Chip testing tool

Abstract

The application relates to the technical field of chip testing, in particular to a chip testing tool. The chip testing tool comprises a tool main body, a bearing piece, a detection assembly and a driving assembly; the tool main body comprises a testing shell and a first probe capable of being extended and retracted, the testing shell is provided with a detection cavity and an opening communicated with the detection cavity, the first probe is installed in the detection cavity and can be externally connected to a power supply; the bearing piece is installed at the bottom of the detection cavity and abuts against the first probe, the bearing piece is made of conductive material; the bearing piece is provided with a plurality of test stations arranged at intervals and used for placing chips; the detection assembly is installed in the detection cavity and is arranged above the bearing piece; the detection assembly is provided with a plurality of second probes arranged at intervals; each second probe is provided below with a corresponding test station; and the driving assembly is installed on the testing shell and is connected with the detection assembly. The abutment of the first probe and the bearing piece can realize the communication between the bearing piece and an external current, without the need of separately wiring each chip, so that the circuit is greatly simplified and the assembly efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and in particular to a chip testing fixture. Background Technology

[0002] In the harsh natural environment of high-altitude areas, the reliability of converters is closely related to the reliability of press-fit diode devices. Before mass production, press-fit diodes need to be tested for stability under irradiation to ensure the reliability of diode chip performance.

[0003] In related technologies, when testing multiple chips, it is necessary to ensure that each chip is powered on. Therefore, a separate circuit is set up at each chip testing station. However, as the demand for large-scale and batch chip testing gradually increases, such a setup can easily lead to complex wiring within the testing fixture. Utility Model Content

[0004] Therefore, it is necessary to provide a chip testing fixture that can simplify wiring and improve the assembly efficiency of the chip testing fixture while enabling batch testing of multiple chips.

[0005] The chip testing fixture includes a main body, a carrier, a probe assembly, and a driving assembly. The main body includes a test housing and a retractable first probe. The test housing has a detection cavity and an opening communicating with the detection cavity. The first probe is installed inside the detection cavity and can be connected to an external power source. The carrier is installed at the bottom of the detection cavity and abuts against the first probe. The carrier is made of conductive material. The carrier has multiple spaced-apart test stations for placing chips. The probe assembly is installed inside the detection cavity and positioned above the carrier. The probe assembly has multiple spaced-apart second probes. Each second probe has a corresponding test station below it. The driving assembly is installed on the test housing and connected to the probe assembly to drive the probe assembly to move up and down.

[0006] Understandably, the carrier component sets up test stations to stably place the chip, and the driving component can drive the probe component to move up and down, so that the second probe moves closer to or away from the chip. The contact between the second probe and the chip enables chip detection. The carrier component is connected to external current by contacting the first probe with the conductive carrier component. Multiple chips are placed at corresponding test stations to form current conduction, facilitating simultaneous batch testing of multiple chips without the need for individual wiring for each chip, greatly simplifying the circuit and improving the assembly efficiency of the chip testing fixture.

[0007] In one embodiment, the tooling body includes a plurality of limiting stops installed in the detection cavity, the plurality of limiting stops surrounding the carrier and forming limiting abutments with the carrier respectively; wherein, at least one of the limiting stops is equipped with a retractable first probe.

[0008] In one embodiment, among the plurality of limiting stops, at least one of the limiting stops opposite to the opening is equipped with the first probe, the first probe being located on the side of the limiting stop facing the carrier.

[0009] In one embodiment, the test housing is equipped with a terminal block; the limiting stop and / or the test housing is provided with a wire embedding space for installing wiring, and the first probe and the terminal block are electrically connected through the wiring in the wire embedding space.

[0010] In one embodiment, the support member has a handle on the side facing the opening, the handle being made of insulating material and spaced apart from the test station.

[0011] In one embodiment, the detection assembly includes a plurality of spaced-apart elastic pins, with each of the second probes surrounded by a plurality of said elastic pins.

[0012] In one embodiment, the detection assembly includes a first mounting plate, a second mounting plate, and a support rib. The first mounting plate is connected to the second mounting plate via the support rib. The first mounting plate and the second mounting plate are respectively angled relative to the support rib. The first mounting plate is equipped with the second probe, and the second mounting plate is connected to the drive assembly.

[0013] In one embodiment, the chip testing fixture further includes a guide rod, which is vertically installed inside the detection cavity; the detection component is sleeved on the guide rod and is movable along the axial direction of the guide rod.

[0014] In one embodiment, the chip testing fixture further includes a movable support member, which is sleeved on the guide rod and slidably connected to the guide rod, and the detection component is sleeved on and connected to the movable support member.

