A structural housing for a high-integration power module

Abstract

The utility model relates to power module technical field especially relates to a kind of structure shell of high integration power module, it includes integrated power supply structure shell, and integrated power supply structure shell inside fixed mounting has upper layer board and lower layer board;Integrated power supply structure shell both sides symmetry fixed mounting have several heat dissipation fins, and heat dissipation fin is metal cavity structure and heat dissipation fin extends to integrated power supply structure shell inside, and integrated power supply structure shell inboard bottom and lower layer board upside are equally spaced fixed mounting with several heat dissipation metal pipes, and several heat dissipation metal pipes are connected with heat dissipation fin inside, and heat dissipation metal pipe inside fills with low-pressure medium water.The utility model uses the way of layered heat dissipation, improves heat dissipation efficiency, avoids the interference of high heating element to low heating element, and in addition, using the way that built-in radiating pipe radiating system and external heat dissipation fin are combined, can greatly improve the heat dissipation effect, ensure the stability of power module when high load operation.

Description

Technical Field

[0001] This utility model relates to the field of power module technology, and in particular to a structural housing for a highly integrated power module. Background Technology

[0002] A power module is a highly integrated power supply device that can convert input electrical energy into output electrical energy that meets specific needs. Supported by its structural housing, it plays a role in providing efficient and stable power supply and integrates functional modules such as power conversion, control, and protection.

[0003] As electronic devices continue to develop towards miniaturization and high performance, the requirements for the integration and performance of power modules are also increasing. Traditional power module housings are gradually becoming unable to meet the needs in terms of space utilization and heat dissipation. Therefore, we propose a highly integrated power module housing. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a structural housing for a highly integrated power module.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A structural housing for a highly integrated power module includes an integrated power structure housing, with an upper plate and a lower plate fixedly installed inside the integrated power structure housing. A plurality of heat dissipation fins are symmetrically fixedly installed on both sides of the integrated power structure housing. The heat dissipation fins have a metal cavity structure and extend into the interior of the integrated power structure housing. A plurality of heat dissipation metal tubes are fixedly installed at equal intervals on the bottom inner side of the integrated power structure housing and the upper side of the lower plate. The heat dissipation metal tubes are internally connected to the heat dissipation fins and are filled with low-pressure water. A lower folding plate is provided on the upper side of the lower heat dissipation metal tube, and an upper folding plate is provided on the upper side of the upper heat dissipation metal tube.

[0007] Furthermore, both the lower and upper folding plates are screwed onto the inner wall of the integrated power supply structure housing.

[0008] Furthermore, both the lower folding plate and the upper folding plate are ceramic substrates.

[0009] Furthermore, an inductor and a power transistor are fixedly mounted on the lower folding plate, and a control processing circuit board, a resistor, and a surface-mount capacitor are fixedly mounted on the upper side of the upper folding plate. The inductor, power transistor, control processing circuit board, resistor, and surface-mount capacitor are electrically connected to each other.

[0010] Furthermore, a bottom mounting plate is fixedly installed at the bottom of the integrated power supply structure housing, and the bottom mounting plate has mounting positioning holes.

[0011] Furthermore, both the upper and lower plates are embedded with nickel-copper alloy plates.

[0012] Furthermore, a signal control interface and a power interface are fixedly installed on the upper plate, and the upper ends of the signal control interface and the power interface extend to the outside of the integrated power structure housing.

[0013] Furthermore, an auxiliary heat dissipation component is provided at the port of the integrated power supply structure housing. The auxiliary heat dissipation component includes a sleeve frame, which is screwed onto the outside of the port of the integrated power supply structure housing. A mesh frame is screwed onto the inside of the sleeve frame, and a dustproof mesh is fixedly installed on the inside of the mesh frame.

[0014] Compared with related technologies, the structural housing of the highly integrated power module proposed in this utility model has the following beneficial effects:

[0015] In this invention, the structural housing of a highly integrated power module features a three-layer design with a neat layout and high space utilization. Each layer houses electrical components with different heat outputs, employing a layered heat dissipation method to improve heat dissipation efficiency, prevent interference from high-heat-generating components to low-heat-generating components, and enhance the operational stability of internal components. Furthermore, heat dissipation fins are installed on the outer side of the integrated power module housing, while a heat dissipation metal pipe connects internally. The working medium within the metal heat dissipation pipe rapidly absorbs heat and vaporizes. Under the pressure difference within the pipe, the vapor flows quickly to the heat dissipation end, releases heat at the heat dissipation fins, and condenses into liquid. The liquid then flows back to the heat-generating end under capillary action, repeating this cycle to achieve efficient heat transfer. This combination of an internal heat dissipation pipe system and external heat dissipation fins significantly improves heat dissipation, ensuring the stability of the power module under high load operation. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the housing of a highly integrated power module proposed in this utility model;

[0017] Figure 2 This is a three-dimensional structural disassembly diagram of the housing of a highly integrated power module proposed in this utility model.

