Wafer glue baking equipment

Abstract

The utility model relates to a baking equipment technical field discloses a wafer baking equipment, including base, the middle part of base is installed with control panel, the top of base is installed with work tank, the outside fixed connection of work tank has the hinge, the other end fixed connection of hinge has apron, the inside installation of work tank has cooling assembly, cooling assembly includes liquid storage tank, liquid storage tank fixedly connects in the inside of work tank, the middle part fixed connection of liquid storage tank has the discharge pipe, the other end fixed connection of discharge pipe has the circulation pipe. In the utility model, through the micro water pump cooperation draws the cooling liquid in the inside of liquid storage tank, and then is transported to the circulation pipe, to realize the fast cooling to the semiconductor, and then realizes the circulation use to the cooling liquid in the circulation pipe by the discharge pipe and is arranged into liquid storage tank, thereby realizes the fast cooling effect to the semiconductor, makes the semiconductor processing efficiency to obtain the improvement.

Description

TECHNICAL FIELD

[0001] The utility model relates to a baking equipment technical field especially relates to a wafer baking equipment. BACKGROUND

[0002] The baking machine is a kind of temperature control heating equipment, mainly used for the surface coating after the plate making of semiconductor silicon wafer, glass slide, wafer, substrate, ITO conductive glass process, film drying, curing, the temperature control range of baking machine is generally between room temperature-360 degrees, temperature control precision is high, it is applicable to various temperature control precision high, heating uniformity requirement high laboratory.

[0003] After the semiconductor baking by high temperature heating, the temperature of semiconductor surface is higher, in the prior art, generally after natural cooling, and natural cooling is simple and low in cost, but it depends on environment, and needs to spend longer time, it is not convenient for quick switching process step, thereby reduce the semiconductor production and processing efficiency, to solve the above problems, a wafer baking equipment is provided. UTILITY MODEL CONTENTS

[0004] In order to make up for the above insufficient, the utility model provides a wafer baking equipment, to improve the prior art in natural cooling environment, and needs to spend longer time, thereby leading to the problem of semiconductor processing efficiency reduction.

[0005] In order to realize the above purpose, the utility model adopts the following technical scheme: A wafer baking equipment, including base, the middle part of base is equipped with control panel, the top of base is equipped with working box, the outer side of working box is fixedly connected with hinge, the other end of hinge is fixedly connected with cover plate, the inner side of working box is equipped with cooling assembly; The cooling assembly includes liquid storage tank, the inner side of working box is fixedly connected with liquid storage tank, the middle part of liquid storage tank is fixedly connected with discharge pipe, the other end of discharge pipe is fixedly connected with circulation pipe, the other end of circulation pipe is fixedly connected with micro water pump, the input end of micro water pump is fixedly connected with extraction pipe, and micro water pump is located in the inside of liquid storage tank; As a further description of the above technical scheme: The outer side of cover plate is equipped with air inlet hole, the middle part of cover plate is equipped with cooling fan, the top of cover plate is fixedly connected with support, the middle part of support is slidably connected with filter screen; As a further description of the above technical scheme: The middle part of support is slidably connected with fixed rod, and the inside of support is provided with spring; As a further description of the above technical scheme: The outer side of the filter screen is provided with a fixing hole, and the fixing rod and the fixing hole are mutually clamped; As a further description of the above technical solution: The inner side of the working box is provided with a heating table, and the middle part of the heating table is provided with a thimble; As a further description of the above technical solution: The middle part of the working box is fixedly connected with a partition plate, and the inner side of the working box is provided with a limiting column; As a further description of the above technical solution: The outer side of the heating table is provided with a groove, and the limiting column is located in the middle part of the groove; As a further description of the above technical solution: The bottom of the base is fixedly connected with a supporting column, and the outer side of the cover plate is fixedly connected with a handle.

[0006] The utility model has the advantages of the following beneficial effects: 1、In the utility model, the cooling liquid in the liquid storage tank is extracted by the micro water pump and the extraction pipe, and then is transported into the circulating pipe, so that the semiconductor is rapidly cooled, and the cooling liquid in the circulating pipe is discharged into the liquid storage tank by the discharge pipe to realize the recycling, thereby realizing the rapid cooling effect of the semiconductor and improving the semiconductor processing efficiency.

