Rubbing device for bonding silicon rod and slicer resin plate

Abstract

The utility model relates to the technical field of bonding auxiliary device especially relates to a kind of glue spreading device for bonding silicon rod and slicing machine resin plate, including handle and the glue spreading strip of fixed connection on handle, the width direction of glue spreading strip one side side is first arc surface, and first arc surface adapts the arc of resin plate to form first glue spreading face;Wherein, glue storage chamber of storing adhesive is formed in handle, output channel is formed in glue spreading strip, glue outlet is set on first arc surface, output channel can be respectively connected glue storage chamber and glue outlet;When reaching threshold value after pressurizing to glue storage chamber, glue outlet can output adhesive, its beneficial effect is that the bonding efficiency and quality between silicon rod and slicing machine resin plate can be significantly improved.The device integrates handle and glue spreading strip, and realizes the accurate delivery and smearing of adhesive by built-in glue storage chamber and output channel.

Description

Technical Field

[0001] This utility model relates to the technical field of bonding auxiliary devices, and in particular to an adhesive applicator for bonding silicon rods and resin plates of a slicing machine. Background Technology

[0002] With the rapid development of the semiconductor industry, the demand for silicon wafers is also increasing. Silicon wafer production is inseparable from the wire cutting process, and one of the crucial steps in this process is bonding silicon rods. Bonding silicon rods, as the name suggests, involves using a special adhesive to bond the silicon rod to the resin workpiece. The strength of this bonding directly affects the yield rate of the finished product. Since multi-wire processing typically takes several to over ten hours, the bonded silicon rods must be sufficiently strong.

[0003] When bonding resin boards to silicon rods, the bonding surface of the resin board is curved, making it difficult to apply the adhesive evenly without suitable tools. This often results in uneven application, affecting the bonding effect and potentially causing the cut silicon wafers to detach after multi-wire cutting, leading to waste. Furthermore, achieving even adhesive application is time-consuming and inconvenient. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides an adhesive applicator for bonding silicon rods and resin plates of slicing machines, which solves the technical problem that the adhesive applicator in the prior art cannot efficiently and reliably apply adhesive to the resin plate.

[0006] Technical issues.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the main technical solutions adopted by this utility model include:

[0009] In a first aspect, this utility model provides an adhesive applicator for bonding silicon rods and resin plates of a slicing machine, comprising a handle and an adhesive applicator strip fixedly connected to the handle. One side of the adhesive applicator strip in the width direction is a first arc surface, and the first arc surface is adapted to the curvature of the resin plate to form a first adhesive applicator surface. The handle contains an adhesive storage chamber, the adhesive applicator strip contains an output channel, and the first arc surface has an adhesive outlet. The output channel can connect the adhesive storage chamber and the adhesive outlet respectively. When the pressure applied to the adhesive storage chamber reaches a threshold, the adhesive outlet can output adhesive.

[0010] (III) Beneficial Effects

[0011] The beneficial effects of this invention are as follows: The adhesive application device for bonding silicon rods and slicing machine resin plates can significantly improve the bonding efficiency and quality between the silicon rods and the slicing machine resin plates. The device integrates a handle with an adhesive application strip and achieves precise delivery and application of adhesive through a built-in adhesive storage chamber and output channel. The handle not only serves as the operator's grip but also stores the adhesive, making the entire device compact and easy to operate.

[0012] The first arc surface of the adhesive strip is precisely designed to fit the curvature of the resin plate of the slicing machine, thereby achieving a high degree of adhesion and ideal bonding effect during the application process. This fit design not only improves the utilization rate of the adhesive but also reduces the risk of bonding failure due to uneven application. Furthermore, the position and number of adhesive outlets can be adjusted according to actual needs. For example, multiple outlets can be set on the first arc surface to ensure that the adhesive can quickly cover the entire contact surface during application, while avoiding adhesive accumulation or overflow due to excessive local pressure.

