Hot press head and hot press apparatus

Abstract

The utility model relates to a hot pressing head and hot pressing equipment belongs to the technical field of hot pressing equipment, it includes base, the heating sheet is used for heating to semiconductor workpiece, the heat insulation block is installed between base and heating sheet, is used for isolating the heat of heating sheet, the exhaust hole is set up on the side wall of heat insulation block, and the exhaust hole is used for discharging the heat of heating sheet, the flow guide plate, the flow guide plate sets up at the exhaust hole, and the flow guide hole is set up on the flow guide plate, and the flow guide hole is located the side wall at the side of heat insulation block towards base, and the exhaust stream of exhaust hole passes along the flow guide plate from the flow guide hole, the first pipe joint is used for pumping to make semiconductor workpiece adsorb in heating sheet, the second pipe joint is used for conveying the exhaust stream, the utility model discloses the flow guide plate sets up in the exhaust hole, makes the gas of exhaust hole along the flow guide plate and discharges, and under the action of the flow guide hole on the flow guide plate, makes the gas of discharge far away from heat insulation block and flow guide plate, and then guarantees to be able to effectively cool heating sheet.

Description

Technical Field

[0001] This utility model relates to the technical field of hot pressing equipment, and in particular to a hot pressing head and hot pressing equipment. Background Technology

[0002] Thermocompression bonding technology is one of the key processes in microelectronic packaging, semiconductor manufacturing, and advanced electronic assembly. It is a solid-state bonding process that combines heat and force to cause plastic deformation between two thin sheets, forming a clean surface with close contact. The thermocompression head is the core component of thermocompression bonding technology, and its performance directly determines the bonding quality, efficiency, and yield.

[0003] The hot press head mainly consists of a heating element, a heat insulation block, and a base. The heating element provides a precise and controllable heat source to achieve rapid heating of the bonding area and maintain the required temperature uniformity and stability. The heat insulation block can block heat transfer from the high-temperature heating element to the downstream base to the maximum extent, reducing heat loss and improving thermal efficiency. At the same time, in order to dissipate heat from the heat insulation block, a serpentine channel is arranged on the side of the heat insulation block facing the heating element. The channel contacts the heating element, and a cooling airflow is introduced into the channel. The flow of the cooling airflow dissipates heat from the contact surface between the heat insulation block and the heating element.

[0004] However, in actual use, heat is usually dissipated by blowing air directly outwards, but the heat lingers around and the ambient temperature remains high, making it difficult to achieve rapid cooling. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a hot press head and hot press equipment to solve the technical problems of slow heating rate and low hot press efficiency of the heating element in the prior art.

[0006] In a first aspect, this utility model provides a hot press head, comprising: Base; Heating elements are used to heat semiconductor workpieces. A heat insulation block is installed between the base and the heating element to isolate the heat from the heating element; an exhaust hole is provided on the side wall of the heat insulation block to discharge the heat from the heating element. A flow guide plate is provided at the exhaust port, and a flow guide hole is provided on the flow guide plate. The flow guide hole is located on the side wall of the heat insulation block facing the base. The heat dissipation airflow discharged from the exhaust port passes through the flow guide plate and flows out through the flow guide hole. The first pipe joint is used to extract air so that the semiconductor workpiece is adsorbed onto the heating element; The second pipe connector is used to deliver cooling airflow.

[0007] Secondly, this utility model also provides a hot pressing device, including the hot pressing head described in the first aspect.

[0008] The technical solution of this utility model has the following advantages: The hot press head provided by this utility model is positioned at the exhaust port via a guide plate. This allows the gas discharged from the exhaust port to flow along the guide plate, and the guide holes on the guide plate further guide the discharged gas away from the heat insulation block and the guide plate, thereby ensuring effective cooling of the heating element. Attached Figure Description

