A shell assembly and electronic device

Abstract

The application relates to the technical field of electronic equipment, in particular to a shell assembly and electronic equipment. The shell assembly comprises a shell body and a cortex layer, the cortex layer is fixedly connected with the shell body, the shell body comprises at least two layer bodies which are stacked along the thickness direction of the shell assembly, the layer bodies are formed by fiber weaving, and adjacent layer bodies are fixedly bonded. By arranging the at least two layer bodies, the thickness of a single layer body can be reduced, the diameter of the fiber used for weaving the layer body can be reduced, the weaving density of the layer body is improved, the structural strength of the layer body is improved, the improvement of the weaving density of the layer body can also reduce the risk of the shell body being pierced by a sharp object, and the puncture resistance of the shell body and the shell assembly is improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a housing assembly and an electronic device. Background Technology

[0002] Electronic devices include bezels and displays and housing components mounted on the bezels. When the exposed surfaces of the housing components are made of leather material, the feel of the electronic device can be improved, thereby enhancing the user experience and the aesthetics of the electronic device.

[0003] However, housing components containing leather materials have poor puncture resistance, and are at higher risk of damage when electronic devices are subjected to external impact.

[0004] Therefore, improving the puncture resistance of housing components is an important problem that urgently needs to be solved in this field. Utility Model Content

[0005] In view of this, this application provides a housing assembly and an electronic device that can improve the puncture resistance of the housing assembly of the electronic device.

[0006] The first aspect of this application provides a housing assembly, including a housing body and a corrugated layer, wherein the corrugated layer is fixedly connected to the housing body, and the housing body includes at least two layers stacked along a first direction.

[0007] In this application, by providing at least two layers, the thickness of a single layer in the first direction can be reduced, thereby reducing the diameter and porosity of the fibers used to weave the layers, and thus increasing the weaving density of the layers, thereby improving the structural strength and impact resistance of the layers, and thus improving the structural strength and impact resistance of the shell body and shell assembly.

[0008] The shell body is constructed as a stacked structure comprising at least two layers. During the processing of the shell body, each layer can be processed individually, which helps to reduce the processing difficulty of the shell.

[0009] In some possible designs, the elastic modulus of the shell body is E, where E ≥ 240 GPa.

[0010] In this application, the elastic modulus of the shell body is not less than 240 GPa. When subjected to puncture force, the high elastic modulus can help the shell body to more effectively disperse local concentrated stress, reduce the pressure peak of the shell body at the puncture point, and thus reduce the risk of the shell body being punctured by a sharp object, so as to improve the puncture resistance of the shell body and shell components.

[0011] In some possible designs, the layer material is PBO fiber.

[0012] In this application, PBO fibers have high tensile strength and high elastic modulus, which enables PBO fibers to provide excellent rigidity and dimensional stability. Furthermore, due to its unique molecular structure, PBO fibers exhibit excellent impact resistance. Shell bodies made of PBO fibers can have high puncture resistance and structural strength, thereby improving the puncture resistance and structural stability of shell components.

[0013] The shell body made of PBO fiber has high puncture resistance and structural strength, and can reduce the thickness of the shell body in the first direction, so as to realize the design of the shell assembly with light weight and thinness.

[0014] PBO fiber has a low density, and shells made of PBO fiber can maintain high strength while being lightweight, so as to achieve lightweight design of shell components.

[0015] In some possible designs, the shell body also includes a first adhesive layer, at least a portion of which is disposed between adjacent layers to bond and fix the adjacent layers together, and the material of the first adhesive layer is resin.

[0016] In this application, the bonding force between the resin and PBO fiber is strong, and the bonding force between resins is also strong. Adjacent layers are fixed by resin bonding, which can improve the bonding effect between adjacent layers, reduce the risk of layer separation and detachment, and improve the structural stability of the shell body and shell assembly.

[0017] In one possible design, the dimension of the layer in the first direction is h1, where 0.1mm ≤ h1 ≤ 0.15mm.

[0018] In this application, the thickness of the layer in the first direction is between 0.1 mm and 0.15 mm, which can reduce the processing difficulty of the layer and reduce the risk of damage to the layer during processing and installation. It can also reduce the risk of a large thickness of the shell body after multiple layers are stacked.

[0019] In one possible design, the number of layers stacked in the first direction is three.

[0020] In this application, the number of layers stacked in the first direction is three, so as to reduce the thickness of each layer in the first direction, and at the same time, it can also reduce the risk of increased processing difficulty caused by the smaller thickness of each layer.

[0021] In some possible designs, the shell body has a dimension of H1 in the first direction, where 0.32mm ≤ H1 ≤ 0.38mm.

[0022] In this application, the dimensions of the shell body in the first direction are between 0.32 mm and 0.38 mm, which can improve the puncture resistance and structure of the shell body, improve the structural stability of the shell assembly and electronic device, reduce the cost of the shell body, reduce the cost of the shell assembly and electronic device, and reduce the weight of the shell body, so as to realize the thinner and lighter design of the shell assembly and electronic device.

[0023] In some possible designs, the housing assembly also includes a second adhesive layer, which bonds and secures the housing body to the leather layer.

[0024] In this application, the shell body and the leather layer are bonded and fixed, which can improve the connection stability between the shell body and the leather layer, reduce the risk of the leather layer falling off the shell body, and improve the structural stability of the shell assembly and electronic device.

[0025] In some possible designs, along the first direction, the side of the leather layer facing away from the shell body has an embossed pattern layer. The second adhesive layer includes a first adhesive layer, which is bonded to the leather layer. The second adhesive layer also includes a second adhesive layer, which is bonded to the shell body. The first and second adhesive layers are used for hot pressing to form the second adhesive layer.

