Electronic heat dissipation structure and circuit board

Abstract

The utility model relates to electronic heat dissipation technical field especially, relates to an electronic heat dissipation structure and circuit board, electronic heat dissipation structure includes heat dissipation body and installs the heat conduction spare and electronic component on heat dissipation body, and electronic component carries out heat dissipation through heat conduction spare and heat dissipation body, and the heat dissipation effect is better. The heat dissipation body of electronic heat dissipation structure, heat conduction spare and electronic component assemble into a integral assembly and then weld to circuit board, formed integrated whole heat dissipation structure, and once installation is completed, reduced assembly step, can simultaneously adapt the heat dissipation of multiple electronic components, reduced the use of individual radiator and shielding, reduced the production cost of circuit board, improved the space utilization of circuit board, satisfied the compact design demand of circuit board. Heat dissipation body can inject coolant, and the heat dissipation efficiency is obviously improved. Heat conduction spare can not only realize heat dissipation to electronic component, but also can realize electromagnetic shielding to electronic component.

Description

Technical Field

[0001] This utility model belongs to the field of electronic heat dissipation technology, and in particular relates to an electronic heat dissipation structure and circuit board. Background Technology

[0002] Electronic heat sinks are typically heatsinks designed to cool high-power electronic components such as MOSFETs, rectifier diodes, and IGBTs. They operate without an external power supply, relying on natural cooling. For example, heat sinks for high-power switching transistors or triodes are usually secured to the heat sink by screws passing through the component and insulating material, thus achieving heat dissipation. In special cases, ultra-high-power electronic components may have built-in cooling fans; for instance, the switching transistors in a switching power supply must be equipped with cooling fans.

[0003] With advancements in science and technology, current electronic circuit manufacturing technologies are trending towards lighter, thinner, shorter, and smaller designs. Circuit board structures are also becoming increasingly compact. This approach increases the heat load per unit volume. To improve the heat dissipation efficiency of electronic components and ensure their reliability and lifespan, the most common heat dissipation method is to mount a heat sink and install a cooling fan. The heat generated by the electronic component during operation is transferred to the heat sink, and then dissipated by the fan blowing air across its surface. However, circuit boards using this heat sink and fan design often have a large overall size due to the large number of high-power electronic components integrated on them. This makes it difficult to achieve a compact design, increases manufacturing costs due to the numerous production and assembly steps involved.

[0004] Therefore, this utility model addresses the aforementioned technical problems by providing an electronic heat dissipation structure that integrates a multi-stage heat sink into a single design, reducing installation steps and improving heat dissipation efficiency, thereby solving the problems mentioned above. Utility Model Content

[0005] To address the aforementioned problems in the existing technology, this utility model provides an electronic heat dissipation structure, comprising:

[0006] A heat dissipation body has a refrigerant cavity formed inside it. A liquid injection hole is provided on one surface of the heat dissipation body to connect to the refrigerant cavity. The liquid injection hole is equipped with a sealing plug to seal the refrigerant cavity. Coolant can be injected into the refrigerant cavity through the liquid injection hole.

[0007] The heat dissipation body is provided with a first mounting base and a second mounting base. A first electronic component is attached to the first mounting base, and a second electronic component is attached to the second mounting base. The first electronic component and the second electronic component conduct heat to the heat dissipation body to dissipate heat.

[0008] The first heat-conducting component is attached to the outer surface of the first electronic component and is mounted to the first mounting base. The first heat-conducting component conducts heat to the heat dissipation body to dissipate heat.

[0009] The second heat-conducting component is attached to the outer surface of the second electronic component and is mounted to the second mounting base. The second heat-conducting component conducts heat to the heat dissipation body to dissipate heat.

[0010] Optionally, in some technical solutions, the first mounting base is formed with a first mounting hole, and the first fastener passes through the first heat-conducting element and the first electronic component and is fastened to the first mounting hole.

[0011] Optionally, in some technical solutions, the second mounting base is formed with a second mounting hole, and the second fastener passes through the second heat conductor and the second electronic component and is fastened to the second mounting hole.

