Impact resistant photovoltaic module

Abstract

This application relates to the field of photovoltaic technology, and particularly to an impact-resistant photovoltaic module. The impact-resistant photovoltaic module includes a module body, which comprises, from the light-receiving side to the backlight side, sequentially stacked the following: a chemically strengthened glass front panel, a first encapsulating film layer, a solar cell layer, a second encapsulating film layer, and a backsheet layer; wherein the thickness of the chemically strengthened glass front panel is 1.0 mm–1.3 mm, and its surface stress value is 600 MPa–900 MPa. This application, by using a chemically strengthened glass front panel of specific thickness and surface stress value as a protective layer, effectively improves the impact resistance and structural reliability of the module while achieving a thinner profile, thus possessing the advantage of improving the impact resistance of a thin photovoltaic module while maintaining structural reliability.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to an impact-resistant photovoltaic module. Background Technology

[0002] Photovoltaic modules typically use glass as the front panel material to protect the internal solar cells. However, ordinary glass is prone to breakage under extreme weather conditions such as hail, leading to module failure. While traditional physically tempered glass has high strength, its impact resistance remains limited when it is thin, especially in thin designs around 1.1 mm, where its impact resistance is significantly insufficient. Utility Model Content

[0003] The main objective of this application is to provide an impact-resistant photovoltaic module, which aims to improve the hail impact resistance performance of existing photovoltaic modules.

[0004] To achieve the above objectives, this application proposes an impact-resistant photovoltaic module, comprising a module body, wherein the module body comprises, in sequence from the light-receiving side to the backlight side, a chemically strengthened glass front panel, a first encapsulating film layer, a solar cell layer, a second encapsulating film layer, and a backsheet layer; wherein the thickness of the chemically strengthened glass front panel is 1.0 mm-1.3 mm, and its surface stress value is 600 MPa-900 MPa.

[0005] In some embodiments, the substrate of the chemically strengthened glass front panel is aluminosilicate glass, and the depth of the compressive stress layer on its surface is 10μm-50μm.

[0006] In some embodiments, the edge of the chemically strengthened glass front panel has a chamfered structure with a chamfer angle of 15°-45°, a chamfer depth of 0.1mm-1mm, and a chamfer width of 0.5mm-2mm.

[0007] In some embodiments, the material of the first encapsulating film layer includes at least one of EVA, POE, and EPE; and / or, the material of the second encapsulating film layer includes at least one of EVA, POE, and EPE.

[0008] In some embodiments, the material of the backsheet layer includes at least one of TPT and PET.

[0009] In some embodiments, the thickness of the backsheet layer is 250-350 μm.

[0010] In some embodiments, the light transmittance of the chemically strengthened glass front panel is ≥94%.

[0011] In some embodiments, the surface of the chemically strengthened glass front panel away from the first encapsulating film layer is coated with an anti-reflective coating, the material of which includes nanoscale silicides.

[0012] In some embodiments, the thickness of the anti-reflective coating is 100nm-120nm.

[0013] In some embodiments, the photovoltaic module further includes a frame that surrounds the outer edge of the module body for fixing the module body.

[0014] This application provides an impact-resistant photovoltaic module that uses a chemically strengthened glass front panel with a specific thickness and surface stress value as a protective layer. This effectively improves the impact resistance and structural reliability of the module while achieving a thinner profile, thus having the advantage of improving the impact resistance of the thin photovoltaic module while maintaining structural reliability. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a photovoltaic module according to an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the adhesive tape fixing of the glass carrier plate and the component according to an embodiment of this application.

[0018] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings.

[0019] The diagram is marked as follows:

[0020] 1-Module body, 11-Chemically strengthened glass front panel, 12-First encapsulating film layer, 13-Solar cell layer, 14-Second encapsulating film layer, 15-Backsheet layer, 16-Anti-reflective coating,

[0021] 2-Border,

[0022] 3- Junction box. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] The following detailed description, with appropriate reference to the accompanying drawings, discloses the negative electrode-free sodium metal battery, electrolyte, preparation method thereof, and electrical device of this application. However, unnecessary detailed descriptions may be omitted. For example, detailed descriptions of well-known matters and repetitive descriptions of practically identical structures may be omitted. This is to avoid unnecessarily lengthy descriptions and to facilitate understanding by those skilled in the art. Furthermore, the accompanying drawings and the following description are provided for the purpose of enabling those skilled in the art to fully understand this application and are not intended to limit the subject matter of the claims.

[0025] The "range" disclosed in this application is defined by a lower limit and an upper limit. A given range is defined by selecting a lower limit and an upper limit, which define the boundaries of a particular range. Ranges defined in this way can include or exclude endpoints and can be arbitrarily combined; that is, any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60-120 and 80-110 are listed for a specific parameter, it is expected that ranges of 60-110 and 80-120 are also included. Furthermore, if minimum range values ​​of 1 and 2 are listed, and if maximum range values ​​of 3, 4, and 5 are listed, then the following ranges are all expected: 1-3, 1-4, 1-5, 2-3, 2-4, and 2-5. In this application, unless otherwise stated, the numerical range "ab" represents a shortened representation of any combination of real numbers between a and b, where a and b are real numbers. For example, the numerical range "0-5" indicates that all real numbers between "0-5" have been listed in this article; "0-5" is simply a shortened representation of these numerical combinations. Furthermore, when a parameter is stated as an integer ≥2, it is equivalent to disclosing that the parameter is, for example, an integer such as 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.

