Chip detection test seat with heat dissipation structure

Abstract

The utility model discloses a chip detection test seat with heat dissipation structure, including base, pivot and upper cover, just the base and upper cover are hinged through pivot setting, still include: the socket of heat dissipation fan and inserting in positioning cavity, the utility model discloses when using, through installing heat dissipation fan on the upper cover to make the original test seat can realize the heat dissipation of chip without changing structure, and through machining part machine shell, in addition, the size of heat dissipation fan can be adjusted according to the size of original socket to can satisfy the use demand of different size socket, when the test seat is not used, the air gap of heat dissipation fan is covered with dustproof cover plate, and the rubber pad is driven to be close to heat dissipation fan by screwing knob, thereby dustproof cover plate is locked on the surface of heat dissipation fan, plays the dustproof purpose to heat dissipation fan, reduces the work intensity of staff dust cleaning.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a chip testing socket with a heat dissipation structure. Background Technology

[0002] During chip testing, heat is generated inside the chip. This heat can affect test results depending on the testing environment. Some existing chip testing sockets do not meet the chip's heat dissipation requirements, thus affecting the accuracy of test results. Furthermore, the heat dissipation structures added to some chip testing sockets are difficult to match with the dimensions of existing sockets, causing inconvenience during chip handling. Utility Model Content

[0003] In order to overcome the shortcomings of the existing technology, one of the objectives of this utility model is to provide a chip testing socket with a heat dissipation structure.

[0004] One of the objectives of this utility model is achieved through the following technical solution: A chip testing socket with a heat dissipation structure includes a base, a hinge, and a top cover, wherein the base and the top cover are hinged together by the hinge, and further includes: Cooling fan: The cooling fan is installed on the back side of the top cover, and a power cord is fixedly connected to the cooling fan. Socket: The base has a pre-set positioning cavity, and the socket is inserted into the positioning cavity. A locking mechanism is provided between the socket and the base.

[0005] Furthermore, the rotating shaft is provided with a return spring for springing the base and the top cover apart.

[0006] Furthermore, the upper cover is provided with a buckle, and the base is provided with a slot for adapting the buckle.

[0007] Furthermore, the locking mechanism includes four fixed cylinders, which are respectively disposed at the four corners of the outer wall of the base. Each fixed cylinder has a matching round block rotatably connected to its inner cavity, and a locking rod is fixedly connected to the bottom of the round block. Each fixed cylinder has a through hole at its bottom that matches the locking rod. The four corners of the bottom of the base are pre-set with fixing holes, and the four corners of the bottom of the socket are pre-set with through holes of the same size as the fixing holes. The other end of each locking rod passes through the adjacent through hole and through hole and is inserted into the inner cavity of the adjacent fixing hole. Each locking rod has a compression spring sleeved on its outer wall. One end of each compression spring is fixedly connected to the adjacent round block, and the other end of each compression spring is fitted against the inner wall of the adjacent fixed cylinder.

[0008] Furthermore, a dust cover of the same size is slidably connected to the back side of the cooling fan, and two circular grooves with the central axis of the dust cover as the axis of symmetry are opened on the inner side of the dust cover. Circular pressure plates are rotatably connected to the inner cavities of the two circular grooves, and a rubber pad is provided on the side of the circular pressure plate away from the center of the inner cavity of the circular groove. Two threaded holes corresponding to the positions of the circular grooves are opened on the back side of the dust cover, and locking screws of the same size are screwed into the inner cavities of the threaded holes. One end of the two locking screws is fixedly connected to the adjacent circular pressure plates, and the other end of the two locking screws is fixedly connected to a knob.

[0009] Furthermore, the depth of the circular groove is greater than the sum of the thicknesses of the circular pressure plate and the rubber pad.

[0010] Furthermore, the base, buckle, and dust cover are all made of metal.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: 1. By mounting the cooling fan on the top cover, the original test socket can achieve chip heat dissipation without changing its structure. Furthermore, the machined component housing allows the size of the cooling fan to be adjusted according to the size of the original socket, thus meeting the needs of different socket sizes. As a result, this test socket can be further promoted in the market.

[0012] 2. With the dust cover, circular groove, circular pressure plate, rubber pad, screw and knob, when the test stand is not in use, the dust cover can be used to cover the air outlet gap of the cooling fan, and the knob can be turned to make the rubber pad stick to the cooling fan, thereby locking the dust cover on the surface of the cooling fan, achieving the purpose of dust prevention for the cooling fan and reducing the workload of the staff in dust removal and cleaning.

[0013] 3. By using a fixed cylinder, a round block, a locking rod, and a compression spring, after the socket is installed inside the base, the locking rod is rotated and overcomes the resistance of the compression spring to pass through the socket through hole and then inserted into the inner cavity of the fixed hole. This allows the socket and base to be quickly assembled together, improving the convenience of socket assembly and disassembly.