[0012] Optionally, in some technical solutions, a first through hole is formed on the first heat-conducting component, a second through hole is formed on the first electronic component, and the first fastener passes through the first through hole and the second through hole to securely connect to the first mounting hole.

[0013] Optionally, in some technical solutions, a third through hole is formed on the second heat-conducting component, a fourth through hole is formed on the second electronic component, and the second fastener passes through the third through hole and the fourth through hole to securely connect to the second mounting hole.

[0014] Optionally, in some technical solutions, both the first mounting hole and the second mounting hole are threaded holes, and both the first fastener and the second fastener are screws.

[0015] Optionally, in some technical solutions, the first mounting base is formed with a first slot, and one end of the first heat-conducting element is inserted into the first slot to fit the first mounting base for installation.

[0016] Optionally, in some technical solutions, the second mounting base is formed with a second slot, and one end of the second heat-conducting element is inserted into the second slot to fit the second mounting base.

[0017] Optionally, in some technical solutions, both the first thermal conductive element and the second thermal conductive element are made of thermally conductive metal. The first thermal conductive element completely covers the mounting of the first electronic component, and the second thermal conductive element completely covers the mounting of the second electronic component. The first thermal conductive element electromagnetically shields the first electronic component, and the second thermal conductive element electromagnetically shields the second electronic component.

[0018] Optionally, in some technical solutions, the first heat-conducting element is formed with a first heat-dissipating fin, the first heat-dissipating fin extending outward from the first heat-conducting element; and / or,

[0019] The second heat-conducting element has a second heat-dissipating fin, which extends outward from the second heat-conducting element.

[0020] Optionally, in some technical solutions, the first heat-conducting element forms a first receiving groove, and the first electronic component is fitted and mounted in the first receiving groove; and / or,

[0021] The second heat-conducting element has a second receiving groove, and the second electronic component is attached and installed in the second receiving groove.

[0022] Optionally, in some technical solutions, the first mounting base and the second mounting base have the same or different structures, and the first heat-conducting element and the second heat-conducting element have the same or different structures.

[0023] Optionally, in some technical solutions, the first electronic component is a first switching transistor, and the second electronic component is a second switching transistor, wherein the first electronic component and the second electronic component have the same or different structures.

[0024] Optionally, in some technical solutions, the first electronic component is a primary MOSFET, the second electronic component is a secondary MOSFET, and the first electronic component and the second electronic component have the same structure.

[0025] Optionally, in some technical solutions, the heat dissipation body is formed as a mounting bracket, the mounting bracket is made of plastic molding, and the first mounting seat and the second mounting seat are disposed at both ends of the mounting bracket; and / or,

[0026] The refrigerant cavity is formed as a hollow structure or a pipe structure.

[0027] Alternatively, in some technical solutions, the sealing plug is a silicone plug.

[0028] In addition, this utility model also provides a circuit board using the above-mentioned electronic heat dissipation structure, wherein the first electronic component and the second electronic component are soldered on the circuit board.

[0029] The technical solution of this utility model has the following advantages or beneficial effects:

[0030] The electronic heat dissipation structure provided by this utility model includes a heat dissipation body, a first heat-conducting element, and a second heat-conducting element. A refrigerant cavity is formed inside the heat dissipation body. A liquid injection hole is provided on one surface of the heat dissipation body, connecting to the refrigerant cavity. The liquid injection hole is equipped with a sealing plug to seal the refrigerant cavity, allowing coolant to be injected into the refrigerant cavity through the liquid injection hole. A first mounting base and a second mounting base are provided on the heat dissipation body. A first electronic component is attached to the first mounting base, and a second electronic component is attached to the second mounting base. The first and second electronic components conduct heat to the heat dissipation body for heat dissipation. The outer surface of the first electronic component is attached to the first heat-conducting element, which is attached to the first mounting base. The first heat-conducting element conducts heat to the heat dissipation body for heat dissipation. The outer surface of the second electronic component is attached to the second heat-conducting element, which is attached to the second mounting base. The second heat-conducting element conducts heat to the heat dissipation body for heat dissipation. The heat sink, heat-conducting components, and electronic components of the electronic heat dissipation structure are assembled into a single unit and then soldered onto the circuit board, forming an integrated heat dissipation structure. This one-time installation reduces assembly steps; it can simultaneously accommodate the heat dissipation of multiple electronic components, reducing the need for individual heat sinks and shielding components, lowering circuit board production costs, improving space utilization, and meeting the compact design requirements of circuit boards. The heat sink can be filled with coolant, significantly improving heat dissipation efficiency. The heat-conducting components not only dissipate heat from the electronic components but also provide electromagnetic shielding. Attached Figure Description