[0013] This device not only simplifies the tedious process of traditional manual adhesive application and improves work efficiency, but also ensures the stability and consistency of bonding quality through optimized structural design. In large-area bonding operations between silicon rods and resin boards, this device can effectively reduce secondary processing or rework caused by uneven adhesive distribution, thereby reducing production costs and improving the overall process level. Furthermore, due to its simple structure and intuitive operation, it can be used without professional training, further enhancing its practical value in industrial production. Attached Figure Description

[0014] Figure 1 This is one of the schematic diagrams of the axial side structure of the adhesive application device of this utility model;

[0015] Figure 2 This is the second schematic diagram of the axial side structure of the adhesive application device of this utility model;

[0016] Figure 3 This is one of the schematic diagrams of the main cross-sectional structure of the adhesive application device of this utility model;

[0017] Figure 4 This is the second schematic diagram of the main cross-sectional structure of the adhesive application device of this utility model;

[0018] Figure 5 This is one of the structural schematic diagrams of the right cross-section of the adhesive strip of this utility model;

[0019] Figure 6 This is the second schematic diagram of the right-side cross-section of the adhesive strip of this utility model.

[0020] [Explanation of Labels in the Attached Image]

[0021] 1. Handle; 1a. Glue reservoir; 1b. Opening;

[0022] 2. Glue strip; 2a. Output channel; 2b. Glue outlet; 2c. First arc surface; 2d. Second arc surface;

[0023] 3. Piston;

[0024] 4. Push rod;

[0025] 5. Lamination;

[0026] 6. Rotary roller; 6a. Glue tank. Detailed Implementation

[0027] To better explain and facilitate understanding of this utility model, the following description is provided in conjunction with the appendix. Figures 1-6 This utility model will be described in detail through specific embodiments. In this document, directional terms such as "upper" and "lower" are used in conjunction with other directional terms. Figure 1 The orientation is used as a reference.

[0028] Example 1:

[0029] Reference Figures 1-6 This utility model provides an adhesive applicator for bonding silicon rods and resin plates of a slicing machine. It includes a handle 1 and an adhesive applicator strip 2 fixedly connected to the handle 1. One side of the adhesive applicator strip 2 in the width direction is a first arc surface 2c, and the first arc surface 2c is adapted to the curvature of the resin plate to form a first adhesive applicator surface. The handle 1 contains an adhesive storage chamber 1a, and the adhesive applicator strip 2 contains an output channel 2a. An adhesive outlet 2b is provided on the first arc surface 2c. The output channel 2a can connect the adhesive storage chamber 1a and the adhesive outlet 2b respectively. When pressure is applied to the adhesive storage chamber 1a to reach a threshold, the adhesive outlet 2b can output adhesive.

[0030] In this embodiment, the adhesive application device can significantly improve the bonding efficiency and quality between the silicon rod and the resin plate of the slicing machine. The device integrates the handle 1 and the adhesive strip 2, and achieves precise delivery and application of adhesive through the built-in adhesive storage chamber 1a and output channel 2a. The handle 1 not only serves as the part held by the operator, but also functions as the adhesive storage part, making the entire device compact and easy to operate.

[0031] For example, the design of the adhesive storage chamber 1a can employ an elastic material or a compressible structure to facilitate the manual pressurization of adhesive into the output channel 2a inside the adhesive strip 2. When the operator squeezes the handle 1, the internal pressure gradually increases. Once a set threshold is reached, the adhesive flows out evenly from the outlet 2b on the first arc surface 2c through the output channel 2a, ensuring the uniformity and continuity of adhesive distribution.

[0032] The first arc surface 2c of the adhesive strip 2 is precisely designed to fit the curvature of the resin plate of the slicing machine, thereby achieving a high degree of adhesion and ideal bonding effect during the application process. This fit design not only improves the utilization rate of the adhesive but also reduces the risk of bonding failure due to uneven application. In addition, the position and number of adhesive outlets 2b can be adjusted according to actual needs. For example, multiple adhesive outlets 2b can be set on the first arc surface 2c to ensure that the adhesive can quickly cover the entire contact surface during the application process, while avoiding adhesive accumulation or overflow due to excessive local pressure.