[0026] In this application, the bonding between the first adhesive layer and the leather layer can limit the bending deformation and outward expansion of the leather layer, which can reduce the risk of incomplete, unclear, or shallow embossing patterns, reduce the difficulty of hot pressing patterns on the leather layer, and help improve the embossing effect of the leather layer.

[0027] After the leather layer is embossed, the first adhesive layer made of hot melt adhesive has a lower viscosity or even no longer has adhesiveness after being hot-pressed again. Setting a second adhesive layer can facilitate the bonding and fixation of the first adhesive layer to the shell body, and help improve the bonding stability between the first adhesive layer and the shell body, reducing the risk of the leather layer falling off the shell body.

[0028] In some possible designs, the first adhesive layer has a dimension of h21 in the first direction, where 0.025mm ≤ h21 ≤ 0.035mm. The second adhesive layer has a dimension of h22 in the first direction, where 0.025mm ≤ h22 ≤ 0.035mm.

[0029] In this application, the thickness of the first adhesive layer and the second adhesive layer in the first direction is between 0.025 mm and 0.035 mm, which can improve the adhesion between the leather layer, the first adhesive layer, the second adhesive layer and the shell body, reduce the risk of the leather layer falling off due to separation of the leather layer, the first adhesive layer, the second adhesive layer and the shell body, and reduce the risk of adhesion failure due to aging or damage of the first adhesive layer and the second adhesive layer. It also improves the adhesion stability between the leather layer, the first adhesive layer, the second adhesive layer and the shell body, and reduces the material cost of the first adhesive layer and the second adhesive layer, so as to reduce the cost of the shell assembly and facilitate the thinning of the shell assembly.

[0030] In some possible designs, the dimension of the second adhesive layer in the first direction is H2, 0.02mm≤H2≤0.03mm.

[0031] In this application, the thickness of the second adhesive layer in the first direction is between 0.02 mm and 0.03 mm, which can improve the adhesion between the leather layer and the shell body, reduce the risk of the leather layer falling off due to separation between the leather layer and the shell body, and reduce the risk of adhesion failure due to aging or damage of the second adhesive layer. It also improves the adhesion stability between the leather layer and the shell body and reduces the material cost of the second adhesive layer, so as to reduce the cost of the shell assembly and electronic device, and also facilitates the thinning of the shell assembly and electronic device.

[0032] In some possible designs, the corrugated layer includes a corrugated body layer and a base layer. Along the first direction, the base layer is disposed between the corrugated body layer and the shell body. The corrugated body layer and the base layer are bonded and fixed together. The base layer is made of polyester.

[0033] In this application, polyester has a lower density than glass fiber, and the substrate layer made of polyester is lighter, which is beneficial for achieving lightweight design of housing components and electronic devices.

[0034] Polyester has high tensile and tear strength. A base layer made of polyester can improve the puncture resistance of the cortex layer to a certain extent. Combined with the shell body made of PBO fiber, it can further improve the puncture resistance of the shell components and electronic devices.

[0035] Polyester has strong dimensional stability and wrinkle resistance. During the hot pressing of the patterned leather layer, the polyester base layer can, to a certain extent, hinder the deformation of the leather body layer, so as to further improve the embossing effect of the leather layer.

[0036] In some possible designs, the size of the cortical layer in the first direction is H3, 0.2mm≤H3≤0.25mm.

[0037] In this application, the thickness of the cortex layer in the first direction is between 0.2 mm and 0.25 mm, which reduces the processing difficulty of the cortex layer, thereby reducing the processing cost of the housing assembly, shortening the processing cycle of the housing assembly, improving the structural strength of the cortex layer, reducing the risk of cortex layer damage, and also reducing the overall thickness of the housing assembly and electronic device, so as to achieve the thinning and weight reduction of the housing assembly and electronic device, and helping to reduce the cost of the housing assembly and electronic device.

[0038] In some possible designs, the housing assembly has a dimension S in the first direction, where 0.57 mm ≤ S ≤ 0.64 mm.

[0039] In this application, the thickness of the housing assembly in the first direction is between 0.57 mm and 0.64 mm, which improves the structural strength of the housing assembly, reduces the risk of the housing assembly being punctured by sharp objects, and can also reduce the overall thickness of the electronic device, so as to achieve the thinning and weight reduction of the housing assembly and the electronic device, and help reduce the cost of the housing assembly and the electronic device.

[0040] A second aspect of this application provides an electronic device, which includes a display screen, a frame, and a housing assembly. The display screen and the housing assembly are respectively connected to both sides of the frame in the thickness direction of the electronic device, and the housing assembly is any of the housing assemblies described above.

[0041] In this application, the shell body of the housing assembly is formed by bonding multiple layers together, which can reduce the thickness of a single layer in the first direction, reduce the diameter and porosity of the fibers used to weave the layers, thereby increasing the weaving density of the layers, improving the structural strength and impact resistance of the layers, and thus improving the puncture resistance of the electronic device. Attached Figure Description

[0042] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 Schematic diagrams of the electronic device provided in this application in some embodiments;

[0044] Figure 2 Cross-sectional views of partial structures of the housing assembly provided in this application in some embodiments;

[0045] Figure 3 This is an enlarged view of a partial structure of the shell body in some embodiments;

[0046] Figure 4 This is a schematic diagram of the stacked structure of the shell body in some embodiments;

[0047] Figure 5 Cross-sectional views of a partial structure of the housing assembly provided in this application in other embodiments;

[0048] Figure 6 Cross-sectional views of partial structures of the housing assembly provided in this application in some of the other embodiments;

[0049] Figures 7 to 9 for Figure 6 A schematic diagram of the manufacturing process of the housing assembly in some embodiments;

[0050] Figure 10 This is a schematic diagram of the layered structure of the cortex in some embodiments;

[0051] Figure 11 The housing assembly provided in this application is shown in some embodiments as a stacked structure.

