A type of workwear

Abstract

This invention provides a tooling comprising a handle, an adsorption section, a first locking member, and a second locking member. The adsorption section includes multiple sub-adsorption sections arranged sequentially and rotatably connected to each other. The first sub-adsorption section is located at one end of the adsorption section and is rotatably connected to the handle. The rotation axis of the sub-adsorption section extends along a first direction. Each sub-adsorption section includes a suction cup with an adsorption surface perpendicular to the first direction. The adsorption surfaces of the suction cups of all sub-adsorption sections are coplanar. The first locking member locks the handle and the first sub-adsorption section or releases the lock on the handle and the first sub-adsorption section. The second locking member locks two adjacent sub-adsorption sections or releases the lock on two adjacent sub-adsorption sections. This tooling can be used to manually remove wafers when their position is abnormal in chip manufacturing equipment, and the shape of the adsorption section can be adjusted according to the type of chip manufacturing equipment to adapt to various types of chip manufacturing equipment.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, and specifically relates to a tooling. Background Technology

[0002] The chip manufacturing industry has a high level of automation, but when wafer positioning abnormalities occur in chip manufacturing equipment, operators need to manually remove the wafers using tools. Existing tools for manually removing wafers have a simple structure and are not suitable for different types of chip manufacturing equipment. Utility Model Content

[0003] The purpose of this invention is to provide a tooling that can be used to manually remove wafers from various types of chip manufacturing equipment.

[0004] To achieve the above objectives, this utility model provides a tooling, comprising:

[0005] handle;

[0006] The adsorption unit includes multiple sub-adsorption units arranged sequentially, with adjacent sub-adsorption units rotatably connected. The sub-adsorption unit located at one end of the adsorption unit is a first sub-adsorption unit, which is rotatably connected to the handle. The rotation axes of all sub-adsorption units extend along a first direction. Each sub-adsorption unit includes a suction cup with an adsorption surface perpendicular to the first direction. The adsorption surfaces of the suction cups in all sub-adsorption units are coplanar.

[0007] A first locking element is used to selectively lock the handle and the first sub-adhesive part so that the handle and the first sub-adhesive part remain relatively stationary, or to release the lock on the handle and the first sub-adhesive part to allow the handle and the first sub-adhesive part to rotate relative to each other; and

[0008] The second locking element is used to selectively lock two adjacent sub-adsorption portions so that the two adjacent sub-adsorption portions remain relatively stationary, or to release the lock on the two adjacent sub-adsorption portions so that the two adjacent sub-adsorption portions can rotate relative to each other.

[0009] Optionally, two adjacent sub-adsorption sections can be detachably connected.

[0010] Optionally, two adjacent sub-adsorption units are rotatably and detachably connected by the second locking member.

[0011] Optionally, the sub-adsorption part further includes a substrate, a first lug, and a second lug; the substrate has a first end and a second end opposite to each other in a second direction, the second direction being perpendicular to the first direction; the first lug is disposed at the first end of the substrate and located in the middle of the substrate in the first direction, and the first lug has a first connecting hole extending through along the first direction; there are two second lugs, both of which are disposed at the second end of the substrate and are spaced apart in the first direction, and the second lug has a second connecting hole extending through along the first direction; the suction cup is disposed on the substrate, and the surface of the suction cup away from the substrate is the adsorption surface;

[0012] The first lug of one of two adjacent sub-adsorption parts is at least partially inserted between the two second lugs of the other; the second locking member is a pin, which is used to pass through the first connecting hole and the second connecting hole.

[0013] Optionally, the handle is provided with a third connecting hole, and the handle is partially inserted between the two second lugs of the first sub-adsorption part;

[0014] The first locking member passes through the third connecting hole and the second connecting hole so that the handle is connected to the first sub-locking member; when the first locking member releases the lock on the handle and the first sub-adsorption part, the first sub-adsorption part and the handle can rotate relative to each other around the first locking member.

[0015] Optionally, the first locking element is a pin.

[0016] Optionally, the tooling includes two adsorption parts, and the connection points of the two adsorption parts and the handle are symmetrical about a preset plane. The preset plane passes through the axis of the handle and is perpendicular to the line connecting the connection points of the two adsorption parts and the handle.

[0017] Optionally, the tooling also includes an air pump, which is disposed within the handle;

[0018] The suction cups of all the sub-adsorption units are connected to the air pump.

