Electronic component carrier preventing chip stringing

Abstract

The utility model discloses a kind of electronic component carrier tapes of preventing chip string material, it is related to electronic device packaging technical field, including carrier tape body, the upper surface of carrier tape body is equidistantly symmetrical and arranged element accommodating cavity along length direction, four inner angles of element accommodating cavity are round corner transition structure, the edge of element accommodating cavity integrally formed has the reinforcing frame that projects upwards, the upper surface of carrier tape body is equidistantly symmetrical and set positioning hole along length direction, the axis of positioning hole is parallel with the center axis of element accommodating cavity and is arranged, buffer pad is movably connected in element accommodating cavity cavity bottom, fixed assembly is installed on the other side of buffer pad.The utility model uses above-mentioned structure, can limit the displacement of chip in carrier tape, avoid physical damage due to mutual collision, friction, and can reduce string material, prevent chip from causing static electricity accumulation and discharge due to jolt in transport process, avoid chip internal circuit to be punctured.

Description

Technical Field

[0001] This utility model belongs to the field of electronic device packaging technology, and specifically relates to an electronic component carrier tape for preventing chip cross-contamination. Background Technology

[0002] Electronic component carrier tape is a strip-shaped packaging material used in the electronics manufacturing industry to carry, protect, and transport surface-mount electronic components (such as resistors, capacitors, and chips). It is typically made of plastic (such as PET, PS, etc.), paper, or metal, with regularly arranged cavities on its surface for precise component fixation, and positioning holes on both sides to facilitate high-speed transport and positioning operations by automated equipment (such as pick-and-place machines). Depending on its function, carrier tape can be divided into through-hole carrier tape, embossed carrier tape, etc., and is often used in conjunction with cover tape to form a sealed package to isolate dust and moisture. It is widely used in SMT (Surface Mount Technology) production lines for semiconductors and electronic component assembly, effectively preventing component damage during transportation and storage, and improving placement efficiency and accuracy through standardized design. It is an indispensable key auxiliary material in the automated production process of electronic components.

[0003] Currently available carrier tapes can cause chips to move and collide freely within the carrier tape's containment cavity during transportation and handling. This can lead to chip corners breaking, pins deforming and bending, and damage to the chip's structural integrity, directly causing chip failure and rendering it unusable. For example, some precision small-sized chips are easily damaged by bumps and knocks during serial movement, affecting subsequent performance. Utility Model Content

[0004] In response to the problems mentioned in the background art, the purpose of this utility model is to provide an electronic component carrier tape that prevents chip cross-contamination, so as to solve the problem that during transportation and handling, chips move and collide randomly in the carrier tape cavity, causing chip corners to break, pins to deform and bend, damaging the integrity of the chip structure, directly leading to chip failure and inability to be used normally.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: An electronic component carrier tape for preventing chip crosstalk includes a carrier tape body. Component receiving cavities are symmetrically arranged at equal intervals along the length of the upper surface of the carrier tape body. The four inner corners of each component receiving cavity have rounded transitions. An upwardly protruding reinforcing frame is integrally formed on the edge of each component receiving cavity. Positioning holes are symmetrically opened at equal intervals along the length of the upper surface of the carrier tape body. The axis of the positioning holes is parallel to the central axis of the component receiving cavity. A buffer pad is movably connected to the bottom of each component receiving cavity. A fixing component is installed on the other side of the buffer pad. The width of the carrier tape body is available in 8, 12, and 16mm, etc., which can limit the displacement of chips within the carrier tape, avoiding physical damage caused by mutual collisions and friction, such as chip corner breakage and pin deformation. Furthermore, it can reduce crosstalk, prevent electrostatic accumulation and discharge caused by chip shaking during transportation, avoid damage to the internal circuitry of the chip, and ensure the stability of its electrical performance.

[0006] As a preferred technical solution, the carrier tape body includes a substrate layer, an antistatic layer, a buffer layer, a heat-sealing layer, and a moisture-proof layer. The upper surface of the substrate layer is provided with an antistatic layer, and the lower surface of the substrate layer is provided with a buffer layer. The upper surface of the antistatic layer is provided with a heat-sealing layer, and the lower surface of the buffer layer is provided with a moisture-proof layer. The substrate layer is made of polystyrene, the antistatic layer is made of polycarbonate with added antistatic agents, the buffer layer is made of low-density polyethylene, and the heat-sealing layer is made of ethylene-... The vinyl acetate copolymer and the moisture-proof layer are made of aluminum foil or aluminized polyester film. The substrate layer, antistatic layer, buffer layer, heat-sealing layer and moisture-proof layer are bonded together with adhesive. The substrate layer 101, with a thickness of 0.2-0.5 mm, provides basic strength and rigidity for the carrier tape. The antistatic layer 102, with a thickness of 0.05-0.1 mm, effectively prevents static electricity accumulation from damaging electronic components. The buffer layer 103, with a thickness of 0.1-0.3 mm, has good cushioning performance and protects electronic components from vibration and impact. The heat-sealing layer 104, with a thickness of 0.03-0.08 mm, is used to heat-seal with the cover tape to form a sealed space. The moisture-proof layer 105, with a thickness of 0.01-0.05 mm, effectively blocks moisture and humidity.