[0014] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the main view structure of the first embodiment; Figure 2 This is a schematic diagram of the right-side structure of the first embodiment; Figure 3 This is a schematic diagram of the disassembled structure of the cooling fan and dust cover in the first embodiment; Figure 4 This is a schematic diagram of the base structure viewed from below in the first embodiment; Figure 5 This is a schematic cross-sectional view of the dust cover in the first embodiment; Figure 6 for Figure 5 Enlarged view of the structure at point A in the middle; Figure 7 This is a top view of the base structure in the second embodiment; Figure 8 This is a cross-sectional view of the fixed cylinder structure in the second embodiment.

[0016] In the diagram: 1. Base; 2. Shaft; 3. Top cover; 4. Cooling fan; 5. Return spring; 6. Buckle; 7. Slot; 8. Power cord; 9. Positioning cavity; 10. Socket; 11. Dust cover; 12. Circular groove; 13. Circular pressure plate; 14. Rubber pad; 15. Threaded hole; 16. Screw; 17. Knob; 18. Fixing cylinder; 19. Locking rod; 20. Round block; 21. Compression spring; 22. Fixing hole; 23. Through hole. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0018] It should be noted that when a component is described as "fixed to" another component, it can be directly on the other component or may have a component in between. When a component is considered "connected to" another component, it can be directly connected to the other component or may have a component in between. When a component is considered "set on" another component, it can be directly set on the other component or may have a component in between. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0020] This utility model provides the following technical solution: Example 1, please refer to Figures 1-6 : A chip testing socket with a heat dissipation structure includes a base 1, a pivot 2, and a top cover 3, with the base 1 and the top cover 3 hinged together by the pivot 2. It also includes a cooling fan 4 mounted on the back of the top cover 3, with a power cord 8 fixedly connected to the cooling fan 4. The plug of the power cord 8 can be plugged into an external power socket to supply power to the cooling fan 4. When the test socket is working, the cooling fan 4 can dissipate heat during the test to cool the chip. The base 1 has a pre-set positioning cavity 9, and a socket 10 is plugged into the positioning cavity 9.

[0021] The rotating shaft 2 is equipped with a reset spring 5 for springing the base 1 and the top cover 3 apart. After the top cover 3 is opened, the top cover 3 and the base 1 can be quickly springed apart, which helps to improve the efficiency of picking up and placing chips.

[0022] The top cover 3 is provided with a buckle 6, and the base 1 is provided with a slot 7 for adapting the buckle 6. After the chip is placed in the test socket, the top cover 3 can be closed on the base 1, and the buckle 6 can be inserted into the slot 7 to lock the top cover 3 and the base 1, ensuring that the top cover 3 will not flip freely during the test and improving the stability of the test.

[0023] A dust cover 11 of the same size is slidably connected to the back side of the cooling fan 4. Two circular grooves 12 with the central axis of the dust cover 11 as the axis of symmetry are opened on the inner side of the dust cover 11. A circular pressure plate 13 is rotatably connected to the inner cavity of the two circular grooves 12. A rubber pad 14 is provided on the side of the circular pressure plate 13 away from the center of the inner cavity of the circular groove 12. Two threaded holes 15 corresponding to the positions of the circular grooves 12 are opened on the back side of the dust cover 11. A matching locking screw 16 is screwed into the inner cavity of the threaded hole 15. One end of the two locking screws 16 is fixedly connected to the adjacent circular pressure plate 13, and the other end of the two locking screws 16 is fixedly connected to a knob 17. When the test stand is not in use, the dust cover 11 can be used to protect the cooling fan 4 from dust, reducing the workload of the staff in cleaning the cooling fan 4.

[0024] The depth of the circular groove 12 is greater than the sum of the thicknesses of the circular pressure plate 13 and the rubber pad 14, which can retract the circular pressure plate 13 and the rubber pad 14 into the inner cavity of the circular groove 12, thereby allowing the dust cover 11 to be smoothly pulled and moved, so that the cooling fan 4 can be used normally.

[0025] The base 1, the buckle 6, and the dust cover 11 are all made of metal, which improves the heat dissipation performance of the test base.

[0026] Working principle: According to the size of the chip under test, the adapter socket 10 is installed into the base 1. Then, the top cover 3 is flipped over and placed on the base 1. The top cover 3 and the base 1 are locked together by the locking structure of the buckle 6 and the slot 7. Then, the two knobs 17 are turned and the screw 16 is rotated, which causes the circular pressure plate 13 and the rubber pad 14 to retract into the inner cavity of the circular groove 12. By pushing the dust cover 11 relative to the cooling fan 4, the air outlet gap between the dust cover 11 and the cooling fan 4 can be misaligned. Then, after the plug of the power cord 8 is inserted into the external power socket, the cooling fan 4 is turned on to dissipate the heat in the inner cavity of the base 1, thereby cooling the chip.

