Electrical apparatus

Abstract

The application discloses an electrical equipment and belongs to the technical field of electrical equipment. The electrical equipment comprises a circuit board, a cover body, a first conductive piece group and a second conductive piece group, the circuit board is provided with a device to be shielded; the cover body is covered outside the device to be shielded; the first conductive piece group is arranged on the circuit board and located outside the cover body, the first conductive piece group comprises a plurality of first conductive pieces which are spaced apart; the second conductive piece group is arranged on the circuit board and located inside the cover body, the second conductive piece group comprises a plurality of second conductive pieces which are spaced apart, and the first conductive pieces and the second conductive pieces are staggered. By arranging the first conductive pieces and the second conductive pieces which are staggered on the outside and the inside of the cover body respectively, the shielding effect can be enhanced, and the manufacturing and maintenance costs can be reduced.

Description

Technical Field

[0001] This application belongs to the field of electrical equipment technology, and in particular relates to an electrical device. Background Technology

[0002] The rapid development of integrated circuits and chip technology has exacerbated the problem of electromagnetic noise in electrical equipment. Electromagnetic noise can interfere with the operation of electrical equipment, leading to malfunctions, crashes, data loss, or performance degradation. To address this, metal casings are often used to cover the components to be shielded on circuit boards. However, gaps exist between the casing and the circuit board, allowing electromagnetic noise to easily leak through these gaps, thus affecting the shielding effectiveness. Utility Model Content

[0003] This application aims to address at least one of the technical problems existing in the related art. To this end, this application proposes an electrical device that enhances the shielding effect and reduces manufacturing and maintenance costs by providing staggered first and second conductive elements on both the inner and outer sides of the enclosure.

[0004] In a first aspect, this application provides an electrical device, comprising:

[0005] The circuit board contains devices to be shielded.

[0006] A cover is placed over the device to be shielded.

[0007] A first conductive element group is disposed on the circuit board and located on the outside of the cover. The first conductive element group includes a plurality of spaced first conductive elements.

[0008] The second conductive element group is disposed on the circuit board and located inside the cover. The second conductive element group includes a plurality of spaced second conductive elements, and the first conductive elements and the second conductive elements are arranged alternately.

[0009] According to the electrical equipment of this application, on the one hand, by respectively arranging a first conductive element group and a second conductive element group on the outer and inner sides of the enclosure, the gap between the enclosure and the circuit board can be filled and a double shielding structure can be formed, enhancing the shielding effect and reducing the impedance between the enclosure and the circuit board, further reducing the propagation of electromagnetic noise. On the other hand, the staggered arrangement of the first and second conductive elements can form a denser conductive path, further reducing the leakage path of electromagnetic noise and improving the overall shielding efficiency. In addition, compared with the related technology of filling the connection between the enclosure and the circuit board with conductive elements (including the first and second conductive elements) spaced apart from the enclosure on the circuit board, not only can manufacturing and maintenance costs be reduced, but the risk of performance degradation and structural deformation of conductive materials due to long-term pressure can also be avoided.

[0010] According to one embodiment of this application, the distance between two adjacent first conductive elements is L1, the distance between two adjacent second conductive elements is L2, and L1 = L2.

[0011] According to one embodiment of this application, the length of the first conductive element along the distribution direction of the first conductive element is L3, and the length of the second conductive element along the distribution direction of the second conductive element is L4, and L3 = L4.

[0012] According to one embodiment of this application, the distance between two adjacent first conductive elements is L1, the length of the second conductive element along the distribution direction of the second conductive element is L4, and L1 < L4; and / or

[0013] The distance between two adjacent second conductive elements is L2, and the length of the first conductive element along the distribution direction of the first conductive element is L3, and L2 < L3.

[0014] According to one embodiment of this application, the side of the first conductive element away from the circuit board and the side of the second conductive element away from the circuit board are flush.

[0015] According to one embodiment of this application, the distance between the first conductive element and the cover is equal to the distance between the second conductive element and the cover.

