A kind of test board for facilitating batch core detection and solder quality testing

Abstract

The utility model relates to a kind of test board for batch detection chip soldering quality, including base, the upper side rear end of base is equipped with upper cover, the inside upper end of upper cover is equipped with visual inspection body, the upper side center of base is equipped with equipment recess, equipment recess left and right inner wall are all screw-fixed guide rail assembly, guide rail assembly includes two groups of guide rails, two groups of guide rails movably connect two groups of support plate assemblies, two groups of support plate assemblies include support plate, two groups of support plate left and right end are equipped with sliding block, the sliding block is all slidingly connected guide rail, the upper side left and right end of support plate is equipped with test board mounting block, test board mounting block between opposite side is equipped with test board, test board includes outer frame, nine chip placing seats are evenly equipped in the inside of outer frame, have can be used to batch detection chip soldering quality, test board can be quickly disassembled and replaced with the advantages of.

Description

Technical Field

[0001] This utility model relates to the field of solder testing technology, and in particular to a test board that facilitates batch testing of solder quality for chips. Background Technology

[0002] Solder inspection is a specialized process used to evaluate / inspect the quality of solder paste deposition on a PCB. It ensures correct and defect-free solder paste deposition on the board. In most cases, PCB malfunctions are due to improper solder paste printing; therefore, solder paste inspection is an essential technology to ensure the lowest possible cost. This is achieved through solder inspection on the production line, utilizing high-definition (HD) cameras and multiple light sources to visually scan the board surface. These systems use captured images and compare them to ideal / traditional board diagrams already stored in the system. The captured and ideal images are then compared to detect and highlight any defects or suspected areas.

[0003] Chinese utility model patent application CN202023342278.7 discloses a solder inspection device for a solder inspection machine. The device includes a worktable fixed to a frame, a rotating device, a clamping device, and a solder inspection device fixedly mounted on the worktable. The rotating device includes a rotating driver fixedly mounted on the worktable, and a rotating worktable fixedly mounted on the rotating end of the rotating driver. Multiple tooling fixtures are arranged in a circular array on the rotating worktable. The clamping device includes a clamping fixing seat fixed to the worktable, a clamping lifting driver fixedly mounted on one side of the clamping fixing seat, and a linear slide rail fixedly mounted on the other side. A lifting fixing seat is fixedly mounted on the slider of the linear slide rail, and a clamping plate is fixedly mounted on the lifting fixing seat and the lifting end of the clamping lifting driver. A pneumatic gripper is fixedly mounted on the clamping plate. This utility model can improve the working efficiency of a solder defect detection system. However, this device has the following problems: firstly, it cannot achieve batch inspection of chip solder quality; secondly, the device lacks convenience during solder inspection. ‌ Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies. This device features a test board with nine chip holders evenly spaced inside, each capable of independently supporting one chip to be tested. Two sets of support plates are slidably connected to parallel guide rails. When the support plates, carrying the upper test board, slide along the guide rails into the testing area behind the device's recess, the visual inspection body automatically scans the solder joints of all nine chips, captures images, and analyzes solder defects. Once one set of test boards finishes testing, it slides forward, and the other set slides in to take over the testing, enabling batch testing. This solves the technical problems of the current device's inability to perform batch testing of solder quality and its lack of convenience during solder testing.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A test board for batch chip solder quality testing includes a base, a top cover at the upper rear end of the base, a visual inspection body inside the upper end of the top cover, a device groove at the center of the upper side of the base, guide rail assemblies fixed to the left and right inner walls of the device groove by screws, the guide rail assembly including two sets of guide rails, the two sets of guide rails being movably connected to two sets of support plate assemblies, the two sets of support plate assemblies including support plates, sliders at the left and right ends of the two sets of support plates, the sliders being slidably connected to the guide rails, test board mounting blocks at the left and right ends of the upper side of the support plates, a test board being positioned between opposite sides of the test board mounting blocks, the test board including an outer frame, and nine chip placement seats evenly arranged inside the outer frame.

[0007] As a preferred embodiment, the two sets of guide rails are arranged side by side on the left and right inner walls of the equipment groove, with the rear ends of both sets of guide rails extending to the rear end of the equipment groove and the front ends of both sets of guide rails extending to the frontmost side of the equipment groove. Guide rail limiting blocks are provided at the front ends of the two sets of guide rails.

[0008] As a preferred embodiment, the test board mounting block has a mounting groove on one side of its opposite side.

[0009] As a preferred embodiment, the outer frame is provided with mounting protrusions at two-thirds of the rear side of the left and right ends, the rear end of the mounting protrusions extends to the rearmost side of the left and right ends of the outer frame, the front end of the mounting protrusions is provided with limiting blocks, and the mounting protrusions and mounting grooves can be slidably connected.

[0010] As a preferred embodiment, each of the four corners of the bottom of the chip placement base is provided with silicone dots, and the chip to be tested is placed on the upper side of the silicone dots. Each chip placement base has the same structure.

[0011] As another preferred embodiment, the two sets of support plate assemblies are arranged vertically along with the positions of the two sets of guide rails.