[0007] As a preferred technical solution, the carrier belt body has symmetrically spaced mounting grooves along its length on one side. Reinforcing ribs are fixedly connected inside the mounting grooves. The mounting grooves and reinforcing ribs are designed as hexagonal honeycomb structures. The reinforcing ribs are made of polycarbonate, which can disperse and transmit external pressure. When the carrier belt is squeezed or bent, the deformation of the honeycomb structure disperses the stress, reduces local stress concentration, effectively prevents the carrier belt from deforming and breaking, and greatly improves the overall compression and bending resistance of the carrier belt.

[0008] As a preferred technical solution, the fixing component includes a cavity, a return spring, a moving plate, and a locking block. An assembly block is fixedly connected to one side of the buffer pad. Cavities are symmetrically formed inside the assembly block. A return spring is fixedly connected to one side of the cavity. A moving plate is fixedly connected to the other end of the return spring. The moving plate is slidably connected to the cavity. A locking block is fixedly connected to the other side of the moving plate. The other side of the locking block extends outward from the outside of the assembly block. Both sides of the locking block have bevels. An assembly groove is formed at the bottom of the component receiving cavity. Locking grooves are symmetrically formed inside the assembly groove. The assembly block and the assembly groove are plugged in, and the locking block and the locking groove are snapped in. By replacing buffer pads of different thicknesses, the same carrier tape can be compatible with chips with a height difference of up to 2mm, without the need to customize carrier tapes for each type of chip.

[0009] In summary, the present invention has the following main advantages: First, in this utility model, the component receiving cavity is precisely matched with the chip shape, such as a square QFN package, through equidistant symmetrical arrangement and rounded inner corners, which restricts the lateral displacement of the chip. At the same time, the frame is strengthened to further prevent the chip from jumping out and prevent material from crossing between adjacent cavities. Moreover, the positioning holes are parallel to the central axis of the component receiving cavity and are equidistantly arranged, which is compatible with the positioning pin / gear structure of the pick-and-place machine. When the carrier tape is transported, the positioning holes mesh with the feeding mechanism to ensure that each receiving cavity can be accurately aligned with the placement head, so as to achieve high-speed and stable automated placement. Secondly, in this utility model, the buffer pad is inserted into the component receiving cavity, and the assembly block is inserted into the assembly groove. During the insertion process, the squeezing force applies pressure to the inclined surface of the locking block, causing the locking block to drive the moving plate to press against the return spring. The return spring is compressed, and at the same time, the locking block retracts into the cavity. When the locking block moves to the locking groove, the locking block pops out and engages with the locking groove. By replacing the buffer pads of different thicknesses, the same carrier tape can be compatible with chips with a height difference of up to 2mm, without the need to customize carrier tapes for each chip. Attached Figure Description

[0010] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a cross-sectional three-dimensional structural schematic diagram of the present invention; Figure 3 This is the utility model Figure 2 Enlarged view of part A; Figure 4 This is a schematic diagram of the planar structure of this utility model; Figure 5 This is a cross-sectional structural diagram of the carrier body of this utility model.

[0011] Reference numerals: 1. Carrier tape body; 101. Substrate layer; 102. Antistatic layer; 103. Buffer layer; 104. Heat-sealing layer; 105. Moisture-proof layer; 2. Positioning hole; 3. Component receiving cavity; 4. Mounting groove; 5. Reinforcing rib; 6. Buffer pad; 7. Assembly block; 8. Fixing component; 81. Cavity; 82. Return spring; 83. Moving plate; 84. Locking block; 9. Locking groove; 10. Assembly groove; 11. Reinforcing frame. Detailed Implementation