[0016] According to one embodiment of this application, multiple first conductive component groups and multiple second conductive component groups are provided and correspond one-to-one; the cover includes multiple side plates, the multiple side plates are connected end to end in sequence, each side plate is connected to the circuit board and corresponds to at least one first conductive component group, and the outer and inner sides of each side plate are respectively provided with corresponding first conductive component groups and second conductive component groups.

[0017] According to one embodiment of this application, the distribution direction of the plurality of first conductive elements in the first conductive element group, the distribution direction of the plurality of second conductive elements in the corresponding second conductive element group, and the extension direction of the corresponding side plate are parallel.

[0018] According to one embodiment of this application, in at least two partially adjacent first conductive element groups, the projection of the first conductive element of one group along its distribution direction falls within the other group.

[0019] According to one embodiment of this application, both the first conductive element and the second conductive element include tin bumps.

[0020] According to one embodiment of this application, it also includes:

[0021] Multiple insulating elements are disposed on the side of the circuit board facing the cover, and the insulating elements are disposed on at least one side of the first conductive element and at least one side of the second conductive element.

[0022] According to one embodiment of this application, it also includes:

[0023] A top cover, covering the outside of the circuit board, and the cover body is disposed inside the top cover; and / or

[0024] The bottom shell is located on the side of the circuit board away from the cover.

[0025] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0026] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0027] Figure 1 This is a schematic diagram of the structure of the electrical equipment provided in the embodiments of this application;

[0028] Figure 2 This is an exploded view of the electrical equipment provided in the embodiments of this application;

[0029] Figure 3 This is a schematic diagram of the structure of the cover and the shield provided in the embodiments of this application;

[0030] Figure 4 This is one of the partial sectional views of the electrical equipment provided in the embodiments of this application;

[0031] Figure 5 This is a second partial sectional view of the electrical equipment provided in the embodiments of this application;

[0032] Figure 6 yes Figure 5 A magnified view of a section at point A in the middle;

[0033] Figure 7 This is a schematic diagram of the circuit board structure provided in an embodiment of this application;

[0034] Figure 8 yes Figure 7 A magnified view of a section at point B.

[0035] Figure label:

[0036] 100. Circuit board;

[0037] 210. Devices to be shielded; 220. Electronic devices;

[0038] 300. Body; 310. Side panels;

[0039] 400. First conductive component group; 410. First conductive component;

[0040] 500. Second conductive component group; 510. Second conductive component;

[0041] 600, top cover; 700, bottom shell; 800, threaded hole; 900, insulating component. Detailed Implementation

[0042] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0043] The following is for reference. Figures 1-8 The electrical device provided in the embodiments of this application is described. The electrical device includes a circuit board 100, a cover 300, a first conductive component group 400, and a second conductive component group 500.

[0044] The circuit board 100 is equipped with a device 210 to be shielded; a cover 300 covers the device 210 to be shielded. The connection between the cover 300 and the circuit board 100 includes, but is not limited to, a threaded connection. The device 210 to be shielded includes, but is not limited to, integrated circuits, microcontrollers, radio frequency modules, power modules, and sensor modules.

[0045] Understandably, the circuit board 100 serves as a carrier to centrally arrange the device to be shielded 210, facilitating subsequent wiring and maintenance. The enclosure 300, placed over the device to be shielded 210, not only effectively blocks the propagation of electromagnetic noise and reduces the possibility of electromagnetic noise radiating outward from the device to be shielded 210, but also provides physical protection and spatial isolation for the device to be shielded 210, reducing the impact of external electromagnetic interference on the device to be shielded 210.

[0046] The first conductive element group 400 is disposed on the circuit board 100 and located on the outside of the cover 300. The first conductive element group 400 includes a plurality of spaced-apart first conductive elements 410. The second conductive element group 500 is disposed on the circuit board 100 and located on the inside of the cover 300. The second conductive element group 500 includes a plurality of spaced-apart second conductive elements 510, and the first conductive elements 410 and the second conductive elements 510 are arranged alternately. It should be noted that the number, shape, and size of the first conductive elements 410 and the second conductive elements 510 can be designed according to actual needs, and this embodiment does not impose specific limitations in this regard.