[0026] Unless otherwise specified, all embodiments and optional embodiments of this application can be combined to form new technical solutions.

[0027] Unless otherwise specified, all technical features and optional technical features of this application may be combined to form new technical solutions.

[0028] Unless otherwise specified, all steps in this application may be performed sequentially or randomly, preferably sequentially. For example, the method includes steps (a) and (b), indicating that the method may include steps (a) and (b) performed sequentially, or it may include steps (b) and (a) performed sequentially. For example, the mention that the method may also include step (c) indicates that step (c) may be added to the method in any order. For example, the method may include steps (a), (b), and (c), or it may include steps (a), (c), and (b), or it may include steps (c), (a), and (b), etc.

[0029] In existing technologies, photovoltaic modules generally use ordinary glass or physically tempered glass as the front panel material. Ordinary glass is prone to cracking when subjected to hail impacts, leading to damage to the internal solar cells. Physically tempered glass increases strength through surface compressive stress, but its impact resistance drops sharply as the thickness decreases. Traditional solutions struggle to balance the trade-off between thinness and impact resistance, hindering the improvement of photovoltaic module reliability under extreme weather conditions.

[0030] To address the aforementioned issues, given the sensitivity of physical tempering processes to glass thickness, which limits the potential for thinner profiles, this application investigates the formation of a deep compressive stress structure through chemical strengthening. It was observed that high surface compressive stress effectively counteracts tensile stress induced by dynamic impact loads, while the gradient stress distribution created by the chemical strengthening process is more conducive to optimizing the mechanical properties of thin glass. Furthermore, considering the buffering effect of the overall component structure on impact energy, a synergistic protection system is proposed through interlayer material matching.

[0031] Based on this, this application proposes an impact-resistant photovoltaic module, such as... Figure 1 As shown, the component includes a main body 1, which is provided with the following layers stacked from the light-receiving side to the backlight side: a chemically strengthened glass front panel 11, a first encapsulating film layer 12, a solar cell layer 13, a second encapsulating film layer 14, and a backsheet layer 15; wherein, the thickness of the chemically strengthened glass front panel 11 is 1.0mm-1.3mm, and its surface stress value is 600MPa-900MPa.

[0032] The chemically strengthened glass front panel refers to a glass substrate with a surface compressive stress layer formed through ion exchange treatment. Specifically, this can be achieved by immersing aluminosilicate glass in a molten salt solution for ion replacement. Its deep compressive stress structure can prevent crack propagation. The encapsulating film layer is the adhesive material layer located between the front panel and the solar cells, and between the solar cells and the backsheet layer. It can be formed using thermoplastic polymers through a melt lamination process, and its viscoelastic properties can absorb impact energy. The surface stress value refers to the compressive stress intensity per unit area of ​​the glass surface layer, which can be adjusted by controlling the ion exchange temperature and time. This parameter directly determines the critical threshold of impact resistance. The thickness range refers to the dimensional limitations of the front panel in the vertical direction, which can be achieved through cutting the glass sheet and chemical processing. This range balances structural strength with the need for lightweight components.

[0033] In this technical solution, the chemically strengthened glass front panel serves as the first protective layer, and its surface compressive stress can offset the instantaneous tensile stress generated by hail impact. When an impact load is applied to the front panel surface, the high surface compressive stress significantly increases the critical stress value required for crack initiation. The viscoelastic properties of the encapsulation layer absorb impact kinetic energy through molecular chain deformation, reducing the mechanical stress transmitted to the cell layer. The backsheet layer and the front panel form a double-sided support structure to prevent the module from undergoing overall bending deformation under impact. The complementary material properties of each functional layer form a multi-level protection mechanism, and the high strength of the front panel and the buffering effect of the intermediate layers synergistically enhance the overall impact resistance.

[0034] Compared to existing technologies, traditional physically tempered glass exhibits only one-third the surface compressive stress of chemically strengthened glass at the same thickness, and the insufficient stress layer depth limits its impact resistance. This solution overcomes the strength limitations of thin glass through a chemical strengthening process, and combined with the synergistic effect of a multi-material system, achieves a substantial improvement in impact resistance.

[0035] Through the above technical solutions, this application effectively improves the structural integrity of thin photovoltaic modules under hail impact, avoiding cell damage caused by front panel breakage. The chemically reinforced front panel maintains lightweight design while meeting impact resistance requirements, expanding the applicability of photovoltaic modules in extreme climate regions. The multi-layered stress buffering mechanism reduces the risk of dynamic load damage to the cells, improving the long-term reliability of the module.