[0018] Figure 3 Schematic diagram of the three-dimensional structure of the shell. Figure 1 ;

[0019] Figure 4 Schematic diagram of the three-dimensional structure of the shell. Figure 2 ;

[0020] Figure 5 This is a schematic diagram of the internal three-dimensional cross-section of the structural shell.

[0021] In the diagram: 1. Integrated power supply housing; 2. Heat sink fins; 3. Signal control interface; 4. Power interface; 5. Bottom mounting plate; 6. Mounting positioning holes; 7. Upper plate; 8. Lower plate; 9. Auxiliary heat dissipation components; 91. Sleeve frame; 92. Mesh frame; 93. Dustproof mesh; 10. Nickel-copper alloy plate; 11. Heat dissipation metal pipe; 12. Lower plate; 13. Upper plate; 14. Inductor; 15. Power transistor; 16. Control processing circuit board; 17. Resistor; 18. Surface mount capacitor. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Reference Figures 1-5 A structural housing for a highly integrated power module includes an integrated power structure housing 1, with an upper plate 7 and a lower plate 8 fixedly installed inside the integrated power structure housing 1; several heat dissipation fins 2 are symmetrically fixedly installed on both sides of the integrated power structure housing 1, the heat dissipation fins 2 are metal cavity structures and extend into the interior of the integrated power structure housing 1, several heat dissipation metal pipes 11 are fixedly installed at equal intervals on the bottom inner side of the integrated power structure housing 1 and the upper side of the lower plate 8, the several heat dissipation metal pipes 11 are connected to the interior of the heat dissipation fins 2, the interior of the heat dissipation metal pipes 11 is filled with low-pressure medium water, a lower folding plate 12 is provided on the upper side of the lower heat dissipation metal pipe 11, and an upper folding plate 13 is provided on the upper side of the upper heat dissipation metal pipe 11.

[0024] With the above-mentioned setup, the boiling point of the low-pressure medium water is relatively low under low-pressure conditions, which in turn promotes the absorption of heat and vaporization of the medium water when the electrical components heat up.

[0025] In this method, a signal control interface 3 and a power interface 4 are fixedly installed on the upper plate 7. The upper ends of the signal control interface 3 and the power interface 4 both extend to the outside of the integrated power structure housing 1. Nickel-copper alloy plates 10 are embedded inside the upper plate 7 and the lower plate 8.

[0026] By setting it in the above manner, the nickel-copper alloy plate 10 can effectively shield electromagnetic waves within a certain frequency range to prevent internal upper and lower layer components from being affected by their respective electromagnetic interference, thereby improving the working stability of electrical components.

[0027] In this method, an auxiliary heat dissipation component 9 is provided at the port of the integrated power supply structure housing 1. The auxiliary heat dissipation component 9 includes a sleeve 91, which is screwed onto the outside of the port of the integrated power supply structure housing 1. A mesh frame 92 is screwed onto the inside of the sleeve 91, and a dustproof mesh 93 is fixedly installed on the inside of the mesh frame 92.

[0028] Through the above-described configuration, the dustproof mesh 93 provides a heat dissipation channel at the port of the integrated power structure housing 1, and also has a dust filtering function to prevent dust from entering the interior of the integrated power structure housing 1 and interfering with its internal electrical components.

[0029] In this configuration, both the lower folding plate 12 and the upper folding plate 13 are screwed onto the inner wall of the integrated power supply structure housing 1.

[0030] With the above-described configuration, the lower folding plate 12 and the upper folding plate 13 can be removed from the inner wall of the integrated power supply structure housing 1, facilitating the maintenance of the electrical components installed on the lower folding plate 12 and the upper folding plate 13.

[0031] In this method, both the lower folding plate 12 and the upper folding plate 13 are ceramic substrates.

[0032] With the above-described configuration, the ceramic substrate has excellent thermal conductivity, enabling it to quickly transfer the heat generated by the electrical components on the lower folding plate 12 and upper folding plate 13 during operation to the heat dissipation metal pipe 11.

[0033] In this configuration, an inductor 14 and a power transistor 15 are fixedly mounted on the lower folding plate 12, while a control processing circuit board 16, a resistor 17, and a surface-mount capacitor 18 are fixedly mounted on the upper side of the upper folding plate 13. The inductor 14, power transistor 15, control processing circuit board 16, resistor 17, and surface-mount capacitor 18 are electrically connected. It should be noted that the inductor 14, power transistor 15, control processing circuit board 16, resistor 17, and surface-mount capacitor 18 are electrically connected, and through their coordinated operation, the power module achieves functions such as power conversion, control, and protection. The above describes the conventional technical implementation of existing power module functions and will not be elaborated further here.

[0034] With the above configuration, the inductor 14 and power transistor 15 are high-heat-generating components, while the control processing circuit board 16, resistor 17 and surface-mount capacitor 18 are low-heat-generating components. By using layered installation of components with different heat generation powers, the high-heat-generating components are prevented from interfering with the ambient temperature of other components.

