A heat dissipation structure and a controller

Abstract

The utility model provides a kind of heat dissipation structure and controller belongs to light supplement lamp technical field.The heat dissipation structure is arranged in the shell of controller, and the heat dissipation structure includes heat dissipation fan and radiator, and the radiator includes two connecting side plates and mutually parallel first base plate, second base plate, the connecting side plate is arranged in the two sides opposite of two base plates, and still be provided with multiple parallelly arranged rib plate between two base plates, and form ventilation passage between two adjacent rib plates.Heat dissipation fan and radiator are all arranged in the shell of controller, and heat dissipation fan is arranged in one side of radiator and is set to ventilation passage.The periphery of connecting side plate is abutted in the inner wall of shell when radiator is all arranged in the shell of controller, and form mounting cavity with the inner wall of shell, and load position for loading circuit board is set on connecting side plate.The structure can realize efficient heat dissipation of circuit board, and can improve the dustproof and waterproof capacity of circuit board, to improve the stability of circuit board work.

Description

Technical Field

[0001] This utility model relates to the field of controller technology, and in particular to a heat dissipation structure and controller. Background Technology

[0002] High-power fill lights are devices with powerful illumination capabilities, widely used in photography, videography, live streaming, security, and other fields. In existing high-power fill lights, based on comprehensive considerations of functional requirements, safety, and practicality, the controller and lamp body are designed separately. This separate design reduces the heat dissipation pressure on the lamp body, ensuring equipment stability. Furthermore, it improves the electrical safety of the controller, reducing the risk of fire. This is because the controller can be installed independently in a well-ventilated location away from flammable materials (such as a metal control cabinet), and it is easy to configure a separate heat dissipation structure. Additionally, the wiring connections are more standardized, reducing potential safety hazards.

[0003] In existing split-type controllers, due to the need for multi-faceted control of the lamp, the controller contains numerous circuit boards. These circuit boards require a large number of components to implement various control functions. These components generate a significant amount of heat during operation, causing a substantial temperature rise in the circuit boards. To improve the waterproof and dustproof capabilities of the circuit boards, existing controllers typically place them in a relatively sealed cavity. This leads to heat accumulation at the circuit boards, which cannot be effectively dissipated, potentially causing the circuit boards to overheat and malfunction.

[0004] Therefore, it is necessary to improve the controllers of existing high-power supplementary lights to overcome the shortcomings of the existing technology. Utility Model Content

[0005] To overcome the problems existing in related technologies, one of the objectives of this utility model is to provide a heat dissipation structure that can not only achieve efficient heat dissipation of the circuit board, but also improve the dustproof and waterproof capabilities of the circuit board, thereby improving the stability of the circuit board operation.

[0006] A heat dissipation structure is disposed inside the housing of the controller;

[0007] The heat dissipation structure includes a cooling fan and a heat sink. The heat sink includes two connecting side plates and a first base plate and a second base plate that are parallel to each other. The connecting side plates are arranged on opposite sides of the two base plates. Multiple parallel ribs are also arranged between the two base plates, and ventilation channels are formed between adjacent ribs.

[0008] Both the cooling fan and the heat sink are housed within the controller housing. The cooling fan is positioned on one side of the heat sink and faces the ventilation channel. When the heat sink is housed within the controller housing, the periphery of the connecting side plate abuts against the inner wall of the housing and forms a mounting cavity with the inner wall of the housing. The connecting side plate is provided with a support position for supporting the circuit board.

[0009] In a preferred embodiment of this invention, the bearing position is disposed within the mounting cavity and is located on the side of the connecting side plate away from the ventilation channel; the edge of the bearing position is provided with a locking block for limiting the circuit board; when the circuit board is disposed at the bearing position, thermally conductive silicone grease is applied between the circuit board and the connecting side plate.

[0010] In a preferred embodiment of this utility model, the two connecting side plates are parallel to each other, the first substrate is disposed at the edge of the two connecting side plates, and the second substrate is disposed at the middle of the two connecting side plates;

[0011] The two connecting side plates form a heat dissipation space between them and the second substrate to accommodate the heat-generating device.

[0012] In a preferred embodiment of this invention, threaded holes are provided on the connecting side plate, the first substrate, and the second substrate.

[0013] In a preferred embodiment of this invention, the distance between two adjacent ribs is 1cm-4cm, and the distance between the first substrate and the second substrate is 3cm-5cm.

[0014] The second objective of this utility model is to provide a controller, including a housing, wherein the housing is provided with the heat dissipation structure as described above.

