A middle frame assembly and electronic equipment

Abstract

This disclosure relates to a mid-frame assembly and an electronic device. The mid-frame assembly includes a frame and a sealing bracket. The frame has a first support portion and a second support portion, with the first support portion being higher than the second support portion and serving a supporting function. The sealing bracket, disposed on the second support portion, serves a sealing function. In this mid-frame assembly, by providing the first and second support portions at different heights, and with the sealing bracket disposed on the second support portion near the inner side of the frame, one end of the sealing bracket is flush with the first support portion. In the assembled state, the sealing bracket provides a sealing function, while the relatively higher first support portion provides the supporting function. This weakens the supporting function of the sealing bracket, thereby preventing compression between the sealing bracket and structures directly or indirectly connected to it, which could lead to damage to the structures connected to the sealing bracket. This improves the product reliability of electronic devices using the aforementioned mid-frame assembly.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device technology, and more particularly to a mid-frame assembly and an electronic device. Background Technology

[0002] To achieve the ultimate visual experience and compact design, smartwatches generally adopt ultra-narrow bezels to increase the screen-to-body ratio.

[0003] To achieve a high level of sealing protection in narrow bezel scenarios, an effective sealing structure is needed to ensure good sealing performance while also taking into account impact resistance, thereby improving the reliability of smartwatches. Utility Model Content

[0004] To overcome the problems existing in the related technologies, this disclosure provides a mid-frame component and an electronic device.

[0005] According to a first aspect of this disclosure, a mid-frame component is provided, comprising:

[0006] The frame is provided with a first support part and a second support part. The second support part is disposed on the inner side of the frame relative to the first support part. Along the thickness direction of the frame, the first support part is higher than the second support part.

[0007] A sealing bracket is installed on the second support part, and the first end of the sealing bracket is flush with the first support part. The first support part is used to provide support, and the sealing bracket is used to provide a sealing function.

[0008] Wherein, there is a preset height difference between the first support part and the second support part, the sealing bracket has a first height, and in the flush state, the difference between the first height and the preset height difference falls within a preset threshold range.

[0009] In this embodiment, by setting a first support part and a second support part with different heights, a sealing bracket is provided on the second support part near the inner side of the frame. One end of the sealing bracket is flush with the first support part. In the assembled state, the sealing bracket plays a sealing role, while the first support part with a relatively higher height plays a supporting role. The supporting role of the sealing bracket is weakened, thereby avoiding the compression between the sealing bracket and the structure directly or indirectly connected to it, which would cause damage to the structure connected to the sealing bracket.

[0010] In some possible embodiments, the frame includes at least one stepped structure, the stepped structure being arranged along the circumferential direction of the frame, and the first support portion being disposed on the stepped structure.

[0011] In this embodiment, the first support portion is positioned on a stepped structure arranged along the circumferential direction of the frame, thereby enabling the first support portion to provide more reliable support throughout the circumferential direction and improving support reliability.

[0012] In some possible embodiments, the frame includes multiple stepped structures, which are spaced apart.

[0013] In this embodiment, by setting a multi-segment step structure with intervals, the material used in the step structure can be reduced to a certain extent, thereby reducing cost and weight. Furthermore, the area between adjacent step structures can also be used to achieve a collision avoidance effect.

[0014] In some possible embodiments, the multiple segments of the stepped structure are symmetrically distributed, including an axisymmetric or centrosymmetric distribution.

[0015] In this embodiment, the symmetrical distribution of the stepped structure ensures a uniform distribution of the supporting force, avoiding uneven stress on the supporting structure and affecting its performance.

[0016] In some possible embodiments, the frame includes a step structure that extends along the circumferential direction of the frame.

[0017] In this embodiment, the stepped structure is continuously arranged in the circumferential direction of the frame, which can provide sufficient support in the entire circumferential direction and has a better support effect.

[0018] In some possible embodiments, the frame is provided with an antenna, wherein the antenna is disposed on the stepped structure, and / or the antenna is disposed around the stepped structure, and at least one section of the stepped structure is provided with a clearance portion for preventing the radiation efficiency of the antenna from being affected.

