A thin film sensor

Abstract

The utility model relates to sensor technical field, and disclose a kind of film type sensor, the film type sensor, including lower bottom shell, the upper surface of lower bottom shell is provided with lower covering film, the upper surface of lower covering film is provided with fixed mechanism.The film type sensor, by being provided with fixed mechanism, cooperate the welding base of bottom constantan layer and lower covering film, connect with solder pad and wire, and utilize the installation slot and limit slot of lower bottom shell and be opened to the space location and form matching of wire, again through loudspeaker-shaped clamping block and wire fixed connection, and with the abutment restraint of shell side wall's limit block, realize the mechanical fixation and stress buffering of wire in multidirectional, effectively prevent the connection of wire from vibration, pulling or temperature change and form friction breakage or fracture, to be able to significantly improve the stability and long-term reliability of sensor electrical connection.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, specifically a thin-film sensor. Background Technology

[0002] Sensors have a wide range of applications, including cryogenic engineering and scientific research: temperature monitoring of cryogenic media such as liquid nitrogen and liquid oxygen; electronics and electrical industries: chip junction temperature testing, PCB hot spot monitoring, and power device heat dissipation analysis; biomedicine: skin temperature measurement and cryogenic therapy equipment; home appliances and automobiles: temperature sensing of refrigerators, air conditioner evaporators, and car seat temperature control systems; and any occasion where it is necessary to measure the surface temperature of an object and space is limited.

[0003] According to a published high-temperature thin-film absolute pressure sensor (publication number: CN214373074U), the pressure sensing head assembly and the transducer are connected via a high-temperature cable. The pressure sensing head assembly uses a sputtered thin-film sensitive core for detection and transmits the pressure of the medium as a voltage signal to the transducer. The transducer processes and transmits the input voltage signal. Because the sputtered thin-film sensitive core has the characteristics of high accuracy, good temperature characteristics, vibration and shock resistance, and a maximum operating temperature of 550°C, and because the sealed housing and pressure interface seat provide a vacuum environment for the sputtered thin-film sensitive core, absolute pressure measurement is achieved. Therefore, by using a sputtered thin-film sensitive core as the pressure sensing element, the aforementioned high-temperature thin-film absolute pressure sensor has the characteristics of a wide operating temperature range, high accuracy, vibration and shock resistance, normal operation at a high temperature of 550°C, and the ability to measure absolute pressure.

[0004] However, in actual use, the sensor head contains multiple components, such as L-shaped terminals, sealed housings, plugs, and sensitive cores, and is sealed using welding and sintering processes. Once a fault occurs, it is difficult to repair on-site and may require complete replacement, increasing maintenance costs and time. In view of this, we propose a thin-film sensor. Utility Model Content

[0005] The purpose of this invention is to provide a thin-film sensor to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A thin-film sensor includes a lower base shell, a lower cover film is disposed on the upper surface of the lower base shell, and a fixing mechanism is disposed on the upper surface of the lower cover film, the fixing mechanism comprising: The bottom constantan layer is welded to the top surface of the lower cover film. The outer surface of the bottom constantan layer is fixedly connected to a pad, and a wire is welded to the end of the pad away from the bottom constantan layer. The mounting groove is formed on the upper surface of the lower bottom shell. A limiting groove is formed in the middle of the mounting groove. The inner wall of the mounting groove and the limiting groove abuts against the outer wall of the wire. A locking block is fixedly connected to the outer surface of the wire. A limiting block is fixedly connected to the outer wall of the lower bottom shell.

[0007] Preferably, the limiting groove is circular in shape, and the shape of the wire matches the shape of the mounting groove and the limiting groove.

[0008] Preferably, the card block is shaped like a trumpet, and an opening matching the size of the wire is provided at the center of the card block.

[0009] Preferably, the sidewall of the limiting block is fixedly connected to the outer wall of the lower bottom shell, and the inner wall of the limiting block abuts against the outer surface of the locking block.

[0010] Preferably, an electroplated copper layer is welded to the upper surface of the bottom constantan layer, and an upper top shell is fixedly connected to the upper surface of the electroplated copper layer.

[0011] Preferably, the upper top shell and the lower bottom shell are matched in size, and the bottom surface of the upper top shell is provided with a connecting groove that matches the size of the mounting groove and the limiting groove, and the bottom surface of the upper top shell is provided with an upper covering film.

[0012] Preferably, the dimensions of the underlying constantan layer match the dimensions of the electroplated copper layer.