[0031] Embodiments of the present invention will be described more fully with reference to the accompanying drawings. However, the accompanying drawings are for illustration and explanation only and do not constitute a limitation on the scope of the present invention.

[0032] Figure 1 This is a three-dimensional schematic diagram of the electronic heat dissipation structure of this utility model;

[0033] Figure 2 This is an exploded view of the electronic heat dissipation structure of this utility model;

[0034] Figure 3 This is a cross-sectional schematic diagram of the electronic heat dissipation structure of this utility model;

[0035] Figure 4 This is a three-dimensional schematic diagram of the heat dissipation body of this utility model;

[0036] Figure 5 This is another schematic diagram of the electronic heat dissipation structure of this utility model;

[0037] Figure 6 This is another schematic diagram of the electronic heat dissipation structure of this utility model;

[0038] Figure 7 This is a schematic diagram of the electronic heat dissipation structure of this utility model applied to a circuit board.

[0039] Figure 8 This is an exploded view of the electronic heat dissipation structure of this utility model applied to a circuit board.

[0040] Illustration:

[0041] 1. Heat sink body; 2. First heat conduction component; 3. Second heat conduction component; 4. Refrigerant cavity; 5. Refrigerant injection hole;

[0042] 6. Sealing plug; 7. First mounting base; 8. Second mounting base; 9. First electronic component; 10. Second electronic component; 11. First mating surface; 12. First mounting surface; 13. Second mating surface; 14. Second mounting surface; 15. First receiving groove; 16. Second receiving groove; 17. First mounting hole; 18. First fastener; 19. First through hole; 20. Second through hole; 21. Second mounting hole; 22. Second fastener; 23. Third through hole; 24. Fourth through hole; 25. First slot; 26. Second slot;

[0043] 27. First heat dissipation fin; 28. Second heat dissipation fin; 29. ​​Circuit board; 30. Third electronic component;

[0044] 31. Fourth electronic component. Detailed Implementation

[0045] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of this utility model. However, this utility model can be implemented in many other different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0046] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0047] In the description of this utility model, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0048] In the description of this utility model, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0049] like Figure 1-8 As shown, an embodiment of this utility model provides an electronic heat dissipation structure, including a heat dissipation body 1, a first heat-conducting element 2, and a second heat-conducting element 3. A refrigerant cavity 4 is formed inside the heat dissipation body 1. A liquid injection hole 5 is provided on one surface of the heat dissipation body 1, communicating with the refrigerant cavity 4. A sealing plug 6 is provided on the liquid injection hole 5 to seal the refrigerant cavity 4. Coolant can be injected into the refrigerant cavity 4 through the liquid injection hole 5. A first mounting base 7 and a second mounting base 8 are provided on the heat dissipation body 1. A first electronic component 9 is attached to the first mounting base 7, and a second electronic component 10 is attached to the second mounting base 8. The first electronic component 9 and the second electronic component 10 transmit heat to the heat dissipation body 1. The heat dissipation is achieved through heat conduction. The outer surface of the first electronic component 9 is attached to the first heat-conducting element 2, which is then attached to the first mounting base 7. The first heat-conducting element 2 conducts heat to the heat dissipation body 1. Similarly, the outer surface of the second electronic component 10 is attached to the second heat-conducting element 3, which is attached to the second mounting base 8. The second heat-conducting element 3 conducts heat to the heat dissipation body 1. The heat generated by the first and second electronic components 9 and 10 during operation is dissipated through the first heat-conducting element 2, the second heat-conducting element 3, and the heat dissipation body 1, significantly improving heat dissipation efficiency. Furthermore, better heat dissipation can be achieved without power supply and using a fan. The heat dissipation body 1, heat-conducting elements, and electronic components of the electronic heat dissipation structure are assembled into a single component and then soldered onto the circuit board 29, forming an integrated overall heat dissipation structure. This single assembly reduces assembly steps. It can simultaneously accommodate the heat dissipation of multiple electronic components, reducing the use of individual heat sinks and shielding components, lowering the production cost of the circuit board 29, improving the space utilization of the circuit board 29, and meeting the compact design requirements of the circuit board 29. Coolant can be injected into the heat dissipation body 1, significantly improving heat dissipation efficiency. Thermal conductive components can not only dissipate heat from electronic components, but also provide electromagnetic shielding for them.