[0019] In this embodiment, since a frame antenna structure is adopted, the antenna may be set on the stepped structure or near the stepped structure. By setting a clearance part in the stepped structure, the clearance part can be used to allow some interference sources that affect the antenna to pass through, so that the interference sources are not too close to the antenna, reducing or avoiding the influence of the interference sources on the antenna and ensuring the antenna radiation efficiency.

[0020] In some possible embodiments, the surface of the first support portion is provided with an isolation layer, the isolation layer comprising at least one of a gasket and an isolation coating.

[0021] In this embodiment, an isolation layer is provided on the first support part. The isolation layer can play an isolation role, preventing the first support part from directly contacting and scratching the cover plate of the electronic device in the assembled state, preventing the first support part from directly contacting the structure connected to it, and preventing damage caused by mutual friction between the structures.

[0022] In some possible embodiments, the sealing bracket extends along the circumferential direction of the frame.

[0023] In this embodiment, the sealing bracket is defined to extend along the circumferential direction of the frame to provide sealing protection for the entire circumference of the frame.

[0024] According to a second aspect of this disclosure, an electronic device is provided, including a cover plate and a mid-frame assembly as described in the first aspect, the cover plate being mounted on one side of the mid-frame assembly, and a first support portion of the mid-frame assembly being connected to the cover plate for supporting the cover plate.

[0025] The sealing bracket provided on the second support part of the middle frame assembly is sealed to the cover plate, and the sealing bracket is used to seal the gap between the cover plate and the second support part.

[0026] In this embodiment, the first support part of the middle frame assembly is connected to the cover plate and is used to support the cover plate. The second support part is used to seal the gap between the cover plate and the first support part. When the cover plate is squeezed by the outside, the pressure is transmitted to the first support part through the cover plate and will not act on the sealing bracket. This can prevent the force from being transmitted to other vulnerable structures of the electronic device between the seals, and effectively prevent damage to the electronic device.

[0027] In some possible embodiments, the sealing bracket is disposed in the space between the cover plate and the frame of the middle frame assembly by vacuum filling.

[0028] In this embodiment, the sealing bracket is formed by vacuum potting. Vacuum potting helps to reduce the black border of the screen and increase the screen ratio. In addition, the sealing bracket formed in this way has a better sealing effect.

[0029] In some possible embodiments, the electronic device includes a flexible circuit board with a bend, and the clearance portion of the mid-frame assembly is used to avoid the bend.

[0030] In this embodiment, since various electrical components are provided on the flexible circuit board, the avoidance part of the middle frame assembly can avoid the bending part of the flexible circuit board, so that the distance between the antenna in the middle frame assembly and the flexible circuit board will not be too close, and the electrical components on the flexible circuit board will not affect the radiation performance of the antenna.

[0031] In some possible embodiments, the cover plate is in contact with the isolation layer on the surface of the first support portion.

[0032] In this embodiment, an isolation layer is provided between the cover plate and the first support portion to avoid direct contact between the cover plate and the first support portion and to prevent the first support portion from scratching the cover plate.

[0033] In some possible embodiments, the electronic device includes a smartwatch or a smart bracelet.

[0034] In this embodiment, a mid-frame component is provided on the smartwatch and smart bracelet, which can effectively improve the reliability and sealing performance of the smartwatch and smart bracelet.

[0035] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0036] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0037] Figure 1 This is a schematic diagram illustrating a mid-frame component according to an exemplary embodiment of the present disclosure.

[0038] Figure 2 yes Figure 1 Cross-sectional view along the A-A' direction.

[0039] Figure 3 This is a top view of a mid-frame component according to an exemplary embodiment of the present disclosure.

[0040] Figure 4 This is a top view of a mid-frame component according to another exemplary embodiment of the present disclosure.

[0041] Figure 5 This is a top view of a mid-frame component according to yet another exemplary embodiment of this disclosure.

[0042] Figure 6 This is a top view of a mid-frame component according to yet another exemplary embodiment of this disclosure.