[0035] In this method, a bottom mounting plate 5 is fixedly installed on the bottom of the integrated power supply structure housing 1, and a mounting positioning hole 6 is provided on the bottom mounting plate 5.

[0036] By setting up the positioning hole 6 as described above, a screw-in mounting positioning hole is provided for the bottom mounting plate 5.

[0037] The working principle of the structural housing of the highly integrated power module provided by this utility model is as follows:

[0038] During use, when the highly integrated power module starts working, the internal electrical components such as the inductor 14, power transistor 15, control processing circuit board 16, resistor 17, and surface-mount capacitor 18 generate heat. The various components of this housing work together to achieve efficient heat dissipation, stable operation, and convenient installation. Regarding heat dissipation, since both the lower folding plate 12 and the upper folding plate 13 are ceramic substrates, they have excellent thermal conductivity. The inductor 14 and power transistor 15 on the lower folding plate 12, as high-heat-generating components, rapidly conduct the heat generated through the ceramic substrate to the lower heat dissipation metal pipe 11. Similarly, the lower-heat-generating components on the upper folding plate 13, such as the control processing circuit board 16, resistor 17, and surface-mount capacitor 18, also transfer their heat through the ceramic substrate to the upper heat dissipation metal pipe 11. The low-pressure medium water filled inside the heat dissipation metal pipe 11 has a low boiling point under low-pressure conditions, allowing it to quickly absorb heat and vaporize. Under the pressure difference inside the pipe, the steam flows rapidly to the heat dissipation fins 2 that are connected to the inside of the heat dissipation metal pipe 11. Heat is released at the heat dissipation fins 2 and condenses into liquid. Then, the liquid flows back to the heating end under the action of capillary force. This cycle repeats, achieving efficient heat transfer. At the same time, the auxiliary heat dissipation component 9 at the port of the integrated power structure housing 1 has a dustproof mesh 93 that provides a heat dissipation channel, promotes air circulation, helps to accelerate heat dissipation, and prevents dust from entering the integrated power structure housing 1 and interfering with electrical components.

[0039] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A structural housing for a highly integrated power module, characterized in that, It includes an integrated power supply structure housing (1), and an upper plate (7) and a lower plate (8) are fixedly installed inside the integrated power supply structure housing (1); The integrated power supply structure housing (1) has several heat dissipation fins (2) symmetrically fixedly installed on both sides. The heat dissipation fins (2) are metal cavity structures and extend into the interior of the integrated power supply structure housing (1). Several heat dissipation metal pipes (11) are fixedly installed at equal intervals on the bottom inner side and the upper side of the lower plate (8) of the integrated power supply structure housing (1). The heat dissipation metal pipes (11) are connected to the interior of the heat dissipation fins (2). The interior of the heat dissipation metal pipes (11) is filled with low-pressure medium water. The lower heat dissipation metal pipe (11) is provided with a lower folding plate (12) on the upper side and the upper heat dissipation metal pipe (11) is provided with an upper folding plate (13).

2. The structural housing of a highly integrated power module according to claim 1, characterized in that, The lower folding plate (12) and the upper folding plate (13) are both screwed onto the inner wall of the integrated power supply structure housing (1).

3. The structural housing of a highly integrated power module according to claim 1, characterized in that, Both the lower folding plate (12) and the upper folding plate (13) are ceramic substrates.

4. The structural housing of a highly integrated power module according to claim 1, characterized in that, An inductor (14) and a power transistor (15) are fixedly mounted on the lower folding plate (12). A control processing circuit board (16), a resistor (17), and a surface-mount capacitor (18) are fixedly mounted on the upper side of the upper folding plate (13). The inductor (14), the power transistor (15), the control processing circuit board (16), the resistor (17), and the surface-mount capacitor (18) are electrically connected.

5. The structural housing of a highly integrated power module according to claim 1, characterized in that, The bottom of the integrated power supply structure housing (1) is fixedly installed with a bottom mounting plate (5), and the bottom mounting plate (5) is provided with mounting positioning holes (6).

6. The structural housing of a highly integrated power module according to claim 1, characterized in that, Both the upper plate (7) and the lower plate (8) are fitted with nickel-copper alloy plates (10).

7. The structural housing of a highly integrated power module according to claim 1, characterized in that, The upper plate (7) is fixedly installed with a signal control interface (3) and a power interface (4), the upper ends of which both extend to the outside of the integrated power structure housing (1).

8. The structural housing of a highly integrated power module according to claim 1, characterized in that, An auxiliary heat dissipation component (9) is provided at the port of the integrated power structure housing (1). The auxiliary heat dissipation component (9) includes a sleeve frame (91). The sleeve frame (91) is screwed onto the outside of the port of the integrated power structure housing (1). A mesh frame (92) is screwed onto the inside of the sleeve frame (91). A dustproof mesh (93) is fixedly installed on the inside of the mesh frame (92).

Images