A high-power heat sink

Abstract

The application relates to the technical field of heat dissipation devices, in particular to a high-power heat dissipation device which comprises a heat dissipation base plate, a heat dissipation fin is arranged on the heat dissipation base plate, a water pipe is arranged around the periphery of the heat dissipation fin and forms a closed water circulation channel, a micro water pump and a refrigerator are arranged on the water circulation channel and are connected with each other, and a power supply unit is electrically connected with the micro water pump and the refrigerator to provide working power for the two. Compared with the prior art, the heat dissipation device has the synergistic effect of heat conduction of the heat dissipation fin, active heat exchange of water flow and active cooling of the refrigerator, can greatly improve the heat dissipation efficiency, effectively avoid heat accumulation, prevent high-power equipment from performance decline or component aging caused by high temperature, and meet the demand of the high-power equipment for efficient heat dissipation.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, and in particular to a high-power heat dissipation device. Background Technology

[0002] In the existing technology, the mainstream heat dissipation solution for high-power equipment (such as high-power electronic components, industrial motors, high-power chips, etc.) that generate a lot of heat during operation is mainly passive heat dissipation. Its core relies on heat dissipation structures such as heat sinks and heat fins, which are directly attached to the heat-generating parts of the equipment to form the basic heat dissipation system of the high-power equipment. This is currently the most widely used heat dissipation technology for high-power equipment in the industry.

[0003] However, traditional passive cooling solutions have a core technical problem: their cooling efficiency depends entirely on increasing the heat dissipation area and air heat exchange efficiency. However, air has a low thermal conductivity, so even if the contact area of ​​the heat sink is increased, the heat exchange rate is still difficult to improve. When faced with a large amount of heat continuously generated by high-power equipment, the heat dissipation rate is much lower than the heat generation rate, which easily leads to the accumulation of heat inside the equipment and on the heat dissipation structure, resulting in high accumulated temperature. This not only causes the working performance of high-power equipment to decrease due to the high temperature environment, but may also accelerate the aging of internal components due to long-term high-temperature operation, shortening the overall service life of the equipment, and failing to meet the actual needs of high-power equipment for efficient heat dissipation. Summary of the Invention

[0004] This application provides a high-power heat dissipation device to solve the technical problem that the prior art cannot meet the actual needs of high-power equipment for efficient heat dissipation.

[0005] This application provides a high-power heat dissipation device, including:

[0006] A heat dissipation substrate, wherein heat dissipation fins are provided on the heat dissipation substrate;

[0007] Water pipes are arranged around the heat sink to form a closed water circulation path, and a miniature water pump and a cooler are connected to each other on the water circulation path.

[0008] A power supply unit is electrically connected to the micro water pump and the cooler respectively to provide working power for both.

[0009] Furthermore, there are multiple heat sinks, which are distributed in parallel on the heat dissipation substrate and have a toothed structure on the plane of the heat dissipation substrate.

[0010] Furthermore, the water pipe is a serpentine copper pipe, with the straight section of the serpentine copper pipe located between the two heat sinks and the bend of the serpentine copper pipe located on the outer edge of the heat sink substrate. The water circulation path is formed by connecting the two ends of the serpentine copper pipe.

[0011] Furthermore, the surface of the heat dissipation substrate is recessed with a mounting groove, and the water pipe is fixedly installed in the mounting groove, the shape of the mounting groove being adapted to the shape of the water pipe.

[0012] Furthermore, both the heat sink and the heat dissipation substrate are made of aluminum alloy, and the heat sink and the heat dissipation substrate are integrally formed.

[0013] Furthermore, the edge of the heat dissipation substrate is provided with at least two mounting holes, and the heat dissipation substrate is fixedly mounted to an external high-power device through the mounting holes.

[0014] Furthermore, the power supply unit includes an external power supply and a power conversion module. The external power supply is electrically connected to the power conversion module, and the output terminal of the power conversion module is electrically connected to the micro water pump and the cooler, respectively.