[0043] Figure 7 This is a schematic diagram of a frame according to an exemplary embodiment of the present disclosure.

[0044] Figure 8 This is a top view of an electronic device according to an exemplary embodiment of the present disclosure.

[0045] Figure 9 yes Figure 8 Cross-sectional view along the B-B' direction.

[0046] Figure 10 yes Figure 8 Cross-sectional view along the C-C' direction. Detailed Implementation

[0047] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0048] To address the problems existing in related technologies, this disclosure provides a mid-frame assembly and an electronic device. The mid-frame assembly includes a frame and a sealing bracket. The frame has a first support portion and a second support portion, with the first support portion being higher than the second support portion and serving a supporting function. The sealing bracket, disposed on the second support portion, serves a sealing function. In this embodiment, the mid-frame assembly, by providing a first support portion and a second support portion of different heights, has a sealing bracket disposed on the second support portion near the inner side of the frame. One end of the sealing bracket is flush with the first support portion. In the assembled state, the sealing bracket provides a sealing function, while the relatively higher first support portion provides the supporting function. This weakens the supporting function of the sealing bracket, thereby preventing compression between the sealing bracket and structures directly or indirectly connected to it, which could lead to damage to the structures connected to the sealing bracket. This improves the product reliability of the electronic device using the aforementioned mid-frame assembly.

[0049] According to an exemplary embodiment, such as Figure 1 As shown, this embodiment provides a mid-frame assembly 10, which can be applied to electronic devices to support and protect other components of the electronic devices.

[0050] like Figure 1 As shown, the mid-frame component 10 includes a frame 11, which is a supporting structure in the mid-frame component 10. The outer contour shape of the frame 11 includes, but is not limited to, rectangle, circle and its variations (such as rounded rectangle, ellipse), etc., without further limitation.

[0051] See Figure 1 and Figure 2 The frame 11 is provided with a first support portion 11a and a second support portion 11b. The second support portion 11b is closer to the inner side of the frame 11 than the first support portion 11a, and the first support portion 11a is along the thickness direction of the frame 11. Figure 2 The z-direction shown is higher than the second support 11b.

[0052] In one example, see Figure 1The frame 11 includes a support plate and a frame. The frame is arranged around the outer periphery of the support plate. The first support part 11a, which is relatively high, can be formed by part of the frame structure and has the function of installing and supporting exposed components such as screen cover and back cover in electronic devices. The second support part 11b, which is relatively low, can be formed by part of the support plate structure and has the function of installing and supporting internal components such as motherboard and battery.

[0053] See Figure 1 and Figure 2 The middle frame assembly 10 also includes a sealing bracket 12, which is mounted on the second support portion 11b of the frame 11 along the thickness direction of the frame 11. Figure 2 As shown in the z-direction, the first end of the sealing bracket 12 is flush with the first support portion 11a, so that the sealing bracket 12 can cooperate with the frame 11 or other components of the electronic device (such as the screen cover 20, back cover) to provide a seal, preventing external moisture and dust from entering the device. In one example, see [reference needed]. Figure 1 The sealing bracket 12 extends along the circumferential direction of the frame 11 to provide a circumferential seal for the entire circumference of the frame 11.

[0054] Among them, see Figure 2 There is a preset height difference between the first support part 11a and the second support part 11b, and the sealing bracket 12 has a first height ( Figure 2 (As shown in the z-direction), the difference between the first height and the preset height difference falls within a preset threshold range. In this embodiment, by setting a difference between the first height and the preset height difference, and ensuring that the difference falls within a preset range, the influence of manufacturing tolerances can be reduced, and the influence of other film layers on the first support 11a and the second support 11b can be reduced. The preset threshold range can be 0.6mm-1mm. The magnitude of the difference between the first height and the preset height difference is determined based on the thickness of the electronic device's display screen. Typically, to ensure a sealing effect, the first height can be slightly smaller than the preset height difference. In one example, when the display screen is thick, to allow sufficient redundancy during installation, the difference between the first height and the preset height difference can be set to 1mm to ensure sufficient space for sealing even when the display screen is thick. In another example, when the display screen is thin, to avoid excessive space between the edge of the display screen and the frame 11, making sealing difficult, the difference between the first height and the preset height difference can be set to 0.6mm to ensure a good sealing effect. Of course, it is understandable that the difference between the first height and the preset height can be adjusted according to the thickness of the electronic device's display screen. For example, the difference between the first height and the preset height can also be 0.7±0.05mm, 0.8mm, 0.9mm, 0.95mm, etc.