[0047] Understandably, on the one hand, by setting the first conductive element group 400 and the second conductive element group 500 on the outer and inner sides of the cover 300 respectively, the gap between the cover 300 and the circuit board 100 can be filled and a double shielding structure can be formed, enhancing the shielding effect and reducing the impedance between the cover 300 and the circuit board 100, further reducing the propagation of electromagnetic noise. On the other hand, the staggered arrangement of the first conductive element 410 and the second conductive element 510 can form a denser conductive path, further reducing the leakage path of electromagnetic noise and improving the overall shielding efficiency. In addition, compared with the related technology of filling the connection between the cover 300 and the circuit board 100 with conductive material, by setting conductive elements (including the first conductive element 410 and the second conductive element 510) on the circuit board 100 at intervals from the cover 300, not only can manufacturing and maintenance costs be reduced, but the risk of performance degradation and structural deformation of conductive materials due to long-term pressure can also be avoided.

[0048] According to the electrical equipment provided in the embodiments of this application, by providing staggered first conductive element 410 and second conductive element 510 on the outer and inner sides of the enclosure 300, the shielding effect can be enhanced and the manufacturing and maintenance costs can be reduced.

[0049] In some embodiments, such as Figure 6 and Figure 8 As shown, the distance between two adjacent first conductive elements 410 is L1, and the distance between two adjacent second conductive elements 510 is L2, and L1 = L2.

[0050] Understandably, by setting the spacing between the first conductive elements 410 and the spacing between the second conductive elements 510 to be equal, the uniformity of the shielding effect can be improved, the leakage path of electromagnetic noise can be blocked more effectively, a more stable conductive path can be formed between the conductive elements, the loop impedance can be reduced, and thus the propagation of electromagnetic noise can be reduced. At the same time, equal spacing makes the arrangement of conductive elements more regular, which facilitates standardized operation in the design and manufacturing process, and improves production efficiency and quality control.

[0051] In some embodiments, such as Figure 6 and Figure 8 As shown, the length of the first conductive element 410 along the distribution direction of the first conductive element 410 is L3, and the length of the second conductive element 510 along the distribution direction of the second conductive element 510 is L4, and L3 = L4.

[0052] Understandably, having all conductive components of the same length can improve the uniformity of shielding, reduce electromagnetic wave leakage paths, improve overall shielding effectiveness, and simplify the manufacturing process.

[0053] In some embodiments, such as Figure 6 and Figure 8As shown, the distance between two adjacent first conductive elements 410 is L1, the length of the second conductive element 510 along the distribution direction of the second conductive element 510 is L4, and L1 < L4.

[0054] It is understandable that, due to the staggered arrangement of the first conductive element 410 and the second conductive element 510, and the fact that L1 < L4, it can be ensured that the projection of the second conductive element 510 on the cover 300 can cover the gap between two adjacent first conductive elements 410, thereby improving the shielding effectiveness and reducing the leakage path of electromagnetic noise.

[0055] In some embodiments, such as Figure 6 and Figure 8 As shown, the distance between two adjacent second conductive elements 510 is L2, the length of the first conductive element 410 along the distribution direction of the first conductive element 410 is L3, and L2 < L3.

[0056] It is understandable that, due to the staggered arrangement of the first conductive element 410 and the second conductive element 510, and the fact that L2 < L4, it can be ensured that the projection of the first conductive element 410 on the cover 300 can cover the gap between two adjacent second conductive elements 510, thereby improving the shielding effectiveness and reducing the leakage path of electromagnetic noise.

[0057] In some embodiments, such as Figure 4 As shown, the side of the first conductive element 410 away from the circuit board 100 and the side of the second conductive element 510 away from the circuit board 100 are flush.

