Power semiconductor module liquid cooling heat sink plate and heat dissipation module

Abstract

The utility model belongs to power semiconductor module heat dissipation technical field, concretely relates to a kind of power semiconductor module liquid cooling heat dissipation plate and heat dissipation module.The utility model's power semiconductor module liquid cooling heat dissipation plate includes: plate body, its front surface is used to install chip, back surface is provided with multiple pinfin;The outer wall of the pinfin is provided with spiral portion.The utility model's power semiconductor module liquid cooling heat dissipation plate can carry out three-dimensional turbulence to cooling liquid from two angles of plane and longitudinal direction by the outer wall of pinfin design into spiral, so that cooling liquid and heat exchange of heat dissipation plate are more sufficient, can improve the heat dissipation effect of power module.In addition, pinfin is divided into three regions according to density, gradually encrypted from liquid inlet to liquid outlet, so that the area where cooling liquid temperature gradually increases can also guarantee heat dissipation performance.

Description

Technical Field

[0001] This utility model belongs to the field of power semiconductor module heat dissipation technology, specifically relating to a liquid cooling heat sink and heat dissipation module for a power semiconductor module. Background Technology

[0002] With the development of new energy vehicles towards higher power and longer range, high-density, high-frequency, and high-current requirements are placed on power modules. Under the same current conditions, SiC chips are much smaller than Si chips and have a higher switching frequency, which perfectly meets these requirements. However, the small size of SiC chips leads to heat concentration. As one of the commonly used automotive-grade modules, the heat dissipation problem of HPD with SiC chips has become an urgent issue to be solved.

[0003] In existing technologies, heat dissipation efficiency and flow resistance are typically improved by optimizing the pinfin structure. For example, the circular cross-section of the pinfin can be optimized into a rhombus, fan shape, or ellipse to enhance heat dissipation performance. However, this optimization only improves the effect of pinfin2 on coolant flow in a planar plane. In the longitudinal direction, the cross-section is continuous, and it cannot turbulentize the coolant from a longitudinal angle. Therefore, the improvement in heat dissipation effect is limited. Utility Model Content

[0004] The purpose of this invention is to provide a liquid cooling heat sink and heat dissipation module for power semiconductor modules, which can turbulent the coolant from both planar and longitudinal directions to further improve the heat dissipation effect.

[0005] This application provides a liquid cooling heat sink for a power semiconductor module, comprising: The board has a front side for mounting chips and a back side with multiple pinfins. The outer wall of the pinfin is provided with a spiral section.

[0006] In one embodiment of this application, the pinfin includes a columnar portion and a spiral portion disposed on the outer periphery of the columnar portion.

[0007] In one embodiment of this application, the pinfin is spiral-shaped.

[0008] In one embodiment of this application, a plurality of cooling zones are sequentially arranged on the back side of the plate along the flow direction of the coolant; wherein Along the flow direction of the coolant, the interaxial spacing between the pinfins in the plurality of cooling zones decreases sequentially.

[0009] In one embodiment of this application, the number of cooling zones is three, namely a first cooling zone, a second cooling zone, and a third cooling zone; The interaxial spacing between pinfins in the first cooling zone is 3.75–4.25 mm; The inter-axial spacing between pinfins in the second cooling zone is 3.25–3.50 mm; The interaxial spacing between pinfins in the third cooling zone is 2.75–3.00 mm.

[0010] In one embodiment of this application, the interaxial spacing between pinfins in the first cooling zone is 3.95 mm; The interaxial spacing between pinfins in the second cooling zone is 3.40 mm; The interaxial spacing between pinfins in the third cooling zone is 2.85 mm.

[0011] Accordingly, this application provides a heat dissipation module, including: A cooling chamber, comprising an inlet, a flow channel, and an outlet connected in sequence; and The power semiconductor module liquid cooling heat sink, as described above, is disposed on the cooling cavity; wherein... The pinfin on the plate is located inside the flow channel.

[0012] In one embodiment of this application, a three-phase full-bridge power module is provided on the front side of the plate; Each phase of the copper-clad laminate corresponds to a specific cooling zone.

