A chip test socket with enhanced signal suppression

Abstract

The utility model discloses a kind of chip test seats of enhanced signal suppression, it is related to chip processing technical field, the chip test seat of this enhanced signal suppression, including test seat body, the top end one side of test seat body is movably installed with gland assembly;The top end of test seat body is installed with positioning plate, and positioning plate's center is equipped with a installation groove, the inside center of installation groove is equipped with guide slot, and the bottom of guide slot is installed with upper metal block;The utility model, chip pin compression probe needle head, probe spring compression generates elastic force, make test seat body inside probe needle head and chip pin stable contact, circuit is conducted;While upper metal block, lower metal block and the ground of chip are connected, while other signals are shielded, finally, the overall structure of the test seat body is relatively simple, and parts can be manufactured by lathe processing mode, maintenance is more convenient in later period, and its use cost is lower, it is convenient for widely used.

Description

Technical Field

[0001] This utility model specifically relates to the field of chip processing technology, and more specifically to a chip test socket that enhances signal suppression. Background Technology

[0002] With the widespread application of chips in consumer electronics, automotive electronics, AI, and industrial IoT, chip verification and testing have always been a focus for developers. As time goes on, the target functions implemented by chips become more diverse, and testing becomes increasingly complex. In the past, chips were primarily used in consumer electronics such as mobile phones and computers. However, as chips gradually enter new electronic application areas, this is no longer a simple matter. Each end market has unique needs, and the methods and conditions for chip usage differ, resulting in more factors affecting chip functionality and quality than before. To ensure effective, reliable, and stable chip functionality and quality, all chips undergo comprehensive testing of all functions before development and application.

[0003] However, current chip testing methods may have certain problems. Conventional chip test sockets often only consider signal port connections and electrical insulation, easily overlooking potential signal crosstalk, which can lead to test signal distortion and affect test results and yield. To address these issues, we propose a chip test socket with enhanced signal suppression. Utility Model Content

[0004] The purpose of this invention is to provide a chip test socket with enhanced signal suppression. The chip pins compress the probe tips, and the probe springs compress to generate elasticity, ensuring stable contact between the probe tips inside the test socket and the chip pins, thus conducting the circuit. Simultaneously, the upper and lower metal blocks are connected to the chip's ground, shielding other signals. This solves the technical problems mentioned in the background section.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A chip test socket with enhanced signal suppression includes a test socket body, wherein a pressure cap assembly is movably mounted on one side of the top end of the test socket body; The top of the test seat is equipped with a positioning plate, and a mounting groove is opened in the center of the positioning plate. A guide groove is opened in the center of the mounting groove, and an upper metal block is installed at the bottom of the guide groove. A probe cover is fixedly installed at the bottom of the test base, and a lower metal block is fixedly installed at the center of the probe cover corresponding to the position of the upper metal block. Multiple sets of probes are installed between the lower metal block and the upper metal block.

[0006] As a further technical solution of this utility model, the pressure cap assembly includes a knob at its top, a screw connected to the bottom of the knob, a push block fixedly installed at the bottom of the screw, and a protruding pressing block fixedly installed at the center of the bottom of the push block.

[0007] As a further technical solution of this utility model, a buckle plate is installed on the outer side of the cover assembly, and a first reset spring is connected between the bottom of one end of the buckle plate and the cover assembly.

[0008] As a further technical solution of this utility model, the side of the cover assembly away from the buckle plate is connected to a second return spring via a rotating shaft. The second return spring is sleeved on the outside of the rotating shaft. The cover assembly is connected to a positioning frame via the rotating shaft, and a fastening block is provided on one side of the positioning frame at the position corresponding to the buckle plate. The buckle plate and the fastening block are snapped together.

[0009] As a further technical solution of this utility model, multiple sets of connecting holes are opened through the two sides of the positioning frame, and a screw hole is opened at the top of the test seat body corresponding to the position of the connecting hole, and the test seat body and the positioning frame are fixedly connected by bolts.

[0010] As a further technical solution of this utility model, the probe cover plate is connected to the bottom of the test base body by bolts, and the test base body is positioned on the PCB board by pins. The bottom of the probe is connected to the solder pad on the PCB board to form an electrical connection.

[0011] Compared with the prior art, the beneficial effects of this utility model are: In this invention, the chip pin compression probe tip is compressed, and the probe spring is compressed to generate elastic force, so that the probe tip inside the test socket body makes stable contact with the chip pin and conducts the circuit; at the same time, the upper metal block and the lower metal block are connected to the chip ground, while shielding other signals.

[0012] In this invention, the probe cover is detachable, allowing the probe to be replaced after disassembly. The probe replacement process is simpler, and the precise positioning plate, mounting slot, and guide slot ensure more accurate chip positioning. The present invention has a relatively simple overall structure of the test seat, and the parts can be manufactured by lathe machining, which makes later maintenance convenient. At the same time, its use cost is low and it is easy to use widely. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This utility model Figure 1 Another perspective illustration.

[0015] Figure 3 This utility model Figure 1 The main view.

[0016] Figure 4 This is a utility model Figure 3 Sectional view at point AA.

[0017] Figure 5 This is a utility model Figure 4 A magnified view of A in the middle.