[0052] Figure label:

[0053] 100 - Display screen; 200 - Bezel; 300 - Housing assembly;

[0054] 10-Shell body; 11-Layer body; 11A-Fiber; 11B-Pore; 111-First layer body; 112-Second layer body; 113-Third layer body; 12-First adhesive layer;

[0055] 20 - Cortex; 21 - Embossing pattern layer; 22 - Cortex body layer; 23 - Basal layer.

[0056] 30 - Second adhesive layer; 31 - First adhesive layer; 32 - Second adhesive layer. Detailed Implementation

[0057] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0058] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0059] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0060] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0061] This application provides an electronic device, which can be a mobile phone, tablet, computer, watch, helmet, earphone, etc. This application does not specifically limit the type of electronic device.

[0062] Figure 1 This is a schematic diagram of the structure of an electronic device in some embodiments. Figure 1 The example electronic device is a mobile phone. For example... Figure 1 As shown, the electronic device may include a display screen 100, a frame 200, and a housing assembly 300. The display screen 100 and the housing assembly 300 are respectively connected to the two sides of the frame 200 in the first direction Z. The housing assembly 300 can be used as the back cover of a mobile phone. The first direction Z can be the thickness direction of the electronic device, the thickness direction of the display screen 100, or the thickness direction of the housing assembly 300. The first direction Z can also be the z-axis direction.

[0063] In addition, the electronic device may also include a second direction and a third direction, wherein the second direction may be the length direction of the electronic device and the third direction may be the width direction of the electronic device.

[0064] To improve the feel and aesthetics of the housing assembly 300 of the electronic device, the exposed surface of the housing assembly 300 can be made of leather material to enhance the user's experience of using the electronic device.

[0065] Figure 2 This is a cross-sectional view of a partial structure of the housing assembly 300 in some embodiments. For example... Figure 2 As shown, the housing assembly 300 may include a housing body 10 and a leather layer 20 stacked along a first direction Z, with the leather layer 20 disposed on the housing body 10. In the first direction Z, the surface of the leather layer 20 facing away from the housing body 10 is made of leather material. By making the exposed surface of the leather layer 20 a leather material, the user experience of the housing assembly 300 and the electronic device can be improved, and the aesthetics of the housing assembly 300 and the electronic device can also be enhanced.

[0066] like Figure 2 As shown, in the first direction Z, the side of the leather layer 20 facing away from the shell body 10 may have an embossed pattern layer 21. The embossed pattern layer 21 may include preset patterns, designs, text, etc., in order to further enhance the aesthetics of the shell assembly 300 and the electronic device.

[0067] The detailed structure of the housing assembly 300 is described layer by layer below.

[0068] Please continue to refer to this. Figure 2 The shell body 10 is used to support and fix the leather layer 20. The leather layer 20 contains leather material, which makes the leather layer 20 relatively soft. That is, the leather layer 20 is prone to bending and deformation under external force. The fixing effect of the shell body 10 on the leather layer 20 can reduce the risk of the leather layer 20 bending, thereby reducing the risk of the leather layer 20 wrinkling or even falling off during the use of the shell assembly 300 and electronic devices, which can improve the user experience of the shell assembly 300 and electronic devices.

[0069] To enhance the support and fixation effect of the shell body 10 on the leather layer 20, the thickness of the shell body 10 can be increased, or the material of the shell body 10 can be adjusted.

[0070] In some embodiments, the thickness of the shell body 10 in the first direction Z is adjusted to be not less than 0.4 mm. For example, the thickness of the shell body 10 in the first direction Z is 0.45 mm. By increasing the thickness of the shell body 10, the structural strength of the shell body 10 can be improved, the deformation resistance of the shell body 10 can be improved, and thus the support and fixation effect of the shell body 10 on the cortical layer 20 can be improved.

[0071] However, the shell body 10 is relatively thick, which results in a relatively large overall thickness of the shell assembly 300 in the first direction Z, which is not conducive to achieving a thinner and lighter shell assembly 300 and electronic device.

[0072] Therefore, in some other embodiments, the shell body 10 can be made of Pi (Polyimide) fiber. Pi fiber has high structural strength and light weight. The shell body 10 made of Pi fiber can provide good support and fixation for the corrugated layer 20, and is also conducive to reducing the overall thickness and weight of the shell assembly 300 and electronic device, so as to achieve the thinning and lightening of the shell assembly 300 and electronic device.

[0073] However, the shell body 10 made of Pi fiber has poor puncture resistance. Puncture resistance refers to the material's ability to resist penetration by sharp objects. That is, the shell body 10 has poor protection against sharp objects such as nails, needles, and stones, and there is a risk that the shell assembly 300 and electronic equipment may be punctured by sharp objects.

[0074] Therefore, in this embodiment of the application, the shell body 10 is made of a material with an elastic modulus of not less than 240 GPa. The elastic modulus of the shell body 10 is E, where E ≥ 240 GPa. For example, the elastic modulus of the shell body 10 can be 240 GPa, 245 GPa, 250 GPa, 255 GPa, 260 GPa, 265 GPa, 270 GPa, 275 GPa, 280 GPa, 285 GPa, 290 GPa, 295 GPa, 300 GPa, etc.

[0075] In this embodiment, the elastic modulus of the shell body 10 is not less than 240 GPa. When subjected to puncture force, the high elastic modulus can help the shell body 10 to more effectively disperse local concentrated stress, reduce the pressure peak of the shell body 10 at the puncture point, thereby reducing the risk of the shell body 10 being punctured by a sharp object, and improving the puncture resistance of the shell body 10, the shell assembly 300 and the electronic device.

[0076] For example, the shell body 10 may also be made of carbon fiber, ceramic fiber or other synthetic fiber. This application embodiment does not make any special limitation on the specific material of the shell body 10.