[0015] In a preferred embodiment of this utility model, a first circuit board and a second circuit board are provided inside the housing. The first circuit board is located at the bearing position, and the second circuit board is located between the two connecting side plates and at the bottom plate of the connecting side plate.

[0016] In a preferred embodiment of this invention, a wireless connection module is provided on the first circuit board, which is any one of a Bluetooth module, a Wi-Fi module, a Zigbee module, or a 4G / 5G module.

[0017] The beneficial effects of this utility model are as follows:

[0018] This utility model provides a heat dissipation structure and supplementary lighting. The heat dissipation structure is installed inside the housing of a controller and includes a cooling fan and a heat sink. The heat sink includes two connecting side plates and a first base plate and a second base plate that are parallel to each other. The connecting side plates are located on opposite sides of the two base plates, and multiple parallel ribs are arranged between the two base plates, forming a ventilation channel between adjacent ribs. Both the cooling fan and the heat sink are installed inside the housing of the controller. The cooling fan is located on one side of the heat sink and faces the ventilation channel. When the heat sink is installed inside the housing of the controller, the periphery of the connecting side plate abuts against the inner wall of the housing and forms a mounting cavity with the inner wall of the housing. The connecting side plate is provided with a support position for supporting the circuit board. When this structure is installed inside the housing of the controller, the multiple ribs in the heat sink form multiple ventilation channels. The cooling fan is positioned facing the ventilation channels, which can drive the air to flow rapidly within the ventilation channels. The heat generated by the circuit board during operation is transferred to the connecting side plates, and then conducted to the first base plate, the second base plate, and the ribs. The flowing air can carry away the heat from these components in a timely manner, greatly improving the heat dissipation efficiency and ensuring that the circuit board operates at a suitable temperature. Furthermore, the periphery of the connecting side plate abuts against the inner wall of the housing, forming a relatively closed mounting cavity. The circuit board is located inside the mounting cavity, reducing the chance of external dust and moisture entering and contacting the circuit board, providing a good protective environment for the circuit board, and improving the circuit board's dustproof and waterproof capabilities. This avoids malfunctions caused by overheating, dust accumulation, or moisture, significantly improving the stability of the circuit board's operation and ensuring the normal operation of the controller and even the entire fill light.

[0019] This application also provides a controller including the above-mentioned heat dissipation structure, which can provide the circuit board with good dust and water resistance and efficient heat dissipation, so that the circuit board can work stably for a long time, thereby making the entire controller have good working stability. Attached Figure Description

[0020] Figure 1 This is a first perspective view of the heat dissipation structure provided in an embodiment of the present invention, which is arranged inside the housing of the controller.

[0021] Figure 2 This is a second perspective view of the heat dissipation structure provided in an embodiment of the present invention, which is arranged inside the housing of the controller.

[0022] Figure 3 yes Figure 2 The main view;

[0023] Figure 4 This is a perspective view of the controller provided in an embodiment of this utility model.

[0024] Figure label:

[0025] 1. Cooling fan; 2. Heat sink; 21. Connecting side plate; 22. Second base plate; 23. First base plate; 24. Rib plate; 25. Ventilation channel; 26. Heat dissipation position; 27. Connecting threaded hole; 100. Housing; 101. Mounting cavity; 200. First circuit board; 201. Wireless connection module; 300. Second circuit board. Detailed Implementation

[0026] Preferred embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0027] In existing high-power supplementary lighting fixtures, the separate controllers contain numerous circuit boards for multi-faceted control of the lamp body. These circuit boards house many components to implement various control functions. The components generate a significant amount of heat during operation, leading to substantial temperature rises on the circuit boards. To improve the circuit boards' waterproof and dustproof capabilities, existing controllers typically place them in a relatively sealed cavity. This results in heat accumulation at the circuit boards, hindering effective heat dissipation and potentially causing them to overheat and malfunction.

[0028] Based on this, this application provides a heat dissipation structure. Example

[0029] See Figures 1-4 This embodiment provides a heat dissipation structure, which is disposed within the housing 100 of the controller, characterized in that:

[0030] The heat dissipation structure includes a cooling fan 1 and a radiator 2. The radiator 2 includes two connecting side plates 21 and a first base plate 23 and a second base plate 22 that are parallel to each other. The connecting side plates 21 are disposed on opposite sides of the two base plates. Multiple parallel ribs 24 are also disposed between the two base plates. A ventilation channel 25 is formed between two adjacent ribs 24. The radiator 2 of this application can be integrally formed from aluminum alloy. The outer contour of the entire radiator 2 is rectangular. In actual use, efficient heat exchange with the outside world is achieved through the ventilation channel 25.