[0036] In some embodiments, the substrate of the chemically strengthened glass front panel is aluminosilicate glass, and the depth of the compressive stress layer on its surface is 10μm-50μm.

[0037] Aluminosilicate glass refers to a glass system containing alumina and silica. Specifically, it can be achieved using soda-lime silicate glass through an ion exchange process. Its chemical stability matches the ion diffusion rate, which is beneficial for forming a uniform compressive stress layer. The surface compressive stress layer depth refers to the thickness of the pressure-bearing region formed on the glass surface through chemical strengthening. This depth can be controlled by adjusting the ion exchange time and temperature parameters. This depth range balances the relationship between stress gradient and material brittleness.

[0038] The compositional characteristics of aluminosilicate glass allow for control over the replacement efficiency of sodium and potassium ions during ion exchange, thereby forming a compressive stress layer with a gradient distribution on the surface. The depth of this compressive stress layer is limited to a specific range, which both inhibits crack propagation through surface compressive stress and avoids an increase in the internal tensile stress region due to an excessively deep stress layer.

[0039] Compared to existing technologies, conventional chemically strengthened glass often suffers from reduced impact resistance in thinner applications due to insufficient stress layer depth, or sacrifices light transmittance to increase strength. This solution utilizes aluminosilicate glass with a specific composition and an optimized ion exchange process to synergistically form a compressive stress layer of controllable depth on a thin substrate while maintaining high light transmittance. Existing technologies using ordinary soda-lime glass suffer from an insufficiently shallow stress layer that cannot effectively resist crack propagation under impact loads, while borosilicate glass suffers from insufficient light transmittance.

[0040] Through the above technical solution, this application can suppress crack initiation and propagation by dispersing the stress concentration caused by hail impact through the surface compressive stress layer when the glass thickness is reduced to 1.1 mm.

[0041] Specifically, the preparation method of the chemically strengthened glass front plate includes the following steps:

[0042] (1) Aluminosilicate glass with a thickness of 1.0mm-1.3mm is used as the substrate;

[0043] (2) Immerse aluminosilicate glass in molten potassium salt (such as KNO3) and carry out ion exchange at a temperature of 400°C to 500°C. Depending on the different performance requirements, the ion exchange time is usually 2-6 hours, so that the sodium ions on the glass surface are replaced by potassium ions to form a high compressive stress layer.

[0044] (3) The depth of the compressive stress layer on the surface of the tempered glass is 10μm-50μm, and the surface stress value is 600MPa-900MPa.

[0045] (4) The tempered glass furnace adopts a cooling method that controls the amount of air intake. Specific cooling rates are used in different temperature ranges to achieve the best surface strength. The temperature gradient can start from 400℃ and decrease by 50℃ every half hour. When it reaches below 200℃, the fan can be turned on at 60% of the maximum air volume. When it reaches 150℃, the maximum air volume is turned on. This is to allow the glass to cool slowly from 400℃ to 200℃, reducing the stress concentration that could cause the glass to break due to excessive cooling.

[0046] In some embodiments, the light transmittance of the chemically strengthened glass front panel is ≥94%.

[0047] A transmittance of ≥94% refers to the transmittance performance of glass in the visible light band. This can be achieved by controlling the purity of the glass composition and surface treatment processes, thus maximizing the efficient utilization of incident light. Improved transmittance is achieved by optimizing the iron content in the glass raw materials and by applying anti-reflective surface treatments, reducing light absorption loss while maintaining the stability of mechanical properties. Simultaneously, high transmittance enhances the transmission efficiency of incident light, preventing a decrease in photovoltaic module power generation efficiency due to optical losses in the glass material.

[0048] In some embodiments, the edge of the chemically strengthened glass front panel has a chamfered structure with a chamfer angle of 15°-45°, a chamfer depth of 0.1mm-1mm, and a chamfer width of 0.5mm-2mm.

[0049] The chamfer angle refers to the angle between the beveled edge and the main surface of the glass. This angle can be achieved through mechanical grinding or laser processing. This angle range balances the need for edge stress dispersion with structural integrity. The chamfer depth refers to the vertical distance from the edge apex to the end of the bevel. This depth can be controlled by adjusting the processing time or tool feed rate. This depth range can eliminate microcracks without significantly reducing the glass thickness. The chamfer width refers to the length of the bevel along the glass surface. This width can be achieved using a multi-stage progressive processing technique. This width range accommodates the encapsulation requirements of lamination processes while avoiding excessive loss of processing precision.

[0050] In the processing of chemically strengthened glass front panels, the edge areas are chamfered to create a smooth transition structure. When external impact loads are applied to the glass edges, the chamfered bevels disperse the stress originally concentrated at the edge points to a larger surface area, thereby reducing the stress peak per unit area. The choice of chamfer angle considers processing feasibility; for example, an angle less than 15° may result in sharp edges, while an angle exceeding 45° may affect the adhesion of the encapsulation layer. The matching relationship between the chamfer depth and the compressive stress layer on the glass surface is carefully considered, ensuring that the stress dispersion area covers the tempered compression layer. The chamfer width design takes into account the flow characteristics of the encapsulation layer during the component lamination process, avoiding the formation of air gaps in the edge areas of the encapsulation material during lamination.