[0077] In some embodiments, the shell body 10 may be made of PBO (Poly-p-phenylene benzobisoxazole) fibers.

[0078] In the embodiments of this application, PBO fibers have high tensile strength and high elastic modulus, which enables PBO fibers to provide excellent rigidity and dimensional stability. Furthermore, due to its unique molecular structure, PBO fibers exhibit excellent impact resistance. The shell body 10 made of PBO fibers can have high puncture resistance and structural strength, thereby improving the puncture resistance and structural stability of the shell assembly 300 and electronic devices.

[0079] The shell body 10 made of PBO fiber has high puncture resistance and structural strength, so the thickness of the shell body 10 in the first direction Z can be reduced to facilitate the thinner and lighter design of the shell assembly 300 and electronic device.

[0080] PBO fiber has a low density, and the shell body 10 made of PBO fiber can have a light weight while ensuring high strength, so as to realize the lightweight design of the shell assembly 300 and electronic equipment.

[0081] Continue to refer to Figure 2The shell body 10 has a dimension H1 in the first direction Z, where 0.32mm ≤ H1 ≤ 0.38mm. For example, the thickness of the shell body 10 can be 0.32mm, 0.33mm, 0.34mm, 0.35mm, 0.36mm, 0.37mm, 0.38mm, etc.

[0082] If the thickness of the shell body 10 is small, the force required for a sharp object to pierce the shell body 10 is small, resulting in poor puncture resistance of the shell body 10. Furthermore, if the thickness of the shell body 10 is small, the strength of the shell body 10 is poor, and the risk of bending and deformation under stress is high, resulting in poor structural stability of the shell assembly 300.

[0083] If the thickness of the housing body 10 is large, the material cost of the housing body 10 will be high, resulting in a higher cost for the housing assembly 300 and the electronic device. Furthermore, if the thickness of the housing body 10 is large, the weight of the housing body 10 will be large, which is not conducive to achieving a thinner and lighter design for the housing assembly 300 and the electronic device.

[0084] Therefore, the dimensions of the shell body 10 in the first direction Z can be between 0.32mm and 0.38mm, which can improve the puncture resistance and structure of the shell body 10, improve the structural stability of the shell assembly 300 and electronic devices, reduce the cost of the shell body 10, reduce the cost of the shell assembly 300 and electronic devices, and reduce the weight of the shell body 10, so as to realize the thinner and lighter design of the shell assembly 300 and electronic devices.

[0085] In this embodiment, the dimension H1 of the shell body 10 in the first direction Z is 0.35mm, which can balance the puncture resistance, structural strength, cost and weight of the shell body 10, and can further optimize the puncture resistance, structural stability, thickness and weight of the shell assembly 300 and electronic device.

[0086] Figure 3 This is an enlarged view of a partial structure of the shell body 10 in some embodiments. For example... Figure 3 As shown, the shell body 10 may include a layer 11 woven from fibers 11A, and the number of layers 11 stacked in the first direction Z may be one or multiple.

[0087] Continue to refer to Figure 3 When the number of layers 11 in the first direction Z is one, the thickness of the shell body 10 is related to the diameter of the fiber 11A. In order to meet the thickness requirements of the shell body 10, the diameter of the fiber 11A can be increased, and thicker fibers 11A can be used to weave the shell body 10. However, the weaving density of coarse fibers is lower during the weaving process, resulting in larger pores 11B. The larger pores 11B result in poorer structural strength and impact resistance of the shell body 10.

[0088] Therefore, embodiments of this application improve the structural strength and impact resistance of the shell body 10 through other means. Figure 4 This is a schematic diagram of the stacked structure of the shell body 10 in some embodiments. For example... Figure 4 As shown, the shell body 10 may include at least two layers 11 stacked along the first direction Z, and adjacent layers 11 are fixedly connected.

[0089] In this embodiment of the application, by setting multiple layers 11, when the thickness H1 of the shell body 10 is within a preset range, the thickness of a single layer 11 in the first direction Z can be reduced, thereby reducing the diameter of the fiber 11A and the pores 11B used for weaving the layer 11, thereby increasing the weaving density of the layer 11, which can improve the structural strength and impact resistance of the layer 11, thereby improving the structural strength and impact resistance of the shell body 10, the shell assembly 300 and the electronic device.

[0090] When it is necessary to adjust the thickness H1 of the shell body 10, it can be achieved by adjusting the number of layers 11 and the thickness of a single layer 11 in the first direction Z. This simplifies the method of adjusting the thickness of the shell body 10 and reduces the difficulty of thickening or thinning the shell body 10.

[0091] Furthermore, by constructing the shell body 10 as a laminated structure comprising at least two layers 11, each layer 11 can be processed individually during the manufacturing process of the shell body 10, thereby reducing the manufacturing difficulty of the shell body 10. Through the bonding and fixing of multiple layers 11, the overall thickness requirement of the shell body 10 can be met, thus satisfying the structural strength and puncture resistance requirements of the shell body 10, the housing assembly 300, and the electronic device.

[0092] The shell body 10 may also include a first adhesive layer 12, at least a portion of which is disposed between adjacent layers 11, so that adjacent layers 11 are bonded and fixed together by the first adhesive layer 12, which simplifies the connection between adjacent layers 11 and thus helps to reduce the processing cost of the shell body 10 and shorten the processing cycle of the shell body 10.

[0093] like Figure 4 As shown, the number of layers 11 stacked in the first direction Z can be at least two. This application embodiment does not impose any special limitation on the number of layers stacked. Taking a stack of three layers 11 in the first direction Z as an example, the layer 11 may include a first layer 111, a second layer 112, and a third layer 113. The first layer 111 and the second layer 112, as well as the second layer 112 and the third layer 113, are all bonded and fixed by a first adhesive layer 12.