[0009] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of the overall structure of the hot press head of this utility model; Figure 2 This is an exploded view of the structure between the heating element, the heat insulation block, and the base in this utility model; Figure 3 This is a schematic diagram of the heating element in this utility model; Figure 4 for Figure 3 Enlarged diagram of section A in the middle; Figure 5 This is a schematic diagram of the resistance wire structure in this utility model; Figure 6 This is a schematic diagram of the front structure of the heat insulation block in this utility model; Figure 7 This is a schematic diagram of the back structure of the heat insulation block in this utility model; Figure 8 This is a schematic diagram showing the flow state of the heat dissipation airflow in this utility model; Figure 9 This is a schematic diagram illustrating the cooperation between the heat dissipation component and the heat insulation block in this utility model; Figure 10 This is a top view of the heat dissipation component and the heat insulation block in this utility model; Figure 11 This is a schematic diagram showing the heat sink component with one end face removed in this utility model; Figure 12 This is a perspective view of the heat sink component in this utility model.

[0011] Explanation of reference numerals in the attached figures: 1. Base; 2. Heat insulation block; 3. Heating element; 31. Hot press plate; 32. Resistance wire; 33. Power cord; 4. Supporting component; 41. First column; 42. Second column; 43. Third column; 5. First heat dissipation hole; 6. Second pipe joint; 7. Heat dissipation groove; 8. Exhaust hole; 9. Guide plate; 91. First plate; 92. Second plate; 93. Third plate; 10. Second heat dissipation hole; 11. First through hole; 12. First connecting part; 13. Second connecting part; 14. Hollowed-out part; 15. Protrusion; 151. First component; 152. Second component; 16. Bolt; 17. Guide hole; 18. First pipe joint; 19. Second through hole; 20. Groove; 21. Sealing component; 22. Adsorption groove; 23. Third through hole; 24. Limiting component; 442. Heat dissipation component; 443. Connecting hole. Detailed Implementation

[0012] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some, not all, of the embodiments of this utility model. Based on the description of this utility model, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this utility model.

[0013] Unless otherwise explicitly specified and limited, the terms "setup," "installation," and "connection" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms based on the specific circumstances.

[0014] The terms “upper,” “lower,” “left,” “right,” “front,” “back,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of description and simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0015] The terms “first,” “second,” “third,” etc., are used merely to distinguish elements with similar properties, not to indicate or imply relative importance or a specific order.

[0016] The terms “include,” “comprising,” or any other variation thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0017] Reference Figures 1-7As shown, this utility model provides a hot press head, including a base 1, a heating element 3, a heat insulation block 2, and a guide plate 9. The heating element 3 is used to heat a semiconductor workpiece. The heat insulation block 2 is installed between the base 1 and the heating element 3 to isolate the heat from the heating element 3. An exhaust hole 8 is provided on the side wall of the heat insulation block 2 to discharge the heat from the heating element 3. The guide plate 9 is located at the exhaust hole 8 and has a guide hole 17. The guide hole 17 is located on the side wall of the heat insulation block 2 facing the base 1, and the heat dissipation airflow discharged from the exhaust hole 8 passes through the guide hole 17 along the guide plate 9. In this embodiment, the guide plate 9 is used at the exhaust hole 8 so that the gas discharged from the exhaust hole 8 is discharged along the guide plate 9, and under the action of the guide hole 17 on the guide plate 9, the discharged gas is moved away from the heat insulation block 2 and the guide plate 9, thereby ensuring that the heat insulation block 2 and the guide plate 9 can be cooled down quickly.

[0018] Specifically, the guide plate 9 includes a first plate 91, a second plate 92 and a third plate 93. The first plate 91 is horizontally arranged, flush with the top surface of the heat insulation block 2 and located on the side wall of the heat insulation block 2, so that it is located above the end of the exhaust hole 8 facing away from the heat dissipation cavity. When the heat dissipation airflow is discharged from the heat dissipation cavity along the exhaust hole and moves upward, the first plate 91 can block the heat dissipation airflow from moving towards the heating element 3.

[0019] One end of the second plate 92 is connected to the first plate 91, and the other end extends toward the base 1. The second plate 92 is set at an angle. The second plate 92 moves away from the side connected to the first plate 91 and away from the heat insulation block 2. At this time, the heat dissipation airflow reaching the second plate 92 can move downward along the inclined surface of the second plate 92.