[0031] Both the cooling fan 1 and the heat sink 2 are housed within the controller housing 100. The cooling fan 1 is positioned on one side of the heat sink 2, facing the ventilation channel 25. When the heat sink 2 is housed within the controller housing 100, the periphery of the connecting side plate 21 abuts against the inner wall of the housing 100, forming a mounting cavity 101. The connecting side plate 21 has a support position for supporting the circuit board. The outer periphery of any connecting side plate 21 is press-fitted against the inner wall of the housing 100, forming a sealed mounting cavity 101, thereby isolating the ventilation channel 25 from the rest of the space within the housing 100. The connecting side plate 21 has a support position on the side facing away from the ventilation channel 25. When the circuit board is mounted on the support position, the space where the circuit board is located is physically isolated from the space where the ventilation channel 25 is located, thus achieving dustproof and waterproof functions for the circuit board. However, the heat generated by the circuit board during operation can be transferred to the ventilation channel 25 through the connecting side plate 21 and carried away by the airflow, thereby achieving effective heat dissipation.

[0032] Specifically, the bearing position is located inside the mounting cavity 101, and the bearing position is located on the side of the connecting side plate 21 away from the ventilation channel 25; the edge of the bearing position is provided with a locking block to limit the circuit board, and when the circuit board is placed in the bearing position, thermally conductive silicone grease is applied between the circuit board and the connecting side plate 21.

[0033] The aforementioned heat dissipation structure and supplementary lighting are installed inside the controller housing 100. Multiple ribs 24 in the heat sink 2 form multiple ventilation channels 25. The cooling fan 1 is positioned towards the ventilation channels 25, enabling rapid airflow within them. Heat generated during circuit board operation is transferred to the connecting side plate 21, and then conducted to the first substrate 23, the second substrate 22, and the ribs 24. The flowing air effectively removes heat from these components, significantly improving heat dissipation efficiency and ensuring the circuit board operates at a suitable temperature. Furthermore, the periphery of the connecting side plate 21 abuts against the inner wall of the housing 100, forming a relatively enclosed mounting cavity 101. The circuit board is located within the mounting cavity 101, reducing the chance of external dust and moisture entering and contacting the circuit board. This provides a good protective environment for the circuit board, enhancing its dust and water resistance and preventing malfunctions caused by overheating, dust accumulation, or moisture. This significantly improves the stability of the circuit board's operation, ensuring the normal operation of the controller and the supplementary lighting system as a whole.

[0034] Furthermore, the two connecting side plates 21 are parallel to each other, the first substrate 23 is disposed at the edge of the two connecting side plates 21, and the second substrate 22 is disposed at the middle of the two connecting side plates 21;

[0035] A heat dissipation position 26 for accommodating heat-generating devices is formed between the two connecting side plates 21 and the second substrate 22.

[0036] Two connecting side plates 21 remain parallel and extend longitudinally along the housing 100; the first substrate 23 is located directly at the top edge of the two connecting side plates 21 and is in contact with the inner wall of the housing 100's upper cover; the second substrate 22 is recessed to the middle height of the two connecting side plates 21 and is parallel to the first substrate 23. Thus, a heat dissipation space 26 with one side open is formed between the first substrate 23, the second substrate 22, and the two connecting side plates 21. This heat dissipation space 26 can fully accommodate power devices with a large height (such as MOSFET modules, rectifier bridges, or transformers). The power device is first locked to the upper surface of the second substrate 22, and its heating surface is also coated with thermal grease between itself and the second substrate 22. The cooling fan 1 is still arranged at one end of the heat sink 2, and the airflow still flows along the ventilation channel 25 formed by the ribs 24. However, at this time, the second substrate 22 also acts as a "cold plate" to absorb the heat of the power device, while the first substrate 23 also acts as a temperature equalization cover, further diffusing the heat laterally, so that the heat is evenly distributed twice before reaching the ventilation channel 25. A thermally conductive pad can be applied between the inner wall of the upper cover of the housing 100 and the first substrate 23 to form an auxiliary heat dissipation path for the housing 100. The open cavity of the heat dissipation position 26 can accommodate large-volume power devices with greater height, without the need to add protrusions or heat dissipation fins to the outside of the housing 100, and the overall height remains unchanged, which can improve space utilization.

[0037] Furthermore, the connecting side plate 21, the first substrate 23, and the second substrate 22 are all provided with connecting threaded holes 27.

[0038] In practical applications, blind holes and threads are integrally extruded or machined on the top edges of the two connecting side plates 21, the four corners of the first substrate 23, and around the power device mounting area of ​​the second substrate 22. The housing 100, power devices, and other components can be locked onto the heat sink 2 by screws connected to the threaded holes 27, thus achieving stable installation.