[0094] In this embodiment of the application, by setting the number of layers 11 stacked in the first direction Z to three, the thickness of each layer 11 in the first direction Z can be reduced. At the same time, the risk of increased processing difficulty caused by the smaller thickness of each layer 11 can also be reduced.

[0095] The dimension of layer 11 in the first direction Z is h1, where 0.1mm ≤ h1 ≤ 0.15mm. For example, the thickness of layer 11 in the first direction Z can be 0.1mm, 0.11mm, 0.12mm, 0.13mm, 0.14mm, 0.15mm, etc.

[0096] If the thickness of layer 11 is small, the processing of layer 11 will be more difficult, and the strength of layer 11 will be poor. During processing and installation, the risk of damage to layer 11 is higher.

[0097] If the thickness of layer 11 is large, the risk of a large thickness of shell body 10 after multiple layers 11 are stacked is high.

[0098] Therefore, the thickness of the layer 11 in the first direction Z is between 0.1 mm and 0.15 mm, which can reduce the processing difficulty of the layer 11, reduce the risk of damage to the layer 11 during processing and installation, and also reduce the risk of a large thickness of the shell body 10 after multiple layers 11 are stacked.

[0099] The thicknesses of the different layers 11 can be the same or different. For example, such as... Figure 4 As shown, the thickness of the first layer 111 in the first direction Z is h11, the thickness of the second layer 112 in the first direction Z is h12, and the thickness of the third layer 113 in the first direction Z is h13. In some embodiments, h11 = h12 = h13, and in other embodiments, h11, h12, and h13 are not equal.

[0100] This application embodiment does not impose any special restrictions on the thickness of each layer 11 or the thickness relationship between adjacent layers 11.

[0101] The first adhesive layer 12 can be hot melt adhesive, resin or other materials. In this embodiment, the specific material of the first adhesive layer 12 is not specifically limited.

[0102] In this embodiment, the first adhesive layer 12 can be made of resin. During the processing, the single layer 11 is first immersed in a container filled with resin, so that all exposed surfaces of the layer 11 are covered with the first adhesive layer 12. Then, the layers 11 are stacked one by one, so that adjacent layers 11 are bonded and fixed together by resin.

[0103] In this embodiment, since the bonding force between the resin and PBO fiber is strong, and the bonding force between resins is also strong, the adjacent layers 11 are fixed by resin bonding, which can improve the bonding effect between adjacent layers 11, reduce the risk of layer separation and detachment, and improve the structural stability of the shell body 10, shell assembly 300 and electronic device.

[0104] Based on the shell body 10 described above, the cortex layer 20 can be fixed to the shell body 10 by means of sewing, bonding or other methods. In this embodiment, the connection and fixing method between the cortex layer 20 and the shell body 10 is not particularly limited.

[0105] Figure 5 This is a cross-sectional view of a partial structure of the housing assembly 300 in some embodiments. For example... Figure 5 As shown, the housing assembly 300 may also include a second adhesive layer 30, through which the housing body 10 and the leather layer 20 are bonded and fixed.

[0106] In this embodiment, the shell body 10 is bonded and fixed to the leather layer 20, which can improve the connection stability between the shell body 10 and the leather layer 20, reduce the risk of the leather layer 20 falling off the shell body 10, and thus improve the structural stability of the shell assembly 300 and the electronic device.

[0107] like Figure 5 As shown, the dimension of the second adhesive layer 30 in the first direction Z is H2, where 0.02mm ≤ H2 ≤ 0.03mm. For example, the thickness of the second adhesive layer 30 in the first direction Z can be 0.02mm, 0.021mm, 0.022mm, 0.023mm, 0.024mm, 0.025mm, 0.026mm, 0.027mm, 0.028mm, 0.029mm, 0.03mm, etc.

[0108] If the thickness of the second adhesive layer 30 is small, the adhesion between the corrugated layer 20 and the shell body 10 will be poor, and there is a risk that the corrugated layer 20 will separate from the shell body 10 and fall off. Moreover, if the thickness of the second adhesive layer 30 is small, the risk of aging and damage to the second adhesive layer 30 leading to adhesion failure is high when environmental temperature, humidity and other factors change, reducing the stability of the adhesion.

[0109] If the thickness of the second adhesive layer 30 is large, the material cost of the second adhesive layer 30 will be high, and it will increase the overall thickness of the housing assembly 300, which is not conducive to achieving the thinness and lightness of the housing assembly 300 and electronic devices.

[0110] Therefore, the thickness of the second adhesive layer 30 in the first direction Z is between 0.02 mm and 0.03 mm, which can improve the bonding effect between the leather layer 20 and the shell body 10, reduce the risk of the leather layer 20 falling off due to separation from the shell body 10, and reduce the risk of bonding failure due to aging or damage of the second adhesive layer 30. It also improves the bonding stability between the leather layer 20 and the shell body 10 and reduces the material cost of the second adhesive layer 30, so as to reduce the cost of the shell assembly 300 and electronic devices, and also helps to achieve the thinning of the shell assembly 300 and electronic devices.

[0111] The second adhesive layer 30 can be glue, double-sided tape, structural adhesive, hot melt adhesive, etc. The embodiments of this application do not impose any special limitations on the type or material of the second adhesive layer 30.

[0112] In this embodiment, hot melt adhesive is an adhesive that becomes liquid or viscous after heating and quickly solidifies after cooling to form a strong bond. The second adhesive layer 30 can be hot melt adhesive. After cooling, the second adhesive layer 30 can quickly solidify and reach a certain strength, which shortens the time required for bonding and fixing the shell body 10 and the leather layer 20, and helps to shorten the production efficiency of the shell assembly 300 and electronic devices.