[0019] Optionally, the air pump is a blow-suction dual-purpose air pump.

[0020] Optionally, the air pump includes a vortex air pump.

[0021] Compared with the prior art, the tooling of this utility model has the following advantages:

[0022] The aforementioned fixture includes a handle, an adsorption part, a first locking member, and a second locking member; the adsorption part includes multiple sub-adsorption parts, which are arranged sequentially and adjacent sub-adsorption parts are rotatably connected; one of the sub-adsorption parts located at one end of the adsorption part is a first sub-adsorption part, which is rotatably connected to the handle; the rotation axes of all the sub-adsorption parts extend along a first direction; each sub-adsorption part includes a suction cup with an adsorption surface perpendicular to the first direction; the adsorption surfaces of the suction cups of all the sub-adsorption parts are coplanar; the first locking member is used to selectively lock the handle to the first sub-adsorption part or release the handle. The first locking member locks the handle and the first sub-adsorption part, preventing relative rotation between them. When the first locking member locks the handle and the first sub-adsorption part, relative rotation is allowed. The second locking member selectively locks or unlocks two adjacent sub-adsorption parts. When the second locking member locks two adjacent sub-adsorption parts, relative rotation is prevented. When the second locking member unlocks two adjacent sub-adsorption parts, relative rotation is allowed. The fixture can be used to manually remove wafers from the chip manufacturing equipment, and the shape of the adsorption part can be adjusted according to the type of chip manufacturing equipment to adapt to various types of chip manufacturing equipment. Attached Figure Description

[0023] The accompanying drawings are provided to better understand this utility model and do not constitute an undue limitation thereof. Wherein:

[0024] Figure 1 This is a schematic diagram of the tooling provided according to an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of the sub-adsorption section of the tooling provided according to an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the sub-adsorption section of the tooling provided according to an embodiment of the present invention. Figure 3 and Figure 2 The observation positions are different, and the first lug and the second lug are partially cut in the figure to show the first connecting hole and the second connecting hole;

[0027] Figure 4 This is a schematic diagram showing the connection relationship between two adjacent sub-adsorption parts of the tooling provided according to an embodiment of the present invention;

[0028] Figure 5This is a partial schematic diagram of the first type of chip manufacturing equipment in the prior art;

[0029] Figure 6 This is a schematic diagram of the application scenario of the tooling provided by this utility model according to an embodiment. The chip manufacturing equipment in the diagram is the first type of chip manufacturing equipment.

[0030] Figure 7 This is a partial structural diagram of the second type of chip manufacturing equipment in the prior art;

[0031] Figure 8 This is a schematic diagram of the application scenario of the tooling provided by this utility model according to an embodiment. The chip manufacturing equipment in the figure is a second type of chip manufacturing equipment, and the tooling is located outside the circle where the three telescopic pillars are located.

[0032] Figure 9 This is a schematic diagram of the application scenario of the tooling provided by this utility model according to an embodiment. The chip manufacturing equipment in the figure is a second type of chip manufacturing equipment, and each adsorption part is located on the inner side of the circle where the three telescopic pillars are located.

[0033] Figure 10 It is the third type of chip manufacturing equipment in existing technology;

[0034] Figure 11 This is a schematic diagram of the third type of chip manufacturing equipment in the prior art carrying a wafer;

[0035] Figure 12 This is a schematic diagram of the application scenario of the tooling provided by this utility model according to an embodiment. The chip manufacturing equipment in the diagram is a third type of chip manufacturing equipment.

[0036] Figure 13 This is a schematic diagram of the fourth type of chip manufacturing equipment in the prior art carrying a wafer;

[0037] Figure 14 This is a schematic diagram of the application scenario of the tooling provided by this utility model according to an embodiment. The chip manufacturing equipment in the diagram is the fourth type of chip manufacturing equipment.

[0038] [The reference numerals in the attached drawings are explained as follows]: 10-tooling, 11-handle, 12-adsorption part, 1201-first segment, 1202-second segment, 1203-third segment, 1204-fourth segment, 1205-fifth segment, 1205-sixth segment, 1207-seventh segment, 121-sub-adsorption part, 121a-first sub-adsorption part, 1211-suction cup, 1212-substrate, 1213-first lug, 1214-second lug, 1215-container 1216-First connecting hole, 1217-Second connecting hole, 1218-Pipe, 1219-Second vent, 13-First locking element, 14-Second locking element, 20-Wafer, 31-First adsorption chuck, 311-Support ring, 312-First adsorption antenna, 313-Second adsorption antenna, 32-Second adsorption chuck, 321-Adsorption chuck body, 322-Telescopic support column, 33-Third adsorption chuck, 331-Groove, 34-Fourth adsorption chuck. Detailed Implementation

[0039] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show components related to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.