[0013] Compared with the prior art, the present invention provides a thin-film sensor, which has the following advantages: 1. This thin-film sensor, through the setting of a fixing mechanism, in conjunction with the welding base of the bottom constantan layer and the lower cover film, combined with the connection of the solder pads and wires, and the use of the mounting groove and limiting groove opened on the bottom shell to spatially limit and match the shape of the wires, and then through the funnel-shaped locking block to fix the wires, and forming an abutment constraint with the limiting block on the side wall of the shell, achieves mechanical fixing and stress buffering of the wires in multiple directions, effectively preventing the connection from loosening or breaking due to vibration, pulling or temperature changes, thereby significantly improving the stability and long-term reliability of the sensor's electrical connection.

[0014] 2. This thin-film sensor employs a welded structure of a bottom constantan layer and an electroplated copper layer, combined with the size matching of the upper and lower shells and the design of connecting grooves. This achieves efficient coupling and stress dispersion between multiple layers of materials. The upper and lower cover films together form an encapsulation protective layer, which not only prevents oxidation and mechanical damage to the internal structure, but also ensures the uniformity of heat conduction and electrical signals. This integrated laminated structure not only improves the sensor's response sensitivity and measurement consistency, but also enhances the overall sealing performance and environmental adaptability, making it suitable for applications with high requirements for accuracy and reliability. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the main structure of this utility model; Figure 2 This is an exploded view of the main structure of this utility model; Figure 3 This is one of the schematic diagrams of the structural fixing mechanism of this utility model; Figure 4 This is the second schematic diagram of the structural fixing mechanism of this utility model.

[0016] In the diagram: 1. Bottom shell; 11. Lower cover film; 2. Fixing mechanism; 21. Bottom constantan layer; 22. Solder pad; 23. Wire; 24. Mounting groove; 25. Limiting groove; 26. Locking block; 27. Limiting block; 3. Electroplated copper layer; 4. Top shell; 41. Connecting groove. Detailed Implementation

[0017] like Figures 1-4 As shown, this utility model provides a technical solution: a thin-film sensor, including a bottom shell 1, a lower cover film 11 is provided on the upper surface of the bottom shell 1, and a fixing mechanism 2 is provided on the upper surface of the lower cover film 11. The fixing mechanism 2 includes: a bottom constantan layer 21, a solder pad 22, a wire 23, a mounting groove 24, a limiting groove 25, a locking block 26, and a limiting block 27.

[0018] In one embodiment of this utility model, the bottom surface of the bottom constantan layer 21 is welded to the upper surface of the lower cover film 11. A solder pad 22 is fixedly connected to the outer surface of the bottom constantan layer 21. A wire 23 is welded to one end of the solder pad 22 and the bottom constantan layer 21. A mounting groove 24 is opened on the upper surface of the lower bottom shell 1. A limiting groove 25 is opened in the middle of the mounting groove 24. The inner walls of the mounting groove 24 and the limiting groove 25 abut against the outer wall of the wire 23. A locking block 26 is fixedly connected to the outer surface of the wire 23. A limiting block 27 is fixedly connected to the outer wall of the lower bottom shell 1. The limiting groove 25 is circular in shape, and the shape of the wire 23 is matched with the shape of the mounting groove 24 and the limiting groove 25. The locking block 26 is trumpet-shaped, and an opening matching the size of the wire 23 is opened at the center of the locking block 26. First, the circuit to be partially electroplated is drawn according to the requirements. Then, the bottom constantan layer 21 is pressed by a high-temperature rapid pressing process. On the lower cover film 11, the circuit to be electroplated with copper layer 3 is then developed using an exposure and development process, exposing the underlying constantan layer 21 as the area to be electroplated. Through electroplating, copper layer 3 is electroplated onto the exposed underlying constantan layer 21. Then, a dry film is applied, and finally, the desired circuit is made through exposure and etching processes. The conductor 23 is soldered, the upper cover film is attached, and the circuit is pressed together using a rapid high-temperature pressing process. The outer surface of the conductor 23 is fixedly connected with a clip 26, and the clip 26 is shaped like a trumpet. Together with the limiting block 27, it can effectively fix the conductor 23 and prevent external friction from causing wear at the connection of the conductor 23. Furthermore, through the mounting groove 24 and the limiting groove 25, the conductor 23 can have more installation length between the upper top shell 4 and the lower bottom shell 1, so that the conductor 23 is constrained between the upper top shell 4 and the lower bottom shell 1, and has stronger tensile strength.