[0012] The beneficial effects of this utility model are:

[0013] (1) In this utility model, nine chip placement seats are evenly arranged inside the test board. Each placement seat can independently carry one chip to be tested. Two sets of support plates are set and slidably connected to the parallel guide rails. When the support plate carries the upper test plate along the guide rail into the detection area behind the equipment groove, the visual inspection body automatically scans the solder points of all nine chips, captures images and analyzes solder defects. When one set of test plates finishes the test, the support plate slides forward through the guide rail, and the other set of test plates slides into the detection area to take over the test. The two sets of test plates alternate, realizing batch testing.

[0014] (2) In this utility model, the mounting protrusion and the mounting groove of the test plate mounting block are used to achieve a sliding fit connection. This design allows the test plate to be quickly disassembled and replaced. When the test plate needs to be replaced, the test plate can be manually pulled out of the mounting groove. The new test plate is aligned with the mounting groove by the rear end of the mounting protrusion and pushed in. The limiting block is fixed in position, so that the test plate can be quickly disassembled and replaced.

[0015] (3) In this utility model, the silicone dots at the four corners of the bottom of the chip placement seat provide the placement position of the chip to be tested. The silicone dots have good buffering and anti-slip properties, which can effectively reduce the position displacement of the chip caused by vibration during the testing process, and at the same time ensure that the chip maintains a stable position during testing, avoiding detection errors caused by displacement.

[0016] In summary, this device has the advantages of facilitating batch testing of chip solder quality and enabling rapid disassembly and replacement of test boards, making it particularly suitable for the field of solder testing technology. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0019] Figure 2 This is a schematic diagram showing the position of the guide rail assembly and the connection position between the guide rail assembly and the support plate assembly in this utility model.

[0020] Figure 3 This is a schematic diagram of the support plate assembly and test plate structure in this utility model. Detailed Implementation

[0021] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0022] Example 1

[0023] like Figures 1 to 3As shown, this utility model provides a test board for batch chip solder quality testing, including a base 1. The upper rear end of the base 1 has a top cover 11. A visual inspection body 3, which is a high-resolution camera, is located inside the top end of the top cover 2. A supplementary light is located below the high-resolution camera, and the center of the supplementary light has a camera channel, which is exactly the same as the camera channel of the high-resolution camera. The supplementary light ring is an inner ring around the camera channel, providing supplementary lighting during image acquisition by the high-resolution camera to ensure clear images. A device groove 11 is located at the center of the upper side of the base 1. The device groove 11 is a recessed area in the middle of the base 1, used to accommodate the guide rail assembly 4, support plate assembly 5, and test board 6, etc. To provide a stable environment for visual inspection, the rear end of the device groove 11, which is located opposite the visual inspection body 3, is the chip inspection area. The left and right inner walls of the device groove 11 are fixed with screws to the guide rail assembly 4. The guide rail assembly 4 includes two sets of guide rails 41, which are movably connected to two sets of support plate assemblies 5. The two sets of support plate assemblies 5 include support plates 51. The left and right ends of the two sets of support plates 51 are provided with sliders 52, which are slidably connected to the guide rails 41. The left and right ends of the upper side of the support plate 51 are provided with test plate mounting blocks 53. A test plate 6 is provided between the opposite sides of the test plate mounting blocks 53. The test plate 6 includes an outer frame 61, and nine chip placement seats 62 are evenly arranged inside the outer frame 61.

[0024] Furthermore, the two sets of guide rails 41 are arranged side by side on the left and right inner walls of the equipment groove 11. The rear ends of the two sets of guide rails 41 extend to the rear end of the equipment groove 11, and the front ends of the two sets of guide rails 41 extend to the frontmost side of the equipment groove 11. The two sets of guide rails 41 are arranged side by side to form a double-layer sliding structure, so that the two sets of support plate assemblies 5 can slide independently on the upper and lower guide rails 41 respectively without interfering with each other. The front ends of the two sets of guide rails 41 are provided with guide rail limiting blocks 411 to ensure that the support plate assembly 5 runs within the sliding range of the guide rails 41.

[0025] Furthermore, the test board mounting block 53 has a mounting groove 531 on the opposite side, and the shape of the mounting groove 531 matches the mounting protrusion 611 of the test board 6 to form a concave-convex sliding fit structure.

[0026] Furthermore, the outer frame 61 has mounting protrusions 611 located at two-thirds of the rear side of its left and right ends. The rear end of the mounting protrusions 611 extends to the rearmost side of the left and right ends of the outer frame 61. The front end of the mounting protrusions 611 has a limiting block 612. The mounting protrusions 611 and the mounting groove 531 can slide and engage in a concave-convex connection. When the test plate 6 needs to be replaced, the test plate 6 can be manually pulled out of the mounting groove 531. The new test plate 6 is aligned with the mounting groove 531 by the rear end of the mounting protrusions 611 and pushed in. The limiting block 612 is fixed in position, allowing the test plate 6 to be quickly disassembled and replaced.