[0040] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of this utility model must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, provided it is feasible, those skilled in the art can selectively implement some or all technical features in any embodiment, or selectively implement a combination of some or all technical features in multiple embodiments, based on the disclosure of this utility model and depending on design specifications or implementation requirements, thereby increasing the flexibility in implementing this utility model.

[0041] As used herein, the singular forms “a,” “an,” and “the” include plural objects, and the plural form “a plurality” includes two or more objects, unless otherwise expressly indicated. As used herein, the term “or” is generally used to include the meaning of “and / or,” unless otherwise expressly indicated, and the terms “install,” “connect,” and “link” should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Connections can be mechanical or electrical. Connections can be direct or indirect through an intermediate medium, and can represent internal communication between two elements or an interaction between two elements. Relational terms such as “first,” “second,” etc., are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate relative importance or implicitly specify the number of indicated technical features. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] The purpose of this invention is to provide a tooling that can be used to manually remove wafers from chip manufacturing equipment, and the tooling can be adapted to various types of chip manufacturing equipment, thus having strong universal applicability.

[0043] To make the objectives, advantages, and features of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to conveniently and clearly illustrate the objectives of the embodiments of this utility model. The same or similar reference numerals in the drawings represent the same or similar parts.

[0044] Figure 1 The diagram shows a structural schematic of the tooling 10 provided in some embodiments of the present invention. For example... Figure 1 As shown, the tooling 10 includes a handle 11 and an adsorption part 12 (such as...). Figure 1 (The part highlighted in red in the middle is shown), first locking member 13 and second locking member 14.

[0045] The adsorption unit 12 includes a plurality of sub-adsorption units 121, which are arranged sequentially. Adjacent sub-adsorption units 121 are rotatably connected, and one sub-adsorption unit 121 located at one end of the adsorption unit 12 is rotatably connected to the handle 11. The rotation axes of all sub-adsorption units 121 extend along a first direction. Each sub-adsorption unit 121 includes a suction cup 1211 with an adsorption surface perpendicular to the first direction, and the adsorption surfaces of the suction cups 1211 of all sub-adsorption units 121 are coplanar.

[0046] For ease of description, the sub-adsorption part 121 connected to the handle 11 will be referred to as the first sub-adsorption part 121a in the following text.

[0047] The first locking member 13 is disposed between the first sub-adsorption part 121a and the handle 11, and is configured to selectively lock the handle 11 and the first sub-adsorption part 121a or unlock the handle 11 and the first sub-adsorption part 121a. When the first locking member 13 locks the first sub-adsorption part 121a and the handle 11, it prevents the first sub-adsorption part 121a and the handle 11 from rotating relative to each other, thereby keeping the relative orientation between the first sub-adsorption part 121a and the handle 11 unchanged; when the first locking member 13 unlocks the first sub-adsorption part 121a and the handle 11, it allows the first sub-adsorption part 121a and the handle 11 to rotate relative to each other, thereby allowing the relative orientation between the first sub-adsorption part 121a and the handle 11 to change.

[0048] The second locking member 14 is disposed between two adjacent sub-adsorption portions 121 and configured to selectively lock or unlock the two adjacent sub-adsorption portions 121. When the second locking member 14 locks the two adjacent sub-adsorption portions 121, it prevents the two adjacent sub-adsorption portions 121 from rotating relative to each other, thereby keeping the relative orientation between the two adjacent sub-adsorption portions 121 unchanged; when the second locking member 14 unlocks the two adjacent sub-adsorption portions 121, it allows the two adjacent sub-adsorption portions 121 to rotate relative to each other, thereby allowing the relative orientation between the two adjacent sub-adsorption portions 121 to change.

[0049] The tooling 10 can be used to manually place the wafer 20 (e.g., Figure 6 , Figure 8 , Figure 9 , Figure 11 , Figure 12 ,and Figure 14(As shown) Removed from the chip manufacturing equipment. In use, the shape of the adsorption part 12 can be varied according to the type of chip manufacturing equipment so that the tooling 10 can be adapted to various types of chip manufacturing equipment.