[0055] In one example, see Figure 2 When a first preset membrane layer (such as waterproof adhesive 13) is provided between the sealing bracket 12 and the second support part 11b, the difference between the first height and the preset height can be set to a negative value according to the thickness of the waterproof adhesive 13, so that the first end of the sealing bracket 12 is flush with the first support part 11a.

[0056] In another example, when a second preset film layer (such as an isolation layer, which will be described in detail later) is provided between the first support 11a and other components of the electronic device, the difference between the first height and the preset height can be set to a positive value so that the first end of the sealing bracket 12 is flush with the first support 11a.

[0057] In another example, when a first preset film layer is provided between the sealing bracket 12 and the second support portion 11b, and a second preset film layer is provided between the first support portion 11a and other components of the electronic device, the difference can be adaptively adjusted according to the thickness difference between the first preset film layer and the second preset film layer so that the first end of the sealing bracket 12 is flush with the first support portion 11a.

[0058] In this embodiment, by setting a first support part and a second support part with different heights, a sealing bracket is provided on the second support part near the inner side of the frame. One end of the sealing bracket is flush with the first support part. In the assembled state, the sealing bracket plays a sealing role, while the first support part with a relatively higher height plays a supporting role. The supporting role of the sealing bracket is weakened, thereby avoiding the compression between the sealing bracket and the structure directly or indirectly connected to it, which would cause damage to the structure connected to the sealing bracket, thereby improving the product reliability of electronic devices using the above-mentioned mid-frame assembly.

[0059] In one exemplary embodiment, such as Figure 1 and Figure 2 As shown, this embodiment provides a middle frame assembly 10, which includes a frame body 11 and a sealing bracket 12. The frame body 11 is provided with a first support portion 11a and a second support portion 11b. The first support portion 11a is higher than the second support portion 11b and is used to provide support. The sealing bracket 12 provided on the second support portion 11b is used to provide a sealing function.

[0060] Among them, such as Figures 3 to 6 As shown, the frame 11 includes at least one stepped structure 11c, which is arranged along the circumferential direction of the frame 11. A first support portion 11a is disposed on the stepped structure 11c. (See reference...) Figure 7Each step structure 11c includes a first bearing surface 111c and a second bearing surface 112c, and a step elevation 113c for connecting the first bearing surface 111c and the second bearing surface 112c. The height of the first bearing surface 111c is lower than that of the second bearing surface 112c. The first bearing surface 111c is closer to the inner side of the frame 11 than the second bearing surface 112c. The first bearing surface 111c of the step structure 11c forms the top surface of the first support part 11a for supporting the preset components of the electronic device (such as the display cover and battery cover). The step elevation 113c of the step structure 11c is used to limit the preset components to avoid the preset components from being offset in the horizontal direction.

[0061] This embodiment uses the circular border of frame 11 as an example to illustrate the implementation of the step structure 11c in frame 11.

[0062] In some embodiments, see Figure 3 and Figure 4 The frame 11 includes a stepped structure 11c. When only one stepped structure 11c is provided, it is configured with a large central angle to distribute the forces on pre-installed components in the electronic device, thereby providing reliable support. See [reference needed] for an example. Figure 3 The stepped structure 11c is configured with a 360° central angle. See another example. Figure 4 The step structure 11c is set with a central angle greater than 270° and less than 360°. In this embodiment, the step structure is continuously set in the circumferential direction of the frame, which can provide sufficient support in the entire circumferential direction and has a better support effect.

