An automatic pressing device for processing a circuit board

Abstract

The utility model is suitable for circuit board processing, provide a kind of automatic press fit device of circuit board processing, including support frame, limiting component, press fit component, monitoring component and controller, the limiting component includes first driving part and second driving part, the first driving part fixedly connected in support frame;In the utility model, when pressure sensor also contacts with circuit board main body, and continue to move downward, the signal detected by pressure sensor is transmitted to controller, then the four displacement sensors of working start work, the displacement of the pressing plate moving downward is monitored, the displacement of the pressing plate or the pressure value monitored by pressure sensor can be used to ensure the press fit quality of circuit board main body, and in this process, limiting structure can limit the circuit board main body being pressed, so that the circuit board main body is not easy to deviate in the press fit process, so that the circuit board main body can be pressed with high quality.

Description

Technical Field

[0001] This utility model relates to circuit board processing, and more particularly to an automated pressing device for circuit board processing. Background Technology

[0002] Circuit boards are made by laminating multiple circuit boards and insulating layers together. During the lamination process, if the operator does not control the lamination position properly, the circuit boards may not be tightly laminated, resulting in substandard quality. Alternatively, excessive pressure applied between the pressure plate and the circuit board may cause deformation and damage to the locating pins and the circuit board, misalignment of the circuit board, and the generation of scrap, thus reducing the lamination quality of the circuit boards. Therefore, an automated lamination device for circuit board processing is needed to solve the above problems. Utility Model Content

[0003] The purpose of this utility model embodiment is to provide an automated pressing device for circuit board processing to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: An automated pressing device for circuit board processing includes a support frame, a limiting component, a pressing component, a monitoring component, and a controller. The limiting component includes a first driving member and a second driving member. The first driving member is fixedly connected inside the support frame, and the two ends of the first driving members that are close to each other are fixedly connected to a limiting shell. Two limiting frames are slidably connected inside the limiting shell. The second driving member is fixedly connected inside the limiting shell, and both ends of the second driving member are fixedly connected to the two limiting frames respectively. The pressing assembly includes a third driving component, which is fixedly connected inside the support frame. The bottom end of the third driving component is fixedly connected to the pressure plate. The bottom of the pressure plate is provided with an installation groove, and the pressure plate is provided with a through hole. The monitoring component includes a pressure sensor and several displacement sensors. The pressure sensor is installed in a mounting slot and is connected to a controller via a cable located in a through hole. The controller is connected to several displacement sensors.

[0005] In a further technical solution, the limiting frame is L-shaped, with the two limiting shells having their opposite sides fixedly connected to several guide rods, which are slidably connected within the support frame.

[0006] In a further technical solution, the upper surface of the support frame is covered with the circuit board body, which is connected between two limiting shells and four limiting frames.

[0007] In a further technical solution, a cavity is provided between the limiting frame and the circuit board body, and the cavity is located directly below the displacement sensor.

[0008] In a further technical solution, several telescopic rods are fixedly connected inside the support frame, and the bottom ends of the telescopic rods are connected to the pressure plate.

[0009] In a further technical solution, the displacement sensor is configured as a displacement sensor, and the pressure sensor is configured as a strain gauge sensor.

[0010] Compared with the prior art, the beneficial effects of this utility model are: In this invention, when the downward-moving pressure plate contacts the top of the circuit board body, the pressure sensor also contacts the circuit board body. As the pressure sensor continues to move downward, the signal detected by the pressure sensor is transmitted to the controller. Then, the four displacement sensors start working to monitor the displacement of the downward-moving pressure plate. The pressing quality of the circuit board body can be ensured by the displacement of the pressure plate or the pressure value monitored by the pressure sensor. In addition, during this process, the limiting structure can limit the pressed circuit board body, making it less likely for the circuit board body to shift during the pressing process, so that the circuit board body can be pressed with high quality. In this invention, when the four L-shaped limiting frames come into contact with the four corners of the circuit board body, and because the two second driving components retract synchronously, the four L-shaped limiting frames can push and position the circuit board body directly below the pressure plate.

[0011] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of the present invention from the front view; Figure 2 This is a three-dimensional structural diagram of the present invention viewed from below; Figure 3 This is a partial three-dimensional cross-sectional structural diagram of the present invention.