[0020] The third plate 93 is located on the side of the second plate 92 facing away from the first plate 91, and the third plate 93 is vertically arranged. One end of the third plate 93 is connected to the second plate 92, and the other end extends towards the base 1. The guide hole 17 is opened on the third plate 93, and one end of the guide hole 17 faces the direction of the heat insulation block 2. When the heat dissipation airflow moving downward along the second plate 92 reaches the third plate 93, the heat dissipation airflow can be discharged from the guide hole 17, away from the heat pressure head, and the heat dissipation airflow discharged from the exhaust hole 8 can form a smooth guide path along the first plate 91, the second plate 92 and the third plate 93. With the help of gravity and structural guidance, the heat dissipation airflow can be efficiently and smoothly discharged in a directional manner without affecting the processing of the workpiece.

[0021] As one specific implementation method, refer to Figures 2-7As shown, the support member 4 is disposed between the heating element 3 and the heat insulation block 2 and connected to the top of the heat insulation block 2, for supporting the heating element 3 on the heat insulation block 2. There is a gap between the heating element 3 and the heat insulation block 2, and the gap between the heating element 3 and the heat insulation block 2 forms a heat dissipation cavity. The first heat dissipation hole 5 is disposed on the heat insulation block 2, and one end of it is connected to the heat dissipation cavity. The pipe joint 6 is disposed on the heat insulation block 2 or the base 1, for sequentially passing the heat dissipation airflow into the first heat dissipation hole 5 and the heat dissipation cavity.

[0022] By setting only a support member 4 between the heating element 3 and the heat insulation block 2, a gap is left between the heating element 3 and the heat insulation block 2 to form a heat dissipation cavity. The heat dissipation airflow is introduced into the first heat dissipation hole 5 through the pipe joint 6 and diffuses from the first heat dissipation hole 5 towards the heat dissipation cavity into the heat dissipation cavity. Therefore, heat dissipation can be achieved directly through the contact of the heat dissipation airflow without the need for contact through the channel. This greatly reduces the direct contact area between the heating element 3 and the heat insulation block 2, reduces heat conduction, and increases the heating rate of the heating element 3. At the same time, after the heat dissipation airflow enters the heat dissipation cavity through the first heat dissipation hole 5, it will evenly wash the back of the heating element 3. The heat dissipation airflow and the back of the heating element 3 are in uniform contact, avoiding the heat dissipation airflow being confined in the channel, which significantly improves the heat dissipation efficiency and uniformity.

[0023] Specifically, the pipe connector 6 is set and connected to the side wall of the base 1. The base 1 has a second heat dissipation hole 10, which penetrates the top surface of the base 1. The pipe connector 6 and the second heat dissipation hole 10 are connected. When the base 1 and the heat insulation block 2 are connected, the first heat dissipation hole 5 and the second heat dissipation hole 10 are connected, thus forming a connected heat dissipation channel. After the external heat dissipation airflow is introduced through the pipe connector 6, the heat dissipation airflow can enter the second heat dissipation hole 10 and the first heat dissipation hole 5 in sequence under the action of the pipe connector 6, and enter the heat dissipation cavity from the top of the first heat dissipation hole 5 to dissipate the heat on the top of the heat insulation block 2. By setting the pipe connector 6 on the more stable base 1, the structure of the heat insulation block 2 is simplified, and a reliable and easy-to-assemble air circuit connection can be achieved by connecting the heat insulation block 2 and the base 1.

[0024] As one specific implementation method, refer to Figure 2 and Figure 3 As shown, a heat dissipation groove 7 is provided on the side of the heat insulation block 2 facing the heating element 3. The heat dissipation groove 7 occupies most of the area of ​​the top surface of the heat insulation block 2, leaving only four narrow sides. The support members 4 are all located in the heat dissipation groove 7 and one end is connected to the bottom of the heat dissipation groove 7, and the other end abuts against the heating element 3. The internal space of the heat dissipation groove 7 forms a heat dissipation cavity. The first heat dissipation hole 5 is set at the bottom of the heat dissipation groove 7 and extends towards the bottom of the heat insulation block 2 until it penetrates the bottom of the heat insulation block 2. In addition, there are two sets of exhaust holes 8, each set of exhaust holes 8 has three exhaust holes. The two sets of exhaust holes 8 are respectively located on both sides of the heat dissipation groove 7 and are connected to the heat dissipation cavity inside the heat dissipation groove 7. At this time, the exhaust holes 8 can discharge the heat dissipation airflow in the heat dissipation cavity to the heat insulation block 2.