[0033] This device not only simplifies the tedious process of traditional manual adhesive application and improves work efficiency, but also ensures the stability and consistency of bonding quality through optimized structural design. In large-area bonding operations between silicon rods and resin boards, this device can effectively reduce secondary processing or rework caused by uneven adhesive distribution, thereby reducing production costs and improving the overall process level. Furthermore, due to its simple structure and intuitive operation, it can be used without professional training, further enhancing its practical value in industrial production.

[0034] Reference Figure 3 and Figure 4 An opening 1b is provided on the side wall of the glue storage chamber 1a, which can communicate with the output channel 2a; it also includes a covering film 5, which covers the opening 1b; when the pressure in the glue storage chamber 1a reaches a threshold, the adhesive can break through the covering film 5, so that the opening 1b is opened.

[0035] In this embodiment, an opening 1b is provided on the side wall of the adhesive storage chamber 1a, and the opening 1b is covered by a membrane 5 to form a pressure-responsive adhesive dispensing control structure. This design uses the membrane 5 as a sealing barrier to isolate the adhesive storage chamber 1a from the output channel 2a. Only when the internal pressure reaches a set threshold can the adhesive break through the membrane 5, opening the opening 1b and initiating adhesive dispensing. This mechanism not only achieves precise control over the timing of adhesive release but also effectively prevents accidental leakage or premature flow of adhesive under unpressurized conditions, improving the stability and operational safety of the device.

[0036] Specifically, the coating 5 can be made of a flexible material with certain tensile strength and bursting threshold, such as plastic film, aluminum foil composite film, or polymer coating film. Its thickness and material can be customized according to the required opening pressure. When the operator applies pressure to the adhesive storage chamber 1a, the adhesive in the storage chamber 1a is squeezed, and the internal pressure gradually increases. When the pressure exceeds the critical bursting strength of the coating 5, the adhesive will break through the coating 5, enter the output channel 2a, and be transported along the guide structure inside the adhesive strip 2 to the elongated strip-shaped adhesive outlet 2b extending along the length direction, realizing a continuous and uniform adhesive application operation.

[0037] When not in use, the adhesive is completely sealed within the adhesive storage chamber 1a, preventing curing or contamination caused by changes in ambient temperature and humidity during long-term storage. Simultaneously, to ensure reliable rupture of the coating 5 under a set pressure, pre-marked areas or locally thinned regions can be provided on the surface of the coating 5 to enhance its consistent response under specific pressure.

[0038] The aforementioned threshold is the pressure value required for the adhesive to break through the coating 5.

[0039] Example 2:

[0040] Reference Figures 3-6 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0041] The glue outlet 2b extends along the length of the glue strip 2 to form a long strip.

[0042] This embodiment further improves the uniformity and coverage efficiency of adhesive application. The elongated adhesive nozzle 2b ensures that the adhesive is linearly distributed along the curved surface of the resin board during application, avoiding discontinuous or localized adhesive shortages that may occur with dotted application. This continuous dispensing method is particularly suitable for bonding operations with large areas or high precision requirements, enabling the adhesive to form a complete and uniform coating layer before the silicone rod contacts the resin board, thereby improving the reliability and stability of the bonding.

[0043] The elongated dispensing nozzle 2b maintains the same curvature as the first arc surface 2c of the adhesive strip 2 and extends along its curved surface, ensuring that the dispensing direction naturally aligns with the application direction and reducing uneven coating caused by angular deviations during operation. Simultaneously, this design also helps reduce the risk of clogging at the dispensing nozzle 2b, as the elongated opening 1b has a larger flow area, accommodating adhesives with higher viscosity or containing small amounts of fillers, thus expanding the applicability of the device.

[0044] This technical solution significantly improves adhesive coating efficiency and consistency, reduces human error, enhances adaptability to different adhesive types and bonding surface shapes, reduces the probability of 2b blockage at the dispensing nozzle, and improves equipment stability and service life. At the same time, it simplifies the operation process, enabling non-professionals to quickly complete high-quality bonding preparation work.

