Swivel device and die bonder

Abstract

This application belongs to the field of semiconductor equipment technology, specifically relating to a turret device and die bonding equipment. The turret device includes: a swing mechanism comprising a rotating base, multiple swing arms, and multiple suction nozzles. The multiple swing arms are spaced apart circumferentially along the rotating base, and a suction nozzle is located at the end of each swing arm away from the rotating base; a pneumatic circuit assembly whose output end is connected to the suction nozzles of the multiple swing arms respectively; multiple solenoid valves, each solenoid valve being located on one side of a swing arm and connected between the output end of the pneumatic circuit assembly and the suction nozzle; and a control board connected to the rotating base. The control board is electrically connected to the solenoid valves via a first wire and is used to control the opening or closing of the solenoid valves, so that the corresponding suction nozzles can pick up or release wafers. This application can reduce the pipeline length between the solenoid valves and the suction nozzles, shorten the reaction time of the suction nozzles, and improve die bonding efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a turret device and a die bonding device. Background Technology

[0002] A die bonder, also known as a chip mounter, is used to pick up a die from a pre-cut wafer and place it on the die flag corresponding to the lead frame, and then bond the die to the lead frame.

[0003] The turret of a die bonder is equipped with a suction nozzle. The nozzle uses the negative pressure of a vacuum system to adsorb the wafer, thereby achieving wafer gripping and placement. In related technologies, a long pipeline supplies negative pressure gas between the vacuum system and the suction nozzle, and a solenoid valve is installed on the pipeline outside the turret to control the gas flow. Because the pipeline between the solenoid valve and the suction nozzle is long, the suction nozzle reacts slowly and cannot adsorb or release the wafer in a timely manner, affecting the die bonder efficiency.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Utility Model Content

[0005] The purpose of this application is to provide a turret device and a die bonding equipment, which aims to reduce the pipeline length between the solenoid valve and the nozzle, shorten the nozzle's reaction time, and improve the die bonding efficiency.

[0006] To achieve the above objectives, this application provides a turret device, comprising: a swing mechanism including a rotating base, multiple swing arms, and multiple suction nozzles, wherein the multiple swing arms are spaced apart circumferentially along the rotating base, and a suction nozzle is provided at the end of each swing arm away from the rotating base; a gas path assembly, wherein the input end of the gas path assembly is connected to an external vacuum system, and the output end of the gas path assembly is respectively connected to the suction nozzles of the multiple swing arms; multiple solenoid valves, wherein the solenoid valves are disposed on one side of the swing arms and connected between the output end of the gas path assembly and the suction nozzles; and a control board connected to the rotating base, wherein the control board is electrically connected to the solenoid valves through a first wire, and is used to control the opening or closing of the solenoid valves so that the corresponding suction nozzles adsorb or release wafers.

[0007] In one possible implementation, the solenoid valve includes a valve chamber and an inlet, an outlet, and a vent that are communicated with and spaced apart from the valve chamber. The side of the swing arm facing the solenoid valve is provided with a first port communicating with the inlet, a second port communicating with the outlet, and a third port communicating with the vent. The side of the swing arm facing the air circuit assembly is provided with a fourth port that communicates with the first port. The output end of the air circuit assembly is communicated with the fourth port. The swing arm is also provided with a fifth port adjacent to the nozzle that communicates with the second port and the nozzle.

[0008] In one possible implementation, the solenoid valve is provided with a positioning hole adjacent to the valve cavity on the side facing the rocker arm, and the rocker arm is provided with a corresponding threaded hole. The solenoid valve is connected to the threaded hole by fasteners passing through the positioning hole.

[0009] In one possible implementation, the turret device further includes a drive unit and a conductive slip ring that is signal-connected to the drive unit. The drive unit includes a rotating shaft with an inner cavity, one end of which is connected to a rotating seat to drive the oscillating mechanism to rotate about the central axis of the rotating seat. At least a portion of the pneumatic circuit assembly is disposed in the inner cavity of the rotating shaft. The conductive slip ring is connected to the end of the rotating shaft away from the oscillating mechanism. The control board is electrically connected to the conductive slip ring via a second wire.

[0010] In one possible implementation, the pneumatic assembly includes a rigid tube, a first flexible tube, a plurality of second flexible tubes, and an adapter. One end of the rigid tube is connected to a conductive slip ring, and the other end of the rigid tube is connected to one end of the first flexible tube. The adapter is located at the end of the rotating shaft away from the conductive slip ring and is connected between the first flexible tube and the plurality of second flexible tubes. The end of the second flexible tube away from the adapter is connected to the air inlet of the solenoid valve through a swing arm.