[0025] Specifically, at least four first heat dissipation holes 5 are provided. In this embodiment, four first heat dissipation holes 5 are provided, but it is not limited to only four. Three, five, etc., can also be provided. The number of first heat dissipation holes 5 is not uniquely limited in this embodiment. The four first heat dissipation holes 5 are arranged in a rectangular pattern on the top surface of the heat insulation block 2 and are evenly distributed. At this time, the four first heat dissipation holes 5 can ensure that the heat dissipation airflow is evenly injected into the heat dissipation cavity from the multiple first heat dissipation holes 5, thereby avoiding local overheating and ensuring the uniformity of heat dissipation. Furthermore, the opening of the first heat dissipation hole 5 facing the heating element 3 is set to be open, which effectively reduces the resistance of the heat dissipation airflow entering the heat dissipation cavity, promotes the diffusion of the heat dissipation airflow around the first heat dissipation hole 5, optimizes the path of the heat dissipation airflow, and is conducive to uniform heat dissipation.

[0026] As one specific implementation method, refer to Figure 1 As shown, the support member 4 includes a first column 41, a second column 42, and a third column 43. Multiple first columns 41 are arranged in a rectangular pattern on the side of the heat insulation block 2 facing the heating element 3. Specifically, four first columns 41 are arranged in a rectangular pattern at the bottom of the heat dissipation groove 7, located at the four corners of the rectangle and surrounding the first heat dissipation hole 5. The second column 42 is located at the center of the side of the heat insulation block 2 facing the heating element 3, thus allowing the second column 42 to be positioned among the multiple first columns 41. Similarly, multiple third columns 43 are also provided. In this embodiment, there are four sets of third columns 43, with two columns in each set. A set of third columns 43 is provided between each pair of adjacent first columns 41, and gaps are left between the third columns 43 and between the third columns 43 and the first columns 41. One end of the first column 41, the second column 42 and the third column 43 are connected to the heat insulation block 2, and the other end extends towards the heating element 3 until the first column 41, the second column 42 and the third column 43 are flush with the opening of the heat dissipation groove 7, so that the first column 41, the second column 42 and the third column 43 can abut against the heating element 3.

[0027] The support member 4, by employing a rectangular arrangement of the first column 41, the third column 43, and the second column 42, can stably support the heating element 3, providing stable load-bearing capacity to the heating element 3. At the same time, it can utilize the gaps between the first column 41, the second column 42, and the third column 43 to guide the heat dissipation airflow to flow in all directions, making the heat dissipation airflow flow more evenly at the bottom of the heating element 3, eliminating heat dissipation dead corners, and improving the overall heat dissipation uniformity.

[0028] In addition, the heating element 3 is detachably connected to the first post 41 and the second post 42. Specifically, bolts are inserted sequentially into the heating element 3 and the first post 41 or the second post 42, and threadedly connected to the first post 41 or the second post 42, thereby achieving detachability, which greatly facilitates the replacement and maintenance of the heating element 3. At the same time, the heating element 3 is connected to the rectangular arrangement of the first post 41 and the second post 42, which improves the stability of the installation of the heating element 3.

[0029] As one specific implementation method, refer to Figure 1 As shown, the heat insulation block 2 has a hollow portion 14 and a protrusion 15 on the side facing the base 1. A gap is left between the hollow portion 14 and the base 1, and the protrusion 15 is attached to the side of the base 1 facing the heat insulation block 2. By providing the protrusion 15 and the hollow portion 14 on the side of the heat insulation block 2 facing the base 1, the heat insulation block 2 and the base 1 only have partial contact at the protrusion 15, while a gap is formed between the hollow portion 14 and the base 1. The contact area between the heat insulation block 2 and the base 1 is greatly reduced, which significantly reduces the heat conduction efficiency from the heat insulation block 2 to the base 1 through the contact surface, improves the heat insulation performance of the heat insulation block 2, effectively reduces heat loss, and protects the base 1 and downstream components.