[0045] Example 3:

[0046] Reference Figures 1-4 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0047] Compared with the method of squeezing the handle 1 to output adhesive in the embodiment, the difference in this embodiment is that the adhesive application device also includes a piston 3 and a push rod 4. The piston 3 is slidably connected in the glue storage chamber 1a along the length direction of the glue storage chamber 1a, and the push rod 4 is fixedly connected to the piston 3 and extends to the outside of the handle 1. The operator can push the push rod 4, thereby causing the piston 3 to pressurize the glue storage chamber 1a and reach the threshold.

[0048] The introduction of piston 3 and push rod 4 creates a highly controllable and stable pressure application structure. The operator can manually push push rod 4 to move piston 3 within adhesive storage chamber 1a, thereby applying pressure to the adhesive in chamber 1a. When the pressure reaches a set threshold, the adhesive will break through the coating 5 and enter the output channel 2a, eventually flowing out evenly through the elongated adhesive outlet 2b extending along the length of the adhesive strip 2.

[0049] Compared to the extrusion pressurization method, the piston 3 push method has higher pressure transmission efficiency and stability, which can ensure that the adhesive is output stably after reaching the set pressure, avoiding problems such as discontinuous glue dispensing or uneven coating caused by uneven operating force or hand tremors.

[0050] A scale marking or travel limit device can be set on the push rod 4 to allow the operator to control the pressure level according to actual needs and achieve quantitative control of the glue dispensing amount. For some adhesive materials that require higher dispensing pressure, a non-slip handle 1 or lever structure can be designed at the end of the push rod 4 to reduce the difficulty of operation and improve the comfort of use.

[0051] Example 4:

[0052] Reference Figure 4 and Figure 6 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0053] The adhesive application device also includes a rotating roller 6, which is rotatably connected to the output channel 2a along the longitudinal axis of the adhesive application strip 2. The rotating roller 6 extends from the adhesive outlet 2b and beyond the first arc surface 2c, allowing it to contact the resin plate. It operates as the resin plate moves radially relative to the adhesive application strip 2, thereby applying the adhesive adhering to itself to the resin plate. An adhesive outlet gap is formed between the rotating roller 6 and the adhesive outlet 2b to output the adhesive.

[0054] In this embodiment, the roller 6 can contact the surface of the resin board, which not only enhances the uniformity of adhesive coating, but also improves coating efficiency and operational stability.

[0055] As the adhesive strip 2 moves along the surface of the resin board, the roller 6 contacts the surface of the resin board and rotates accordingly as the resin board moves radially relative to the adhesive strip 2. This rolling contact method allows the surface of the roller 6 to adhere to the adhesive continuously flowing from the dispensing nozzle 2b, and its own rotation evenly spreads the adhesive to the bonding area of ​​the resin board. Compared to direct extrusion, the introduction of the roller 6 effectively avoids inconsistent coating thickness caused by uneven operating force or fluctuations in moving speed, ensuring the smoothness and consistency of the adhesive layer.

[0056] In a specific implementation, the roller 6 can be made of a smooth metal material to prevent the adhesive from curing too quickly on the roller 6 and to reduce damage to the surface of the resin board. In addition, the axial length of the roller 6 can be matched with the length of the adhesive outlet 2b of the adhesive strip 2 to ensure that the entire coating area is effectively covered.

[0057] The circumferential surface of the rotating roller 6 has grooves 6a distributed circumferentially.

[0058] In this adhesive application device, the adhesive trough 6a further optimizes the transfer and application process of the adhesive, improving the uniformity, continuity, and adaptability of the coating. As a structural feature of the surface of the rotating roller 6, the adhesive trough 6a continuously receives adhesive from the adhesive outlet 2b during its rotation and stores it within the trough. Subsequently, upon contact with the resin board surface, it rolls to evenly transfer the adhesive to the bonding area of ​​the resin board. This structure not only enhances the adhesive-carrying capacity of the rotating roller 6 but also effectively improves the controllability and consistency of the adhesive during the coating process.