[0015] Furthermore, the heat dissipation substrate is also provided with a cable inlet, through which the cable of the external power supply passes and is connected to the micro water pump and the cooler respectively.

[0016] Furthermore, the external power supply is an AC220V power supply, and the power conversion module is a DC24V conversion module. The external power supply is converted into a DC24V voltage that can power the micro water pump and the cooler.

[0017] Furthermore, when there are multiple coolers, the multiple coolers are connected in series in the water circulation path.

[0018] The technical solution provided in this application has the following advantages compared with the prior art:

[0019] In this application, the heat sink on the heat dissipation substrate first receives heat from the high-power device through thermal conduction. Water pipes surrounding the heat sink form a closed water circulation path. A miniature water pump drives the water flow within this path, allowing the flowing water to quickly remove heat from the heat sink, solving the problem of low heat exchange rate in traditional air systems. Simultaneously, a cooler in the water circulation path actively cools the circulating water, further enhancing its heat absorption capacity and preventing the water from heating up due to heat absorption, thus reducing its heat dissipation effect. The power supply unit continuously supplies power to the miniature water pump and cooler, ensuring their stable operation to maintain continuous water circulation and active cooling. This structure, through the synergistic effect of heat conduction by the heat sink, active heat exchange by the water flow, and active cooling by the cooler, significantly improves heat dissipation efficiency, effectively preventing heat accumulation and thus preventing performance degradation or component aging of high-power devices due to high temperatures, meeting their demand for efficient heat dissipation. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0023] Figure 1 This is a schematic diagram of the structure of a high-power heat dissipation device provided in an embodiment of this application;

[0024] Figure 2 for Figure 1 Schematic diagram of the heat dissipation substrate;

[0025] Figure 3 This is a schematic diagram of the water circulation path of a high-power heat dissipation device provided in an embodiment of this application.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1. Heat sink base; 11. Heat sink; 12. Mounting slot; 13. Mounting hole; 14. Cable inlet;

[0028] 2. Water pipes; 21. Water circulation path; 22. Miniature water pump; 23. Refrigerator. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0031] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0032] To address the technical problem that existing technologies cannot meet the actual needs of high-power equipment for efficient heat dissipation, this application provides a high-power heat dissipation device. This structure significantly improves heat dissipation efficiency through the synergistic effect of heat conduction by heat sinks, active heat exchange by water flow, and active cooling by a cooler. It effectively avoids heat accumulation, thereby preventing high-power equipment from experiencing performance degradation or component aging due to high temperatures, and meeting its need for efficient heat dissipation.

[0033] Please see Figures 1 to 3The present application provides a high-power heat dissipation device, comprising: a heat dissipation substrate 1, on which heat dissipation fins 11 are provided; a water pipe 2, which is arranged around the heat dissipation fins 11 to form a closed water circulation passage 21, on which a micro water pump 22 and a cooler 23 are connected to each other; and a power supply unit, which is electrically connected to the micro water pump 22 and the cooler 23 respectively to provide working power for them.

[0034] Specifically, the heat dissipation substrate 1 is flat, with one side surface in contact with the heat-generating part of the high-power device, and several heat dissipation fins 11 vertically arranged on the other side surface, evenly distributed along the substrate surface; the water pipe 2 is a rigid tube, arranged in a spiral winding or multi-segment wrapping manner around the periphery of the heat dissipation fins 11 (such as between adjacent heat dissipation fins 11, or on the outside of the heat dissipation fins 11), and the two ends of the water pipe 2 are connected to form a closed water circulation passage 21. The micro water pump 22 and the cooler 23 are connected in series in the water circulation passage 21 through pipes, wherein the micro water pump 22 is used to drive the fluid flow in the passage, and the cooler 23 is used to cool the fluid in the passage. The power supply unit is an independent power module or an external power interface, which is connected to the circuit interfaces of the micro water pump 22 and the cooler 23 respectively through wires to form a power supply circuit. This structure increases the heat dissipation area through heat sink 11, initially dissipating heat. The surrounding water pipe 2 quickly removes the heat from heat sink 11 through water circulation. The high thermal conductivity of water improves heat exchange efficiency. The micro water pump 22 and the cooler 23 work together to enhance active heat dissipation capabilities and prevent heat accumulation. The power supply unit ensures continuous operation. The overall structure takes into account the advantages of both passive and active heat dissipation, greatly improving the heat dissipation effect and meeting the heat dissipation needs of high-power equipment.