[0030] The protrusion 15 includes a first component 151 and a second component 152, both of which are integrally formed with the heat insulation block 2. The first component 151 is located at the center of the side of the heat insulation block 2 facing the base 1 and is X-shaped. The second component 152 is located on the periphery of the side of the heat insulation block 2 facing the base 1. The hollow portion 14 is located between the first component 151 and the second component 152. The protrusion 15 further defines the central first component 151 and the peripheral second component 152, so that the central first component 151 provides the main load-bearing capacity, and the peripheral second component 152 provides the edge load-bearing capacity. The first component 151 and the second component 152 together provide the load-bearing capacity for the heat insulation block 2, while the hollow portion 14 located between the first component 151 and the second component 152 minimizes the contact area between the heat insulation block 2 and the base 1, ensuring the stability of the heat insulation block 2 while minimizing the contact area, thus achieving a balance between structural strength and heat insulation effect.

[0031] Furthermore, the second component 152 has four supports located at the four corners of the side of the heat insulation block 2 facing the base 1. This symmetrical distribution ensures that when the heat insulation block 2 is installed on the base 1, the support points are evenly distributed at the four most stable corners. This provides stable support while minimizing the contact area with the base 1, further optimizing the heat insulation effect. Simultaneously, the perforated portion 14 extends into the second component 152 until it penetrates the side wall of the heat insulation block 2. This perforated portion 14 allows some external airflow to pass through, thus more effectively removing locally accumulated heat and further improving the overall heat insulation and heat dissipation performance.

[0032] As another implementation method, refer to Figure 1 As shown, the heat insulation block 2 has through holes 11, and multiple through holes 11 are provided. The multiple through holes 11 are provided one-to-one with multiple first pillars 41 and second pillars 42. The through holes 11 penetrate the top and bottom of the heat insulation block 2, and the first pillars 41 and second pillars 42 are respectively fixed in the corresponding through holes 11. The bolts on the first pillars 41 and second pillars 42 all extend into the through holes 11. Furthermore, the multiple through holes 11 are provided on the first component 151 on the protrusion 15. By providing through holes 11, the actual contact area between the protrusion 15 itself and the base 1 can be directly reduced, thereby further improving the heat insulation performance. At the same time, it can also provide space for the bolts, allowing the bolts to extend to the bottom of the first pillar 41 or the second pillar 42.

[0033] As one specific implementation method, refer to Figure 1 As shown, in order to connect the base 1 and the heat insulation block 2, a first connecting part 12 is integrally formed on the side wall of the base 1 facing the heat insulation block 2, and a second connecting part 13 corresponding to the first connecting part 12 is integrally formed on the side wall of the heat insulation block 2 facing the base 1. There are two of each of the first connecting parts 12 and the second connecting parts 13. The two first connecting parts 12 are symmetrically arranged about the base 1, and the two second connecting parts 13 are symmetrically arranged about the heat insulation block 2. When the base 1 and the heat insulation block 2 are installed, the two first connecting parts 12 and the two second connecting parts 13 are arranged one-to-one, and the corresponding first connecting parts 12 and second connecting parts 13 are detachably connected by bolts. The detachable connection facilitates the installation, disassembly and replacement of the heat insulation block 2, and avoids the connection on the bottom surface of the heat insulation block 2 or the top surface of the base 1. Thus, the connection point is set on the side wall, rather than on the main heat conduction path, which is conducive to maintaining good heat insulation performance.