[0051] Compared to existing technologies, traditional photovoltaic modules typically employ right-angled edges or simple rounded corners, without optimizing for the stress distribution characteristics of chemically strengthened glass. Right-angled edges are prone to stress concentration points upon impact, while conventional rounded corner treatments may weaken the protective effect of the tempered layer due to excessive curvature radii. This solution, through a beveled chamfer at a specific angle, maintains the integrity of the tempered layer while establishing a better stress transfer path, which is particularly crucial in the application of thin chemically strengthened glass.

[0052] In some embodiments, the surface of the chemically strengthened glass front panel away from the first encapsulating film layer is coated with an anti-reflective coating 16, the material of which includes nanoscale silicides.

[0053] The anti-reflective coating refers to an optical functional layer applied to the surface of the chemically strengthened glass front panel. It can be prepared using nanoscale silicide materials, which fill the microscopic pores on the glass surface to form a dense structure, reducing light reflection loss. Nanoscale silicides refer to silicon-based compounds with particle sizes at the nanoscale, such as silicon nitride or silicon oxide. They can be achieved using the sol-gel method or magnetron sputtering. These nanoparticles can reduce the reflectivity of incident light through the interfacial refractive index gradient effect while maintaining the bonding strength with the glass substrate.

[0054] Specifically, when an anti-reflective layer is formed on the surface of chemically strengthened glass through a coating process, nano-sized silicate particles are uniformly distributed on the glass surface, forming a thin film structure where the refractive index gradually transitions from air to the glass substrate. When light passes through this coating, the change in refractive index reduces Fresnel reflection at the interface, thereby improving light transmittance. Simultaneously, the nanoparticles fill microscopic defects on the glass surface, forming a dense and continuous film, preventing localized stress concentration caused by uneven coating and preserving the original surface stress distribution of the chemically strengthened glass.

[0055] Compared to existing technologies, traditional anti-reflective coatings typically use micron-sized particles or organic materials. The former, due to their large particle size, cannot effectively suppress diffuse reflection, while the latter is prone to aging and peeling under high temperature or ultraviolet light environments. This solution, however, achieves superior anti-reflective performance and enhances the long-term stability of the coating in outdoor environments through the dense structure of the nano-sized silicide coating and the properties of inorganic materials.

[0056] Through the above technical solution, this application effectively reduces the light reflection loss on the surface of chemically strengthened glass, improves the photoelectric conversion efficiency of photovoltaic modules, and avoids the problem of mechanical performance degradation caused by coating peeling or uneven stress distribution, thereby improving the reliability and durability of the modules in complex environments.

[0057] In some embodiments, the thickness of the anti-reflective coating is 100nm-120nm, preferably 110nm.

[0058] In some embodiments, the material of the first encapsulating film layer includes at least one of EVA, POE, and EPE; and / or, the material of the second encapsulating film layer includes at least one of EVA, POE, and EPE.

[0059] EVA refers to ethylene-vinyl acetate copolymer, specifically a polymer material formed by the copolymerization of ethylene monomers and vinyl acetate monomers. Different hardness and adhesion properties can be achieved by adjusting the monomer ratio, and its polar groups enhance the adhesion to glass surfaces. POE refers to polyolefin elastomer, specifically a thermoplastic elastomer material with a polyolefin matrix. High molecular weight distribution can be achieved using metallocene-catalyzed polymerization, and its molecular chain entanglement effectively disperses impact stress. EPE refers to a multilayer encapsulation material structure composed of ethylene-vinyl acetate copolymer (EVA) and polyolefin elastomer (POE). Specifically, EPE encapsulation film is a three-layer encapsulation material, typically constructed as EVA / POE / EVA, with the middle layer being POE and the outer and inner layers being EVA. This combination utilizes the good adhesion and processability of EVA and the excellent weather resistance, PID (potential-induced degradation) resistance, and low water vapor permeability of POE. Therefore, EPE encapsulation film combines the advantages of both.

[0060] The choice of encapsulation layer materials is limited to combinations of polymeric compounds with specific viscoelastic properties. Ethylene-vinyl acetate copolymers form chemical bonds with the chemically strengthened glass surface through polar groups, while polyolefin elastomers absorb dynamic impact energy through physical entanglement between molecular chains. The three-layer structure of the EPE encapsulation film forms an interpenetrating network structure during lamination, and its synergistic effect allows the encapsulation layer to maintain interfacial bonding strength while dissipating impact stress through deformation when subjected to hail impacts.

[0061] This solution introduces the aforementioned encapsulation layer material, whose elastic modulus gradually decreases from the glass interface toward the battery layer, thus better matching the thermal expansion behavior of different material layers.