[0035] Furthermore, the heat dissipation efficiency of the heat sink 11 depends on the water flow rate in the water pipe 2. The heat sink 11 initially dissipates heat by increasing the contact area, and the heat needs to be transferred through the water flow in the water pipe 2. If the water flow rate is too low, the water will stay in the water pipe 2 around the heat sink 11 for too long, easily becoming saturated with heat absorption, and unable to continuously remove the newly added heat from the heat sink 11, resulting in heat accumulation on the heat sink 11. If the water flow rate is appropriate, the heat transferred from the heat sink 11 to the water pipe wall can be removed in time, and the large contact area of ​​the heat sink 11 improves the overall heat exchange efficiency. The cooling effect of the cooler 23 is mutually constrained by the water flow rate in the water pipe 2. The cooler 23 needs to cool the circulating water to restore its heat absorption capacity. If the water flow rate is too low, the water stays in the cooler 23 for a longer time, and the cooler 23 cools the water more thoroughly. When the water returns to the heat sink 11, its heat absorption capacity is stronger. However, too low a flow rate will result in slow overall water circulation, which cannot match the heat generation rate of the heat sink 11 and will instead cause heat accumulation. If the water flow rate is too high, the water stays in the cooler 23 for a shorter time, and the cooler 23 cannot cool the water thoroughly. When the water returns to the heat sink 11, its heat absorption capacity decreases and it cannot effectively remove the heat from the heat sink 11. Only when the water flow rate is matched with the cooling efficiency of the cooler 23 can the water be cooled thoroughly and circulated quickly to the heat sink 11, balancing the cooling effect and circulation speed. In this embodiment, the micro water pump 22 can meet the dynamic heat dissipation needs of the device. When the heat generated by the external high-power equipment increases, the water pump can increase the water flow rate to accelerate the removal of heat from the heat sink 11 by the water flow in the water pipe 2, thus preventing the heat sink 11 from accumulating heat due to insufficient heat dissipation. When the heat generated by the equipment decreases, the water flow rate can be reduced to reduce energy consumption while meeting the heat dissipation needs, achieving heat dissipation on demand. Combined with the design of the water pipe 2 surrounding the heat sink 11 and the cooler 23 connected in series in the water circulation passage 21 in this embodiment, the water pump can adjust the water flow rate to match the cooling efficiency of the cooler 23. This avoids the cooler 23 not cooling down sufficiently due to the excessively fast flow rate, resulting in a decrease in the heat absorption capacity of the water flow, and also avoids the water circulation being delayed due to the excessively slow flow rate, resulting in heat accumulation on the heat sink 11. This ensures that the cooled water flow can efficiently exchange heat with the heat sink 11.

[0036] like Figure 2-3 As shown, there are multiple heat sinks 11, which are distributed in parallel on the heat dissipation substrate 1 and have a toothed structure on the plane of the heat dissipation substrate 1.

[0037] Specifically, in this embodiment, there are 12 heat sinks 11, which are symmetrically distributed in two groups on one side of the mounting surface of the heat dissipation substrate 1. Each heat sink 11 is a sheet-like structure, and the extension direction of each heat sink 11 is consistent. One end of each heat sink 11 is fixed to the mounting surface of the heat dissipation substrate 1 by welding, integral molding, or bonding, while the other end extends away from the substrate. A uniform gap is formed between adjacent heat sinks 11, and the whole structure presents a tooth-like structure similar to gear teeth on the plane of the heat dissipation substrate 1. The tooth-like distribution of the parallel heat sinks 11 greatly increases the contact area with the surrounding medium, improves the heat dissipation efficiency, and the uniform gap facilitates the smooth flow of fluids (such as circulating water or air), reducing heat accumulation.