[0050] An optional operation for manually removing the wafer 20 from the chip manufacturing equipment using the tooling 10 is roughly as follows:

[0051] Step S1: Release the first locking member 13 from locking the first sub-adsorption part 121a and the handle 11, and release each of the second locking members 14 from locking the corresponding two adjacent sub-adsorption parts 121.

[0052] Step S2: Based on the characteristics of the chip manufacturing equipment, control the rotation of each of the sub-adsorption parts 121 to adjust the shape of the adsorption part 12 to match the chip manufacturing equipment.

[0053] Step S3: Lock the first sub-adsorption part 121a and the handle 11 with the first locking member 13, and lock the corresponding two adjacent sub-adsorption parts 121 with each of the second locking members 14, so that the shape of the adsorption part 12 remains fixed.

[0054] Step S4: The operator holds the handle 11 and uses the adsorption part 12 to adsorb the wafer 20 on the chip manufacturing equipment. In this step, the adsorption surface of the suction cup 1211 of each of the sub-adsorption parts 121 of the adsorption part 12 contacts the wafer 20 and adsorbs the wafer 20.

[0055] In other operations, step S1 may not release the first locking member 13 from locking the first sub-adsorption part 121 and the handle 11; alternatively, step S1 may release only a portion of the second locking members 14 from locking the corresponding two adjacent sub-adsorption parts 121, without releasing the other portion of the second locking members 14 from locking the corresponding two adjacent sub-adsorption parts 121, depending on the specific needs. It is easy to understand that if step S1 does not release the first locking member 13 from locking the first sub-adsorption part 121 and the handle 11, then step S3 does not require re-locking the first locking member 13 onto the first sub-adsorption part 121 and the handle 11; if step S1 only releases a portion of the second locking members 14 from locking the corresponding two adjacent sub-adsorption parts 121, then step S3 only requires re-locking the corresponding sub-adsorption parts 121. Once step S3 is completed, the first locking member 13 locks the first sub-adsorption part 121a and the handle 11, and each second locking member 14 locks the corresponding two adjacent sub-adsorption parts 121.

[0056] In a preferred embodiment, the tooling 10 includes two suction units 12, the connection points of the two suction units 12 and the handle 11 are symmetrical about a preset plane, the preset plane passes through the axis L1 of the handle 11, and the preset plane is perpendicular to the line L2 connecting the connection points of the two suction units 12 and the handle 11. It should be understood that the suction surfaces of all the suction cups 1211 of the two suction units 12 are coplanar.

[0057] Before adsorbing the wafer 20, the operator can adjust the two adsorption parts 12 to be located on opposite sides of the axis 11 of the handle 11 and symmetrical about the preset plane. This can increase the contact area between the tooling 10 and the wafer 20, and improve the uniformity of the adsorption force applied by the tooling 10 to the wafer 20, thereby improving the adsorption stability of the tooling 10 on the wafer 20.

[0058] Preferably, two adjacent sub-adsorption portions 121 of the same adsorption portion 12 are detachably connected. This allows the number of sub-adsorption portions 121 of each adsorption portion 12 to be adjusted according to the size of the wafer 20, so that the size of the adsorption portion 12 is more suitable for the wafer 20 and the stability of the tooling 10 in adsorbing the wafer 20 is improved.

[0059] Optionally, two adjacent sub-adsorption portions 121 of the same adsorption portion 12 are rotatably and detachably connected by the second locking member 14.

[0060] For details, please refer to Figure 2 and Figure 3Each of the sub-adsorption portions 121 further includes a substrate 1212, a first lug 1213, and a second lug 1214. The substrate 1212 has a first end and a second end (not shown) facing each other in a second direction, which is perpendicular to the first direction. The first lug 1213 is disposed on the first end of the substrate 1212 and is located at the middle of the substrate 1212 in the first direction. The first lug 1213 is provided with a first connecting hole 1216 extending through the first direction. Each of the sub-adsorption portions 121 has two second lugs 1214, both of which are disposed on the second end of the substrate 1212 and are spaced apart in the first direction, such that a receiving groove 1215 is formed between the two second lugs 1214, and the receiving groove 1215 corresponds to the first lug 1213 in the first direction. Each of the second lugs 1214 is provided with a second connecting hole 1217 extending through along the first direction, and the second connecting holes 1217 on two second lugs 1214 located on the same sub-adsorption part 121 are aligned. The suction cup 1211 is disposed on the substrate 1212, and the surface of the suction cup 1211 away from the substrate 1212 is the adsorption surface.