[0059] The shape, depth, and distribution density of the adhesive tank 6a can be adjusted according to the viscosity of the adhesive, the required coating thickness, and the surface characteristics of the resin board. For example, for high-viscosity adhesives, a deeper adhesive tank 6a with larger spacing can be designed to enhance its carrying and release capabilities; while for applications requiring thin-layer coating, a shallow, densely spaced tank can be used to ensure uniform adhesive distribution without accumulation. Furthermore, the edges of the adhesive tank 6a can be designed with rounded corners to reduce scratch damage to the resin board surface during coating, improving operational safety.

[0060] In a specific implementation, the adhesive groove 6a can be directly formed on the surface of the roller 6 using processes such as machining. If the roller 6 is made of an elastic material such as silicone or polyurethane, the adhesive groove 6a can also undergo elastic deformation to a certain extent, so that it can still maintain a good adhesive transfer effect when contacting surfaces with different curvatures or uneven surfaces.

[0061] Example 5:

[0062] Reference Figures 1-4 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0063] The adhesive strip 2 is detachably connected to the handle 1. Multiple adhesive strips 2 are available in various lengths and models.

[0064] In this embodiment, the adhesive strip 2 and the handle 1 are connected by a detachable structure, giving the adhesive application device greater flexibility and adaptability. This allows the operator to quickly change adhesive strips 2 of different lengths and models to fit resin plates of different sizes in the slicing machine, thereby achieving more efficient and precise adhesive application. This modular structure not only improves the versatility of the device but also significantly enhances its applicability under various working conditions.

[0065] Specifically, the adhesive strip 2 and the handle 1 can be connected securely and conveniently through snaps, threads, or plugs. The connection structure should ensure sealing and structural strength while also facilitating disassembly and replacement to improve operational efficiency. For example, a standardized interface can be provided at the end of the handle 1 to form a sealed connection with the bottom of adhesive strips 2 of different lengths, automatically connecting the glue storage chamber 1a and the output channel 2a, ensuring that the adhesive can still be smoothly delivered to the glue outlet 2b after the adhesive strip 2 is replaced.

[0066] Offering various lengths of adhesive application strips 2 allows the device to adapt to the coating needs of resin board surfaces of different widths. For example, when processing small or narrow resin boards, a shorter adhesive application strip 2 can be selected to improve operational flexibility and coating accuracy; while in large-area bonding operations, a longer adhesive application strip 2 can be used to achieve full coverage in a single coating, reducing repetitive operations and improving work efficiency. Furthermore, adhesive application strips 2 of different lengths can be used with rollers 6 and glue tank 6a of different specifications to meet the requirements of different adhesive types, coating thicknesses, and process parameters.

[0067] This technical solution enhances the versatility and expandability of the device. By simply replacing the adhesive strip 2, it can be adapted to various specifications of resin boards, reducing the cost of repeated equipment purchases and maintenance. It also improves ease of operation, shortens replacement time, and increases on-site work efficiency. Furthermore, it optimizes the coating effect, as adhesive strips 2 of different lengths can more accurately match the coating area, ensuring uniform and complete adhesive distribution. It also facilitates cleaning and maintenance; when the adhesive strip 2 becomes clogged or worn, only the corresponding part needs to be replaced without affecting the normal use of the entire device.

[0068] Example 6:

[0069] Reference Figure 2 In addition to possessing all the technical solutions of the above embodiments, the embodiments of this utility model further possess the following technical solutions:

[0070] The other side of the adhesive strip 2 in the width direction is a second arc surface 2d, and the second arc surface 2d is adapted to the curvature of the resin board to form a second adhesive surface.

[0071] In this adhesive application device, the second adhesive application surface further expands the device's versatility, enabling it to simultaneously or continuously apply adhesive to two different curved areas of the resin board in one operation, significantly improving coating efficiency and ease of operation.