[0038] It is understood that, in this embodiment, the number of heat sinks 11 can be 12 or other numbers, depending on the needs of the heat dissipation device, and is not limited here.

[0039] like Figure 1 As shown, the water pipe 2 is a serpentine copper pipe. The straight part of the serpentine copper pipe is located between the two heat sinks 11, and the bent part of the serpentine copper pipe is located on the outer edge of the heat sink base plate 1. The water circulation passage 21 is formed by connecting the two ends of the serpentine copper pipe.

[0040] Specifically, the water pipe 2 in this embodiment adopts a serpentine copper pipe, which is composed of multiple sections of straight pipes and bends connected alternately, forming a continuous serpentine structure. Each straight section of the serpentine copper pipe is embedded in the gap between two adjacent heat sinks 11, with the extension direction of the straight pipe consistent with the distribution direction of the heat sinks 11, and the outer wall of the straight pipe is in contact with or close to the surface of the heat sink 11. The bends of the serpentine copper pipe are located in the outer edge area of ​​the heat dissipation substrate 1, and the curvature of the bends is adapted to the edge contour of the heat dissipation substrate 1, used to connect two adjacent straight pipe sections, so that the serpentine copper pipe covers the area where the heat sink 11 is located. At the same time, the two ends of the serpentine copper pipe are fixed by welding or sealing joints to form a closed water circulation channel 21. This design increases the contact area with the heat sink 11 by embedding the straight pipes into the gaps of the heat sink 11, thereby improving the heat exchange efficiency. The bends are located on the outer edge of the substrate and do not occupy heat dissipation space, ensuring normal heat dissipation of the heat sink 11. In addition, the copper pipe has excellent thermal conductivity, the serpentine structure provides comprehensive coverage, the closed channel ensures stable water circulation, and the overall heat dissipation capacity is enhanced. The structure is compact and highly adaptable.

[0041] like Figure 2-3 As shown, a mounting groove 12 is recessed on the surface of the heat dissipation substrate 1, and the water pipe 2 is fixedly installed in the mounting groove 12. The shape of the mounting groove 12 is adapted to the shape of the water pipe 2.

[0042] Specifically, the surface of the heat dissipation substrate 1 (the side where the heat sink 11 is mounted) is recessed inward to form a mounting groove 12. The outline and orientation of the mounting groove 12 perfectly match the shape of the water pipe 2 (such as the distribution of straight and curved pipe sections). The water pipe 2 is completely embedded in the mounting groove 12 and fixed by means of snap-fit, bonding, or interference fit, so that the outer wall of the water pipe 2 is tightly fitted with the inner wall of the mounting groove 12 without any obvious gaps. By adapting the shape of the mounting groove 12 to the water pipe 2, the positioning of the water pipe 2 can be ensured to be accurate and firmly fixed, avoiding displacement. The tight fit between the water pipe 2 and the mounting groove 12 improves the heat conduction efficiency. The embedded design saves space, making the overall structure more compact, while protecting the water pipe 2 from external damage and ensuring heat dissipation stability.

[0043] In an optional embodiment, both the heat sink 11 and the heat dissipation substrate 1 are made of aluminum alloy, and the heat sink 11 and the heat dissipation substrate 1 are integrally formed.

[0044] Specifically, both the heat dissipation substrate 1 and the heat sink 11 are made of aluminum alloy and processed by die casting or extrusion molding: molten aluminum alloy is injected into a pre-set mold, and after cooling and solidification, it is formed into an integral structure in one step. The heat dissipation substrate 1 is flat, and the heat sink 11 is directly formed on one side surface of the heat dissipation substrate 1. There are no splicing gaps or connecting parts between the two, forming an inseparable integrated structure. Aluminum alloy has excellent thermal conductivity, ensuring rapid heat transfer between the substrate and the heat sink 11; the integrated molding eliminates splicing gaps, reduces thermal resistance, further improves heat conduction efficiency, and also increases the overall structural strength, avoiding the risk of the heat sink 11 detaching.