[0007] 2、In the utility model, the air in the cover plate is rapidly circulated through the cooperation of the cooling fan and the air inlet hole, so that the temperature in the working box is reduced, and then the semiconductor is cooled by the cooling assembly, thereby avoiding the phenomenon of semiconductor edge curling caused by thermal shock. DRAWINGS

[0008] Figure 1 A three-dimensional schematic view of a wafer baking equipment is provided for the utility model; Figure 2 A structural schematic view of a working box of a wafer baking equipment is provided for the utility model; Figure 3 A structural schematic view of a heating table of a wafer baking equipment is provided for the utility model; Figure 4 A structural schematic view of a cooling fan of a wafer baking equipment is provided for the utility model; Figure 5 A structural schematic view of a thimble of a wafer baking equipment is provided for the utility model; Figure 6 A structural schematic view of a circulating pipe of a wafer baking equipment is provided for the utility model.

[0009] LEGEND: 1, base; 2, support column; 3, control panel; 4, work tank; 5, hinge; 6, cover plate; 7, handle; 8, support; 9, filter screen; 10, fixed hole; 11, fixed rod; 12, spring; 13, heat dissipation fan; 14, thimble; 15, heating table; 16, partition; 17, liquid storage tank; 18, extraction pipe; 19, circulating pipe; 20, discharge pipe; 21, micro water pump; 22, limiting column; 23, groove; 24, air inlet hole. DETAILED DESCRIPTION

[0010] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0011] Referring to Figure 1 , Figure 2 , Figure 5 and Figure 6The utility model provides a kind of wafer glue baking equipment, including base 1, the middle part of base 1 is equipped with control panel 3, the top of base 1 is equipped with working tank 4, and working tank 4 is provided with stable support by base 1, so that working tank 4 can be stably operated, the control of equipment is realized by control panel 3, to realize the switching of manufacturing process, the outside of working tank 4 is fixedly connected with hinge 5, the other end of hinge 5 is fixedly connected with cover plate 6, cover plate 6 can be connected with working tank 4 by hinge 5, to realize the sealing of working tank 4 by cover plate 6, so that equipment can better process semiconductor, the inside of working tank 4 is equipped with cooling assembly, and the rapid cooling of semiconductor is realized by cooling assembly, to pass through the working efficiency of semiconductor processing, cooling assembly includes liquid storage tank 17, and liquid storage tank 17 is fixedly connected in the inside of working tank 4, and working tank 4 supports liquid storage tank 17, so that liquid storage tank 17 can be stably operated, the storage of cooling liquid is realized by liquid storage tank 17, the middle part of liquid storage tank 17 is fixedly connected with discharge pipe 20, the other end of discharge pipe 20 is fixedly connected with circulation pipe 19, the other end of circulation pipe 19 is fixedly connected with micro water pump 21, the input end of micro water pump 21 is fixedly connected with extraction pipe 18, and micro water pump 21 is located in the inside of liquid storage tank 17, and the extraction of cooling liquid in liquid storage tank 17 is realized by micro water pump 21 and extraction pipe 18 cooperation, and is transported to circulation pipe 19, to realize the rapid cooling of semiconductor, the cooling liquid in circulation pipe 19 is discharged by discharge pipe 20, so that cooling liquid returns to liquid storage tank 17, to realize the circulation use of cooling liquid, the rapid cooling of semiconductor is realized by the cooperation between each structure of cooling assembly, so that manufacturing process can be quickly switched, to improve the processing efficiency of semiconductor.

[0012] Referring to Figures 1-6An air inlet 24 is provided on the outer side of the cover plate 6, and a cooling fan 13 is installed in the middle of the cover plate 6. The cover plate 6 provides support for the cooling fan 13, enabling the cooling fan 13 to operate stably. This allows the cooling fan 13 and the air inlet 24 to work together to allow the air inside the cover plate 6 to circulate rapidly, thereby cooling the working chamber 4. A bracket 8 is fixedly connected to the top of the cover plate 6, and a filter screen 9 is slidably connected to the middle of the bracket 8. The cover plate 6 provides support for the bracket 8, enabling the bracket 8 to operate stably, thereby providing stable support for the filter screen 9. Dust is blocked by the filter screen 9, preventing it from entering the interior of the cover plate 6 and affecting the air circulation inside the cover plate 6. A fixing rod 11 is slidably connected to the middle of the bracket 8, and a spring 12 is installed inside the bracket 8. A fixing hole 10 is opened on the outer side of the filter screen 9. The fixing rod 11 and the fixing hole 10 are interlocked, and the filter screen 9 is locked by the cooperation of the fixing rod 11 and the fixing hole 10, so that the filter screen 9 will not shift during operation. The spring 12 can reset the fixing rod 11 after it moves. The inner working box 4 A heating stage 15 is mounted on the side, and a ejector pin 14 is mounted in the middle of the heating stage 15. The working box 4 provides support for the heating stage 15, enabling it to operate stably and heat the semiconductor. The heating stage 15 also supports the ejector pin 14, allowing it to operate stably and support the semiconductor. This allows the semiconductor to rise and fall at a suitable temperature, ensuring uniform heating on both sides. A partition 16 is fixedly connected to the middle of the working box 4, which controls the heating stage 15 and the circulating circuit. The tube 19 is divided, and a limiting post 22 is installed on the inner side of the work box 4. A groove 23 is opened on the outer side of the heating table 15. The limiting post 22 is located in the middle of the groove 23. The groove 23 and the limiting post 22 cooperate with each other to limit the heating table 15, so that the heating table 15 will not be displaced when it is working. A support post 2 is fixedly connected to the bottom of the base 1, and a handle 7 is fixedly connected to the outer side of the cover plate 6. The support post 2 provides stable support for the base 1, so that the base 1 can better support the equipment to work. The handle 7 makes it easier to open and close the cover plate 6.