[0063] In other embodiments, see Figures 5 to 7 The frame 11 is provided with multiple stepped structures 11c, which are spaced apart. The central angles of different stepped structures 11c can be the same or different. In this embodiment, the spaced stepped structures 11c can provide reliable support when the sum of the central angles of the multiple stepped structures 11c is small, thereby reducing the material used in the frame 11 and reducing cost and weight. Furthermore, the space between adjacent stepped structures 11c can avoid some components of the electronic device. For example, it can keep the frame antenna away from the interference source, or it can optimize the internal layout of the device to set up a larger sealing bracket 12 to enhance the sealing performance.

[0064] Among them, such as Figures 5 to 7As shown, when the frame 11 is provided with multiple stepped structures 11c, the multiple stepped structures 11c are symmetrically distributed. This embodiment does not impose excessive limitations on the number of stepped structures 11c; two, three, four, or more stepped structures 11c are all acceptable. In this embodiment, the symmetrical distribution of the stepped structures 11c ensures a uniform distribution of supporting force, avoiding uneven stress on the supporting structure and thus preventing it from affecting the supporting performance.

[0065] In some embodiments, such as Figure 5 As shown, the multi-segment stepped structure 11c is symmetrically distributed, and the axis of symmetry can be perpendicular to the thickness direction of the frame 11. Figure 2 In the multi-segment stepped structure 11c that is perpendicular to any straight line in the z-direction shown, the shapes of the multiple stepped structures 11c located on the same side of the axis of symmetry can be the same or different.

[0066] In other embodiments, let Figure 6 As shown, the multi-segment stepped structure 11c is symmetrically distributed at its center (the geometric center of the frame 11). The multi-segment stepped structure 11c can be formed by arranging the multi-segment stepped structure 11c in a ring array around the central axis of the frame 11.

[0067] In one exemplary embodiment, such as Figure 1 As shown, this embodiment provides a middle frame assembly 10, which includes a frame body 11 and a sealing bracket 12. The frame body 11 is provided with a first support portion 11a and a second support portion 11b. The first support portion 11a is higher than the second support portion 11b and is used to provide support. The sealing bracket 12 provided on the second support portion 11b is used to provide a sealing function.

[0068] The mid-frame assembly 10 provided in this embodiment may include various components of the mid-frame assembly 10 provided in any of the foregoing embodiments. For example, the frame 11 includes at least one stepped structure 11c, the stepped structure 11c is arranged along the circumferential direction of the frame 11, and the first support portion 11a is disposed on the stepped structure 11c.

[0069] like Figure 1 As shown, the frame 11 is equipped with an antenna (not shown in the attached diagram). When the frame 11 is made of a conductive material, it can serve as the radiator of the antenna; when the frame 11 is made of a non-conductive material, it can serve as the antenna substrate, and the radiator of the antenna is formed on the frame 11 using laser-direct-structuring (LDS) technology. It is understood that when the antenna is placed in the frame 11, it does not occupy the space defined by the frame 11, thus freeing up more space for other components of the electronic device (such as batteries, motherboards, etc.), facilitating optimized device layout. Furthermore, placing the antenna in the frame 11 also keeps it away from other components of the electronic device, reducing electromagnetic interference and improving signal quality.

[0070] In some embodiments (not shown in the figures), at least one section of the stepped structure is provided with a clearance portion, which keeps the antenna on the stepped structure away from a preset component of the electronic device, thereby reducing or avoiding the impact on the antenna's radiation efficiency. In this embodiment, when the antenna is disposed on the stepped structure, the area in the stepped structure where the antenna is disposed can be recessed (the recessed direction faces outwards from the frame) to allow the antenna to be moved away from the preset component.

[0071] In other embodiments, such as Figure 7 As shown, along the circumferential direction of the frame 11, a clearance portion 11d is formed between adjacent step structures 11c, which allows for adaptive setting of the position of the step structure 11c so that the antenna is set between two adjacent step structures 11c, that is, the antenna is set around the step structure 11c.

[0072] In some other embodiments (not shown in the figures), when the length of the antenna is greater than the distance between two adjacent stepped structures, a recess needs to be provided in the stepped structure. The recess of the stepped structure and the space between the adjacent stepped structures form a clearance part so that each part of the antenna can be less affected by the preset components.