[0045] like Figure 1 As shown, the edge of the heat dissipation substrate 1 is provided with at least two mounting holes 13, and the heat dissipation substrate 1 is fixedly mounted on an external high-power device through the mounting holes 13.

[0046] Specifically, the heat dissipation substrate 1 is flat, with at least two mounting holes 13 extending through its edge. These mounting holes 13 are spaced apart along the edge (they can be symmetrically or evenly distributed). During assembly, connectors (such as screws or bolts) pass through the mounting holes 13 and engage with the pre-drilled threaded holes or mating nuts of the external high-power device, ensuring close contact between the contact surface of the heat dissipation substrate 1 and the heat-generating parts of the external high-power device, thus achieving a fixed connection between the heat dissipation substrate 1 and the external device. The mounting holes 13 ensure a secure connection between the heat dissipation substrate 1 and the external device, preventing loosening. After fixing, the substrate and device fit tightly together, reducing thermal resistance and improving heat conduction efficiency. Simultaneously, the edge placement does not occupy the core heat dissipation area, ensuring heat dissipation functionality.

[0047] In an optional embodiment, the power supply unit includes an external power supply and a power conversion module, the external power supply and the power conversion module being electrically connected, and the output terminal of the power conversion module being electrically connected to the micro water pump 22 and the cooler 23, respectively.

[0048] Specifically, the external power supply in the power supply unit can be a mains power input interface or an external independent power source (such as a battery). Its output terminal is electrically connected to the input terminal of the power conversion module via a wire. The power conversion module (such as an AC-DC conversion module or a DC-DC voltage regulator module) can convert the electrical energy input from the external power supply into voltage and current specifications suitable for the micro water pump 22 and the cooler 23. The two output terminals of the module are electrically connected to the power interfaces of the micro water pump 22 and the cooler 23 respectively via wires, forming an independent power supply circuit. The power conversion module adapts to the power supply requirements of the external power supply and the load (water pump, cooler 23), avoiding damage to the equipment due to voltage and current mismatch. The external power supply ensures continuous power supply and maintains the stable operation of the heat dissipation system. The overall power supply structure has strong compatibility, adapts to different external power supply scenarios, and has reliable connections, reducing the risk of power supply failure.

[0049] like Figure 1 As shown, the heat dissipation substrate 1 is also provided with a cable inlet 14. The cable of the external power supply passes through the cable inlet 14 and is connected to the micro water pump 22 and the cooler 23 respectively.

[0050] Specifically, in this embodiment, an inlet 14 is provided through the center of the heat dissipation substrate 1 (the area without heat sink 11). The shape of the inlet 14 is adapted to the cross-section of the external power cable (such as a circle or a square with chamfers), and a rubber protective ring can be provided on the inner wall of the inlet 14. The external power cable (including the branch lines connecting the micro water pump 22 and the cooler 23 respectively) passes through the inlet 14 from the outside of the heat dissipation substrate 1, extends to the inside of the heat dissipation substrate 1, and the two branch ends of the cable are respectively connected to the power interface of the micro water pump 22 and the power interface of the cooler 23. The cable can be limited and fixed at the inlet 14 by a buckle or a seal to prevent the cable from moving randomly.

[0051] In an optional embodiment, the external power supply is an AC220V power supply, and the power conversion module is a DC24V conversion module. The external power supply is converted into a DC24V voltage that can power the micro water pump 22 and the cooler 23.