[0072] Specifically, the adhesive strip has a first arc surface and a second arc surface on both sides. Both are designed to fit the different arc surface structures of the resin board, ensuring that they can adhere to the area to be bonded during the application process and reducing problems such as uneven adhesive distribution or air bubble residue caused by poor contact.

[0073] The first arc surface 2c can dispense adhesive, and the second arc surface 2d can act as a trowel. Since it does not have an adhesive outlet 2b, it is flatter and can further smooth the adhesive on the resin board.

[0074] It can be understood that, except for conflicting parts, the above embodiments 1-6 can be freely combined to form other embodiments of this utility model.

[0075] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0076] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0077] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0078] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to those processes, articles, or apparatus / devices.

[0079] The technical solution of this utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the protection scope of this utility model is obviously not limited to these specific embodiments. Without departing from the principle of this utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of this utility model.

Claims

1. A glue applicator for bonding silicon rods and resin plates of a slicing machine, characterized in that: Includes a handle (1) and an adhesive strip (2) fixedly connected to the handle (1). One side of the adhesive strip (2) in the width direction is a first arc surface (2c), and the first arc surface (2c) is adapted to the curvature of the resin board to form a first adhesive surface. The handle (1) has a storage chamber (1a) for storing adhesive, the adhesive strip (2) has an output channel (2a), and the first arc surface (2c) has an outlet (2b). The output channel (2a) can connect the storage chamber (1a) and the outlet (2b) respectively. When the pressure applied to the storage chamber (1a) reaches a threshold, the outlet (2b) can output adhesive.

2. The adhesive applicator for bonding silicon rods and slicing machine resin plates as described in claim 1, characterized in that: The glue outlet (2b) extends along the length of the glue strip (2) to form a long strip.

3. The adhesive applicator for bonding silicon rods and slicing machine resin plates as described in claim 1, characterized in that: It also includes a piston (3) and a push rod (4), wherein the piston (3) is slidably connected in the glue storage chamber (1a) along the length direction of the glue storage chamber (1a), and the push rod (4) is fixedly connected to the piston (3) and extends to the outside of the handle (1); The operator can push the push rod (4), thereby causing the piston (3) to pressurize the glue reservoir (1a) to a threshold.

4. The adhesive applicator for bonding silicon rods and slicing machine resin plates as described in claim 1, characterized in that: An opening (1b) is provided on the side wall of the glue storage chamber (1a), and the opening (1b) can communicate with the output channel (2a); It also includes a film (5) that covers the opening (1b); When the pressure inside the adhesive storage chamber (1a) reaches a threshold, the adhesive can break through the membrane (5) to open the opening (1b).

5. The adhesive applicator for bonding silicon rods and slicing machine resin plates as described in claim 1, characterized in that: It also includes a rotating roller (6), which is rotatably connected to the output channel (2a) along the longitudinal axis of the adhesive strip (2), and the rotating roller (6) extends out of the adhesive outlet (2b) and extends beyond the first arc surface (2c) so that the rotating roller (6) can contact the resin board and operate when the resin board moves radially relative to the adhesive strip (2), thereby allowing the rotating roller (6) to apply the adhesive attached to itself to the resin board; A glue outlet gap is formed between the rotating roller (6) and the glue outlet (2b).

6. The adhesive applicator for bonding silicon rods and slicing machine resin plates as described in claim 5, characterized in that: The circumferential surface of the roller (6) is provided with a rubber groove (6a).

7. The adhesive applicator for bonding silicon rods and slicing machine resin plates as described in claim 6, characterized in that: The other side of the adhesive strip (2) in the width direction is a second arc surface (2d), and the second arc surface (2d) is adapted to the curvature of the resin board to form a second adhesive surface.

8. The adhesive applicator for bonding silicon rods and slicing machine resin plates as described in claim 7, characterized in that: The adhesive strip (2) is detachably connected to the handle (1).

9. The adhesive applicator for bonding silicon rods and slicing machine resin plates as described in claim 8, characterized in that: The adhesive strip (2) is available in multiple lengths and models.

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