[0013] The beneficial effects of this utility model are: Unlike existing technologies, this application provides a liquid-cooled heat sink and heat dissipation module for a power semiconductor module. The liquid-cooled heat sink for the power semiconductor module includes: a plate body, with a front side for mounting chips and a back side having multiple pinfins; the outer wall of each pinfin has a spiral portion. This utility model's liquid-cooled heat sink for a power semiconductor module, by designing the outer wall of the pinfins in a spiral shape, can create three-dimensional turbulence for the coolant from both planar and longitudinal angles, resulting in more thorough heat exchange between the coolant and the heat sink, thus improving the heat dissipation effect of the power module. Furthermore, the pinfins are divided into three regions based on their density, gradually increasing in density from the inlet to the outlet, ensuring heat dissipation performance even in areas where the coolant temperature gradually increases.

[0014] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0015] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0016] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a perspective view of a heat dissipation module according to a preferred embodiment of the present invention; Figure 2 This is a perspective view of a liquid-cooled heat sink for a power semiconductor module according to a preferred embodiment of the present invention; Figure 3 This is a schematic diagram of a preferred embodiment of the pinfin of this utility model; Figure 4 This is a schematic diagram of a pinfin according to another preferred embodiment of the present invention; Figure 5 This is a top view of the rear of a liquid-cooled heat sink for a power semiconductor module according to another preferred embodiment of the present invention; Figure 6 This is a cross-sectional view of a heat dissipation module according to a preferred embodiment of the present invention; Figure 7 It is a traditional heat sink.

[0018] In the picture: Board 1, Cooling Zone 11, First Cooling Zone 101, Second Cooling Zone 102, Third Cooling Zone 103, Pinfin 2, Spiral Section 21, Columnar Section 22, Cooling Chamber 3, Liquid Inlet 31, Flow Channel 32, Liquid Outlet 33, Copper Clad Laminate 4, Chip 5. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] This application provides a liquid-cooled heat sink and heat dissipation module for a power semiconductor module, which are described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0021] See Figure 1 and Figure 2 In one embodiment, the power semiconductor module liquid cooling heat sink includes: a plate body 1, the front side of which is used to mount the chip 5, and the back side is provided with multiple pinfins 2; the outer wall of the pinfins 2 is provided with a spiral portion 21.

[0022] In this embodiment, by providing a spiral portion 21 on the outer wall of the pinfin 2, not only is the contact area between the heat sink and the coolant increased, but the coolant can also be turbulent from both planar and longitudinal angles, making the heat exchange between the coolant and the plate 1 more thorough and further enhancing the heat dissipation capacity of the heat sink.

[0023] See Figure 3 As an optional embodiment of the pinfin 2, the pinfin 2 includes a columnar portion 22 and a helical portion 21 disposed on the outer periphery of the columnar portion 22. For example, the pinfin 2 may be formed by machining external threads on the outer wall of the columnar body. Of course, the helical portion 21 may also be fixed on the outer periphery of the columnar body.

[0024] See Figure 4 As another alternative implementation of pinfin2, pinfin2 is spiral-shaped, meaning that pinfin2 has no columnar part in the middle and its entirety is spiral-shaped. For example, it can be a filament bent into a spiral shape, similar to a spring.

[0025] In some applications, the coolant achieves optimal heat dissipation when it first enters the flow channel from the inlet, effectively carrying away heat from this phase. However, as the coolant flows along the channel, its temperature gradually increases, reducing its heat dissipation efficiency, and its performance is worst near the outlet. Therefore, the overall heat dissipation of the power module is uneven, resulting in localized areas of high temperature.

[0026] Based on this, in this embodiment, see Figure 5 The back of the plate 1 is provided with a plurality of cooling zones 11 in sequence along the flow direction of the coolant; wherein the interaxial spacing between pinfins 2 in the plurality of cooling zones 11 decreases in sequence along the flow direction of the coolant.

[0027] In this embodiment, by gradually increasing the density of pinfins 2 in the cooling zone 11 along the flow direction of the coolant, the turbulence effect of the coolant in the area where the coolant temperature rises can be improved, as well as the contact area between the coolant and the heat sink can be increased, thereby ensuring the heat dissipation effect.

[0028] Optionally, there are three cooling zones 11, namely a first cooling zone 101, a second cooling zone 102, and a third cooling zone 103; the interaxial spacing between pinfins 2 in the first cooling zone 101 is 3.75 to 4.25 mm; the interaxial spacing between pinfins 2 in the second cooling zone 102 is 3.25 to 3.50 mm; and the interaxial spacing between pinfins 2 in the third cooling zone 103 is 2.75 to 3.00 mm.

