Positioning clamp for chip bonding

Abstract

The utility model provides a positioning clamp for chip bonding, which belongs to the technical field of chip positioning clamps and comprises a base. The chip positioning table and the supporting plate are arranged on the top of the base, and the chip positioning table is located on one side of the supporting plate; the chip upper positioning groove is formed in the central position of the top of the chip positioning table; the feeding and discharging alternating assembly is arranged on the inner side of the chip positioning table; the feeding and discharging alternating assembly comprises a hot pressing bonding table sliding on the inner side wall of the chip positioning table. The chip lower positioning groove is formed in the top of the thermocompression bonding table; the clamping groove is formed in the inner side wall of the chip lower positioning groove; the slot is formed in the outer wall of one side of the thermocompression bonding table and is communicated with the clamping groove; according to the utility model, through the mutual cooperation of the loading and unloading rotation assembly and the material ejecting and discharging assembly, the unloading position of the bonded chips and the loading position of the non-bonded chips are staggered, so that loading and unloading are facilitated at the same time, and the chip bonding efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of chip positioning fixture technology, specifically relating to a positioning fixture for chip bonding. Background Technology

[0002] Chip bonding is a core process in semiconductor packaging, mainly used to achieve mechanical connection and electrical interconnection between chips and substrates or between chips.

[0003] During chip bonding, a fixture is needed to position and hold the two parts of the chip. After positioning, some chips need to be thermo-bonded using equipment. After bonding, the fixture needs to be removed. When removing the chip, an ejector mechanism is usually used to eject the chip. At this time, chip loading and unloading are completed in the same position, which causes mutual interference and reduces the bonding efficiency of the chip.

[0004] Therefore, a positioning fixture for chip bonding is proposed. Summary of the Invention

[0005] This invention provides a positioning fixture for chip bonding, the purpose of which is to solve the problems mentioned above.

[0006] This utility model provides a positioning fixture for chip bonding, including a base; a chip positioning stage and a support plate disposed on the top of the base, the chip positioning stage being located on one side of the support plate; a chip positioning groove formed at the center of the top of the chip positioning stage; and a loading / unloading rotation assembly disposed inside the chip positioning stage; wherein the loading / unloading rotation assembly includes: a hot-press bonding stage sliding on the inner wall of the chip positioning stage; a lower chip positioning groove formed on the top of the hot-press bonding stage; a slot formed on the inner wall of the lower chip positioning groove; a slot formed on the outer wall of one side of the hot-press bonding stage and communicating with the slot; a spring one disposed at the bottom of the lower chip positioning groove; and a top-discharge assembly disposed inside the lower chip positioning groove; wherein the top-discharge assembly includes: a support plate disposed at the top of the spring one; an inner groove formed on the outer wall of the support plate; a spring two disposed on the inner wall of the inner groove; a locking block disposed at one end of the spring two; and an insertion rod disposed on the outer wall of the support plate.

[0007] Furthermore, an electric push rod is provided on one side of the outer wall of the support plate, and the output end of the electric push rod is fixedly connected to one side of the outer wall of the hot pressing bonding stage.

[0008] Furthermore, a through guide hole is provided at the bottom of the lower positioning slot of the chip, and a guide post is provided through the guide hole. A limit plate is provided at the bottom end of the guide post near the lower position of the hot-press bonding stage, and a limit ring is provided on the outer side wall of the guide post near the inner side of the lower positioning slot of the chip.

[0009] Furthermore, both the card block and the insertion rod have matching bevels on one side of their outer walls;

[0010] By adopting the above technical solution, the inclined plane causes the insert rod to contact the locking block, which is then pushed and moved, causing the locking block to disengage from the slot.

[0011] Furthermore, the card block can be embedded inside the card slot, and the card block and the support plate are connected by a guide rod and a guide hole;

[0012] By adopting the above technical solution, the guide rod and guide hole ensure the linear movement of the card block, so that the card block can be embedded in the card slot, thereby achieving the limitation of the position of the support plate.

[0013] Furthermore, the upper positioning slot and the lower positioning slot of the chip coincide;

[0014] By adopting the above technical solution, it is ensured that after the two parts of the chip are placed in the positioning slot on the chip, they can fall into the positioning slot on the chip, which facilitates subsequent hot-press bonding.