[0113] In some embodiments, such as Figure 5 As shown, the number of second adhesive layers 30 between the shell body 10 and the leather layer 20 is one. During the bonding process, the shell body 10, the second adhesive layer 30, and the leather layer 20 are first stacked sequentially along the first direction Z. Then, the shell body 10, the second adhesive layer 30, and the leather layer 20 are subjected to high-temperature pressing. Under the action of high temperature, the second adhesive layer 30 becomes viscous. After cooling, the second adhesive layer 30 is rapidly cured, thereby achieving the bonding and fixation between the shell body 10 and the leather layer 20.

[0114] Figure 6 This is a cross-sectional view of a partial structure of the housing assembly 300 in some other embodiments. For example... Figure 6 As shown, the number of second adhesive layers 30 between the shell body 10 and the leather layer 20 can be two, and the second adhesive layer 30 may include a first adhesive layer 31 and a second adhesive layer 32.

[0115] Figures 7 to 9 This is a schematic diagram of the manufacturing process of the housing assembly 300 in some embodiments. During the manufacturing process, such as... Figure 7 As shown, the first adhesive layer 31 and the leather layer 20 are first stacked along the first direction Z, and the first adhesive layer 31 can be attached to the surface of the leather layer 20.

[0116] like Figure 8 As shown, an embossed pattern layer 21 is formed by hot pressing on the side of the cortical layer 20 away from the first adhesive layer 31. After hot pressing and cooling, the first adhesive layer 31 is cured.

[0117] After that, as Figure 9 As shown, the shell body 10, the second adhesive layer 32, and the leather layer 20 to which the first adhesive layer 31 is bonded are stacked along the first direction Z. The surfaces on both sides of the second adhesive layer 32 are in contact with the first adhesive layer 31 and the shell body 10, respectively. The leather layer 20, the second adhesive layer 32, and the shell body 10 are hot-pressed. After cooling, the first adhesive layer 31 and the shell body 10 are bonded and fixed together by the second adhesive layer 32. Figure 6 The housing assembly 300 shown has a second adhesive layer 30 formed by hot-pressing a first adhesive layer 31 and a second adhesive layer 32 together.

[0118] The back cover of the electronic device can be cut along the first direction Z to obtain the cross-section of the back cover. The cross-section can be magnified by a microscope to observe the cross-section of the second adhesive layer 30, and the double-layer structure of the second adhesive layer 30 can be seen through the microscope.

[0119] Because the cortex layer 20 is relatively soft, when the embossed pattern layer 21 is hot-pressed onto the surface of the cortex layer 20, if a force is applied downward along the first direction Z to the cortex layer 20, the soft cortex layer 20 will bend and deform under the action of the external force. The cortex layer 20 may even extend outward in a plane perpendicular to the first direction Z. After the hot pressing is completed, the cortex layer 20 will shrink and deform back, resulting in problems such as incomplete, unclear, and shallow embossed pattern layer 21. In other words, it is more difficult to hot-press the pattern onto the soft cortex layer 20 and the embossing effect is poor.

[0120] In this embodiment of the application, before hot pressing the embossed pattern layer 21, the first adhesive layer 31 is first attached to the surface of the leather layer 20. The adhesion between the first adhesive layer 31 and the leather layer 20 can limit the bending deformation and outward expansion of the leather layer 20, which can reduce the risk of incomplete, unclear, or shallow patterns in the embossed pattern layer 21, thereby reducing the difficulty of hot pressing the pattern on the leather layer 20 and improving the embossing effect of the leather layer 20.

[0121] After the leather layer 20 is embossed, the first adhesive layer 31, made of hot melt adhesive, has low adhesion or even no adhesion after being hot-pressed again. Therefore, the second adhesive layer 32 is provided to facilitate the bonding and fixation of the first adhesive layer 31 to the shell body 10, and to improve the bonding stability of the first adhesive layer 31 to the shell body 10, thereby reducing the risk of the leather layer 20 falling off the shell body 10.

[0122] Refer again Figure 6The first adhesive layer 31 has a dimension h21 in the first direction Z, where 0.025mm ≤ h21 ≤ 0.035mm. For example, the thickness of the first adhesive layer 31 in the first direction Z can be 0.025mm, 0.026mm, 0.027mm, 0.028mm, 0.029mm, 0.030mm, 0.031mm, 0.032mm, 0.033mm, 0.034mm, 0.035mm, etc.

[0123] If the thickness of the first adhesive layer 31 is small, the adhesion between the first adhesive layer 31 and the leather layer 20 will be poor, and there is a risk that the first adhesive layer 31 will separate from the leather layer 20, causing the leather layer 20 to fall off. Moreover, if the thickness of the first adhesive layer 31 is small, when the ambient temperature, humidity, etc. change, the first adhesive layer 31 is more likely to age and be damaged, leading to adhesion failure, thus reducing the stability of the adhesion.

[0124] If the thickness of the first adhesive layer 31 is large, the material cost of the first adhesive layer 31 will be high, and it will increase the overall thickness of the housing assembly 300, which is not conducive to achieving the thinness and lightness of the housing assembly 300 and electronic devices.

[0125] Therefore, the thickness of the first adhesive layer 31 in the first direction Z can be between 0.025mm and 0.035mm, which can improve the bonding effect between the first adhesive layer 31 and the leather layer 20, reduce the risk of the leather layer 20 falling off due to separation of the first adhesive layer 31 and the leather layer 20, and reduce the risk of bonding failure due to aging or damage of the first adhesive layer 31. This improves the bonding stability between the first adhesive layer 31 and the leather layer 20 and reduces the material cost of the first adhesive layer 31, so as to reduce the cost of the housing assembly 300 and electronic devices, and also helps to achieve the thinning and lightening of the housing assembly 300 and electronic devices.