[0012] Example refer to Figures 1 to 5 This embodiment describes an electronic component carrier tape for preventing chip cross-contamination, comprising a carrier tape body 1. Component receiving cavities 3 are symmetrically arranged at equal intervals along the length direction on the upper surface of the carrier tape body 1. The four inner corners of the component receiving cavities 3 are rounded. The edges of the component receiving cavities 3 are integrally formed with upwardly protruding reinforcing frame 11. Positioning holes 2 are symmetrically opened at equal intervals along the length direction on the upper surface of the carrier tape body 1. The axis of the positioning holes 2 is parallel to the central axis of the component receiving cavities 3. A buffer pad 6 is movably connected to the bottom of the component receiving cavities 3. A fixing component 8 is installed on the other side of the buffer pad 6. The component receiving cavities 3, through symmetrical arrangement at equal intervals and rounded inner corners, precisely match the shape of the chip, such as a square QFN package, limiting the lateral displacement of the chip. At the same time, the reinforcing frame 11 further prevents the chip from jumping out, preventing cross-contamination between adjacent cavities. Moreover, the positioning holes 2 are parallel to the central axis of the component receiving cavities 3 and are equidistantly arranged, adapting to the positioning pin / gear structure of the pick-and-place machine. During carrier tape transport, the positioning holes 2 engage with the feeding mechanism to ensure that each receiving cavity is precisely aligned with the placement head, achieving high-speed and stable automated placement.

[0013] refer to Figure 5The carrier tape body 1 includes a substrate layer 101, an antistatic layer 102, a buffer layer 103, a heat-sealing layer 104, and a moisture-proof layer 105. The upper surface of the substrate layer 101 is provided with the antistatic layer 102, and the lower surface of the substrate layer 101 is provided with the buffer layer 103. The upper surface of the antistatic layer 102 is provided with the heat-sealing layer 104, and the lower surface of the buffer layer 103 is provided with the moisture-proof layer 105. The substrate layer 101 is made of polystyrene, the antistatic layer 102 is made of polycarbonate with added antistatic agent, the buffer layer 103 is made of low-density polyethylene, the heat-sealing layer 104 is made of ethylene-vinyl acetate copolymer, and the moisture-proof layer 105 is made of aluminum foil or aluminized polyester film. The layers 4 and 105 are bonded together with adhesive. The substrate layer 101, with a thickness of 0.2-0.5mm, provides basic strength and rigidity for the carrier tape. The antistatic layer 102, with a thickness of 0.05-0.1mm, effectively prevents static electricity accumulation from damaging electronic components. The buffer layer 103, with a thickness of 0.1-0.3mm, has good buffering performance and protects electronic components from vibration and impact. The heat-sealing layer 104, with a thickness of 0.03-0.08mm, is used to heat-seal with the cover tape to form a sealed space. The moisture-proof layer 105, with a thickness of 0.01-0.05mm, effectively blocks moisture and humidity.

[0014] refer to Figure 1 The carrier belt body 1 has symmetrically spaced mounting grooves 4 along its length on one side. Reinforcing ribs 5 are fixedly connected inside the mounting grooves 4. The mounting grooves 4 and reinforcing ribs 5 are hexagonal honeycomb-shaped. The reinforcing ribs 5 are made of polycarbonate. The reinforcing ribs 5 can disperse and transmit external pressure, so that when the carrier belt is squeezed or bent, the deformation of the honeycomb structure disperses the stress, reduces local stress concentration, effectively prevents the carrier belt from deforming and breaking, and greatly improves the overall compression and bending resistance of the carrier belt.

[0015] refer to Figures 2 to 3The fixing assembly 8 includes a cavity 81, a return spring 82, a moving plate 83, and a locking block 84. A mounting block 7 is fixedly connected to one side of the buffer pad 6. Cavities 81 are symmetrically formed inside the mounting block 7. A return spring 82 is fixedly connected to one side of the cavity 81. The moving plate 83 is fixedly connected to the other end of the return spring 82. The moving plate 83 is slidably connected to the cavity 81. A locking block 84 is fixedly connected to the other side of the moving plate 83. The other side of the locking block 84 extends outward from the outside of the mounting block 7. Both sides of the locking block 84 have inclined surfaces. A mounting block is formed at the bottom of the component receiving cavity 3. The assembly groove 10 has symmetrical locking grooves 9 inside. The assembly block 7 is inserted into the assembly groove 10, and the locking block 84 is snapped into the locking groove 9. The buffer pad 6 is inserted into the component receiving cavity 3, so that the assembly block 7 is inserted into the assembly groove 10. During the insertion process, the squeezing force applies pressure to the inclined surface of the locking block 84, so that the locking block 84 drives the moving plate 83 to press against the return spring 82. The return spring 82 is compressed, and at the same time the locking block 84 retracts into the cavity 81. When the locking block 84 moves to the locking groove 9, the locking block 84 pops out and snaps into the locking groove 9.