[0027] Example 2, please refer to Figure 7 and Figure 8 : A locking mechanism is provided between the socket 10 and the base 1.

[0028] The locking mechanism includes four fixed cylinders 18, which are respectively located at the four corners of the outer wall of the base 1. Each fixed cylinder 18 has a corresponding round block 20 rotatably connected to its inner cavity, and a locking rod 19 is fixedly connected to the bottom of the round block 20. Each fixed cylinder 18 has a through hole at its bottom that matches the locking rod 19. The four corners of the bottom of the base 1 have pre-set fixing holes 22, and the four corners of the bottom of the socket 10 have pre-set through holes 23 of the same size as the fixing holes 22. The other end of each locking rod 19 is... Do not penetrate adjacent through holes 23 and insert into the inner cavity of adjacent fixing holes 22. Each locking rod 19 is fitted with a compression spring 21 on its outer wall. One end of each compression spring 21 is fixedly connected to the adjacent round block 20, and the other end of each compression spring 21 is fitted against the inner wall of the adjacent fixing cylinder 18. The elasticity of the compression spring 21 can be used to insert the locking rod 19 into the inner cavity of the fixing hole 22, so that the socket 10 can be stably installed inside the base 1, improving the convenience of disassembling and replacing the socket 10.

[0029] Working principle: When using this utility model, when disassembling the socket 10, the locking rod 19 can be pulled to overcome the resistance of the compression spring 21 and disengage from the inner cavity of the fixing hole 22 and the through hole 23. Then, by rotating the locking rod 19 away from the socket 10, the socket 10 can be taken out from the positioning cavity 9. Conversely, the socket 10 can be quickly installed into the positioning cavity 9, improving the convenience of operation for the staff.

[0030] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A chip testing socket with a heat dissipation structure, comprising a base (1), a rotating shaft (2), and a top cover (3), wherein the base (1) and the top cover (3) are hinged together by the rotating shaft (2), characterized in that, Also includes: Cooling fan (4): The cooling fan (4) is installed on the back side of the top cover (3), and a power cord (8) is fixedly connected to the cooling fan (4). Socket (10): The base (1) has a pre-set positioning cavity (9), and the socket (10) is inserted into the positioning cavity (9). A locking mechanism is provided between the socket (10) and the base (1).

2. The chip testing socket with a heat dissipation structure as described in claim 1, characterized in that: The rotating shaft (2) is provided with a return spring (5) for springing the base (1) and the top cover (3) apart.

3. The chip testing socket with a heat dissipation structure as described in claim 1, characterized in that: The upper cover (3) is provided with a buckle (6), and the base (1) is provided with a slot (7) for adapting the buckle (6).

4. A chip testing socket with a heat dissipation structure as described in claim 1, characterized in that: The locking mechanism includes four fixed cylinders (18), which are respectively located at the four corners of the outer wall of the base (1). Each fixed cylinder (18) has a matching round block (20) rotatably connected to its inner cavity, and a locking rod (19) is fixedly connected to the bottom of the round block (20). Each fixed cylinder (18) has a through hole at its bottom that matches the locking rod (19). The four corners of the bottom of the base (1) are each provided with a fixing hole (22). The socket (10) At the four corners of the bottom, there are through holes (23) of the same size as the fixing holes (22). The other end of each locking rod (19) passes through the adjacent through holes and through holes (23) and is inserted into the inner cavity of the adjacent fixing holes (22). Each locking rod (19) is fitted with a compression spring (21) on its outer wall. One end of each compression spring (21) is fixedly connected to the adjacent round block (20), and the other end of each compression spring (21) is fitted to the inner wall of the adjacent fixing cylinder (18).

5. A chip testing socket with a heat dissipation structure as described in claim 1, characterized in that: The back of the cooling fan (4) is slidably connected to a dust cover (11) of the same size. The inner side of the dust cover (11) has two circular grooves (12) with the central axis of the dust cover (11) as the axis of symmetry. The inner cavity of the two circular grooves (12) is rotatably connected to a circular pressure plate (13). A rubber pad (14) is provided on the side of the circular pressure plate (13) away from the center of the inner cavity of the circular groove (12). The back of the dust cover (11) has two threaded holes (15) corresponding to the positions of the circular grooves (12). The inner cavity of the threaded holes (15) is screwed with a matching locking screw (16). One end of the two locking screws (16) is fixedly connected to the adjacent circular pressure plate (13), and the other end of the two locking screws (16) is fixedly connected to a knob (17).

6. A chip testing socket with a heat dissipation structure as described in claim 5, characterized in that: The depth of the circular groove (12) is greater than the sum of the thicknesses of the circular pressure plate (13) and the rubber pad (14).

7. A chip testing socket with a heat dissipation structure as described in claim 1, characterized in that: The base (1), buckle (6) and dust cover (11) are all made of metal.

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