[0013] In the diagram: 1. Support frame; 2. Limiting component; 21. First driving component; 22. Limiting shell; 23. Second driving component; 24. Limiting frame; 25. Cavity; 26. Guide rod; 3. Pressing component; 31. Third driving component; 32. Pressure plate; 33. Mounting groove; 34. Through hole; 35. Telescopic rod; 4. Monitoring component; 41. Pressure sensor; 42. Displacement sensor; 5. Circuit board body; 6. Controller. Detailed Implementation

[0014] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0015] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0016] Please see Figure 1-3 This utility model provides an automated pressing device for circuit board processing, including a support frame 1, a limiting component 2, a pressing component 3, a monitoring component 4, and a controller 6. The limiting component 2 includes a first driving member 21 and a second driving member 23. The first driving member 21 is fixedly connected inside the support frame 1. The two ends of the two first driving members 21 that are close to each other are fixedly connected to a limiting shell 22. Two limiting frames 24 are slidably connected inside the limiting shell 22. The second driving member 23 is fixedly connected inside the limiting shell 22. The two ends of the second driving member 23 are fixedly connected to the two limiting frames 24 respectively. The pressing assembly 3 includes a third driving member 31, which is fixedly connected to the support frame 1. The bottom end of the third driving member 31 is fixedly connected to the pressure plate 32. The bottom of the pressure plate 32 is provided with a mounting groove 33, and the pressure plate 32 is provided with a through hole 34. The monitoring component 4 includes a pressure sensor 41 and several displacement sensors 42. The pressure sensor 41 is installed in the mounting groove 33 and is connected to the controller 6 through a cable provided in the through hole 34. The controller 6 is connected to several displacement sensors 42.

[0017] In this embodiment, by setting the first driving member 21, the second driving member 23 and the third driving member 31, the first driving member 21, the second driving member 23 and the third driving member 31 can be designed as electric push rods, cylinders or hydraulic cylinders according to the actual situation. The circuit board body 5 is placed on the support frame 1, so that the circuit board body 5 is located inside the limiting component 2. The first driving member 21 is controlled to extend. The two extended first driving members 21 drive the limiting shell 22 to overlap with the two sides of the circuit board body 5 respectively. Then, the two second driving members 23 are controlled to retract. The two retracted second driving members 23 drive the two limiting frames 24 to move closer to each other. The two sets of limiting frames 24 that move closer to each other contact the front and back of the circuit board body 5 respectively. At this time, the limiting structure formed by the two limiting shells 22 and the four limiting frames 24 can limit the circuit board inside. The third drive component 31 extends, causing the pressure plate 32 to move downwards. The downward-moving pressure plate 32 then moves the pressure sensor 41 and displacement sensor 42 downwards. When the downward-moving pressure plate 32 contacts the top of the circuit board body 5, since the bottom of the circuit board body 5 and the bottom of the pressure sensor 41 are on the same plane, the pressure sensor 41 also contacts the circuit board body 5. As the pressure sensor 41 continues to move downwards, it detects pressure. The signal detected by the pressure sensor 41 is then transmitted to the controller 6. The time controller 6 controls the four displacement sensors 42 to work. Then, the laser generated by the four displacement sensors 42 passes through the cavity 25 and shines on the surface of the support frame 1 and is reflected back to the sensor. At this time, the displacement sensors 42 start to work and monitor the displacement of the downward moving pressure plate 32. The displacement of the pressure plate 32 can be used to know and ensure the pressing quality of the circuit board body 5. In this process, the limiting structure can limit the pressed circuit board body 5, so that the circuit board body 5 is not easy to shift during the pressing process, so that the circuit board body 5 can be pressed with high quality. like Figure 1 and Figure 3 As shown, this utility model provides an automated pressing device for circuit board processing. The limiting frame 24 is L-shaped, and the two limiting shells 22 are fixedly connected to a number of guide rods 26 on opposite sides. The number of guide rods 26 are slidably connected in the support frame 1. In this embodiment, the guide rod 26, which is slidably connected in the support frame 1, can limit the movement of the limiting shell 22, so that when the limiting shell 22 moves under the action of the first driving member 21, the limiting shell 22 will not shake, and the limiting shell 22 can move smoothly along the axial direction of the guide rod 26. like Figures 1-3 As shown, this utility model provides an automated pressing device for circuit board processing. The upper surface of the support frame 1 is covered with the circuit board body 5, which is connected between two limiting shells 22 and four limiting frames 24. In this embodiment, when the four L-shaped limiting frames 24 come into contact with the four corners of the circuit board body 5, the L-shaped limiting frames 24 can limit the corners of the circuit board body 5, and because the two second driving members 23 retract synchronously, the four L-shaped limiting frames 24 can push the circuit board body 5 and position it directly below the pressure plate 32. like Figure 1 and Figure 3 As shown, this utility model provides an automated pressing device for circuit board processing. A cavity 25 is provided between the limiting frame 24 and the circuit board body 5. The cavity 25 is located directly below the displacement sensor 42. In this embodiment, by setting the cavity 25, the laser generated by the displacement sensor 42 when it is working can pass through the control and irradiate the surface of the support frame 1. Then, the displacement sensor 42 connected to the pressure plate 32 and the support frame 1 cooperate with each other to successfully monitor the pressing distance after the pressure plate 32 contacts the circuit board body 5. like Figures 1-3 As shown, this utility model provides an automated pressing device for circuit board processing. Several telescopic rods 35 are fixedly connected inside the support frame 1, and the bottom ends of the several telescopic rods 35 are connected to the pressure plate 32. In this embodiment, the telescopic rod 35 can limit the movement of the pressure plate 32, so that the pressure plate 32 can move smoothly along the axial direction of the telescopic rod 35 under the action of the working third driving member 31. like Figure 1 and Figure 2 As shown, this utility model provides an automated pressing device for circuit board processing, wherein the displacement sensor 42 is configured as a displacement sensor 42 and the pressure sensor 41 is configured as a strain gauge sensor. In this embodiment, the bottom of the strain gauge sensor can be on the same plane as the bottom of the pressure plate 32, and then the pressure plate 32 and the pressure sensor 41 can simultaneously contact the circuit board body 5.