[0061] When assembling the adsorption section 12, as follows Figure 4 As shown, the first lug 1213 of one of the two adjacent sub-adsorption parts 121 is at least partially inserted into the receiving groove 1215 of the other, aligning the first connecting hole 1216 and the second connecting hole 1217. Then, the second locking member 14 is partially inserted through the first connecting hole 1216 and the second connecting hole 1217. Thus, when the second locking member 14 is not locking the two adjacent sub-adsorption parts 121, the two adjacent sub-adsorption parts 121 can rotate relative to each other about the second locking member 14; that is, the axis of rotation of the two adjacent sub-adsorption parts 121 when they rotate relative to each other is the axis of the second locking member 14.

[0062] In practice, the second locking element 14 can be a pin as used in the prior art.

[0063] Optionally, the housing 11 and the first sub-adsorption part 121a can also be detachably connected. Further, the housing 11 and the first sub-adsorption part 121a are detachably and rotatably connected by the first locking member 13.

[0064] Specifically, the housing 11 is provided with a third connecting hole (not shown in the figure). The housing 11 is partially inserted into the receiving groove 1215 of the first sub-adsorption part 121a, such that the third connecting hole is aligned with the second connecting hole 1217 of the first sub-adsorption part 121a. The first locking member 13 passes through the third connecting hole and the second connecting hole 1217. In this way, when the first locking member 13 does not lock the housing 11 and the first sub-adsorption part 121a, the housing 11 and the first sub-adsorption part 121a can rotate relative to each other around the first locking member 13, that is, the axis of rotation of the housing 11 and the first sub-adsorption part 121a relative to each other is the axis of the first locking member 13. Similar to the second locking member 14, the first locking member 13 can also be a pin in the prior art.

[0065] Optionally, in this embodiment of the invention, the suction cup 1211 adsorbs the wafer 20 under the action of an air pump (not shown in the figure). Therefore, the suction cups 1211 of all the sub-adsorption parts 121 are connected to the air pump. It is easy to understand that when two adjacent sub-adsorption parts 121 are detachably connected, and when the first sub-adsorption part 121a is detachably connected to the handle 11, the suction cup 1211 is detachably connected to the air pump. It is understood that the suction surface of the suction cup 1211 is provided with a plurality of first air holes (not shown in the figure), and the first air holes are connected to the air pump.

[0066] Optionally, the tooling 10 further includes the air pump, which is disposed inside the handle 11. And, as... Figure 2 and Figure 3 As shown, the sub-adsorption unit 121 further includes a pipe 1218, one end of which is connected to the suction cup 1211 and the other end is connected to the air pump, so that the air pump and the first air hole are connected through the pipe 1218.

[0067] Preferably, the tooling 10 further includes an adapter module (not shown in the figure), which includes multiple branch pipe interfaces and a converging pipe. The converging pipe is disposed inside the handle, with one end connected to the air pump and the other end connected to all the branch pipe interfaces. All the branch pipe interfaces are disposed on the handle 11 and arranged facing outwards from the handle 11. Each branch pipe interface is connected to one of the pipes 1218. It should be understood that the total number of the sub-adsorption sections 121 included in the two adsorption sections 12 is less than or equal to the number of branch pipe interfaces.

[0068] The air pump has a first working mode and a second working mode. In the first working mode, the air pump draws in air; in the second working mode, it blows air outwards. That is, the air pump is a dual-purpose blow-and-suction air pump. In practice, the air pump can be any type of dual-purpose blow-and-suction air pump in the prior art, such as a vortex air pump. Corresponding to the structure of the air pump, the suction cup 1211 also has several second air holes 1219 on its side (e.g., ...). Figure 14 As shown in the diagram, the second air vent 1219 is also connected to the air pump via the pipe 1218. This configuration allows the suction cup 1211 of the tooling 10 to adsorb the wafer 20 by negative pressure adsorption when the air pump is drawing air, or to adsorb the wafer 20 based on Bernoulli's principle when the air pump is blowing air, further improving the application range of the tooling 10.

[0069] The application of the tooling 10 will be explained through several common application scenarios.

[0070] Figure 5 This document shows a partial schematic diagram of a chip manufacturing apparatus in the prior art. For ease of description and understanding, it will be referred to as... Figure 5 The chip manufacturing equipment shown is called the first type of chip manufacturing equipment.