[0034] Furthermore, the hot press head also includes a first pipe connector 18, which is disposed on the base 1 or the heat insulation block 2. The first pipe connector 18 is connected to the first through hole 11. The bolt 16 has a second through hole 19, which penetrates the top and bottom walls of the bolt 16, thereby connecting the second through hole 19 with the first through hole 11. The first pipe connector 18 is used to sequentially draw air from the first through hole 11 and the second through hole 19, thereby adsorbing the workpiece to be hot-pressed on the heating element 3. At this time, the first through hole 11 not only provides space for the bolt 16 to extend to the bottom of the first column 41 or the second column 42, but also provides a physical channel for vacuum adsorption. The bolt 16 can not only install the heating element 3, but also act as a suction head, providing a physical channel for vacuum adsorption. Therefore, there is no need to set up an additional adsorption structure, which optimizes the structure and reduces the complexity of the structure.

[0035] In this embodiment, the first pipe connector 18 is specifically set on the base 1, and the base 1 has a third through hole 23. The first pipe connector 18 and the third through hole 23 are connected. When the base 1 and the heat insulation block 2 are connected, the third through hole 23 and the first through hole 11 are sealed and connected. The key first pipe connector 18 is integrated and set on the more stable base 1, thereby simplifying the structure of the heat insulation block 2. At this time, the third through hole 23, the first through hole 11 and the second through hole 19 can be completely connected to form a complete adsorption channel for vacuum adsorption of the workpiece to be processed.

[0036] Furthermore, refer to Figure 2 and Figure 4 As shown, the base 1 has a groove 20 corresponding to the third through hole 23. The third through hole 23 is located on the bottom wall of the groove 20. A sealing element 21 is provided in the groove 20. The third through hole 23 passes through the sealing element 21. When the base 1 and the heat insulation block 2 are connected, the third through hole 23 and the first through hole 11 are connected. The sealing element 21 and the heat insulation block 2 abut against each other, thereby ensuring the airtightness of the connection between the third through hole 23 and the first through hole 11 and preventing vacuum leakage. Specifically, the sealing element 21 is set as sealing silicone. In addition, the first column 41 and the second column 42 need to be fixed and sealed to the top of the first through hole 11, thereby avoiding vacuum leakage between the first through hole 11 and the second through hole 19.

[0037] As one specific implementation method, refer to Figure 2 and Figure 3As shown, the heating element 3 has an adsorption groove 22 on the side facing away from the heat insulation block 2. The adsorption groove 22 extends on the heating element 3. One end of the bolt 16 facing away from the first through hole 11 is located in the adsorption groove 22. Specifically, the top of the bolt 16 corresponding to the first column 41 is located in the adsorption groove 22 and does not protrude from the opening of the adsorption groove 22. Since the top of the bolt 16 is located in the adsorption groove 22, the negative pressure of the second through hole 19 directly acts on the space of the adsorption groove 22, thereby forming a negative pressure cavity. When the workpiece is covered by the adsorption groove 22, the negative pressure can be effectively conducted and distributed in the contact area of ​​the workpiece, improving the reliability and uniformity of adsorption.

[0038] Optionally, the bolts are made of materials with a low coefficient of thermal expansion, such as titanium, nickel-based alloys, aluminum, etc.

[0039] When the heating element 3 dissipates heat, the heat dissipation airflow flows into the heat dissipation cavity through the first heat dissipation hole 5, and then exits through the exhaust hole 8. The flow state of the heat dissipation airflow is as follows: Figure 8 As stated above.

[0040] As one specific implementation method, refer to Figures 9-12 As shown, a heat dissipation component 442 is provided inside the heat dissipation cavity; the heat dissipation component 442 can contact or separate from the heating element 3; when the heat dissipation component 442 is in contact with the heating element 3, it can cool the heating element 3; when the heat dissipation component 442 is separated from the heating element 3, the heating element 3 does not cool down. By utilizing the contact between the heat dissipation component 442 and the heating element 3, heat from the heating element 3 is quickly transferred to the heat dissipation component 442 through heat conduction, thereby achieving rapid cooling. When the heat dissipation component 442 is separated from the heating element 3, it does not actively absorb heat from the heating element 3, ensuring stable heat output from the heating element 3 and guaranteeing its normal operation.

[0041] like Figures 9-12 As shown, optionally, the heat sink 442 is a mesh structure formed by hollow rods and rings. By forming a mesh structure, the contact area with the heating element 3 is increased, ensuring rapid heat conduction.

