by the customer by pressing.

[0019] The above embodiments of this utility model provide a lamination structure for a PCB with embedded inductors. Through structural design, the mounting accuracy and reliability of the inductor component 4 within the PCB body 5 are significantly improved. Specifically: 1) This structure ensures that the inductor component 4 can be accurately aligned with the predetermined position during the embedding process by setting locking points around the blind slot 1 and providing a stepped protrusion at the middle position of the bottom of the blind slot 1, which greatly reduces the connection problems caused by displacement during the lamination process.

[0020] 2) The stepped blind groove 1 not only provides a stable support for the inductor component 4, but also effectively guides the resin flow, ensuring that the bottom and surrounding of the inductor component 4 are fully filled, avoiding the formation of voids, thereby solving the risk of board bursting due to insufficient glue filling.

[0021] 3) The optimized pressing structure improves the fixing stability and electrical connection quality of the inductor component 4 during the production process, significantly reduces the production defect rate, and thus improves the overall yield and electrical performance of the PCB board.

[0022] 4) Through the above improvements, this invention significantly enhances product reliability and lifespan, reduces maintenance costs, and yields substantial economic benefits. Furthermore, with the increasing trend towards miniaturization of electronic devices, this high-efficiency, high-reliability PCB design will have broad market application prospects.

[0023] In summary, the lamination structure of the embedded inductor PCB proposed in this utility model not only solves the technical problems existing in traditional processes, but also provides the industry with a more advanced and reliable solution, which has important practical value and significance for technology promotion.

[0024] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0025] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A press-fit structure of a buried inductance PCB, comprising a PCB body (5) and a blind slot (1) provided on the PCB body (5), the blind slot (1) being used for accommodating an inductance component (4), characterized in that, The blind slot (1) is provided with blind slot edge locking points (2) around its perimeter. The blind slot edge locking points (2) are used to limit the position of the inductive component (4). The bottom of the blind slot (1) is provided with a bottom protrusion (3) in the middle. The bottom protrusion (3) is a stepped structure used to support the inductor (4).

2. The lamination structure of a buried inductor PCB according to claim 1, wherein, The blind groove (1) is rectangular; The size of the blind slot (1) is 0.1-0.2 mm larger than the corresponding single-sided size of the inductor (4).

3. The lamination structure of a buried inductor PCB according to claim 1 or 2, characterized by, The thickness of the blind groove edge locking point (2) is 20-50μm; The thickness of the PCB body (5) corresponding to the blind slot (1) is 0.05-0.2mm; The thickness of the bottom protrusion (3) of the blind groove is 5-30 μm.

4. The laminated structure of a buried inductor PCB according to claim 3, wherein, The blind groove (1) is made by depth control milling.

5. The laminated structure of a buried inductor PCB according to claim 3, wherein, The blind groove edge blocking point (2) is symmetrically arranged along the midpoint of the side of the blind groove (1).

Images