[0058] It should be noted that, for ease of description, in this embodiment, the device to be shielded 210, the first conductive component group 400 and the second conductive component group 500 are all disposed on the upper surface of the circuit board 100, and the cover 300 is close to the circuit board 100 from top to bottom and installed together.

[0059] It is understandable that the top surface of the first conductive element 410 and the top surface of the second conductive element 510 are flush, that is, the height of the first conductive element 410 and the second conductive element 510 is the same, so as to reduce the reflection and refraction of electromagnetic waves between the first conductive element 410 and the second conductive element 510, improve the shielding effect, and facilitate installation and maintenance.

[0060] In some embodiments, such as Figure 6 and Figure 8 As shown, the distance between the first conductive element 410 and the cover 300 is equal to the distance between the second conductive element 510 and the cover 300. For example, the distance between the first conductive element 410 and the cover 300 is 0.5 mm.

[0061] It is understandable that the first conductive element 410 and the second conductive element 510 are equidistant from the cover 300, which can improve the uniform distribution of the electromagnetic field, reduce electromagnetic leakage between the first conductive element 410 and the second conductive element 510, and improve the shielding effect.

[0062] In some embodiments, such as Figure 4 , Figure 6 and Figure 8 As shown, both the first conductive element 410 and the second conductive element 510 include tin bumps. It should be noted that the shape and size of the tin bumps can be designed according to actual needs, and this embodiment does not impose specific limitations on them. Of course, in other embodiments, the first conductive element 410 and the second conductive element 510 may also include, but are not limited to, conductive foam or rubber, and this embodiment does not impose specific limitations on them.

[0063] Understandably, when performing STM (Surface Mount Technology) process, circuit board 100 can be directly tinned to form tin bumps, which not only improves production efficiency and reduces manufacturing costs, but also improves the positional accuracy of conductive components on circuit board 100 and enhances the reliability of electrical equipment.

[0064] In some embodiments, such as Figure 8 As shown, the electrical equipment also includes a plurality of insulating elements 900, which are disposed on the side of the circuit board 100 facing the cover 300. Insulating elements 900 are disposed on at least one side of the first conductive element 410 and at least one side of the second conductive element 510.

[0065] Understandably, by providing physical isolation to the solder bumps through the insulating element 900 disposed on the circuit board 100, electromagnetic leakage between solder bumps is reduced, and the possibility of deformation of the solder bumps during formation and use is reduced, thereby improving the shielding effect.

[0066] In some embodiments, such as Figure 8 As shown, each conductive component has an insulating component 900 at both ends along its length, providing a clear physical boundary, which helps to improve the processing accuracy, production efficiency and shielding effect in the SMT process.

[0067] In some embodiments, such as Figures 3 to 5As shown, multiple first conductive component groups 400 and second conductive component groups 500 are provided, each corresponding to the other. The cover 300 includes multiple side plates 310, which are connected end-to-end in sequence. Each side plate 310 is connected to the circuit board 100 and corresponds to at least one first conductive component group 400. The outer and inner sides of each side plate 310 are respectively provided with corresponding first conductive component groups 400 and second conductive component groups 500. The material of the side plates 310 includes, but is not limited to, metal. It should be noted that the number and shape of the side plates 310 can be designed according to actual needs, and this embodiment does not impose specific limitations on this.

[0068] It is understandable that multiple side plates 310 are connected end to end in sequence to surround the device to be shielded 210 in a circumferential manner, and each side plate 310 has a second conductive component group 500 and a first conductive component group 400 respectively on its inner and outer sides. That is, multiple first conductive component groups 400 and multiple second conductive component groups 500 are distributed along the circumferential direction of the cover 300, ensuring all-round coverage of electromagnetic shielding and enhancing the shielding effect.

[0069] It should be noted that the number, shape and size of the first conductive elements 410 in each first conductive element group 400 may not be exactly the same; the number, shape and size of the second conductive elements 510 in each second conductive element group 500 may not be exactly the same, and this embodiment does not impose specific restrictions on this.