[0062] Through the above technical solution, this application solves the problem of stress concentration caused by the mismatch between the modulus of the encapsulation material and the adjacent layers during the impact resistance process of ultra-thin chemically strengthened glass components, avoids the generation of interlayer bubbles and interface delamination, and maintains the dimensional stability of the encapsulation layer in a long-term humid and hot environment.

[0063] In some embodiments, the material of the backsheet layer includes at least one of TPT and PET.

[0064] TPT refers to a composite material specifically designed for use as a backsheet in solar panels. Specifically, "TPT" refers to a composite material composed of three layers: Tedlar (polyvinyl fluoride, PVF), Polyester, and another Tedlar (PVF). This structure can be abbreviated as TPT. The outer Tedlar layer provides excellent weather resistance, UV resistance, and chemical stability, protecting the internal components from environmental factors. The middle polyester layer (such as PET) primarily provides mechanical strength and dimensional stability. This combination makes TPT an ideal backsheet material, effectively protecting solar panels from moisture, UV radiation, and other harsh weather conditions, while also ensuring electrical insulation and extending the lifespan of the solar panels.

[0065] PET refers to polyethylene terephthalate, specifically a thermoplastic polyester material formed by the polycondensation of terephthalic acid and ethylene glycol. It can be produced using a biaxially oriented film process. Its rigid molecular chain structure provides high tensile strength and creep resistance. The high modulus of polyethylene terephthalate can disperse external impact loads, reducing the risk of stress concentration.

[0066] In some embodiments, the backsheet layer thickness is 250-350 μm.

[0067] The range of backsheet thickness can balance the mechanical support requirements with the lightweight requirements of the components. When the backsheet thickness is limited to 250-350μm, the synergistic improvement in its bending stiffness and puncture resistance can further buffer the impact energy of hail, while avoiding the increase in encapsulation stress caused by excessive thickness.

[0068] Compared to existing technologies, traditional backsheets made of polyethylene or polypropylene suffer from insufficient weather resistance and mechanical strength, making them prone to delamination. While simply increasing thickness can improve rigidity, it leads to increased module weight and more complex lamination processes. This solution optimizes the material system and limits the thickness range, achieving targeted enhancement of impact resistance while maintaining backsheet flexibility.

[0069] Through the above technical solutions, this application can prevent the backsheet from failing due to material degradation or mechanical damage under extreme weather conditions. At the same time, by controlling the thickness, it can reduce the warping deformation caused by the difference in thermal expansion coefficient during the encapsulation process, thereby improving the structural integrity and long-term reliability of photovoltaic modules under hail impact conditions.

[0070] In some embodiments, the photovoltaic module further includes a frame 2, which is disposed around the outer edge of the module body 1 for fixing the module body 1.

[0071] In some embodiments, the photovoltaic module also includes a junction box 3.

[0072] Specifically, this application also provides a method for preparing an impact-resistant photovoltaic module, including the following steps:

[0073] (1) Provide a chemically strengthened glass front plate with a thickness of 1.0mm-1.3mm, which forms a compressive stress layer on the surface through an ion exchange process;

[0074] (2) The chemically strengthened glass front plate is fixed to the support carrier plate with high temperature resistant tape; the first encapsulation film layer, the solar cell, the second encapsulation film layer and the back sheet material are stacked in sequence under the chemically strengthened glass front plate to form a stacked structure.

[0075] (3) The laminated structure is laminated and cured; then the support plate is removed.

[0076] The lamination process includes several key components: Ion exchange, a rigid substrate for supporting thin glass, and a heat treatment method. Ion exchange involves creating a compressive stress layer on the glass surface through ion replacement. This process improves the glass's impact resistance without altering its thickness. A support carrier is a rigid substrate used to support the thin glass. It can be made of ceramic or metal materials with a coefficient of thermal expansion matching the glass. Its function is to maintain the flatness of the glass and distribute mechanical stress during lamination. High-temperature adhesive tape is a bonding material that maintains adhesion at high temperatures. It can be made of silicone-based or polyimide-based tape and prevents displacement or warping of the glass during lamination. Lamination curing involves bonding the layers under hot and pressure conditions. This can be achieved through staged heating and pressurization, eliminating interlayer gaps and forming a stable interfacial bond.

[0077] In the application of thin chemically strengthened glass, the flexural strength is improved after the glass front plate forms a surface compressive stress layer through ion exchange. Temporarily fixing the glass front plate to the support substrate using high-temperature resistant tape prevents deformation or breakage due to excessive glass thinness during subsequent lamination operations. After lamination, the thermal expansion characteristics of the support substrate match those of the glass during lamination and curing, reducing thermal stress concentration. Specific tilt angles and speed control during support substrate removal prevent mechanical damage to the glass edges.

[0078] Compared to existing technologies, traditional manufacturing methods do not use a supporting carrier plate to fix the thin glass front plate, making the glass susceptible to breakage due to thermocompression stress during lamination. This solution, however, achieves stable positioning of the thin glass during lamination through the synergistic effect of the supporting carrier plate and high-temperature resistant adhesive tape. Existing technologies typically use physically tempered glass directly as the front plate, but the physical tempering process is thickness-sensitive and cannot form an effective compressive stress layer within the 1.0mm-1.3mm range. This solution solves the strengthening problem of thin glass through a chemical strengthening process.