[0013] Working Principle: During use, the manufacturing process parameters are set via the control panel 3. After setting, pulling the handle 7 moves the cover plate 6, causing it to rotate with the hinge 5, thus opening the cover plate 6. The semiconductor to be processed can then be placed on the ejector pin 14 in the center of the heating table 15. The cover plate 6 is then reset to close the work chamber 4. The equipment is then started to heat the semiconductor inside the work chamber 4, achieving high-temperature processing. After processing, the cooling fan 13 is activated. The cooling fan 13 and the air inlet 24 work together to heat the interior of the cover plate 6. The air is rapidly circulated to reduce the temperature inside the working chamber 4. Once the temperature inside the working chamber 4 has decreased, the micro water pump 21 is activated to extract coolant from the storage tank 17 via the extraction pipe 18. The coolant is then transported to the circulation pipe 19 and discharged back into the storage tank 17 via the discharge pipe 20, thus achieving the recycling of the coolant. Simultaneously, the circulation of the coolant continuously and rapidly cools the semiconductor, resulting in a stable and rapid temperature reduction. At this point, the cover plate 6 can be opened to remove the cooled semiconductor, and a new semiconductor to be processed can be placed in, thereby improving the semiconductor processing efficiency.

[0014] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer coating equipment, comprising a base (1), characterized in that: A control panel (3) is installed in the middle of the base (1), a work box (4) is installed on the top of the base (1), a hinge (5) is fixedly connected to the outside of the work box (4), a cover plate (6) is fixedly connected to the other end of the hinge (5), and a cooling component is installed on the inside of the work box (4). The cooling assembly includes a liquid storage tank (17), which is fixedly connected to the inside of the working box (4). A discharge pipe (20) is fixedly connected to the middle of the liquid storage tank (17), and a circulation pipe (19) is fixedly connected to the other end of the discharge pipe (20). A micro water pump (21) is fixedly connected to the other end of the circulation pipe (19), and an extraction pipe (18) is fixedly connected to the input end of the micro water pump (21). The micro water pump (21) is located inside the liquid storage tank (17).

2. The wafer coating equipment according to claim 1, characterized in that: An air inlet (24) is provided on the outer side of the cover plate (6), a cooling fan (13) is installed in the middle of the cover plate (6), a bracket (8) is fixedly connected to the top of the cover plate (6), and a filter screen (9) is slidably connected to the middle of the bracket (8).

3. The wafer coating equipment according to claim 2, characterized in that: A fixing rod (11) is slidably connected to the middle of the bracket (8), and a spring (12) is provided inside the bracket (8).

4. The wafer coating equipment according to claim 3, characterized in that: The filter screen (9) has a fixing hole (10) on its outer side, and the fixing rod (11) and the fixing hole (10) are engaged with each other.

5. The wafer coating equipment according to claim 1, characterized in that: A heating table (15) is installed on the inner side of the work box (4), and a pin (14) is installed in the middle of the heating table (15).

6. The wafer coating equipment according to claim 5, characterized in that: A partition (16) is fixedly connected to the middle of the work box (4), and a limit post (22) is installed on the inner side of the work box (4).

7. The wafer coating equipment according to claim 6, characterized in that: The heating platform (15) has a groove (23) on its outer side, and the limiting post (22) is located in the middle of the groove (23).

8. The wafer coating equipment according to claim 1, characterized in that: The bottom of the base (1) is fixedly connected to a support column (2), and the outer side of the cover plate (6) is fixedly connected to a handle (7).

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