[0050] Specifically, such as Figure 1-4As shown, in this embodiment, the heat dissipation body 1 is formed as a mounting bracket. The first heat-conducting component 2, the second heat-conducting component 3, the first electronic component 9, and the second electronic component 10 are all securely mounted through the heat dissipation body 1. It not only serves the function of heat dissipation but also acts as a mounting carrier. The heat dissipation body 1 has a cuboid structure, with a first mounting base 7 and a second mounting base 8 formed at its two ends, respectively. The heat dissipation body 1 is manufactured using a one-piece plastic molding process. The interior of the heat dissipation body 1 forms a hollow refrigerant cavity 4, which is used to contain coolant. Injecting coolant into the refrigerant cavity 4 can further improve the heat dissipation effect of the heat dissipation body 1. It should be noted that in other embodiments, the heat dissipation body 1 can also be manufactured using materials with good thermal conductivity, such as aluminum alloy, to meet higher heat dissipation requirements; the refrigerant cavity 4 can also be set as a repeatedly bent pipe structure, which can also achieve a good heat dissipation effect. More specifically, in order to inject coolant into the refrigerant cavity 4, a liquid injection hole 5 is provided on the upper surface of the heat sink body 1. The liquid injection hole 5 is connected to the refrigerant cavity 4. Injecting an appropriate amount of coolant into the refrigerant cavity 4 through the liquid injection hole 5 can improve the heat dissipation effect of the heat sink body 1 and further improve the heat dissipation efficiency of the electronic heat dissipation structure. It should be noted that in some embodiments, the coolant can be selectively injected or not injected as needed, and the coolant can also be replaced with a solid coolant as needed. Preferably, in this embodiment, in order to seal the liquid injection hole 5 and prevent coolant leakage, a sealing plug 6 is provided on the liquid injection hole 5 to seal the refrigerant cavity 4. The sealing plug 6 is a silicone plug made of silicone material. The silicone plug is tightly inserted into the liquid injection hole 5 to seal the liquid injection hole 5, prevent coolant leakage, and avoid damage to the circuit board 29.