[0079] Through the above technical solutions, this application can better suppress the risk of thin glass breakage during the lamination process and improve the structural integrity of photovoltaic modules under extreme conditions such as hail impacts. By optimizing the glass front panel fixing method and lamination process parameters, the encapsulation failure problem caused by glass deformation in traditional processes is avoided, realizing the reliable application of ultra-thin chemically strengthened glass in photovoltaic modules.

[0080] The specific lamination curing conditions include: lamination curing at a temperature of 120℃-150℃ and a pressure of 0.5MPa-1.0MPa for 10min-30min.

[0081] The temperature range refers to the controlled range of the heating environment during lamination. This can be achieved using a laminator with segmented temperature control. The lower limit of the temperature range meets the melting requirements of the encapsulation material, while the upper limit prevents cracks in the stress layer of the chemically strengthened glass surface due to thermal expansion. The pressure range refers to the range of mechanical pressure applied during lamination. This can be controlled using hydraulic or pneumatic systems. The lower limit ensures the removal of interlayer bubbles and dense adhesion of the materials, while the upper limit prevents structural damage to thin glass due to pressure concentration. The curing time refers to the duration of the lamination process. This can be precisely controlled using an automated timing device. The lower limit allows the encapsulation material to fully cross-link and form a stable interface, while the upper limit prevents relaxation of internal stress in the glass due to prolonged high temperatures.

[0082] In the fabrication of photovoltaic modules using chemically strengthened glass as the front panel, the combined control of temperature and pressure synergistically balances the thermal stability and interfacial bonding quality of the materials. For example, when the temperature is controlled between 120°C and 150°C, the encapsulation layer material can achieve sufficient melting and flow, while the surface compressive stress layer of the chemically strengthened glass remains intact because it does not exceed its thermal deformation critical value. When the pressure is controlled between 0.5 MPa and 1.0 MPa, uniform pressure can promote the filling of the gap between the cell and the backsheet by the encapsulation material, while avoiding localized stress concentration that could cause micro-cracks in the thin glass. When the curing time is set to 10 to 30 minutes, the cross-linking reaction of the encapsulation material can reach the preset curing degree, while the stress relaxation effect of the chemically strengthened glass is limited to an acceptable range.

[0083] Specifically, the steps for removing the support plate are as follows: peel off the support plate at an angle of ≤10° and at a peeling speed of ≤5mm / s.

[0084] The tilt angle refers to the angle formed when the support carrier separates from the chemically strengthened glass front plate. This angle can be monitored and adjusted in real time using an angle control device. Limiting the tilt angle range avoids shear stress concentration caused by abrupt changes in the peeling force direction. The peeling speed refers to the linear movement rate of the support carrier when separating from the chemically strengthened glass front plate. This speed can be achieved by driving the peeling mechanism with a speed-regulating motor and adjusting it in conjunction with a speed sensor feedback. Controlling the upper limit of the speed reduces the impact load during the dynamic peeling process.

[0085] When the support plate is slowly peeled off at an angle of less than or equal to 10 degrees, the direction of the interfacial debonding force tends to be parallel to the glass surface. This avoids the destructive shearing effect of the vertical component of the peeling force on the compressive stress layer of the glass surface caused by an excessively large angle. Simultaneously, the peeling speed is limited to less than 5 millimeters per second, keeping the adhesive fracture process in a quasi-static mode, resulting in a more uniform distribution of interfacial stress and preventing microcrack propagation caused by instantaneous load fluctuations due to rapid peeling. This synergistic control method effectively balances the relationship between process efficiency and glass structural integrity.

[0086] Specifically, the difference between the coefficient of thermal expansion of the supporting substrate and the coefficient of thermal expansion of the chemically strengthened glass front plate is ≤1.0×10⁻⁶. -6 / ℃.

[0087] During the lamination process of photovoltaic modules, the process temperature is significantly higher than that of the ambient temperature. If the difference in thermal expansion coefficients between the support substrate and the front panel is too large, the difference in thermal expansion behavior of different materials may lead to non-uniform stress distribution at the interface. This stress concentration phenomenon can easily cause microcrack propagation or interlayer displacement in the glass front panel, thereby affecting the structural integrity of the module. By matching the thermal expansion characteristics of the two materials, the thermal deformation coordination between the materials is enhanced, thereby reducing the risk of interface damage caused by thermal stress during processing. This design maintains a relatively stable bonding state at the contact interface between the glass front panel and the support substrate during lamination, avoiding glass breakage or module delamination caused by thermal expansion mismatch, and improving the structural stability of ultra-thin glass under high-temperature processing conditions. The realization of this technical solution is based on the influence mechanism of material thermal expansion behavior on interface stress. Through the matching and optimization of material parameters, the physical response of different materials in the temperature field is coordinated, providing a more compatible support system for the processing of ultra-thin glass.