[0073] Among them, such as Figure 1 As shown, the mid-frame assembly 10 also includes an isolation layer (not shown in the attached figure), which is disposed on the surface of the first support portion 11a of the frame 11. Since the frame 11 is generally made of metal, it has good strength and hardness. The frame 11 is used to support structures such as the cover plate 20. The edge of the cover plate 20 is coated with an ink layer to shield the internal structure of the electronic device. If the metal frame 11 is in direct contact with the cover plate of the electronic device for a long time, the frame 11 may scratch off the ink layer on the cover plate 20, affecting the overall aesthetics. The isolation layer can be, for example, a gasket or an isolation coating. The gasket material can be, for example, PET (polyethylene terephthalate). PET gaskets have flexibility and elasticity, and can absorb and disperse the stress generated by drops or compression. The isolation coating can be, for example, a coating with an isolation function or a certain protective function, such as a screen-printed ink coating.

[0074] According to an exemplary embodiment of this disclosure, such as Figures 8 to 10 As shown, this embodiment provides an electronic device, which includes a cover 20. The electronic device is a smart wearable device such as a smartwatch or smart bracelet. The cover 20 of the electronic device includes, but is not limited to, a screen protection cover and a battery protection cover (i.e., a back cover).

[0075] like Figure 8As shown, the electronic device also includes a mid-frame assembly 10 provided in any of the foregoing embodiments of this disclosure. A cover plate 20 of the electronic device is disposed on one side of the mid-frame assembly 10. A first support portion 11a of the mid-frame assembly 10 is connected to the cover plate 20 for mounting and supporting the cover plate 20. A sealing bracket 12 is provided on the second support portion 11b of the mid-frame assembly 10, extending along the thickness direction of the mid-frame assembly 10. Figure 9 As shown in the z direction, the first end of the sealing bracket 12 is flush with the first support portion 11a, so that the sealing bracket 12 can seal the gap between the cover plate 20 and the second support portion 11b.

[0076] In the electronic device provided in this embodiment, the first support part of the middle frame assembly is connected to the cover plate and is used to support the cover plate. The second support part is used to seal the gap between the cover plate and the first support part. When the cover plate is squeezed by the outside, the pressure is transmitted to the first support part through the cover plate and will not act on the sealing bracket. This can prevent the force from being transmitted to other vulnerable structures of the electronic device between the seals, and effectively prevent the electronic device from being damaged.

[0077] In some embodiments, such as Figure 9 As shown, the sealing bracket 12 is disposed in the space between the cover plate 20 and the frame 11 of the middle frame assembly 10 through vacuum encapsulation. Vacuum encapsulation is a technique that uses a vacuum environment to encapsulate and seal electronic devices. This vacuum environment eliminates air bubbles and allows the encapsulating material to fully penetrate the tiny pores of the electronic device, forming a defect-free sealing bracket 12. Vacuum encapsulation offers advantages such as strong sealing performance and reduced screen bezel size. In one example, the bezel size of the cover plate 20 can be reduced by 0.7 mm after vacuum encapsulation.

[0078] In related technologies, electronic devices are sealed using vacuum potting processes. However, the resulting sealing support not only seals the device but also supports the cover plate. Since the main component of the sealing support is silicone, it retains some elasticity even after hardening. When the cover plate is subjected to external impact, the cover plate transmits the force to the sealing support, causing it to compress. This compression then squeezes the display film layer. Weak layers in the display film (such as polarizers) are prone to cracking under pressure. Furthermore, the cover plate also squeezes the waterproof adhesive through the sealing support, leading to deformation and failure of the waterproof adhesive. Therefore, electronic devices using vacuum potting processes exhibit poor reliability, negatively impacting the user experience.

[0079] In the electronic device provided in this embodiment, the first support part 11a of the middle frame assembly 10 provides support for the cover plate 20. Since the first support part 11a is a rigid structure, even if the cover plate 20 is subjected to external force impact, it will not shift towards the inside of the electronic device and squeeze the display film layer 30, the sealing bracket 12 and the waterproof adhesive 13, thereby avoiding the situation where the display film layer 30 is broken and the waterproof adhesive 13 is deformed and fails, thus improving product reliability and production line yield.