[0027] Furthermore, each of the four corners of the bottom of the chip placement base 62 is provided with silicone pads 621. The chip to be tested is placed on the upper side of the silicone pads 621. The silicone pads 621 have good buffering and anti-slip properties, which can effectively reduce the positional displacement of the chip caused by vibration during the testing process, and at the same time ensure that the chip maintains a stable position during testing, avoiding testing errors caused by displacement. The silicone pads 621 are half the height of the inside of the chip placement base 62, not exceeding the upper height of the chip placement base 62, providing a reference height for chip placement and also providing a convenient basis for subsequent chip removal. Each chip placement base 62 has the same structure. The chip placement base 62 is a standardized design with completely identical structures, ensuring uniformity and consistency in the testing process.

[0028] (4) Furthermore, the two sets of support plate assemblies 5 are set up vertically along with the positions of the two sets of guide rails 41. The two sets of support plate assemblies 5 are respectively located on the upper and lower layers of guide rails 41, forming two parallel test plate 6 bearing platforms. When one set of support plate assemblies 5 slides into the detection area behind the equipment groove 11, the other set of support plate assemblies 5 is located in front of the equipment groove 11, in a standby or replacement state. When one set of test plates 6 finishes detection, the support plate 51 slides forward through the sliding connection between the slider 52 and the guide rail 41. The slider 52 can be an electric slider to achieve automatic back-and-forth alternation, or a regular slider can be used to manually push the support plate assemblies 5 back and forth. The other set of test plates 6 slides into the detection area to take over the detection. The two sets of test plates 6 alternate, realizing batch detection. This layout design of parallel vertical and alternating front and back achieves the continuity and efficiency of the detection process.

[0029] Working process: First, the operator places the chip to be tested in the chip placement seat 62 of the test board 6. Each chip is fixed and anti-slip by four silicone dots 621 on the bottom. Then, the support plate 51 is pushed so that it slides backward along the guide rail 41 via the slider 52. When the test board 6 on the support plate 51 is completely slid into the detection area at the rear end of the equipment groove 11, the vision inspection body 3 inside the top cover 11 is automatically activated to perform image acquisition and defect analysis on the solder joints of the nine chip placement seats 62 on the test board 6. Then, the support plate 51 that has completed the inspection slides forward along the guide rail 41. At the same time, another set of guide rails 41 slides the support plate 51 with the new test board 6 into the detection area to take over the inspection.

[0030] Secondly, when it is necessary to replace the test board 6, the test board 6 can be manually pulled out of the mounting slot 531. The new test board 6 is aligned with the mounting slot 531 by the rear end of the mounting protrusion 611 and pushed in. The limiting block 612 is locked in place, so that the test board 6 can be quickly disassembled and replaced.

[0031] In the description of this utility model, it should be understood that the terms "front and back", "left and right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0032] Of course, those skilled in the art should understand that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. The term "a" should not be understood as a limitation on the quantity.

[0033] The above description is merely a preferred embodiment of this utility model, but the scope of protection of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art under the technical guidance of this utility model should be included within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A test board for easily batch testing the solder quality of chips, characterized in that: The device includes a base (1), a cover (2) on the upper rear end of the base (1), a visual inspection body (3) inside the upper end of the cover (2), a device groove (11) on the upper center of the base (1), and guide rail assemblies (4) fixed to the left and right inner walls of the device groove (11) with screws. The guide rail assembly (4) includes two sets of guide rails (41), which are movably connected to two sets of support plate assemblies (5). The two sets of support plate assemblies (5) include support plates (51), and sliders (52) are provided on the left and right ends of the two sets of support plates (51). The sliders (52) are slidably connected to the guide rails (41). Test plate mounting blocks (53) are provided on the left and right ends of the upper side of the support plate (51). Test plates (6) are provided between opposite sides of the test plate mounting blocks (53). The test plates (6) include an outer frame (61), and nine chip placement seats (62) are evenly provided inside the outer frame (61).

2. The solder quality test board for easy batch chip testing according to claim 1, characterized in that, The two sets of guide rails (41) are arranged side by side on the left and right inner walls of the equipment groove (11). The rear ends of the two sets of guide rails (41) extend to the rear end of the equipment groove (11), and the front ends of the two sets of guide rails (41) extend to the frontmost side of the equipment groove (11). The front ends of the two sets of guide rails (41) are provided with guide rail limiting blocks (411).

3. The solder quality test board for easy batch chip testing according to claim 1, characterized in that, The test board mounting block (53) has a mounting groove (531) on one side.

4. A test board for facilitating batch testing of solder quality in chips according to claim 1, characterized in that, The outer frame (61) has a mounting protrusion (611) at two-thirds of the rear side of the left and right ends. The rear end of the mounting protrusion (611) extends to the last side of the left and right ends of the outer frame (61). The front end of the mounting protrusion (611) has a limiting block (612). The mounting protrusion (611) and the mounting groove (531) can be slidably connected.

5. A test board for batch chip solder quality testing according to claim 1, characterized in that, The chip placement base (62) has silicone dots (621) at the four corners of its bottom. The chip to be tested is placed on the upper side of the silicone dots (621). Each chip placement base (62) has the same structure.

6. A test board for batch chip solder quality testing according to claim 1, characterized in that, The two sets of support plate assemblies (5) are positioned vertically according to the positions of the two sets of guide rails (41).

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