[0018] 1-Test base body, 2-Pressure cap assembly; 11-Positioning plate, 12-Mounting groove, 13-Guide groove, 14-Upper metal block, 15-Probe cover plate, 16-Lower metal block, 17-Probe; 21-Knob, 22-Screw, 23-Push block, 24-Pressing block, 25-Snap plate, 26-First return spring, 27-Second return spring, 28-Positioning frame, 29-Snap-on block. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-5 This utility model provides a chip test socket with enhanced signal suppression, including a test socket body 1, and a pressure cover assembly 2 is movably installed on one side of the top of the test socket body 1; The top of the test seat body 1 is equipped with a positioning plate 11, and a mounting groove 12 is opened at the center of the positioning plate 11. A guide groove 13 is opened at the center of the mounting groove 12, and an upper metal block 14 is installed at the bottom of the guide groove 13. The bottom end of the test base 1 is fixedly installed with a probe cover plate 15, and a lower metal block 16 is fixedly installed at the center of the probe cover plate 15 corresponding to the position of the upper metal block 14. Multiple sets of probes 17 are installed between the lower metal block 16 and the upper metal block 14. In this example, the cap assembly 2 includes a knob 21 at its top, a screw 22 connected to the bottom of the knob 21, and a push block 23 fixedly installed at the bottom of the screw 22. A protruding pressing block 24 is fixedly installed at the center of the bottom of the push block 23.

[0021] In this example, a buckle plate 25 is installed on the outer side of the cover assembly 2, and a first reset spring 26 is connected between the bottom of one end of the buckle plate 25 and the cover assembly 2.

[0022] In this example, the side of the cover assembly 2 away from the buckle plate 25 is connected to a second return spring 27 via a pivot. The second return spring 27 is sleeved on the outside of the pivot. The cover assembly 2 is connected to a positioning frame 28 via a pivot. A fastening block 29 is provided on one side of the positioning frame 28 at the position corresponding to the buckle plate 25. The buckle plate 25 and the fastening block 29 are snapped together.

[0023] In this example, multiple sets of connecting holes are provided through the two sides of the positioning frame 28, and a screw hole is provided at the top of the test seat body 1 corresponding to the position of the connecting hole. The test seat body 1 and the positioning frame 28 are fixedly connected by bolts.

[0024] In this example, the probe cover plate 15 is connected to the bottom of the test base body 1 by bolts, and the test base body 1 is positioned on the PCB board by pins. The bottom of the probe 17 is connected to the solder pad on the PCB board to form an electrical connection. By adopting the above technical solution, the probe cover plate 15 is detachable, and the probe 17 can be replaced after disassembly. The replacement process of the probe 17 is simpler, and the precise positioning plate 11, mounting slot 12 and guiding slot 13 can ensure more accurate positioning of the chip.

[0025] The working principle of this utility model is as follows: This device is mainly used to test chips packaged as DFN5. When picking up and placing the chip, the cover assembly 2 is opened, and the chip is placed in the guide groove 13 of the mounting groove 12 of the positioning plate 11 according to the distribution of the probes 17 inside the test base body 1. The chip pins are positioned on the corresponding probes 17. After closing the cover assembly 2, rotate the knob 21 on the cover assembly 2. At this time, the screw 22 inside the cover assembly 2 rotates, driving the pressing block 24 at the push block 23 to press the chip. The chip pins compress the probe 17 needle, and the spring of probe 17 is compressed to generate elastic force, so that the probe 17 inside the test socket 1 makes stable contact with the chip pins and conducts the circuit. At the same time, the upper metal block 14 and the lower metal block 15 are connected to the ground of the chip, while shielding other signals.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0027] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A chip test socket for enhanced signal suppression, characterized in that: Includes a test seat body (1), and a pressure cap assembly (2) is movably installed on one side of the top of the test seat body (1); The top of the test seat body (1) is equipped with a positioning plate (11), and a mounting groove (12) is opened at the center of the positioning plate (11). A guide groove (13) is opened at the center of the mounting groove (12), and an upper metal block (14) is installed at the bottom of the guide groove (13). The bottom end of the test seat (1) is fixedly installed with a probe cover plate (15), and a lower metal block (16) is fixedly installed at the center of the probe cover plate (15) corresponding to the position of the upper metal block (14). Multiple sets of probes (17) are installed between the lower metal block (16) and the upper metal block (14).

2. The chip test socket for enhanced signal suppression according to claim 1, characterized in that: The cap assembly (2) includes a knob (21) at its top, a screw (22) connected to the bottom of the knob (21), and a push block (23) fixedly installed at the bottom of the screw (22), and a protruding pressing block (24) fixedly installed at the center of the bottom of the push block (23).

3. The chip test socket for enhanced signal suppression according to claim 2, characterized in that: A buckle plate (25) is installed on the outer side of the cover assembly (2), and a first reset spring (26) is connected between the bottom of one end of the buckle plate (25) and the cover assembly (2).

4. The chip test socket for enhanced signal suppression according to claim 3, characterized in that: The pressure cap assembly (2) is connected to a second return spring (27) via a pivot on the side away from the buckle plate (25). The second return spring (27) is sleeved on the outside of the pivot. The pressure cap assembly (2) is connected to a positioning frame (28) via a pivot. A snap-fit ​​block (29) is provided on one side of the positioning frame (28) at the position corresponding to the buckle plate (25). The buckle plate (25) and the snap-fit ​​block (29) are snap-fitted together.

5. The chip test socket for enhanced signal suppression according to claim 4, characterized in that: Multiple sets of connecting holes are opened through the two sides of the positioning frame (28), and a screw hole is opened at the top of the test seat body (1) corresponding to the position of the connecting hole. The test seat body (1) and the positioning frame (28) are fixedly connected by bolts.

6. The chip test socket for enhanced signal suppression according to claim 1, characterized in that: The probe cover plate (15) is connected to the bottom of the test base body (1) by bolts, and the test base body (1) is positioned on the PCB board by pins. The bottom of the probe (17) is connected to the pad on the PCB board to form an electrical connection.

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