[0016] Operating principle and advantages: First, the buffer pad 6 is inserted into the component receiving cavity 3, and the assembly block 7 is inserted into the assembly slot 10. During the insertion process, the squeezing force applies pressure to the inclined surface of the locking block 84, causing the locking block 84 to drive the moving plate 83 to press against the return spring 82. The return spring 82 is compressed, and at the same time, the locking block 84 retracts into the cavity 81. When the locking block 84 moves to the locking slot 9, the locking block 84 pops out and engages with the locking slot 9, placing the chip into the component receiving cavity 3. Through equidistant symmetrical arrangement and rounded inner corners, the chip shape is precisely matched, such as a square QFN package, limiting the lateral displacement of the chip. At the same time, the reinforced frame 11 further prevents the chip from jumping out and prevents cross-contamination between adjacent chambers. This invention can limit the displacement of the chip within the carrier tape, avoiding physical damage caused by mutual collisions and friction, such as chip corner breakage and pin deformation. It can also reduce cross-contamination, prevent static electricity accumulation and discharge caused by shaking during transportation, avoid damage to the internal circuitry of the chip, and ensure the stability of its electrical performance.

Claims

1. An electronic component carrier tape for preventing chip cross-contamination, comprising a carrier tape body (1), characterized in that: The upper surface of the carrier tape body (1) is symmetrically arranged with component receiving cavities (3) at equal intervals along the length direction. The four inner corners of the component receiving cavity (3) are rounded transition structures. The edge of the component receiving cavity (3) is integrally formed with an upwardly protruding reinforcing frame (11). The upper surface of the carrier tape body (1) is symmetrically opened with positioning holes (2) at equal intervals along the length direction. The axis of the positioning hole (2) is parallel to the central axis of the component receiving cavity (3). The bottom of the component receiving cavity (3) is movably connected with a buffer pad (6). A fixing component (8) is installed on the other side of the buffer pad (6).

2. The electronic component carrier tape for preventing chip cross-contamination according to claim 1, characterized in that: The carrier tape body (1) includes a substrate layer (101), an antistatic layer (102), a buffer layer (103), a heat-sealing layer (104), and a moisture-proof layer (105). The upper surface of the substrate layer (101) is provided with an antistatic layer (102), the lower surface of the substrate layer (101) is provided with a buffer layer (103), the upper surface of the antistatic layer (102) is provided with a heat-sealing layer (104), and the lower surface of the buffer layer (103) is provided with a moisture-proof layer (105).

3. The electronic component carrier tape for preventing chip cross-contamination according to claim 2, characterized in that: The substrate layer (101) is made of polystyrene, the antistatic layer (102) is made of polycarbonate with added antistatic agent, the buffer layer (103) is made of low-density polyethylene, the heat-sealing layer (104) is made of ethylene-vinyl acetate copolymer, and the moisture-proof layer (105) is made of aluminum foil or aluminized polyester film.

4. The electronic component carrier tape for preventing chip cross-contamination according to claim 3, characterized in that: The substrate layer (101), antistatic layer (102), buffer layer (103), heat-sealing layer (104) and moisture-proof layer (105) are bonded together by adhesive.

5. The electronic component carrier tape for preventing chip cross-contamination according to claim 1, characterized in that: The carrier tape body (1) has symmetrically spaced mounting grooves (4) along its length on one side. A reinforcing rib (5) is fixedly connected inside the mounting groove (4). The mounting groove (4) and the reinforcing rib (5) are arranged in a hexagonal honeycomb shape. The reinforcing rib (5) is made of polycarbonate.

6. The electronic component carrier tape for preventing chip cross-contamination according to claim 1, characterized in that: The fixing component (8) includes a cavity (81), a return spring (82), a moving plate (83), and a locking block (84). An assembly block (7) is fixedly connected to one side of the buffer pad (6). The assembly block (7) has symmetrical cavities (81) inside. A return spring (82) is fixedly connected to one side of the cavity (81). A moving plate (83) is fixedly connected to the other end of the return spring (82). The moving plate (83) is slidably connected to the cavity (81). A locking block (84) is fixedly connected to the other side of the moving plate (83). The other side of the locking block (84) extends out of the outside of the assembly block (7). Both sides of the locking block (84) are provided with inclined surfaces.

7. An electronic component carrier tape for preventing chip cross-contamination according to claim 6, characterized in that: The component receiving cavity (3) has an assembly groove (10) at the bottom, and a locking groove (9) is symmetrically provided inside the assembly groove (10). The assembly block (7) is inserted into the assembly groove (10), and the locking block (84) is snapped into the locking groove (9).

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