[0070] In some embodiments, such as Figure 5 As shown, the distribution direction of the plurality of first conductive elements 410 in the first conductive element group 400, the distribution direction of the plurality of second conductive elements 510 in the corresponding second conductive element group 500, and the extension direction of the corresponding side plate 310 are parallel.

[0071] It is understandable that multiple conductive elements are distributed at intervals along the extension direction of each side plate 310, which can improve the uniformity of electromagnetic shielding, make the layout between the cover 300 and the conductive elements more compact, and also simplify the manufacturing process.

[0072] In some embodiments, such as Figure 5As shown, four side plates 310 are provided. The four side plates 310 are defined as two first side plates 310 and two second side plates 310. The two first side plates 310 are arranged opposite each other in the left-right direction and extend in the front-back direction. The first conductive element group 400 and the second conductive element group 500 corresponding to the first side plate 310 are respectively arranged on the left and right sides of the first side plate 310, and the multiple first conductive elements 410 and the multiple second conductive elements 510 are spaced apart in the front-back direction. The two second side plates 310 are arranged opposite each other in the front-back direction and extend in the left-right direction. The first conductive element group 400 and the second conductive element group 500 corresponding to the second side plate 310 are respectively arranged on the front and back sides of the second side plate 310, and the multiple first conductive elements 410 and the multiple second conductive elements 510 are spaced apart in the left-right direction.

[0073] It is understandable that all the first conductive elements 410 are circumferentially distributed on the outside of the cover 300, and all the second conductive elements 510 are circumferentially distributed on the inside of the cover 300, thereby ensuring the integrity of electromagnetic shielding in the front-back and left-right directions, and effectively reducing the possibility of electromagnetic noise leaking or entering from the bottom of the cover 300 and the circuit board 100.

[0074] In some embodiments, such as Figure 3 , Figure 5 and Figure 7 As shown, the second side plate 310 and the circuit board 100 are respectively provided with mating threaded holes 800. Therefore, the second side plate 310 corresponds to two first conductive component groups 400 and second conductive component groups 500 spaced apart in the left-right direction. That is, the distance between the two first conductive component groups 400 and the distance between the two second conductive component groups 500 are used to avoid the threaded holes 800. Of course, in other embodiments, the first side plate 310 may correspond to at least two first conductive component groups 400 and second conductive component groups 500. This embodiment does not impose specific limitations on this.

[0075] In some embodiments, such as Figure 7 and Figure 8 As shown, in at least two partially adjacent first conductive element groups 400, the projection of the first conductive element 410 of one group along its distribution direction falls into the other group.

[0076] Understandably, by partially overlapping the projections of some adjacent first conductive element groups 400, the integrity of electromagnetic shielding at the corners of the enclosure 300 can be enhanced. This effectively reduces the possibility of electromagnetic noise leaking from the gaps between adjacent first conductive element groups 400.

[0077] For example, such as Figure 7 and Figure 8As shown, the projection of multiple first conductive elements 410 spaced apart along the left and right directions falls on multiple first conductive elements 410 spaced apart along the front and back directions and located at the frontmost or rearmost end.

[0078] In some embodiments, such as Figures 1 to 4 As shown, the electrical equipment also includes a top cover 600, which covers the outside of the circuit board 100, and a housing 300 is disposed inside the top cover 600. The material of the top cover 600 includes, but is not limited to, metal. The connection between the top cover 600 and the circuit board 100 includes, but is not limited to, a threaded connection.

[0079] It is understandable that by covering the circuit board 100 with the top cover 600, not only can the electronic device 220 located on the circuit board 100 and outside the cover 300 be physically protected and the mechanical strength of the electrical equipment be enhanced, but it can also work with the cover 300 to form a multi-layer shield and improve the electromagnetic shielding effect.

[0080] In some embodiments, such as Figures 1 to 4 As shown, the top cover 600 and the cover 300 are integrally molded structures to further improve the structural strength of electrical equipment, reduce electromagnetic leakage, reduce assembly errors, and improve production efficiency and reliability.