[0018] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An automated pressing device for circuit board processing, comprising a support frame (1), a limiting component (2), a pressing component (3), a monitoring component (4), and a controller (6), characterized in that: The limiting component (2) includes a first driving member (21) and a second driving member (23). The first driving member (21) is fixedly connected inside the support frame (1). The two ends of the first driving members (21) that are close to each other are fixedly connected to the limiting shell (22). Two limiting frames (24) are slidably connected inside the limiting shell (22). The second driving member (23) is fixedly connected inside the limiting shell (22). The two ends of the second driving member (23) are fixedly connected to the two limiting frames (24) respectively. The pressing assembly (3) includes a third driving member (31), which is fixedly connected to the support frame (1). The bottom end of the third driving member (31) is fixedly connected to the pressure plate (32). The bottom of the pressure plate (32) is provided with an installation groove (33), and the pressure plate (32) is provided with a through hole (34). The monitoring component (4) includes a pressure sensor (41) and several displacement sensors (42). The pressure sensor (41) is installed in the mounting groove (33). The pressure sensor (41) is connected to the controller (6) through a cable provided in the through hole (34). The controller (6) is connected to several displacement sensors (42).

2. The automated lamination device for circuit board processing according to claim 1, characterized in that: The limiting frame (24) is L-shaped, and the two limiting shells (22) are fixedly connected to several guide rods (26) on opposite sides. The several guide rods (26) are slidably connected in the support frame (1).

3. The automated lamination device for circuit board processing according to claim 1, characterized in that: The upper surface of the support frame (1) is covered with the circuit board body (5), which is connected between two limiting shells (22) and four limiting frames (24).

4. The automated lamination device for circuit board processing according to claim 1, characterized in that: A cavity (25) is provided between the limiting frame (24) and the circuit board body (5), and the cavity (25) is located directly below the displacement sensor (42).

5. The automated lamination device for circuit board processing according to claim 1, characterized in that: The support frame (1) has several telescopic rods (35) fixedly connected inside, and the bottom ends of the telescopic rods (35) are connected to the pressure plate (32).

6. The automated lamination device for circuit board processing according to claim 1, characterized in that: The displacement sensor (42) is configured as a displacement sensor (42), and the pressure sensor (41) is configured as a strain gauge sensor.

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