[0071] like Figure 5 As shown, the first type of chip manufacturing equipment includes a first adsorption chuck 31. The first adsorption chuck 31 includes a support ring 311 and two adsorption antenna groups. The two adsorption antenna groups are disposed on the support ring 311 and are symmetrical about a first straight line L3. The first straight line L3 is perpendicular to and intersects the axis of the support ring 311. Each adsorption antenna group includes a first adsorption antenna 312 and a second adsorption antenna 313. The first adsorption antenna 312 and the second adsorption antenna 313 of the same adsorption antenna group are spaced apart along the extension direction of the first straight line L3. Preferably, the first adsorption antenna 312 and the second adsorption antenna 313 of the same adsorption antenna group are located on opposite sides of a second straight line L4. The second straight line L4 is perpendicular to the first straight line L3 and perpendicular to and intersects the axis of the support ring 311.

[0072] Corresponding to the first type of chip manufacturing equipment, by performing steps S2 and S3, the adsorption section 12 can be formed as follows: Figure 1 and Figure 6 The shape shown. Figure 1 and Figure 6In this design, the adsorption portion 12 includes a first segment 1201, a second segment 1202, and a third segment 1203 connected to each other. The first segment 1201 is connected to the handle 11 and extends axially away from the handle 11. The second segment 1202 is connected to the end of the first segment 1201 away from the handle 11. The second segment 1202 is perpendicular to the first segment 1201 and extends axially away from the handle 11. The third segment 1203 is connected to the end of the second segment 1202 away from the handle 11 and extends axially towards the handle 11, such that the adsorption portion 12 is formed as part of a rectangle.

[0073] It should be understood that the first segment 1201, the second segment 1202, and the third segment 1203 each include at least one of the sub-adsorption portions 121. The number of sub-adsorption portions 121 included in the first segment 1201, the second segment 1202, and the third segment 1203 are all determined as needed, with the aim of ensuring that the adsorption portions 12 do not interfere with the first adsorption chuck 31.

[0074] When the wafer 20 is picked up, the adsorption part 12 is located on the side of the wafer 20 facing the first adsorption chuck 31, and one of the third segments 1203 is between the first adsorption antenna 312 and the second adsorption antenna 313 of one adsorption antenna group, and another of the third segments 1203 is between the first adsorption antenna 312 and the second adsorption antenna 313 of another adsorption antenna group. In addition, the air pump draws air so that the suction cup 1211 adsorbs the wafer 20 by negative pressure.

[0075] Figure 7 This is a partial structural diagram of another chip manufacturing equipment in the prior art. In this article, this chip manufacturing equipment is referred to as the second type of chip manufacturing equipment.

[0076] like Figure 7As shown, the second type of chip manufacturing equipment includes a second adsorption chuck 32, which includes an adsorption chuck body 321 and telescopic supports 322. There are three telescopic supports 322, which are disposed on the adsorption chuck body 321 and arranged at equal intervals around the axis of the adsorption chuck body 321. The three telescopic supports 322 are located on the same circle. The telescopic supports 322 are configured to extend and retract in a direction perpendicular to the adsorption chuck body 321. The extension and retraction of the telescopic supports 322 can move the wafer 20 in a direction perpendicular to the adsorption chuck body 321. Specifically, when the wafer 20 is supported on the adsorption chuck 321, the telescopic supports 322 extend to move the wafer 20 away from the adsorption chuck body 321; when the telescopic supports 322 extend and support the wafer 20, the wafer 20 is moved closer to the adsorption chuck body 321 by retracting the telescopic supports 322.

[0077] Corresponding to the second type of chip manufacturing equipment, by performing steps S2 and S3, the adsorption section 12 can be formed as follows: Figure 8 or Figure 9 The shape shown. Figure 8 and Figure 9 In this configuration, the adsorption section 12 includes a plurality of fourth segments 1204, wherein the fourth segment 1204 closest to the handle 11 is inclined relative to the axis of the handle 11, and adjacent fourth segments 1204 of the same adsorption section 12 are connected at an angle such that the distance between the two adsorption sections 12 continuously increases in the direction away from the handle 11, or increases first and then remains constant, or increases first and then remains constant and then decreases, or increases first and then decreases. It should be understood that each fourth segment 1204 includes at least one sub-adsorption section 121.