[0052] Specifically, in the power supply unit, the external power supply is AC220V AC mains power, which can be connected to the mains interface via a cable with a plug; the power conversion module is a DC24V conversion module, whose input end is electrically connected to the output end of the AC220V external power supply via a wire. Internally, the module uses circuit design to convert the input AC220V AC power to DC24V DC power. The DC24V output end of the power conversion module is electrically connected to the power interfaces of the micro water pump 22 and the cooler 23 via independent wires, forming a stable power supply circuit, enabling the micro water pump 22 and the cooler 23 to obtain a suitable DC24V operating voltage. The AC220V external power supply is a common mains power source, readily available to ensure continuous power supply; the DC24V conversion module accurately matches the load voltage requirements, avoiding damage to the equipment due to voltage mismatch.

[0053] In an optional embodiment, when there are multiple coolers 23, the multiple coolers 23 are connected in series in the water circulation passage 21.

[0054] Specifically, in this embodiment, the number of coolers 23 can be set according to the needs of the heat dissipation equipment. When multiple coolers 23 are set, they are arranged sequentially according to the water flow direction. The outlet of the first cooler 23 is connected to the inlet of the next cooler 23 through a pipe. The inlet of the first cooler 23 is connected to the outlet of the micro water pump 22, and the outlet of the last cooler 23 is connected to the return end of the water pipe 2, so that multiple coolers 23 form a continuous series path, and water can flow through each cooler 23 in sequence. In the case of multiple coolers 23 connected in series, the circulating water can be cooled by passing through multiple coolers 23 in sequence, and the cooling effect is superimposed, thereby further improving the cooling efficiency of the circulating water.

[0055] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0056] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0057] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0058] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0059] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0060] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0061] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include these modifications and variations.

[0062] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A high-power heat dissipation device, characterized in that, include: A heat dissipation substrate, wherein heat dissipation fins are provided on the heat dissipation substrate; Water pipes are arranged around the heat sink to form a closed water circulation path, and a miniature water pump and a cooler are connected to each other on the water circulation path. A power supply unit is electrically connected to the micro water pump and the cooler respectively to provide working power for both.

2. The high-power heat dissipation device according to claim 1, characterized in that, The number of heat sinks is multiple, and the multiple heat sinks are distributed in parallel on the heat dissipation substrate and have a toothed structure on the plane of the heat dissipation substrate.

3. The high-power heat dissipation device according to claim 2, characterized in that, The water pipe is a serpentine copper pipe, with the straight section of the serpentine copper pipe located between the two heat sinks and the bend of the serpentine copper pipe located on the outer edge of the heat sink substrate. The water circulation path is formed by connecting the two ends of the serpentine copper pipe.

4. The high-power heat dissipation device according to claim 3, characterized in that, The surface of the heat dissipation substrate is recessed with a mounting groove, and the water pipe is fixedly installed in the mounting groove. The shape of the mounting groove is adapted to the shape of the water pipe.

5. The high-power heat dissipation device according to claim 1, characterized in that, Both the heat sink and the heat dissipation substrate are made of aluminum alloy, and the heat sink and the heat dissipation substrate are integrally formed.

6. The high-power heat dissipation device according to claim 1, characterized in that, The heat dissipation substrate has at least two mounting holes on its edge, and the heat dissipation substrate is fixedly mounted on an external high-power device through the mounting holes.

7. The high-power heat dissipation device according to claim 1, characterized in that, The power supply unit includes an external power supply and a power conversion module. The external power supply is electrically connected to the power conversion module, and the output terminal of the power conversion module is electrically connected to the micro water pump and the cooler, respectively.

8. The high-power heat dissipation device according to claim 7, characterized in that, The heat dissipation substrate is also provided with a cable inlet, through which the cable of the external power supply passes and is connected to the micro water pump and the cooler respectively.

9. The high-power heat dissipation device according to claim 8, characterized in that, The external power supply is an AC220V power supply, and the power conversion module is a DC24V conversion module. The external power supply is converted into a DC24V voltage that can power the micro water pump and the cooler.

10. The high-power heat dissipation device according to claim 1, characterized in that, When there are multiple coolers, the multiple coolers are connected in series in the water circulation path.

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