[0042] Optionally, the heat sink 442 is made of metal. The thermal conductivity of metal is utilized to accelerate heat transfer.

[0043] Preferably, the metal material can be one or more of aluminum, iron, alloys, etc., and there is no limitation here.

[0044] like Figure 12As shown, optionally, the sides of the rod and ring are provided with connecting holes 443 that connect the inside and outside of the rod and ring; the inside of the rod and ring is connected to the first heat dissipation hole 5; the heat dissipation airflow can flow from the inside of the rod and ring to the outside through the connecting holes; when the first heat dissipation hole 5 passes cold air into the inside of the rod and ring, the heat dissipation airflow can push the rod and ring to contact the heating element 3. Using the heat dissipation airflow to push the rod and ring to contact the heating element 3 eliminates the need for an external power source, saving energy and preventing damage to the external power source from heat during the heating process. The connecting holes 443 on the sides of the rod and ring connect the inside and outside of the rod and ring, and the inside of the rod and ring is connected to the first heat dissipation hole 5, allowing the heat dissipation airflow to flow from the inside to the outside, accelerating the heat dissipation of the rod and ring, and thus accelerating the heat dissipation of the heating element 3.

[0045] In some embodiments, the heat insulation block 2 further includes a plurality of second through holes for introducing liquid and a liquid guiding channel, the liquid guiding channel being connected to the second through holes and used to guide the liquid evenly to the periphery of the heat insulation block 2.

[0046] In some embodiments, the heat insulation block 2 further includes a plurality of second through-hole groups and a liquid guide channel communicating with each second through-hole group, each second through-hole group including at least one second through-hole.

[0047] Optionally, each liquid guide channel may have a different flow guiding method, and multiple liquid guide channels may be isolated from each other or partially connected.

[0048] In some embodiments, the heat insulation block 2 further includes a plurality of second through hole groups and a liquid guide channel communicating with each second through hole group. Each second through hole group includes at least one second through hole, and each liquid guide channel has a different flow guiding method.

[0049] In some embodiments, the heat dissipation uniformity index requirement of the heating element 3 is obtained. Based on the heat dissipation uniformity index requirement and the degree to which the guiding method of each liquid guiding channel, determined in advance by experiments, improves the heat dissipation uniformity index, one or more target liquid guiding channels are selected to guide the liquid, and the heat dissipation device is controlled to output liquid to the second through hole in the second through hole group connecting all target liquid guiding channels. In this way, the heat dissipation uniformity can be improved.

[0050] In some embodiments, to improve the heat dissipation rate of the heating element 3, the heat insulation block 2 also includes a semiconductor refrigeration module, which absorbs heat from the heating element 3 when energized. The semiconductor refrigeration module achieves cooling through the Peltier effect, featuring no vibration or noise, no refrigerant required, real-time temperature control, and a controllable temperature difference range. When direct current passes through a thermocouple composed of two different semiconductor materials connected in series, heat can be absorbed and released at the two ends of the thermocouple, respectively, thus achieving cooling.

[0051] Optionally, the cooling end of the semiconductor cooling module is located near the side of the heat insulation block 2 closest to the heating element 3. The semiconductor cooling module absorbs heat from the heating element 3 through the heat insulation block 2. In this way, the heat dissipation speed can be accelerated.

[0052] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0053] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A hot press head, characterized in that, include: Base (1); Heating element (3) is used to heat semiconductor workpieces; A heat insulation block (2) is installed between the base (1) and the heating element (3) to isolate the heat of the heating element (3); an exhaust hole (8) is provided on the side wall of the heat insulation block (2) to exhaust the heat of the heating element (3); A guide plate (9) is provided at the exhaust hole (8). A guide hole (17) is provided on the guide plate (9). The guide hole (17) is located on the side wall of the heat insulation block (2) facing the base (1). The heat dissipation airflow discharged from the exhaust hole (8) passes through the guide hole (17) along the guide plate (9).