[0078] In one example, such as Figure 8 As shown, when the wafer 20 is picked up, the telescopic support 322 extends, the adsorption part 12 is located on the side of the wafer 20 facing the second adsorption chuck 32, and the tooling 10 is located outside the circle where the three telescopic supports 322 are located. In addition, the air pump draws air so that the suction cup 1211 adsorbs the wafer 20 by negative pressure.

[0079] In another example, such as Figure 9As shown, when the wafer 20 is picked up, the telescopic support 322 extends, the adsorption part 12 is located on the side of the wafer 20 facing the second adsorption chuck 32, the handle 11 is located outside the circle where the three telescopic supports 322 are located, each adsorption part 12 is partially located inside the circle where the three telescopic supports 322 are located and is located between two telescopic supports 322, and the air pump draws air so that the suction cup 1211 adsorbs the wafer 20 by negative pressure.

[0080] Figure 10 This is a partial structural diagram of another type of chip manufacturing equipment in the prior art. In this article, this chip manufacturing equipment is referred to as the third type of chip manufacturing equipment.

[0081] like Figure 10 As shown, the third type of chip manufacturing equipment includes a third adsorption chuck 33, on which two grooves 331 are formed, and the two grooves 331 are parallel. Generally, the two grooves 331 are arranged on opposite sides of a third straight line L5, which passes through the center of the third adsorption chuck 33. Preferably, the distances from the two grooves 331 to the third straight line L5 are equal. Furthermore, the dimensions of the two grooves 331 in the extension direction of the third straight line L5 may be equal or unequal. Figure 11 As shown, when the third adsorption chuck 33 carries the wafer 20, the surface of the third adsorption chuck 33 with the groove 331 is in contact with the wafer 20.

[0082] Corresponding to the third type of chip manufacturing equipment, by performing steps S2 and S3, the adsorption section 12 is formed as follows: Figure 12 The shape shown. Figure 12 In this design, the adsorption portion 12 includes a fifth segment 1205 and a sixth segment 1206. The fifth segment 1205 is connected to the handle 11 and extends away from the axis of the handle 11 in a direction perpendicular to the axis of the handle 11. The sixth segment 1206 is connected to the end of the fifth segment 1205 away from the axis of the handle 11 and extends away from the handle 11 along the axial direction of the handle 11. The dimension of the fifth segment 1205 in the direction perpendicular to the axis of the handle 11 is determined by the distance between the two grooves 331, and the length of the sixth segment 1206 in the axial direction of the handle 11 is related to the length of the grooves 331.

[0083] like Figure 12As shown, when the wafer 20 is picked up, the adsorption part 12 is located on the side of the wafer 20 facing the third adsorption chuck 33, and each adsorption part 12 is at least partially inserted into one of the grooves 331, and the air pump draws air so that the suction cup 1211 adsorbs the wafer 20 by negative pressure.

[0084] Figure 13 This is a schematic diagram of another type of chip manufacturing equipment in the prior art carrying the wafer 20, which is referred to as the fourth type of chip manufacturing equipment.

[0085] like Figure 13 As shown, the fourth chip manufacturing equipment includes a fourth adsorption chuck 34. The surface of the fourth adsorption chuck 34 that is in contact with the wafer 20 is flat, and the size of the surface of the fourth adsorption chuck 34 that is in contact with the wafer 20 is comparable to the size of the wafer 20, resulting in that the side of the wafer 20 facing the fourth adsorption chuck 34 does not have space to accommodate the adsorption part 12.

[0086] For the fourth type of chip manufacturing equipment, by performing steps S2 and S3, the adsorption part 12 can have any suitable shape, for example... Figure 6 The shape shown, or Figure 8 , Figure 9 The shape shown, or Figure 12 The shape shown. When the suction cup 20 is picked up, the adsorption part 12 is located on the side of the wafer 20 away from the fourth adsorption chuck 34, and the air pump blows air so that the suction cup 1211 adsorbs the wafer 20 based on Bernoulli's principle.

[0087] Bernoulli's principle specifically states that the gap between the sub-adsorption section 121 and the wafer 20 is extremely small. For example... Figure 14 As indicated by the arrow, the gas blown out by the air pump flows through the second air hole 1219 into the gap between the sub-adsorption section 121 and the wafer 20, and then flows to the outer periphery of the wafer 21 and the sub-adsorption section 121. When the gas flows through the gap between the sub-adsorption section 121 and the wafer 20, a narrowing effect occurs, causing an increase in flow velocity. This results in a decrease in air pressure in the region between the sub-adsorption section 121 and the wafer 20, thus creating a low-pressure region. Meanwhile, the air pressure at the outer periphery of the wafer 20 is higher, thereby pushing the wafer 20 towards the suction cup 1211, causing the suction cup 1211 to adsorb the wafer 20.