[0126] Refer again Figure 6 The second adhesive layer 32 has a dimension of h22 in the first direction Z, where 0.025mm ≤ h22 ≤ 0.035mm. For example, the thickness of the second adhesive layer 32 in the first direction can be 0.025mm, 0.026mm, 0.027mm, 0.028mm, 0.029mm, 0.030mm, 0.031mm, 0.032mm, 0.033mm, 0.034mm, 0.035mm, etc.

[0127] If the thickness of the second adhesive layer 32 is small, the adhesion between the second adhesive layer 32 and the first adhesive layer 31, and between the second adhesive layer 32 and the shell body 10, will be poor. This poses a risk of separation between the second adhesive layer 32 and the first adhesive layer 31, and separation between the second adhesive layer 32 and the shell body 10, leading to the detachment of the leather layer 20. Furthermore, if the thickness of the second adhesive layer 32 is small, changes in environmental temperature and humidity can cause it to age and become damaged, leading to adhesive failure and reducing the stability of the bond.

[0128] If the thickness of the second adhesive layer 32 is large, the material cost of the second adhesive layer 32 will be high, and it will increase the overall thickness of the housing assembly 300, which is not conducive to achieving the thinness and lightness of the housing assembly 300 and electronic devices.

[0129] Therefore, the thickness of the second adhesive layer 32 in the first direction Z can be between 0.025mm and 0.035mm, which can improve the bonding effect between the second adhesive layer 32 and the first adhesive layer 31, and between the second adhesive layer 32 and the shell body 10. It reduces the risk of the leather layer 20 falling off due to the separation of the second adhesive layer 32 from the first adhesive layer 31 and the shell body 10, and also reduces the risk of bonding failure due to aging or damage of the second adhesive layer 32. It improves the bonding stability between the second adhesive layer 32 and the first adhesive layer 31, and between the second adhesive layer 32 and the shell body 10, and reduces the material cost of the second adhesive layer 32, so as to reduce the cost of the shell assembly 300 and electronic devices, and also helps to achieve the thinning of the shell assembly 300 and electronic devices.

[0130] Figure 10 This is a schematic diagram of the layered structure of the cortical layer 20 in some embodiments. For example... Figure 10 As shown, the cortex layer 20 may include a cortex body layer 22 and a base layer 23. Along the first direction Z, the base layer 23 is disposed between the cortex body layer 22 and the shell body 10. An embossed pattern layer 21 is formed on one side surface of the cortex body layer 22. The base layer 23 is disposed on the side of the cortex body layer 22 away from the embossed pattern layer 21. The cortex body layer 22 and the base layer 23 are bonded and fixed, which can simplify the connection formation of the cortex body layer 22 and the base layer 23 and reduce the connection cost of the cortex body layer 22 and the base layer 23.

[0131] The substrate 23 can be made of glass fiber or polyester (polyethylene terephthalate fiber).

[0132] In this embodiment, the substrate 23 can be made of polyester. Compared with glass fiber, polyester has a lower density and the substrate 23 made of polyester is lighter, which is beneficial to achieving lightweight design of housing assembly 300 and electronic device.

[0133] Polyester has high tensile and tear strength. The base layer 23 made of polyester can improve the puncture resistance of the leather layer 20 to a certain extent. Combined with the shell body 10 made of PBO fiber, it can further improve the puncture resistance of the shell assembly 300 and electronic equipment.

[0134] Polyester has strong dimensional stability and wrinkle resistance. During the hot pressing of the patterned layer 21 on the leather layer 20, the base layer 23 made of polyester can, to a certain extent, hinder the deformation of the leather body layer 22, so as to further improve the embossing effect of the leather layer 20.

[0135] like Figure 10 As shown, the dimension of the cortical layer 20 in the first direction Z is H3, where 0.2mm ≤ H3 ≤ 0.25mm. For example, the thickness of the cortical layer 20 in the first direction Z can be 0.2mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, etc.

[0136] If the thickness of the cortical layer 20 is small, the processing of the cortical layer 20 will be more difficult, and the strength of the cortical layer 20 will be poor, with a higher risk of damage to the cortical layer 20.

[0137] If the thickness of the cortex layer 20 is large, the overall size of the housing assembly 300 and the electronic device will be large, which will not be conducive to achieving the thinness and lightness of the housing assembly 300 and the electronic device, and will also increase the cost of the housing assembly 300 and the electronic device.

[0138] Therefore, the thickness of the cortical layer 20 in the first direction Z can be between 0.2 mm and 0.25 mm, which reduces the processing difficulty of the cortical layer 20, thereby reducing the processing cost of the housing assembly 300, shortening the processing cycle of the housing assembly 300, improving the structural strength of the cortical layer 20, reducing the risk of damage to the cortical layer 20, and also reducing the overall thickness of the housing assembly 300 and the electronic device, so as to achieve the thinning and weight reduction of the housing assembly 300 and the electronic device, and help reduce the cost of the housing assembly 300 and the electronic device.

[0139] Based on the aforementioned shell body 10, second adhesive layer 30, and cortical layer 20, Figure 11 The housing assembly 300 provided in the embodiments of this application is shown in some embodiments as a schematic diagram of a stacked structure. In summary, exemplary, such as Figure 11 As shown, the housing assembly 300 may include a housing body 10, a second adhesive layer 30, and a leather layer 20 stacked along the first direction Z. The housing body 10 may include three layers 11, the second adhesive layer 30 may include a first adhesive layer 31 and a second adhesive layer 32, and the leather layer 20 may include a base layer 23, a leather body layer 22, and an embossed pattern layer 21 formed on the exposed surface of the leather body layer 22.

[0140] like Figure 11 As shown, the housing assembly 300 provided in this embodiment has a dimension S in the first direction Z, where 0.57mm ≤ S ≤ 0.64mm. For example, the thickness of the housing assembly 300 in the first direction Z can be 0.57mm, 0.58mm, 0.59mm, 0.60mm, 0.61mm, 0.62mm, 0.63mm, 0.64mm, etc.