[0088] Specifically, the thickness of the support plate is 2.8mm ± 0.1mm.

[0089] In the lamination process of ultra-thin photovoltaic glass, the supporting carrier plate needs to simultaneously meet the requirements of mechanical support performance and operational feasibility. If the carrier plate thickness is insufficient, its bending stiffness may not be able to effectively distribute the lamination pressure, leading to local deformation or breakage of the glass front plate under high temperature and pressure. If the carrier plate is too thick, the increased weight may affect the efficiency of manual operation, and the excessive heat capacity may prolong the heating and cooling cycle. By controlling the carrier plate thickness within a specific range, the carrier plate has sufficient rigidity to resist the mechanical stress during the lamination process, while maintaining a moderate heat conduction rate, so that the thermal response of the support system and the glass front plate tends to be synchronized. This thickness design allows the carrier plate to stably support the ultra-thin glass in the high-temperature processing environment, while avoiding the interface temperature gradient caused by its own thermal inertia difference, thereby reducing local stress concentration caused by heat conduction lag during the lamination process. This solution, based on the synergistic optimization of material mechanical properties and thermophysical behavior, provides suitable support conditions for the precision processing of ultra-thin glass, reducing processing defects caused by insufficient equipment rigidity or thermal response mismatch during manual operation.

[0090] Specifically, the adhesion attenuation rate of high-temperature resistant tape in the range of 20℃-180℃ is ≤15%.

[0091] This refers to the fact that the adhesive strength of high-temperature resistant tape decreases by no more than 15% when used in a temperature range of 20℃ to 180℃. By limiting the adhesive strength attenuation parameter of the high-temperature resistant tape, the problem of interfacial adhesion failure caused by temperature changes during photovoltaic module lamination is solved. In the high-temperature environment of the lamination process, the tape, as a dynamic fixing medium, needs to maintain stable adhesive performance. If its adhesive strength decreases significantly with increasing temperature, it may lead to module positioning misalignment or interface detachment. By controlling the adhesive strength attenuation of the tape within the process temperature range, the change in adhesive strength during the heating-curing-cooling thermal cycle matches the process requirements. The improved temperature stability of the tape's adhesive strength constrains the relative displacement between the glass front plate and the carrier plate during lamination, reducing the risk of interfacial slippage caused by adhesive failure. This solution is based on the coupling relationship between the thermal response characteristics of the adhesive material and the process temperature curve. By optimizing the temperature sensitivity of the tape's adhesive strength, it maintains interfacial constraint under dynamic thermal conditions, providing continuous and reliable positioning conditions for the high-temperature processing of ultra-thin glass.

[0092] Specifically, the high-temperature resistant tape can be applied to either the two diagonal areas of the chemically strengthened glass front panel or the four corner areas of the chemically strengthened glass front panel.

[0093] As an example, the positioning and fixing of the carrier plate and the glass is as follows: A chemically strengthened glass front plate with a thickness of 1.1mm ± 0.2mm is laid flat on a borosilicate glass carrier plate of the same size (carrier plate thickness is 3.2mm ± 0.1mm, surface roughness Ra≤0.2μm). High-temperature resistant paper tape (width 5mm ± 0.5mm, temperature resistance ≥180℃) is manually applied to the two diagonal corners of the glass and the carrier plate. The length of the tape extending beyond the edge is ≤3mm, achieving an initial positioning accuracy of ±0.5mm.

[0094] As an example, such as Figure 2 As shown, the four corners are dynamically fixed as follows: At the four corners of the component, 10mm±1mm from the edge, four strips of high-temperature resistant tape with a size of 8mm×40mm (adhesive force ≥0.4N / mm) are manually pasted to dynamically fix the carrier plate and the component during the lamination process.

[0095] A phased positioning constraint mechanism is constructed through a tape-attaching strategy with a specific spatial layout. In the lamination process of photovoltaic modules, the relative displacement control between the glass front panel and the supporting substrate needs to balance positioning accuracy and stress release requirements. Adhesion in diagonal areas forms the initial geometric constraint, establishing a basic positioning reference for the module's planar coordinate system; adhesion in the four corner areas forms a dynamic displacement compensation system, creating a multi-directional constraint field during the thermal expansion of the lamination process. This regional arrangement ensures that when the module expands due to heat, the direction of the tape constraint force vector differs from the direction of material thermal deformation, decomposing unidirectional deformation into multi-dimensional micro-displacements. When the lamination temperature rises, causing the interface material to expand, the oblique constraint of the diagonal tape generates an in-plane shear force, while the symmetrical arrangement of the four corner tapes forms a ring-shaped moment balance, transforming the linear displacement caused by thermal expansion into micro-strain that can be absorbed by the elastic deformation of the tape. This layout design is based on the stress distribution principle in elasticity. By utilizing the geometric relationship between the tape position and the direction of force, the thermomechanical stress during the lamination process is dispersed to multiple bonding interfaces, reducing the risk of single-point bonding failure, while maintaining the planar positioning reference of the components in high-temperature fluid environments.