[0081] In some embodiments, such as Figure 1 , Figure 2 and Figure 4 As shown, the electrical equipment also includes a base housing 700, which is disposed on the side of the circuit board 100 away from the enclosure 300 to further enhance the mechanical strength and electromagnetic shielding effect of the entire electrical equipment. The material of the base housing 700 includes, but is not limited to, metal.

[0082] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0083] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0084] In the description of this application, "first feature" and "second feature" may include one or more of the features.

[0085] In the description of this application, "multiple" means two or more.

[0086] In the description of this application, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being in contact through another feature between them.

[0087] In the description of this application, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicate that the first feature is at a higher horizontal level than the second feature.

[0088] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0089] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electrical device, characterized by include: A circuit board (100) is provided with a device (210) to be shielded; A cover (300) is provided over the device to be shielded (210); A first conductive element group (400) is disposed on the circuit board (100) and located on the outside of the cover (300). The first conductive element group (400) includes a plurality of spaced first conductive elements (410). The second conductive element group (500) is disposed on the circuit board (100) and located inside the cover (300). The second conductive element group (500) includes a plurality of spaced second conductive elements (510), and the first conductive element (410) and the second conductive element (510) are arranged alternately.

2. The electrical device of claim 1, wherein, The distance between two adjacent first conductive elements (410) is L1, and the distance between two adjacent second conductive elements (510) is L2, and L1 = L2.

3. The electrical device of claim 1, wherein, The length of the first conductive element (410) along the distribution direction of the first conductive element (410) is L3, and the length of the second conductive element (510) along the distribution direction of the second conductive element (510) is L4, and L3 = L4.

4. The electrical device of claim 1, wherein, The distance between two adjacent first conductive elements (410) is L1, the length of the second conductive element (510) along the distribution direction of the second conductive element (510) is L4, and L1 < L4; and / or The distance between two adjacent second conductive elements (510) is L2, and the length of the first conductive element (410) along the distribution direction of the first conductive element (410) is L3, and L2 < L3.

5. The electrical device of claim 1, wherein, The side of the first conductive element (410) away from the circuit board (100) and the side of the second conductive element (510) away from the circuit board (100) are flush.

6. The electrical device of claim 1, wherein, The distance between the first conductive element (410) and the cover (300) is equal to the distance between the second conductive element (510) and the cover (300).

7. The electrical device according to any one of claims 1 to 6, characterized in that The first conductive component group (400) and the second conductive component group (500) are each provided in multiple and correspond one to one; the cover (300) includes multiple side plates (310), the multiple side plates (310) are connected end to end in sequence, each side plate (310) is connected to the circuit board (100) and corresponds to at least one of the first conductive component groups (400), and the outer and inner sides of each side plate (310) are respectively provided with the corresponding first conductive component group (400) and second conductive component group (500).

8. The electrical device of claim 7, wherein, The distribution direction of the plurality of first conductive elements (410) in the first conductive element group (400), the distribution direction of the plurality of second conductive elements (510) in the corresponding second conductive element group (500), and the extension direction of the corresponding side plate (310) are parallel.

9. The electrical device of claim 7, wherein, In at least two partially adjacent first conductive element groups (400), the projection of the first conductive element (410) of one group along its distribution direction falls into the other group.

10. The electrical equipment according to any one of claims 1 to 6, characterized in that, Both the first conductive element (410) and the second conductive element (510) include tin bumps.

11. The electrical device of claim 10, wherein, Also includes: Multiple insulating elements (900) are disposed on the side of the circuit board (100) facing the cover (300), and the insulating elements (900) are disposed on at least one side of the first conductive element (410) and at least one side of the second conductive element (510).

12. The electrical device according to any one of claims 1 to 6, characterized in that Also includes: A top cover (600) is disposed on the outside of the circuit board (100), and a cover body (300) is disposed on the inside of the top cover (600); and / or The bottom shell (700) is disposed on the side of the circuit board (100) away from the cover (300).

Images