[0019] In addition, the side wall of the limiting block 27 is fixedly connected to the outer wall of the lower bottom shell 1, the inner wall of the limiting block 27 abuts against the outer surface of the locking block 26, the upper surface of the bottom constantan layer 21 is welded with an electroplated copper layer 3, the upper surface of the electroplated copper layer 3 is fixedly connected with an upper top shell 4, the size of the upper top shell 4 matches that of the lower bottom shell 1, and the bottom surface of the upper top shell 4 is provided with a connecting groove 41 that matches the size of the mounting groove 24 and the limiting groove 25. The size of the bottom constantan layer 21 matches the size of the electroplated copper layer 3, and the main body of the electroplated copper layer 3... It is composed of copper foil, which refers to high-purity copper, the "positive electrode" material in thermocouples. The bottom constantan layer 21 is mainly composed of constantan foil, a copper-nickel alloy, typically about 55% copper and 45% nickel. It is known for its near-zero temperature coefficient of resistance and is the "negative electrode" material in thermocouples. This "copper / constantan" combination thermocouple is called a type T thermocouple. Type T thermocouples (copper-constantan) have the highest measurement accuracy among all thermocouples, and their error range is the lowest among all standard thermocouples. One of the smallest thermocouples, the T-type thermocouple is ideal for applications requiring high-precision measurements. In low-temperature environments, it generates a relatively large and stable thermoelectric potential, exhibiting high sensitivity far superior to other thermocouples such as K-type or J-type. Its thermoelectric potential (EMF) has a relatively linear relationship with temperature, simplifying signal processing and temperature conversion, thus improving the overall system accuracy. Furthermore, the foil material is very thin, resulting in excellent thermal uniformity, crucial for measuring surface temperatures or scenarios requiring rapid response. This reduces measurement errors caused by the material's own thermal conduction. Both copper and constantan foils possess good ductility and flexibility, allowing them to be easily attached to curved, irregular, or dynamically moving surfaces such as bearings, rollers, and electronic chip heat sinks to create flexible thin-film sensors. Additionally, copper is a common and inexpensive metal, and constantan, as a mature alloy, has relatively controllable costs. This makes the T-type thermocouple a cost-effective and high-precision temperature measurement solution, especially advantageous in the mass production of foil sensors.

[0020] In this utility model, when in use, the circuit to be partially electroplated is first drawn according to the requirements. Then, the bottom constantan layer 21 is pressed onto the lower cover film 11 through a high-temperature rapid pressing process. Next, the circuit to be electroplated with copper layer 3 is developed using an exposure and development process. The part of the bottom constantan layer 21 that is exposed is the area to be electroplated. Through the electroplating process, the copper layer 3 is electroplated onto the exposed bottom constantan layer 21. Then, a dry film is applied. Finally, the desired circuit is made through exposure and etching processes, the wires 23 are soldered, the upper cover film is attached, and the circuit is pressed together through a rapid high-temperature pressing process.

[0021] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. A thin-film sensor, comprising a lower base shell (1), wherein a lower cover film (11) is disposed on the upper surface of the lower base shell (1), characterized in that: A fixing mechanism (2) is provided on the upper surface of the lower covering film (11), the fixing mechanism (2) including: The bottom constantan layer (21) is welded to the upper surface of the lower cover film (11) and the outer surface of the bottom constantan layer (21) is fixedly connected to the pad (22). The end of the pad (22) away from the bottom constantan layer (21) is welded with a wire (23). The mounting groove (24) is opened on the upper surface of the lower bottom shell (1). A limiting groove (25) is opened in the middle of the mounting groove (24). The inner wall of the mounting groove (24) and the limiting groove (25) abuts against the outer wall of the wire (23). A locking block (26) is fixedly connected to the outer surface of the wire (23). A limiting block (27) is fixedly connected to the outer wall of the lower bottom shell (1).

2. A thin-film sensor according to claim 1, characterized in that: The limiting groove (25) is circular in shape, and the shape of the wire (23) matches the shape of the mounting groove (24) and the limiting groove (25).

3. A thin-film sensor according to claim 1, characterized in that: The card block (26) is shaped like a trumpet, and an opening matching the size of the wire (23) is provided at the center of the card block (26).

4. A thin-film sensor according to claim 1, characterized in that: The side wall of the limiting block (27) is fixedly connected to the outer wall of the lower bottom shell (1), and the inner wall of the limiting block (27) abuts against the outer surface of the card block (26).

5. A thin-film sensor according to claim 1, characterized in that: The upper surface of the bottom constantan layer (21) is welded with an electroplated copper layer (3), and the upper surface of the electroplated copper layer (3) is fixedly connected with an upper top shell (4).

6. A thin-film sensor according to claim 5, characterized in that: The upper top shell (4) and the lower bottom shell (1) are matched in size, and the bottom surface of the upper top shell (4) is provided with a connecting groove (41) that matches the size of the mounting groove (24) and the limiting groove (25), and the bottom surface of the upper top shell (4) is provided with an upper covering film.

7. A thin-film sensor according to claim 5, characterized in that: The dimensions of the underlying constantan layer (21) are matched with the dimensions of the electroplated copper layer (3).

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