[0015] The beneficial effects of this utility model are as follows:

[0016] This invention utilizes the cooperation of a loading / unloading rotation component and a top-loading ejection component to stagger the unloading positions of bonded chips and the loading positions of unbonded chips, facilitating simultaneous loading and unloading and improving chip bonding efficiency. Through the cooperation of the locking block and the insertion rod, it ensures that the chips on the support plate are at a limited height after thermoforming bonding, facilitating chip transfer. Furthermore, it ensures that when the support plate moves to the set position, the thermoformed chips can be ejected from the chip positioning slot, facilitating chip removal. Chip removal and thermoforming bonding operations can be performed simultaneously.

[0017] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained by means of the structures particularly pointed out in the description and the drawings. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0020] Figure 2 This is a schematic diagram of the hot-press bonding stage structure according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the support plate structure according to an embodiment of the present utility model;

[0022] Figure 4 This is a schematic diagram of the top material discharge assembly structure according to an embodiment of the present utility model;

[0023] Figure 5 This is a cross-sectional view of the chip positioning stage according to an embodiment of the present invention;

[0024] Reference numerals in the attached diagram: 1. Base; 2. Chip positioning stage; 3. Upper positioning slot of chip; 4. Support plate; 5. Electric push rod; 6. Loading / unloading rotating assembly; 61. Hot pressing bonding stage; 62. Lower positioning slot of chip; 63. Slot; 64. Slot; 65. Spring 1; 66. Guide hole; 7. Top material ejection assembly; 71. Support plate; 72. Inner groove; 73. Spring 2; 74. Locking block; 75. Guide post; 76. Limiting plate; 77. Limiting ring; 78. Insertion rod. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0026] Reference Figure 1-5 This utility model embodiment proposes a positioning fixture for chip bonding, including a base 1, a chip positioning stage 2 is provided on the top of the base 1, a chip positioning groove 3 is provided at the center of the top of the chip positioning stage 2, and two support plates 4 are symmetrically arranged on the top of the base 1 near the outer side of the chip positioning stage 2, and an electric push rod 5 is provided on one side of the outer wall of one of the support plates 4.

[0027] The electric push rod 5 is fixedly connected to the hot pressing bonding stage 61 in the loading and unloading rotation assembly 6 through its output end on one side. The hot pressing bonding stage 61 has two chip lower positioning slots 62 symmetrically opened on its top. The chip upper positioning slot 3 and the chip lower positioning slot 62 overlap to ensure that the two parts of the chip can fall into the chip lower positioning slot 62 after being placed in the chip upper positioning slot 3, which facilitates subsequent hot pressing bonding. Two slots 63 are symmetrically opened on the inner side wall of the two chip lower positioning slots 62. Slots 64 are opened on the outer side wall of one side of the hot pressing bonding stage 61 near the two slots 63. A spring 65 is provided at the bottom inside the chip lower positioning slot 62, and a guide hole 66 is provided at the bottom inside the chip lower positioning slot 62 near the outer side of the spring 65.

[0028] The top of spring 65 is provided with a support plate 71 from the top material discharge assembly 7. Two symmetrical inner grooves 72 are formed on the outer wall of the support plate 71. A spring 73 is provided on the inner wall of each of the two inner grooves 72. A locking block 74 is provided at one end of each spring 73. The locking block 74 can be embedded inside the locking groove 63. The locking block 74 and the support plate 71 are guided and connected by a guide rod and a guide hole. The guide rod and guide hole ensure linear movement of the locking block 74, allowing it to be embedded in the locking groove 63, thereby limiting the position of the support plate 71. The bottom of the support plate 71 is provided with… A guide post 75 passes through a guide hole 66. A limit plate 76 is provided at the bottom end of the guide post 75 near the lower part of the hot-press bonding stage 61. A limit ring 77 is provided on the outer side wall of the guide post 75 near the inner side of the chip lower positioning groove 62. Insert rods 78 are provided on the horizontal side of one side of the outer wall of the two support plates 4 near the slot 64. Matching and fitting inclined surfaces are provided on one side of the outer wall of the card block 74 and the insert rods 78. After the insert rods 78 contact the card block 74 through the inclined surfaces, the card block 74 is pushed and moved, causing the card block 74 to disengage from the card slot 63.