[0015] In one embodiment, the drive assembly includes a drive support, an operating handle, and a drive rod; the drive support is mounted on the top of the test housing; the drive rod passes through the drive support and the test housing to connect to the detection assembly; the operating handle is rotatably connected to the drive support and to the drive rod to drive the drive rod to move up and down. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the chip testing fixture provided in the embodiments of this application;

[0018] Figure 2 This is a schematic diagram of the main body of the chip testing fixture provided in the embodiments of this application;

[0019] Figure 3 This is a schematic diagram of the structure of the carrier component in the chip testing fixture provided in the embodiments of this application;

[0020] Figure 4 This is a schematic diagram of the probe component in the chip testing fixture provided in the embodiments of this application;

[0021] Figure 5 This is a schematic diagram of the structure of the guide rod and the movable support in the chip testing fixture provided in the embodiments of this application;

[0022] Figure 6 This is a schematic diagram of the structure of the driving component in the chip testing fixture provided in the embodiments of this application.

[0023] Reference numerals: 100, chip testing fixture; 10, fixture body; 11, test housing; 111, detection chamber; 112, opening; 12, first probe; 13, limiting stop; 131, mounting groove; 14, terminal block; 20, carrier; 201, test station; 21, handle; 30, detection assembly; 31, second probe; 32, elastic ejector pin; 33, first mounting plate; 34, second mounting plate; 35, support rib; 40, drive assembly; 41, drive support; 42, operating handle; 43, drive rod; 50, guide rod; 60, moving support; 70, heavy-duty connector. Detailed Implementation

[0024] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0025] It should be noted that when a component is referred to as being "fixed to," "set on," or "properly placed on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0027] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0028] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0029] Please see Figures 1 to 6 This application provides a chip testing fixture 100, which includes a fixture body 10 and a carrier 20. The fixture body 10 includes a test shell 11, which has a detection cavity 111 and an opening 112 communicating with the detection cavity 111. The carrier 20 can be installed in the detection cavity 111 through the opening 112. The carrier 20 is installed at the bottom of the detection cavity 111 and has multiple spaced test stations 201 for placing chips, realizing the synchronous detection of multiple chips and improving the detection efficiency.

[0030] like Figure 1As shown, in an optional embodiment, the chip testing fixture 100 further includes a detection component 30 and a driving component 40. The detection component 30 is installed in the detection cavity 111 and placed above the carrier 20. The detection component 30 is provided with a plurality of spaced second probes 31. Each second probe 31 is provided with a corresponding test station 201 below it. The driving component 40 is installed in the test housing 11 and connected to the detection component 30. It can provide power to the detection component 30 to drive the detection component 30 to move up and down, so that the detection component 30 can approach or move away from the chip. The detection component 30 can contact the chip surface through the second probes 31 to form a current conduction and obtain detection information to realize the detection of the chip. After the detection is completed, the detection component 30 moves away from the chip under the drive of the driving component 40, so as to facilitate the removal of the carrier 20 and the chip.

[0031] like Figure 1 and Figure 2 As shown, in an optional embodiment, the fixture body 10 further includes a retractable first probe 12, which is installed inside the detection cavity 111 and can be connected to an external power source. The carrier 20, made of conductive material, abuts against the first probe 12 to form a current connection, energizing the entire carrier 20 and enabling current connection with the chip on the test station 201, facilitating simultaneous testing of multiple chips. This configuration eliminates the need for individual wiring for each chip, simplifying circuit layout, improving the assembly efficiency of the entire chip testing fixture 100, and reducing maintenance costs. For example, the carrier 20 can be made of copper for its excellent conductivity.

[0032] like Figure 3 As shown, in a specific embodiment, the carrier 20 has a plurality of spaced circular protrusions protruding outward on its own surface. Each circular protrusion is adapted to the size of the circular groove of the chip being tested. Each circular protrusion forms a test station 201. The chip is limited by the circular protrusions, which helps to fix the position of the chip.

[0033] like Figure 1 and Figure 2 As shown, in an optional embodiment, the tooling body 10 includes multiple limiting stops 13 installed within the detection chamber 111. These limiting stops 13 surround the carrier 20 and respectively form limiting abutments with the carrier 20, restricting the movement of the carrier 20 on the bottom plane of the detection chamber 111, thus keeping the carrier 20 in a fixed position and facilitating the maintenance of detection stability. Simultaneously, during assembly, the carrier 20 can be automatically placed and calibrated in one go directly through the surrounding limiting stops 13, simplifying assembly.

[0034] like Figure 1 and Figure 2As shown, in a specific embodiment, at least one limiting stop 13 is equipped with a retractable first probe 12, so that the carrier 20 can directly contact the first probe 12 while contacting the limiting stop 13, thereby forming current conduction. This is simple to operate and helps to shorten the current conduction path.