2. The hot press head as described in claim 1, characterized in that, The guide plate (9) includes: The first plate (91) is located above the end of the exhaust hole (8) facing away from the heat dissipation cavity; The second plate (92) is connected to the first plate (91) on one side and extends towards the base (1) on the other side. The second plate (92) is inclined. The third plate (93) is disposed on the side of the second plate (92) facing away from the first plate (91), with one end connected to the second plate (92) and the other end extending toward the base (1). The guide hole (17) is opened on the third plate (93).

3. The hot press head as described in claim 1, characterized in that, The hot press head also includes: A support member (4) is disposed between the heating element (3) and the heat insulation block (2) for supporting the heating element (3) on the heat insulation block (2), and the gap between the heating element (3) and the heat insulation block (2) forms a heat dissipation cavity; The first heat dissipation hole (5) is provided on the heat insulation block (2), and one end of it is connected to the heat dissipation cavity; The pipe connector (6) is installed on the heat insulation block (2) or the base (1) to sequentially deliver the heat dissipation airflow to the first heat dissipation hole (5) and the heat dissipation cavity.

4. The hot press head as described in claim 3, characterized in that, The heat insulation block (2) has a heat dissipation groove (7) on the side facing the heating element (3). The internal space of the heat dissipation groove (7) forms a heat dissipation cavity. The first heat dissipation hole (5) is located at the bottom of the heat dissipation groove (7). The support member (4) is located in the heat dissipation groove (7) and abuts against the heating element (3). The exhaust hole (8) is connected to the inside of the heat dissipation groove (7) and is used to discharge the heat dissipation airflow in the heat dissipation cavity out of the heat insulation block (2).

5. The hot press head as described in claim 3, characterized in that, The carrier (4) includes: The first column (41) is provided in multiple rectangular arrangement on the side of the heat insulation block (2) facing the heating element (3); The second column (42) is located at the center of the heat insulation block (2) on the side facing the heating element (3) and is located between a plurality of first columns (41), and the first heat dissipation hole (5) is located between the first column (41) and the second column (42); There are multiple third columns (43), and a third column (43) is provided between each two adjacent first columns (41).

6. The hot press head as described in claim 1, characterized in that, The heating element (3) is disposed on the side of the heat insulation block (2) facing away from the base (1). The heating element (3) includes a heat pressing plate (31) and a resistance wire (32) located in the heat pressing plate (31). The resistance wire (32) is arranged in the heat pressing plate (31) along a first direction. The resistance wire (32) extends towards the heat pressing plate (31) in the direction away from the heat insulation block (2) and is embedded in the inner wall of the heat pressing plate (31).

7. The hot press head as described in claim 3, characterized in that, The heating element (3) and the carrier (4) abut against each other and are detachably connected to the carrier (4) by bolts (16).

8. The hot press head as described in claim 7, characterized in that, The heat insulation block (2) has multiple first through holes (11), and the multiple first through holes (11) are correspondingly arranged with the support member (4) connected to the heating element (3). The support member (4) is arranged in the corresponding first through hole (11). The bolt (16) passes through the heating element (3) and the corresponding support member (4) in sequence and is threadedly connected to the support member (4). The bolt (16) extends into the first through hole (11) with one end facing away from the heating element (3).

9. The hot press head as described in claim 8, characterized in that, It also includes a first pipe connector (18), which is connected to the first through hole (11); The bolt (16) has a second through hole (19) connected to the first through hole (11). The first pipe joint (18) is used to sequentially draw air from the first through hole (11) and the second through hole (19), thereby adsorbing the workpiece to be heated on the heating element (3).

10. The hot press head as described in claim 1, characterized in that, The heat insulation block (2) has a hollow part (14) and a protrusion (15) on the side facing the base (1), wherein there is a gap between the hollow part (14) and the base (1), and the protrusion (15) fits into the base (1).

11. The hot press head as described in claim 10, characterized in that, The protrusion (15) includes a first component (41) and a second component (42), wherein the first component (41) is disposed at the center of the heat insulation block (2) on the side facing the base (1), and the second component (42) is disposed on the periphery of the heat insulation block (2) on the side facing the base (1), and the hollow part (14) is located between the first component (41) and the second component (42).

12. A hot pressing device, characterized in that, Includes the hot press head as described in any one of claims 1-11.

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