[0051] Furthermore, in this embodiment, the two ends of the heat dissipation body 1 are a first mounting base 7 and a second mounting base 8, respectively. The structures of the first mounting base 7 and the second mounting base 8 may be the same or different, and the structures of the first heat-conducting element 2 and the second heat-conducting element 3 may be the same or different. The design of the first mounting base 7 and the second mounting base 8 needs to be specifically set according to the shape of the first heat-conducting element 2 and the second heat-conducting element 3, as well as the shape of the first electronic component 9 and the second electronic component 10. That is to say, the first mounting base 7 is set to fit the shape of the first electronic component 9 and the first heat-conducting element 2, and should maximize the contact area between the first mounting base 7 and the first electronic component 9 and the first heat-conducting element 2, thereby ensuring that the first electronic component 9 obtains the best heat dissipation effect. Similarly, the second mounting base 8 is set to fit the shape of the second electronic component 10 and the second heat-conducting element 3, and should maximize the contact area between the second mounting base 8 and the second electronic component 10 and the second heat-conducting element 3, thereby ensuring that the second electronic component 10 obtains the best heat dissipation effect. It should be noted that in other embodiments, the shape of the heat sink 1 should be designed according to the cooling requirements of the electronic components. For example, when there are three, four, or more electronic components on the circuit board 29 that require heat dissipation, such as... Figure 5As shown, when three electronic components on circuit board 29 require heat dissipation (i.e., the first electronic component 9, the second electronic component 10, and the third electronic component 30 are mounted on the heat sink 1), then the heat sink 1 is equipped with three mounting brackets to accommodate three heat-conducting components for heat dissipation of the three electronic components; for example... Figure 6 As shown, when there are four electronic components on the circuit board 29 that need heat dissipation, that is, when the first electronic component 9, the second electronic component 10, the third electronic component 30 and the fourth electronic component 31 are installed on the heat dissipation body 1, then the heat dissipation body 1 is provided with four mounting bases to adapt to four heat-conducting components to dissipate heat from the four electronic components.

[0052] Furthermore, in this embodiment, a first mating surface 11 is formed on the first mounting base 7, and a first mounting surface 12 is formed on the first electronic component 9. The first mounting surface 12 is mounted on the first mating surface 11. Therefore, most of the heat generated by the first electronic component 9 during operation is conducted through the first mounting surface 12 to the first mating surface 11, and then dissipated through the heat sink 1. A second mating surface 13 is formed on the second mounting base 8, and a second mounting surface 14 is formed on the second electronic component 10. The second mounting surface 14 is mounted on the second mating surface 13. Therefore, most of the heat generated by the second electronic component 10 during operation is conducted through the second mounting surface 14 to the second mating surface 13, and then dissipated through the heat sink 1. In particular, in some embodiments, when the heat dissipation requirement of the circuit board 29 is low, the electronic heat dissipation structure may not require heat-conducting components for heat conduction and dissipation. Simply mounting the electronic component on the mounting base is sufficient to meet the low heat dissipation requirement of the circuit board 29. The electronic heat dissipation structure can be flexibly applied.

[0053] Furthermore, in this embodiment, both the first heat-conducting element 2 and the second heat-conducting element 3 are in the form of a cover structure, made of thermally conductive metal, such as aluminum alloy or copper. Preferably, the first heat-conducting element 2 and the second heat-conducting element 3 are made of aluminum alloy by stamping, which can reduce the production cost of the electronic heat dissipation structure. More specifically, in order to better conduct and dissipate the heat of the electronic components, the first heat-conducting element 2 is formed with a first receiving groove 15. The back of the first electronic component 9 is mounted against the bottom of the first receiving groove 15, the side of the first electronic component 9 is mounted against the side of the first receiving groove 15, and the upper end of the first heat-conducting element 2 is mounted against the first mounting base 7. Thus, most of the heat generated when the first electronic component 9 is working is conducted to the first heat-conducting element 2 and dissipated on the first heat-conducting element 2. The heat dissipation body 1 also dissipates heat from the first heat-conducting element 2, resulting in a better heat dissipation effect. The second heat-conducting element 3 has a second receiving groove 16. The back of the second electronic component 10 is mounted against the bottom of the second receiving groove 16, and the side of the second electronic component 10 is mounted against the side of the second receiving groove. The upper end of the second heat-conducting element 3 is mounted against the second mounting base 8. Thus, most of the heat generated when the second electronic component 10 is working is conducted to the second heat-conducting element 3 and dissipated on the second heat-conducting element 3. The heat dissipation body 1 also dissipates heat from the second heat-conducting element 3, resulting in a better heat dissipation effect.