[0035] like Figure 1 and Figure 2 As shown, in a specific embodiment, the limiting stop 13 is provided with a mounting groove 131 to mount the retractable first probe 12. Before the carrier 20 is assembled into the detection cavity 111, the first probe 12 extends out of the mounting groove 131. During the assembly of the carrier 20 into the detection cavity 111, under the thrust of the carrier 20, the first probe 12 retracts into the mounting groove 131, so that while the carrier 20 forms an electrical connection with the first probe 12, the carrier 20 can also form an abutment limit with the limiting stop 13. In a specific embodiment, the limiting stop 13 is made of insulating material.

[0036] like Figure 1 and Figure 2 As shown, in a specific embodiment, the limiting stop 13 can be configured as a stop bar or a stop block, which has a simple structure and is easy to manufacture and assemble.

[0037] like Figure 1 and Figure 2 As shown, in a specific embodiment, among the multiple limiting stops 13, at least one limiting stop 13 opposite to the opening 112 is equipped with a first probe 12. The first probe 12 is located on the side of the limiting stop 13 facing the carrier 20, that is, the first probe 12 is located on the opposite side of the opening 112. During the process of the carrier 20 being placed into the detection cavity 111 from the opening 112, the operator usually moves the carrier 20 directly along the opening 112 toward the back of the detection housing. By limiting the position of the first probe 12, the carrier 20 can directly abut against the first probe 12 under the conventional placement method. The whole operation process is smooth and simple, without having to consider whether there is interference with the first probe 12 and change the position of the carrier 20 when it is placed.

[0038] like Figure 1 and Figure 2 As shown, in a specific embodiment, the test housing 11 is equipped with a terminal block 14; the limiting stop 13 and / or the test housing 11 are provided with a wire embedding space for installing wiring. The first probe 12 is electrically connected to the terminal block 14 through the wiring in the wire embedding space, and the first probe 12 is connected to an external power source through the terminal block 14. Simultaneously, the wire embedding space facilitates the concealment of wiring, reduces interference with the internal structure of the detection cavity 111, and also protects the wiring, making it less prone to bending and wear.

[0039] like Figure 1 and Figure 3 As shown, in a specific embodiment, the carrier 20 is provided with a handle 21 on the side facing the opening 112. The handle 21 is made of insulating material and is spaced apart from the test station 201, so that the operator can take the carrier 20 through the handle 21 to realize the transfer of the carrier 20 and avoid electric shock.

[0040] like Figure 4 As shown, in a specific embodiment, the detection component 30 includes a plurality of spaced-apart elastic pins 32, with each second probe 31 surrounded by a plurality of elastic pins 32. During the movement of the detection component 30 toward the chip, the elastic pins 32 first contact the chip. As the detection component 30 continues to move, the elastic pins 32 elastically compress and contract until the second probe 31 contacts the chip. The multiple elastic pins 32 surrounding the second probe 31 facilitate even distribution of force, resulting in a better buffering effect.

[0041] like Figure 4 As shown, in a specific embodiment, each second probe 31 is surrounded by four elastic pins 32. The four elastic pins 32 are spaced at the same distance from each other, and each elastic pin 32 is at the same distance from the second probe 31. This promotes uniform force on the four elastic pins 32, promotes tight contact between the second probe 31 and the chip, and ensures detection quality.

[0042] In a specific embodiment, the second probe 31 is configured to be retractable. Since there may be slight differences in thickness at the same location on different chips, this configuration allows the second probe 31 to adapt to such thickness differences and shrink accordingly, ensuring that each second probe 31 can fit tightly against the chip, thereby ensuring the reliability of the detection effect.

[0043] like Figure 4 As shown, in a specific embodiment, the detection component 30 includes a first mounting plate 33, a second mounting plate 34, and a support rib 35. The first mounting plate 33 is connected to the second mounting plate 34 via the support rib 35. The first mounting plate 33 and the second mounting plate 34 are respectively angled to the support rib 35. The first mounting plate 33 is equipped with a second probe 31 for assembly and support. The second mounting plate 34 is connected to the drive component 40 to facilitate power transmission of the drive component 40. It is through the arrangement of the first mounting plate 33, the second mounting plate 34, and the support rib 35 that the overall movement of the detection component 30 is achieved based on the integration of multiple second probes 31.

[0044] like Figure 4As shown, in a specific embodiment, the second probe 31 and a plurality of elastic pins 32 surrounding it form a detection array. The detection component 30 is provided with a plurality of supporting ribs 35 to separate the plurality of detection arrays, so as to make the detection component 30 more modular and enable each detection array to correspond to a chip for detection.