[0011] In one possible implementation, the adapter includes a support plate and a connecting shaft disposed on one side of the support plate. The adapter is connected to the end of the rotating shaft away from the conductive slip ring via the support plate. The connecting shaft includes a first air hole extending along its own axial direction and a plurality of second air holes spaced apart along its own circumference. The second air holes communicate with the first air holes. The end of the first flexible tube away from the rigid tube communicates with the first air hole via a first connector, and the end of the second flexible tube communicates with the second air hole via a second connector.

[0012] In one possible implementation, a floating joint is provided between the end of the rigid tube away from the first flexible tube and the pipeline of the vacuum system.

[0013] In one possible implementation, the turret device further includes a flow meter, one end of which is connected to a pipeline of the vacuum system, and the other end of which is connected to the end of the rigid tube away from the first flexible tube; a fixing frame is provided on the conductive slip ring, and the flow meter is fixedly connected to the fixing frame.

[0014] In one possible implementation, the conductive slip ring includes a first coil assembly and a second coil assembly stacked and spaced apart. The first coil assembly is located on the side of the second coil assembly away from the swing mechanism. The second coil assembly is fixedly connected to the end of the rotating shaft away from the rotating seat. The control board is electrically connected to the second coil assembly through a second wire.

[0015] Another aspect of this application provides a die bonding apparatus, including a turret device as described in this application.

[0016] The turret device and die bonding equipment provided in this application, by correspondingly arranging multiple solenoid valves on one side of multiple swing arms of the swing mechanism, and connecting the solenoid valves between the output end of the gas path assembly and the nozzle, and controlling the opening or closing of each solenoid valve through the first wire of the control board, so that the nozzle of the corresponding swing arm can adsorb or release the wafer. Compared with the related technology, which arranges the solenoid valves outside the turret device, this application can reduce the pipeline length between the solenoid valve and the nozzle, shorten the reaction time of the nozzle, and improve the die bonding efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the die bonding device provided in the embodiments of this application;

[0019] Figure 2 This is a schematic diagram of the structure of the turret device provided in the embodiments of this application;

[0020] Figure 3 for Figure 2 The diagram shown is a top-down view of the turret device.

[0021] Figure 4 for Figure 2 The diagram shows the structure of the solenoid valve in the turret device.

[0022] Figure 5 for Figure 2 The diagram shows the structure of the swing arm in the turret device.

[0023] Figure 6 for Figure 5 The diagram shows a cross-sectional view of the swing arm along direction AA.

[0024] Figure 7 for Figure 5The diagram shows a cross-sectional view of the swing arm along direction BB.

[0025] Figure 8 for Figure 3 The diagram shows a cross-sectional view of the turret device along direction CC.

[0026] Figure 9 for Figure 8 The diagram shows the structure of the adapter in the pneumatic circuit assembly.

[0027] Figure 10 for Figure 2 The diagram shows the structure of the conductive slip ring in the turret device.

[0028] Explanation of key figure labels:

[0029] 1000. Die bonding equipment; 100. Turret device; 200. Storage box; 300. Die picking assembly; 400. Ring changing assembly; 500. Rotation mechanism; 600. Needle mechanism; 700. Die bonding mechanism; 800. Fixture platform;

[0030] 1. Swinging mechanism; 11. Rotating seat; 12. Swing arm; 121. First port; 122. Second port; 123. Third port; 124. Fourth port; 125. Fifth port; 126. Threaded hole; 13. Nozzle;

[0031] 2. Air circuit assembly; 20. Rigid tube; 21. First flexible tube; 22. Third connector; 23. Adapter; 231. Support plate; 232. Connecting shaft; 2321. First air port; 2322. Second air port; 24. First connector; 25. Second connector; 26. Floating connector;

[0032] 3. Solenoid valve; 31. Air inlet; 32. Air outlet; 33. Vent; 34. Fastener;

[0033] 4. Control panel; 5. Drive unit; 51. Rotating shaft;

[0034] 6. Conductive slip ring; 61. First coil assembly; 62. Second coil assembly;

[0035] 7. Flow meter; 8. Mounting bracket. Detailed Implementation

[0036] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0037] Figure 1This is a schematic diagram of the die bonding device provided in an embodiment of this application.