[0054] Furthermore, in this embodiment, in order to ensure that the first electronic component 9 is securely mounted on the heat sink body 1 and forms a heat conduction, the first mounting base 7 is provided with a first mounting hole 17, and the first fastener 18 passes through the first heat conduction element 2 and the first electronic component 9 and is securely connected to the first mounting hole 17. Specifically, the first mounting base 7 is provided with a first mounting hole 17 at the middle position of the first contact surface 11, and the first fastener 18 passes through the first heat conduction element 2 and the first electronic component 9 and is securely connected to the first mounting hole 17. The first mounting hole 17 is preferably a threaded hole, and the first fastener 18 is preferably a screw. The screw securely mounts the first heat conduction element 2 and the first electronic component 9 on the heat sink body 1, and the first contact surface 11 is in complete contact with the first mounting surface 12, ensuring good heat conduction effect. More specifically, a first through hole 19 is formed at the upper end of the first heat-conducting component 2, and a second through hole 20 is formed at the middle position of the upper end of the first electronic component 9 located on the first mounting surface 12. The first fastener 18 passes through the first through hole 19 and the second through hole 20 and is fastened to the first mounting hole 17, so that the upper ends of the first electronic component 9 and the upper ends of the first heat-conducting component 2 are both in contact with the first mounting base 7, ensuring good heat conduction effect.

[0055] Furthermore, in this embodiment, in order to ensure that the second electronic component 10 is securely mounted on the heat sink body 1 and forms a heat conduction, the second mounting base 8 is provided with a second mounting hole 21, and the second fastener 22 passes through the second heat conduction element 3 and the second electronic component 10 and is securely connected to the second mounting hole 21. Specifically, a second mounting hole 21 is provided on the second mounting base 8 at the middle position of the second contact surface 13, and the second fastener 22 passes through the second heat conduction element 3 and the second electronic component 10 and is securely connected to the second mounting hole 21. The second mounting hole 21 is preferably a threaded hole, and the second fastener 22 is preferably a screw. The screw securely mounts the second heat conduction element 3 and the second electronic component 10 on the heat sink body 1, and the second contact surface 13 is in complete contact with the second mounting surface 14, ensuring good heat conduction effect. More specifically, a third through hole 23 is formed at the upper end of the second heat-conducting element 3, and a fourth through hole 24 is formed at the upper end of the second electronic component 10 located in the middle of the second mounting surface 14. The second fastener 22 passes through the third through hole 23 and the fourth through hole 24 and is fastened to the second mounting hole 21, so that the upper end of the second electronic component 10 and the upper end of the second heat-conducting element 3 are both in contact with the second mounting base 8, ensuring good heat conduction effect.

[0056] Furthermore, in this embodiment, in order to fit the first heat-conducting element 2 onto the heat dissipation body 1 to form heat conduction and heat dissipation, the first mounting base 7 is formed with a first slot 25. One end of the first heat-conducting element 2 is inserted into the first slot 25 and fitted onto the first mounting base 7. Specifically, the first mounting base 7 is symmetrically provided with first slots 25 on both sides. The groove shape of the first slot 25 is arc-shaped, and the upper end of the first heat-conducting element 2 is formed with an arc-shaped folded edge. The upper end of the first heat-conducting element 2 is inserted into the first slot 25 for installation. The arc-shaped transition surfaces on the two components are in contact with each other, so that the heat on the first heat-conducting element 2 can also be conducted to the heat dissipation body 1. That is, the heat dissipation body 1 also dissipates heat from the first heat-conducting element 2, and at the same time, the first heat-conducting element 2 also dissipates heat and conducts heat to the first electronic component 9.

[0057] Furthermore, in this embodiment, in order to fit the second heat-conducting element 3 onto the heat dissipation body 1 to form heat conduction and heat dissipation, the second mounting base 8 is formed with a second slot 26. One end of the second heat-conducting element 3 is inserted into the second slot 26 and fitted onto the second mounting base 8. Specifically, the second mounting base 8 is symmetrically provided with second slots 26 on both sides. The groove shape of the second slot 26 is arc-shaped, and the upper end of the second heat-conducting element 3 is formed with an arc-shaped folded edge. The upper end of the second heat-conducting element 3 is inserted into the second slot 26 for installation. The arc-shaped transition surfaces on the two components are in contact with each other, so that the heat on the second heat-conducting element 3 can also be conducted to the heat dissipation body 1. That is, the heat dissipation body 1 also dissipates heat from the second heat-conducting element 3, and at the same time, the second heat-conducting element 3 also dissipates heat and conducts heat to the second electronic component 10.