[0045] like Figure 1 and Figure 5 As shown, in a specific embodiment, the chip testing fixture 100 further includes a guide rod 50, which is vertically installed inside the detection cavity 111. The detection component 30 is sleeved on the guide rod 50 and can move along the axial direction of the guide rod 50. The guide rod 50 plays a role in limiting and guiding the movement of the detection component 30, which is conducive to the stable movement of the detection component 30 and the detection of the chip, and avoids the detection component 30 from shaking during the movement, which would affect the reliability of the detection.

[0046] like Figure 1 and Figure 5 As shown, in a specific embodiment, the chip testing fixture 100 further includes a movable support 60. The movable support 60 is sleeved on the guide rod 50 and forms a slidable connection with the guide rod 50. The detection component 30 is sleeved on and connected to the movable support 60. The movable support 60 is slidably connected to the guide rod 50 to reduce the frictional force experienced by the detection component 30 during movement, thereby protecting the detection component 30, preventing wear and tear during movement, and promoting smooth movement of the detection component 30. For example, the movable support 60 uses a linear bearing, which is connected to the second mounting plate 34.

[0047] like Figure 1 and Figure 6 As shown, in a specific embodiment, the drive assembly 40 includes a drive support 41, an operating handle 42, and a drive rod 43. The drive support 41 is mounted on the top of the test housing 11. The drive rod 43 passes through the drive support 41 and the test housing 11 to connect to the detection assembly 30. The operating handle 42 is rotatably connected to the drive support 41 and connected to the drive rod 43. When the operating handle 42 rotates, it can drive the drive rod 43 to move up and down. The drive rod 43 transmits power to the detection assembly 30, thereby realizing the up and down movement of the detection assembly 30. The operation is simple.

[0048] like Figure 1 As shown, in a specific embodiment, the chip testing fixture 100 also includes a heavy-duty connector 70 installed on the test housing 11. The heavy-duty connector 70 is electrically connected to the second probe 31. The second probe 31 can input the detection signal to the heavy-duty connector 70 and input the detection signal data to the host computer through the heavy-duty connector 70. This part is well known to those skilled in the art and will not be described in detail here.

[0049] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A chip testing fixture, characterized in that, include: The tooling body includes a test housing and a retractable first probe. The test housing has a detection cavity and an opening communicating with the detection cavity. The first probe is installed in the detection cavity and can be connected to an external power source. A carrier is installed at the bottom of the detection cavity and abuts against the first probe. The carrier is made of conductive material. The carrier has multiple spaced test stations for placing chips. A detection assembly is installed inside the detection cavity and positioned above the carrier; the detection assembly is provided with a plurality of spaced-apart second probes; and a corresponding test station is provided below each of the second probes; A drive component, installed in the test housing and connected to the detection component, is used to drive the detection component to move up and down.

2. The chip testing fixture according to claim 1, characterized in that, The tooling body includes multiple limiting stops installed in the detection cavity. The multiple limiting stops surround the carrier and respectively form limiting abutments with the carrier. At least one of the limiting stops is equipped with the retractable first probe.

3. The chip testing fixture according to claim 2, characterized in that, Among the plurality of limiting stops, at least one of the limiting stops opposite to the opening is equipped with the first probe, and the first probe is located on the side of the limiting stop facing the carrier.

4. The chip testing fixture according to claim 2, characterized in that, The test housing is equipped with wiring terminals; The limiting stop and / or the test housing are provided with a wire embedding space, which is used to install wiring. The first probe and the terminal are electrically connected through the wiring in the wire embedding space.

5. The chip testing fixture according to claim 1, characterized in that, The support component has a handle on the side facing the opening. The handle is made of insulating material and is spaced apart from the test station.

6. The chip testing fixture according to claim 1, characterized in that, The detection assembly includes a plurality of spaced elastic pins, and each of the second probes is surrounded by a plurality of said elastic pins.

7. The chip testing fixture according to claim 1, characterized in that, The detection assembly includes a first mounting plate, a second mounting plate, and a support rib. The first mounting plate is connected to the second mounting plate via the support rib. The first mounting plate and the second mounting plate are respectively angled to the support rib. The first mounting plate is equipped with the second probe, and the second mounting plate is connected to the drive assembly.

8. The chip testing fixture according to claim 1, characterized in that, The chip testing fixture also includes a guide rod, which is vertically installed inside the detection cavity; the detection component is sleeved on the guide rod and can move along the axial direction of the guide rod.

9. The chip testing fixture according to claim 8, characterized in that, The chip testing fixture also includes a movable support component, which is sleeved on the guide rod and slidably connected to the guide rod. The detection component is sleeved on and connected to the movable support component.

10. The chip testing fixture according to any one of claims 1 to 9, characterized in that, The drive assembly includes a drive support, an operating handle, and a drive rod; the drive support is mounted on the top of the test housing; the drive rod passes through the drive support and the test housing to connect to the detection assembly; the operating handle is rotatably connected to the drive support and to the drive rod to drive the drive rod to move up and down.

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