[0088] In summary, through the cooperation between the adsorption part 12 and the handle 11, and the cooperation between two adjacent sub-adsorption parts 121, the shape of the adsorption part 12 can be adapted to different application scenarios according to requirements, thereby improving the application range and versatility of the tooling 10. The functional design of the air pump allows the tooling to adsorb the wafer 20 on the side of the wafer 20 facing the adsorption chuck of the chip manufacturing equipment (including the first adsorption chuck 31, the second adsorption chuck 32, and the third adsorption chuck 33 as described above) using negative pressure adsorption, and also on the side of the wafer 20 away from the adsorption chuck of the chip manufacturing equipment (e.g., the fourth adsorption chuck 34 as described above) based on Bernoulli's principle, further broadening the application range and versatility of the tooling 10.

[0089] While the present invention has been disclosed above, it is not limited thereto. Those skilled in the art can make various modifications and variations to the present invention without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and variations.

Claims

1. A tooling apparatus characterized by, include: handle; The adsorption section includes multiple sub-adsorption sections, which are arranged sequentially and adjacent sub-adsorption sections are rotatably connected. The sub-adsorption part located at one end of the adsorption part is the first sub-adsorption part, and the first sub-adsorption part is rotatably connected to the handle; the rotation axis of all the sub-adsorption parts extends along a first direction; the sub-adsorption part includes a suction cup, and the suction cup has an adsorption surface perpendicular to the first direction; the adsorption surfaces of the suction cups of all the sub-adsorption parts are coplanar; A first locking element is used to selectively lock the handle and the first sub-adhesive part so that the handle and the first sub-adhesive part remain relatively stationary, or to release the lock on the handle and the first sub-adhesive part so that the handle and the first sub-adhesive part can rotate relative to each other; as well as, The second locking element is used to selectively lock two adjacent sub-adsorption portions so that the two adjacent sub-adsorption portions remain relatively stationary, or to release the lock on the two adjacent sub-adsorption portions so that the two adjacent sub-adsorption portions can rotate relative to each other.

2. The tooling of claim 1, wherein, The two adjacent sub-adsorption units are detachably connected.

3. The tooling of claim 2, wherein, The two adjacent sub-adsorption units are rotatably and detachably connected by the second locking member.

4. The tooling of claim 3, wherein, The sub-adsorption part further includes a substrate, a first lug, and a second lug; the substrate has a first end and a second end opposite to each other in a second direction, the second direction being perpendicular to the first direction; the first lug is disposed at the first end of the substrate and located in the middle of the substrate in the first direction, and the first lug has a first connecting hole extending through the first direction; there are two second lugs, both of which are disposed at the second end of the substrate and are spaced apart in the first direction, and the second lug has a second connecting hole extending through the first direction; the suction cup is disposed on the substrate, and the surface of the suction cup away from the substrate is the adsorption surface; The first lug of one of two adjacent sub-adsorption parts is at least partially inserted between the two second lugs of the other; the second locking member is a pin, which is used to pass through the first connecting hole and the second connecting hole.

5. The tooling of claim 4, wherein, The handle is provided with a third connection hole, and the handle is partially inserted between the two second lugs of the first sub-adsorption part; The first locking member passes through the third connecting hole and the second connecting hole so that the handle is connected to the first sub-locking member; when the first locking member releases the lock on the handle and the first sub-adsorption part, the first sub-adsorption part and the handle can rotate relative to each other around the first locking member.

6. The tooling of claim 5, wherein, The first locking element is a pin.

7. The tooling of claim 1 wherein, The tooling includes two adsorption parts, and the connection points of the two adsorption parts and the handle are symmetrical about a preset plane. The preset plane passes through the axis of the handle and is perpendicular to the line connecting the connection points of the two adsorption parts and the handle.

8. The tooling of claim 1 wherein, The tooling also includes an air pump, which is disposed inside the handle; The suction cups of all the sub-adsorption units are connected to the air pump.

9. The tooling of claim 8, wherein, The air pump is a dual-purpose blow and suction air pump.

10. The tooling of claim 9, wherein, The air pump comprises a vortex air pump.

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