[0058] Furthermore, in this embodiment, both the first heat-conducting component 2 and the second heat-conducting component 3 are formed by stamping aluminum plates. The first heat-conducting component 2 completely covers the first electronic component 9, and the second heat-conducting component 3 completely covers the second electronic component 10. The first heat-conducting component 2 electromagnetically shields the first electronic component 9, and the second heat-conducting component 3 electromagnetically shields the second electronic component 10. Specifically, the first electronic component 9 is covered by the first receiving groove 15, thereby the first heat-conducting component 2 forms electromagnetic shielding for the first electronic component 9; the second electronic component 10 is covered by the second receiving groove 16, thereby the second heat-conducting component 3 forms electromagnetic shielding for the second electronic component 10. This avoids electromagnetic interference to the first electronic component 9 and the second electronic component 10, and eliminates the need for a dedicated shielding cover, achieving the effect of multiple uses for the same component, saving parts, and reducing the production cost of the circuit board 29.

[0059] Furthermore, in this embodiment, to further improve the heat dissipation efficiency of the first electronic component 9 and the second electronic component 10, the first heat-conducting element 2 is formed with a first heat dissipation wing 27, which extends outward from the first heat-conducting element 2; the second heat-conducting element 3 is formed with a second heat dissipation wing 28, which extends outward from the second heat-conducting element 3. Specifically, the first heat dissipation wing 27 forms an arc transition with the groove side of the first receiving groove 15, and the second heat dissipation wing 28 forms an arc transition with the groove side of the second receiving groove 16; the upper part of the first heat-conducting element 2 is inserted into the first slot 25, and the first heat dissipation wing 27 is attached to the first slot 25 and partially exposed outside the first slot 25; the upper part of the second heat-conducting element 3 is inserted into the second slot 26, and the second heat dissipation wing 28 is attached to the second slot 26 and partially exposed outside the second slot 26; the first heat dissipation wing 27 and the second heat dissipation wing 28 not only increase the heat dissipation area, but also contact the heat dissipation body 1 containing coolant, significantly improving the heat dissipation efficiency and reducing the temperature rise of the electronic components.

[0060] Furthermore, in some embodiments, when the electronic heat dissipation structure is applied to the circuit board 29 of the switching power supply, the first electronic component 9 is a first switching transistor, and the second electronic component 10 is a second switching transistor. The structures of the first electronic component 9 and the second electronic component 10 may be the same or different. Preferably, the first electronic component 9 is a primary MOSFET, and the second electronic component 10 is a secondary MOSFET. The structures of the first electronic component 9 and the second electronic component 10 are the same. It should be noted that the conventional electronic components used as switching transistors on the circuit board 29 are usually MOSFETs or IGBTs. When the circuit board 29 uses the same electronic components, the shapes and structures of the corresponding mounting bases and heat-conducting components can be the same or different. When the circuit board 29 uses different electronic components for switching control, the shapes and structures of the corresponding heat-conducting components and mounting bases should also be adapted to be different due to the different shapes and structures of the switching transistors. That is, the shapes and structures of the first mounting base 7, the second mounting base 8, the first heat-conducting component 2, and the second heat-conducting component 3 can be arbitrarily set according to requirements. Of course, electronic components can also be high-power rectifier tubes. There is no limitation on the type of electronic components here. As long as the circuit board 29 requires heat dissipation of electronic components, the above-mentioned electronic heat dissipation structure can be applied.