[0080] Among them, such as Figure 10 As shown, the electronic device also includes a flexible circuit board, which includes a bending portion 40. The bending portion 40 can, for example, bend the flexible circuit board into a U-shape to connect stacked electronic components, such as connecting the display panel of the display film layer 30 to the motherboard. See reference. Figure 10 When the antenna is installed in the clearance portion 11d of the middle frame assembly 10, the clearance portion 11d can be moved away from the bending portion 40 of the flexible circuit board, thereby reducing or avoiding interference from the electrical components on the flexible circuit board to the antenna on the frame 11, so as to ensure the radiation efficiency of the antenna.

[0081] Among them, such as Figure 9 As shown, the cover plate 20 is in contact with an isolation layer disposed on the surface of the first support portion 11a. Screen printing ink is disposed on the side of the cover plate 20 facing the first support portion 11a, and the isolation layer reduces the wear caused by direct contact between the screen printing ink on the non-display side of the cover plate 20 and the first support portion 11a.

[0082] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0083] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A mid-frame component, characterized in that, include: The frame is provided with a first support part and a second support part. The second support part is disposed on the inner side of the frame relative to the first support part. Along the thickness direction of the frame, the first support part is higher than the second support part. A sealing bracket is installed on the second support part, and the first end of the sealing bracket is flush with the first support part. The first support part is used to provide support, and the sealing bracket is used to provide a sealing function. Wherein, there is a preset height difference between the first support part and the second support part, the sealing bracket has a first height, and in the flush state, the difference between the first height and the preset height difference falls within a preset threshold range.

2. The mid-frame assembly according to claim 1, characterized in that, The frame includes at least one stepped structure, which is arranged along the circumferential direction of the frame, and the first support is disposed on the stepped structure.

3. The mid-frame assembly according to claim 2, characterized in that, The frame includes multiple stepped structures, which are spaced apart.

4. The mid-frame assembly according to claim 3, characterized in that, The stepped structure is symmetrically distributed in multiple segments, and the symmetrical distribution can be either axisymmetric or centrosymmetric.

5. The mid-frame assembly according to claim 2, characterized in that, The frame includes a stepped structure that extends along the circumferential direction of the frame.

6. The mid-frame assembly according to any one of claims 2 to 5, characterized in that, The frame is equipped with an antenna, wherein... The antenna is mounted on the stepped structure. And / or, The antenna is disposed around the stepped structure, and at least one section of the stepped structure is provided with a clearance portion, which is used to avoid affecting the radiation efficiency of the antenna.

7. The mid-frame assembly according to any one of claims 1 to 5, characterized in that, The surface of the first support portion is provided with an isolation layer, which includes at least one of a gasket and an isolation coating.

8. The mid-frame assembly according to any one of claims 1 to 5, characterized in that, The sealing bracket extends along the circumferential direction of the frame.

9. An electronic device, characterized in that, The device includes a cover plate and a mid-frame assembly as described in any one of claims 1 to 8, wherein the cover plate is mounted on one side of the mid-frame assembly, and a first support portion of the mid-frame assembly is connected to the cover plate for supporting the cover plate. The sealing bracket provided on the second support part of the middle frame assembly is sealed to the cover plate, and the sealing bracket is used to seal the gap between the cover plate and the second support part.

10. The electronic device according to claim 9, characterized in that, The sealing bracket is installed in the space between the cover plate and the frame of the middle frame assembly by vacuum filling.

11. The electronic device according to claim 9, characterized in that, The electronic device includes a flexible circuit board, the flexible circuit board includes a bending portion, and the avoidance portion of the mid-frame assembly is used to avoid the bending portion.

12. The electronic device according to claim 9, characterized in that, The cover plate is in contact with the isolation layer on the surface of the first support portion.

13. The electronic device according to claim 9, characterized in that, The electronic devices include smartwatches and smart bracelets.

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