[0029] The specific implementation method is as follows: When performing chip thermo-bonding, the two parts of the chip are placed into the chip upper positioning groove 3 in sequence, and the chip falls into the support plate 71 in the chip lower positioning groove 62. The chip on the support plate 71 is thermo-bonded by the equipment. When the chip is squeezed, the support plate 71 moves downward synchronously. Under the vertical guidance of the guide hole 66 and the guide post 75, the support plate 71 moves vertically downward. When the locking block 74 on the support plate 71 coincides with the locking groove 63, the squeezing force of the inner wall of the chip lower positioning groove 62 on the locking block 74 disappears. Under the action of the rebound force of the second spring 73, the locking block 74 is pushed into the locking groove 63, realizing the position limit of the support plate 71. At this time, the guide post 75 cannot continue to move downward under the limit of the limiting ring 77. The guide post 75 supports the support plate 71.

[0030] As the support plate 71 moves downward a certain distance, the chip on the support plate 71 is completely inside the chip lower positioning groove 62. The control electric push rod 5 drives the thermosetting bonding stage 61 to move linearly through its output end on one side. One of the chip lower positioning grooves 62 on the thermosetting bonding stage 61 is misaligned with the chip upper positioning groove 3. At this time, the chip is misaligned with the chip upper positioning groove 3. When the thermosetting bonding stage 61 moves horizontally, the insertion rod 78 passes through the slot 64 and enters the card slot 63. Through the setting of the insertion rod 78 and the inclined surface on the card block 74, the insertion rod 78 can push the card block 74 to move. The card block 74 is put into the card slot 63. After the support plate 71 loses its limit, under the action of the spring force 65, the support plate 71 is pushed upward. The chip after thermosetting bonding on the support plate 71 is pushed out of the chip lower positioning groove 62, which is convenient for material picking. Material picking and thermosetting bonding operations can be carried out simultaneously, which is highly efficient.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A positioning fixture for chip bonding, characterized in that: Including the base (1); A chip positioning stage (2) and a support plate (4) are provided on the top of the base (1), with the chip positioning stage (2) located on one side of the support plate (4); A chip positioning groove (3) is formed at the top center of the chip positioning stage (2); The loading and unloading rotation assembly (6) is located inside the chip positioning stage (2); The loading and unloading rotation assembly (6) includes: A thermosetting bonding stage (61) that slides on the inner wall of the chip positioning stage (2); A chip lower positioning groove (62) is formed on the top of the hot-press bonding stage (61); A slot (63) is formed on the inner side wall of the lower positioning groove (62) of the chip; A slot (64) is formed on one side of the outer wall of the hot-press bonding stage (61) and communicates with the slot (63); A spring (65) is provided at the bottom of the lower positioning groove (62) of the chip; and A top material discharge assembly (7) is provided inside the lower positioning groove (62) of the chip; The top material discharge assembly (7) includes: A support plate (71) is provided at the top of the spring (65); An inner groove (72) is formed on the outer wall of the support plate (71); Spring 2 (73) is provided on the inner sidewall of the inner groove (72); A locking block (74) is provided at one end of the second spring (73); Insert rod (78) is provided on the outer wall of the support plate (4).

2. The positioning jig for die bonding according to claim 1, characterized by: An electric push rod (5) is provided on one side of the outer wall of the support plate (4), and the output end of the electric push rod (5) is fixedly connected to one side of the outer wall of the hot pressing bonding table (61).

3. The positioning jig for die bonding according to claim 1, characterized by: The bottom of the chip lower positioning groove (62) is provided with a through guide hole (66), and a guide post (75) passes through the guide hole (66). A limit plate (76) is provided at the bottom of the guide post (75) near the lower part of the hot-press bonding stage (61), and a limit ring (77) is provided on the outer side wall of the guide post (75) near the inner side of the chip lower positioning groove (62).

4. The positioning jig for die bonding according to claim 1, characterized by: Both the card block (74) and the insert rod (78) have matching bevels on one side of their outer walls.

5. The positioning jig for die bonding according to claim 1, characterized by: The card block (74) can be embedded inside the card slot (63), and the card block (74) and the support plate (71) are connected by a guide rod and a guide hole.

6. The positioning jig for die bonding according to claim 1, characterized by: The upper positioning slot (3) and the lower positioning slot (62) of the chip overlap.

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