[0141] If the thickness of the housing assembly 300 is small, the strength of the housing assembly 300 is poor, and the risk of the housing assembly 300 being punctured by a sharp object is high, that is, the puncture resistance of the housing assembly 300 is poor.

[0142] If the thickness of the housing component 300 is too large, it will not be conducive to achieving the thinness and lightness of the housing component 300 and electronic device, and will also increase the cost of the housing component 300 and electronic device.

[0143] Therefore, the thickness of the housing assembly 300 in the first direction Z is between 0.57 mm and 0.64 mm, which improves the structural strength of the housing assembly 300, reduces the risk of the housing assembly 300 being punctured by sharp objects, and also reduces the overall thickness of the electronic device, so as to achieve the thinning and weight reduction of the housing assembly 300 and the electronic device, and helps to reduce the cost of the housing assembly 300 and the electronic device.

[0144] The thickness of the layer 11 made of PBO fiber in the first direction Z can be between 0.1 mm and 0.15 mm, and adjacent layers 11 are fixed together by resin bonding. The total thickness of the shell body 10 formed after the three layers 11 are hot-pressed and fixed can be 0.35 mm in the first direction Z.

[0145] The total thickness of the second adhesive layer 30 formed after the first adhesive layer 31 and the second adhesive layer 32 are hot-pressed and fixed can be 0.02 mm in the first direction Z.

[0146] The total thickness of the cortical layer 20 formed by the base layer 23, the cortical body layer 22, and the embossed pattern layer 21 formed on the exposed surface of the cortical body layer 22 in the first direction Z can be 0.2 mm.

[0147] The total thickness of the shell assembly 300 formed after the shell body 10, the second adhesive layer 30 and the leather layer 20 are fixed in the first direction Z can be 0.57 mm.

[0148] In the housing assembly 300 provided in this application embodiment, the housing body 10 is made of PBO fiber and the base layer 23 is made of polyester, which makes the housing assembly 300 have strong puncture resistance, light weight and thin thickness, thereby improving the puncture resistance of the housing assembly 300 and the electronic device having the housing assembly 300, which is conducive to realizing the thinner and lighter design of the housing assembly 300 and the electronic device having the housing assembly 300.

[0149] By using a double-layer hot melt adhesive design, the deformation of the leather body layer 22 is restricted by the first adhesive layer 31 when forming the embossed pattern layer 21, and the base layer 23 made of polyester is used to restrict the deformation of the leather body layer 22. This helps to improve the embossing effect, thereby improving the integrity and clarity of the embossed pattern of the housing assembly 300 and the electronic device having the housing assembly 300, so as to improve the appearance.

[0150] For the same or similar parts among the various embodiments in this specification, please refer to each other.

Claims

1. A housing assembly, characterized in that, The housing assembly includes a housing body and a cortical layer, the cortical layer covering the surface of the housing body; The shell body comprises at least two layers stacked along a first direction.

2. The housing assembly according to claim 1, characterized in that, The elastic modulus of the layer is E, where E ≥ 240 GPa.

3. The housing assembly according to claim 2, characterized in that, The material of the layer is PBO fiber.

4. The housing assembly according to claim 1, characterized in that, The shell body further includes a first adhesive layer, wherein at least a portion of the structure of the first adhesive layer is disposed between adjacent layers in the first direction, so that the adjacent layers are bonded and fixed. The first adhesive layer is made of resin.

5. The housing assembly according to claim 1, characterized in that, The dimension of the layer in the first direction is h1, where 0.1mm ≤ h1 ≤ 0.15mm.

6. The housing assembly according to claim 1, characterized in that, The number of layers stacked in the first direction is three.

7. The housing assembly according to any one of claims 1 to 6, characterized in that, The dimension of the shell body in the first direction is H1, where 0.32mm≤H1≤0.38mm.

8. The housing assembly according to any one of claims 1 to 6, characterized in that, The housing assembly further includes a second adhesive layer, through which the housing body and the cortical layer are bonded and fixed.

9. The housing assembly according to claim 8, characterized in that, Along the first direction, the cortical layer has an embossed pattern layer on the side opposite to the shell body; The second adhesive layer includes a first adhesive layer, which is bonded and fixed to the leather layer; The second adhesive layer further includes a second adhesive layer, and the first adhesive layer is bonded and fixed to the shell body by the second adhesive layer; The first adhesive layer and the second adhesive layer are used for hot pressing to form the second adhesive layer.

10. The housing assembly according to claim 9, characterized in that, The dimension of the first adhesive layer in the first direction is h21, where 0.025mm ≤ h21 ≤ 0.035mm; The second adhesive layer has a dimension of h22 in the first direction, where 0.025mm ≤ h22 ≤ 0.035mm.

11. The housing assembly according to claim 8, characterized in that, The dimension of the second adhesive layer in the first direction is H2, 0.02mm≤H2≤0.03mm.

12. The housing assembly according to any one of claims 1 to 6, characterized in that, The cortical layer includes a cortical body layer and a base layer. Along the first direction, the base layer is disposed between the cortical body layer and the shell body, and the cortical body layer and the base layer are bonded and fixed together. The base layer is made of polyester.

13. The housing assembly according to any one of claims 1 to 6, characterized in that, The size of the cortical layer in the first direction is H3, where 0.2mm ≤ H3 ≤ 0.25mm.

14. The housing assembly according to any one of claims 1 to 6, characterized in that, The dimension of the housing assembly in the first direction is S, where 0.57mm≤S≤0.64mm.

15. An electronic device, characterized in that, The electronic device includes a display screen, a frame, and a housing assembly, wherein the display screen and the housing assembly are respectively connected to the frame on both sides of the electronic device in the thickness direction, and the housing assembly is the housing assembly according to any one of claims 1 to 14.

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