[0029] Preferably, the interaxial spacing between pinfins 2 in the first cooling zone 101 is 3.95 mm; the interaxial spacing between pinfins 2 in the second cooling zone 102 is 3.40 mm; and the interaxial spacing between pinfins 2 in the third cooling zone 103 is 2.85 mm.

[0030] Accordingly, based on the above embodiments, see also Figure 6 An embodiment of this application provides a heat dissipation module, including: a cooling cavity 3, which includes an inlet 31, a flow channel 32 and an outlet 33 connected in sequence; and a power semiconductor module liquid cooling heat dissipation plate as described above disposed on the cooling cavity 3; wherein the pinfin 2 on the plate 1 is located in the flow channel 32.

[0031] Optionally, a window can be provided on the upper surface of the cooling cavity 3, and the back of the liquid cooling heat sink plate 1 of the power semiconductor module can be sealed on the window, that is, the pinfin 2 is inserted into the flow channel 32.

[0032] Furthermore, a three-phase full-bridge power module is provided on the front side of the board 1; the copper-clad laminate 4 of each phase corresponds to the corresponding cooling zone 11.

[0033] See Figure 7A traditional heat sink has an elliptical cross-section for its pinfins, and the density of the pinfins is consistent along the flow direction of the coolant. Simulations were performed on the power semiconductor module liquid-cooled heat sink of this invention and the traditional heat sink under the same operating conditions. The simulation results show that the highest temperature reached by the traditional heat sink is 170℃, while the highest temperature of the heat sink of this invention is 163℃. The difference in maximum temperature is 7℃, indicating that the heat sink of this invention reduces the overall temperature of the module. Furthermore, in the traditional heat sink, the highest junction temperature of one phase chip at the water channel inlet is 160℃, and the highest junction temperature of another phase chip at the water channel outlet is 170℃, resulting in a 10℃ difference in the highest junction temperature between phases of the module, leading to uneven temperature distribution. In contrast, the heat sink of this invention has a highest junction temperature of 160℃ at the water channel inlet and 163℃ at the water channel outlet, with a 3℃ difference in the highest junction temperature between phases of the module, significantly improving the overall temperature uniformity of the module.

[0034] It should be noted that all the devices (parts whose specific structures are not specified) selected in this application are general standard parts or parts known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.

[0035] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0036] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0037] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification.

Claims

1. A liquid-cooled heat sink for a power semiconductor module, characterized in that, include: The board (1) has a front side for mounting chips (5) and a back side with multiple pinfins (2). The outer wall of the pinfin (2) is provided with a spiral part (21); The back of the plate (1) is provided with a plurality of cooling zones (11) in sequence along the flow direction of the coolant; wherein the interaxial spacing between the pinfins (2) in the plurality of cooling zones (11) decreases in sequence along the flow direction of the coolant. The number of cooling zones (11) is 3, namely the first cooling zone (101), the second cooling zone (102), and the third cooling zone (103). The interaxial spacing between pinfins (2) in the first cooling zone (101) is 3.75 to 4.25 mm; The interaxial spacing between pinfins (2) in the second cooling zone (102) is 3.25 to 3.50 mm; The interaxial spacing between pinfins (2) in the third cooling zone (103) is 2.75 to 3.00 mm.

2. The liquid-cooled heat sink for power semiconductor modules according to claim 1, characterized in that, The pinfin (2) includes a columnar portion (22) and a spiral portion (21) disposed on the outer periphery of the columnar portion (22).

3. The liquid-cooled heat sink for power semiconductor modules according to claim 1, characterized in that, The pinfin (2) is spiral-shaped.

4. The liquid-cooled heat sink for power semiconductor modules according to claim 1, characterized in that, The interaxial spacing between pinfins (2) in the first cooling zone (101) is 3.95 mm; The interaxial spacing between pinfins (2) in the second cooling zone (102) is 3.40 mm; The interaxial spacing between pinfins (2) in the third cooling zone (103) is 2.85 mm.

5. A heat dissipation module, characterized in that, include: The cooling chamber (3) includes an inlet (31), a flow channel (32) and an outlet (33) connected in sequence. as well as The power semiconductor module liquid cooling heat sink as described in any one of claims 1-4 is disposed on the cooling cavity (3); wherein The pinfin (2) on the plate (1) is located inside the flow channel (32).

6. The heat dissipation module according to claim 5, characterized in that, A three-phase full-bridge power module is provided on the front side of the plate (1); Each phase of the copper-clad laminate (4) corresponds to the corresponding cooling zone (11).

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