[0039] Furthermore, the distance between two adjacent ribs 24 is 1cm-4cm, and the distance between the first substrate 23 and the second substrate 22 is 3cm-5cm. When the spacing between the ribs 24 is controlled at 1cm-4cm and the distance between the first substrate 23 and the second substrate 22 is 3cm-5cm, this design can achieve efficient heat dissipation with sufficient area, without causing excessively high airflow during heat dissipation, thus reducing operating noise. In addition, this makes the channels less prone to bridging and blockage by dust, thereby enabling the heat dissipation structure to dissipate heat efficiently over a long period of time. Example

[0040] See Figures 1-4This embodiment provides a controller, including a housing 100, wherein the housing 100 is provided with a heat dissipation structure as described above.

[0041] This application also provides a controller including the above-mentioned heat dissipation structure, which can provide the circuit board with good dust and water resistance and efficient heat dissipation, so that the circuit board can work stably for a long time, thereby making the entire controller have good working stability.

[0042] Furthermore, a first circuit board 200 and a second circuit board 300 are disposed within the housing 100. The first circuit board 200 is disposed at the bearing position, and the second circuit board 300 is disposed between the two connecting side plates 21 and the bottom plate of the connecting side plates 21. A wireless connection module 201 is disposed on the first circuit board 200, and the wireless connection module 201 is any one of a Bluetooth module, a Wi-Fi module, a Zigbee module, or a 4G / 5G module.

[0043] The first circuit board 200 is positioned on the bearing position outside the connecting side plate 21 by a clip and is fixed by screws. Thermal grease is filled between the first circuit board 200 and the connecting side plate 21. The second circuit board 300 is laid horizontally between the two connecting side plates 21 and is locked into the threaded hole at the bottom of the connecting side plate 21. In practical applications, the heat of the power devices on the second circuit board 300 is quickly carried away by the airflow through the second substrate 22 → rib 24; the heat of the wireless module is dissipated through the first circuit board 200 → connecting side plate 21 → the same airflow path, avoiding mutual heating between high-heat devices and radio frequency devices, so that the components on the first circuit board 200 and the second circuit board 300 can work stably.

[0044] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings. In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0045] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0046] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. The above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. For those skilled in the art, this utility model can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A heat dissipation structure, disposed within the housing of a controller, characterized in that: The heat dissipation structure includes a cooling fan and a heat sink. The heat sink includes two connecting side plates and a first base plate and a second base plate that are parallel to each other. The connecting side plates are arranged on opposite sides of the two base plates. Multiple parallel ribs are also arranged between the two base plates, and ventilation channels are formed between adjacent ribs. Both the cooling fan and the heat sink are housed within the controller housing. The cooling fan is positioned on one side of the heat sink and faces the ventilation channel. When the heat sink is housed within the controller housing, the periphery of the connecting side plate abuts against the inner wall of the housing and forms a mounting cavity with the inner wall of the housing. The connecting side plate is provided with a support position for supporting the circuit board.

2. The heat dissipation structure according to claim 1, characterized in that: The bearing position is located inside the mounting cavity and is located on the side of the connecting side plate away from the ventilation channel. The edge of the bearing position is provided with a locking block to limit the circuit board. When the circuit board is placed in the bearing position, thermally conductive silicone grease is applied between the circuit board and the connecting side plate.

3. The heat dissipation structure according to claim 2, characterized in that: The two connecting side plates are parallel to each other, the first substrate is disposed at the edge of the two connecting side plates, and the second substrate is disposed at the middle of the two connecting side plates; The two connecting side plates form a heat dissipation space between them and the second substrate to accommodate the heat-generating device.

4. The heat dissipation structure according to any one of claims 1-3, characterized in that: The connecting side plate, the first substrate, and the second substrate are all provided with connecting threaded holes.

5. The heat dissipation structure according to any one of claims 1-3, characterized in that: The distance between two adjacent ribs is 1cm-4cm, and the distance between the first substrate and the second substrate is 3cm-5cm.

6. A controller, comprising a housing, characterized in that: The housing is provided with a heat dissipation structure as described in any one of claims 1-5.

7. The controller according to claim 6, characterized in that: The housing contains a first circuit board and a second circuit board. The first circuit board is located at the bearing position, and the second circuit board is located between the two connecting side plates and at the bottom plate of the connecting side plates.

8. The controller according to claim 7, characterized in that: The first circuit board is provided with a wireless connection module, which is any one of a Bluetooth module, a Wi-Fi module, a Zigbee module, or a 4G / 5G module.

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