[0096] The following description is based on specific embodiments.

[0097] Example 1

[0098] This embodiment provides an impact-resistant photovoltaic module comprising a 1.2mm thick aluminosilicate chemically strengthened glass front panel (surface stress 750MPa, stress layer depth 30μm, light transmittance 95%), coated with a 110nm nano-silicon nitride anti-reflective coating. Both the first and second encapsulating film layers are made of EPE material (0.5mm thick), and the back panel is a 300μm thick TPT material layer. The chamfering is done at a 30° angle and a depth of 0.5mm. Hail impact testing showed that the glass remained intact during the hail test.

[0099] Example 2

[0100] The difference between this embodiment and the previous one is that it uses 1.0mm ultrathin chemically strengthened glass (surface stress 900MPa, stress layer depth 50μm), and both the first and second encapsulating film layers are made of pure POE material. A 45° chamfer angle enhances edge impact resistance. The anti-reflective coating uses a composite structure of nano-silicon oxide and silicon nitride with a thickness of 105nm, and the backing is a 350μm thick pure PET layer. Hail impact testing showed that the glass did not break during the hail test.

[0101] Example 3

[0102] The difference between this embodiment and Embodiment 1 is that the front glass panel is 1.3mm thick (surface stress 600MPa) and has a chamfer depth of 1mm to form a wide transition area. Both the first and second encapsulating film layers are made of EVA material, and the backing is a 250μm ultra-thin PET substrate. Hail impact testing showed that the glass did not break during the hail test.

[0103] Example 4

[0104] The difference between this embodiment and Embodiment 1 is that no chamfering was performed, and the glass edge remained at a right angle. Hail impact testing showed that the glass did not break during the hail test.

[0105] Comparative Example 1

[0106] The difference between this comparative example and Example 1 is that 1.2mm physically tempered glass (surface stress 300MPa, stress layer depth 100μm) was used, and the hail impact test showed that the glass shattered at the point of impact with the hail.

[0107] Comparative Example 2

[0108] The difference between this comparative example and Example 1 is that the chemically strengthened glass is 0.8 mm thick and has a surface stress of 430 MPa. Hail impact tests show that the glass shattered at the point of impact.

[0109] Performance testing

[0110] 1. Layer thickness test: The thickness of the chemically strengthened glass front panel, encapsulation film layer, and back panel layer is measured using a laser thickness gauge at multiple points and the average value is taken.

[0111] 2. Visible light transmittance test: Visible light transmittance was measured using a spectrophotometer.

[0112] 3. Hail Impact Resistance Test: According to IEC 61215 standard, hailstones with a diameter of 55 mm were used to impact the component surface at a speed of 32 m / s. The test was conducted using a hail impact testing instrument conforming to IEC 61215 standard. Whether the glass cracked was recorded, and changes in the component's electrical performance were detected.

[0113] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural transformations made based on the content of the specification and drawings of this application under the concept of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. An impact-resistant photovoltaic module, characterized in that, The component body includes a module body, which is provided with the following components stacked sequentially from the light-receiving side to the backlight side: Chemically strengthened glass front panel, first encapsulating film layer, solar cell layer, second encapsulating film layer, and backsheet layer; The thickness of the chemically strengthened glass front plate is 1.0mm-1.3mm, and its surface stress value is 600MPa-900MPa.

2. The photovoltaic module as described in claim 1, characterized in that, The substrate of the chemically strengthened glass front panel is aluminosilicate glass, and the depth of its surface compressive stress layer is 10μm-50μm.

3. The photovoltaic module as described in claim 2, characterized in that, The edge of the chemically strengthened glass front plate has a chamfered structure with a chamfer angle of 15°-45°, a chamfer depth of 0.1mm-1mm, and a chamfer width of 0.5mm-2mm.

4. The photovoltaic module as described in claim 1, characterized in that, The material of the first encapsulating film layer includes at least one of EVA, POE, and EPE; and / or, the material of the second encapsulating film layer includes at least one of EVA, POE, and EPE.

5. The photovoltaic module as described in claim 1, characterized in that, The material of the backsheet layer includes at least one of TPT and PET.

6. The photovoltaic module as described in claim 1, characterized in that, The thickness of the backsheet layer is 250-350 μm.

7. The photovoltaic module as described in claim 1, characterized in that, The light transmittance of the chemically strengthened glass front panel is ≥94%.

8. The photovoltaic module as described in any one of claims 1 to 7, characterized in that, The chemically strengthened glass front panel is coated with an anti-reflective coating on the side of the front panel away from the first encapsulating film layer. The anti-reflective coating is made of nanoscale silicides.

9. The photovoltaic module as described in claim 8, characterized in that, The thickness of the anti-reflective coating is 100nm-120nm.

10. The photovoltaic module as described in claim 8, characterized in that, The photovoltaic module also includes a frame, which is arranged around the outer edge of the module body for fixing the module body.

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