[0061] Furthermore, such as Figure 7-8 As shown, an embodiment of this utility model also provides a circuit board 29 using the above-described electronic heat dissipation structure. The first electronic component 9 and the second electronic component 10 are soldered onto the circuit board 29. The electronic components dissipate heat through the heat-conducting component and the heat dissipation body 1, resulting in better heat dissipation. The heat dissipation body 1, the heat-conducting component, and the electronic components of the electronic heat dissipation structure are assembled into a single component and then soldered onto the circuit board 29, forming an integrated overall heat dissipation structure. This single-stage installation reduces assembly steps; it can simultaneously accommodate the heat dissipation of multiple electronic components, reducing the use of individual heat sinks and shielding components, lowering the production cost of the circuit board 29, improving the space utilization of the circuit board 29, and meeting the compact design requirements of the circuit board 29. The heat dissipation body 1 can be injected with coolant, significantly improving heat dissipation efficiency. The heat-conducting component not only dissipates heat from the electronic components but also provides electromagnetic shielding.

[0062] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0063] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An electronic heat dissipation structure, characterized in that, include: A heat dissipation body has a refrigerant cavity formed inside it. A liquid injection hole is provided on one surface of the heat dissipation body to connect to the refrigerant cavity. The liquid injection hole is equipped with a sealing plug to seal the refrigerant cavity. Coolant can be injected into the refrigerant cavity through the liquid injection hole. The heat dissipation body is provided with a first mounting base and a second mounting base. A first electronic component is attached to the first mounting base, and a second electronic component is attached to the second mounting base. The first electronic component and the second electronic component conduct heat to the heat dissipation body to dissipate heat. The first heat-conducting component is attached to the outer surface of the first electronic component and is mounted to the first mounting base. The first heat-conducting component conducts heat to the heat dissipation body to dissipate heat. The second heat-conducting component is attached to the outer surface of the second electronic component and is mounted to the second mounting base. The second heat-conducting component conducts heat to the heat dissipation body to dissipate heat.

2. The electronic heat dissipation structure as described in claim 1, characterized in that, The first mounting base has a first mounting hole, and the first fastener passes through the first heat-conducting element and the first electronic component and is securely connected to the first mounting hole.

3. The electronic heat dissipation structure as described in claim 2, characterized in that, The second mounting base has a second mounting hole, and the second fastener passes through the second heat conductor and the second electronic component and is securely connected to the second mounting hole.

4. The electronic heat dissipation structure as described in claim 1, characterized in that, The first mounting base has a first slot, and one end of the first heat-conducting element is inserted into the first slot to fit the first mounting base.

5. The electronic heat dissipation structure as described in claim 4, characterized in that, The second mounting base has a second slot, and one end of the second heat-conducting element is inserted into the second slot to fit the second mounting base.

6. The electronic heat dissipation structure as described in claim 1, characterized in that, Both the first and second thermal conductive components are made of thermally conductive metal. The first thermal conductive component completely covers the mounting of the first electronic component, and the second thermal conductive component completely covers the mounting of the second electronic component. The first thermal conductive component electromagnetically shields the first electronic component, and the second thermal conductive component electromagnetically shields the second electronic component.

7. The electronic heat dissipation structure as described in claim 6, characterized in that, The first heat-conducting element has a first heat-dissipating fin, which extends outward from the first heat-conducting element; and / or, The second heat-conducting element has a second heat-dissipating fin, which extends outward from the second heat-conducting element.

8. The electronic heat dissipation structure as described in claim 6, characterized in that, The first heat-conducting element has a first receiving groove, and the first electronic component is fitted and mounted in the first receiving groove; and / or, The second heat-conducting element has a second receiving groove, and the second electronic component is attached and installed in the second receiving groove.

9. The electronic heat dissipation structure as described in claim 1, characterized in that, The heat dissipation body is formed into a mounting bracket, which is made of molded plastic. The first mounting base and the second mounting base are disposed at both ends of the mounting bracket; and / or, The refrigerant cavity is formed as a hollow structure or a pipe structure.

10. A circuit board, characterized in that, The electronic heat dissipation structure includes any one of claims 1-9, wherein the first electronic component and the second electronic component are soldered onto the circuit board.

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