[0038] See Figure 1 This application provides a die bonding device 1000, including a turret device 100, a storage box 200, a die picking component 300, a ring changing component 400, a rotating mechanism 500, a needle mechanism 600, a die bonding mechanism 700, and a clamping platform 800.

[0039] The storage box 200 is used to store crystal rings, and the crystal picking component 300 is used to pick up the crystal rings from the storage box 200; the ring changing component 400 is used to pick up the crystal rings and place them in the rotating mechanism 500; the rotating mechanism 500 is used to rotate the crystal rings to a position below the needle piercing mechanism 600, and the needle piercing mechanism 600 is used to pierce the blue film of the crystal rings to push out and peel off the wafers on the blue film of the crystal rings; the turret device 100 is used to transfer the wafers, and the crystal fixing mechanism 700 is used to adsorb the wafers on the turret device 100 and fix the wafers on the support of the clamping platform 800.

[0040] The turret device 100, storage box 200, crystal picking assembly 300, ring changing assembly 400, rotating mechanism 500, needle-piercing mechanism 600, and crystal bonding mechanism 700 constitute a working assembly. Two working assemblies are symmetrically arranged, and a fixture platform 800 is positioned between the two working assemblies. During operation, the two sets of working assemblies simultaneously perform crystal bonding operations on the support on the fixture platform 800. The two sets of working assemblies cooperate without interference, optimizing the overall layout of the equipment and improving the overall crystal bonding efficiency.

[0041] In related technologies, the nozzle of the turret device 100 is connected to the vacuum system via a relatively long pipeline to supply negative pressure gas, and a solenoid valve is installed on the pipeline outside the turret device 100 to control the opening and closing of the gas path. Because the pipeline between the solenoid valve and the nozzle is relatively long, the nozzle reacts slowly and cannot pick up or release the wafer in a timely manner, affecting the die bonding efficiency.

[0042] Therefore, this application provides a turret device 100, which aims to reduce the pipeline length between the solenoid valve and the nozzle, shorten the nozzle's reaction time, and improve die bonding efficiency. The specific structure of the turret device 100 provided in this application embodiment is described in detail below with reference to the accompanying drawings.

[0043] Figure 2 This is a schematic diagram of the structure of the turret device provided in the embodiments of this application. Figure 3 for Figure 2 The diagram shown is a top-down view of the turret device.

[0044] See Figure 2 and Figure 3This application provides a turret device 100, including a swing mechanism 1, a pneumatic circuit assembly 2, multiple solenoid valves 3 and a control board 4.

[0045] The oscillating mechanism 1 includes a rotating base 11, multiple swing arms 12, and multiple suction nozzles 13. The swing arms 12 are spaced apart circumferentially along the rotating base 11 and are fixedly connected to the rotating base 11 by fasteners. Each swing arm 12 has a suction nozzle 13 at its end furthest from the rotating base 11. Optionally, the rotating base 11 has a disc-shaped structure, and the multiple swing arms 12 are spaced apart circumferentially along the rotating base 11. The suction nozzles 13 of the swing arms 12 can be provided with multiple suction holes. The suction holes are small in size to better adsorb wafers, prevent wafers from falling into the suction holes, and position the wafers. Different numbers of suction holes can form different adsorption areas to adsorb wafers of different sizes.

[0046] The input end of the gas path assembly 2 is connected to an external vacuum system, and the output end of the gas path assembly 2 is connected to the suction nozzles 13 of the multiple swing arms 12 respectively. The location of the gas path assembly 2 is not limited. For example, the gas path assembly 2 can be led out from the central axis of the rotating seat 11 and connected to the multiple suction nozzles 13 respectively. The suction nozzles 13 adsorb the wafer through negative pressure.

[0047] Solenoid valve 3 is located on one side of swing arm 12 and is connected between the output end of air path assembly 2 and nozzle 13. Solenoid valve 3 is a pneumatic valve body. Solenoid valve 3 is connected between the output end of air path assembly 2 and nozzle 13 and is used to open or close the air path between air path assembly 2 and nozzle 13.

[0048] The control board 4 is connected to the rotating base 11, and is electrically connected to the solenoid valve 3 via a first wire. The control board 4 controls the opening or closing of the solenoid valve 3 to allow the corresponding suction nozzle 13 to pick up or release the wafer. Optionally, the control board 4 is a circular circuit board, and multiple first wires (such as...) are spaced apart along its circumference. Figure 3 (As shown by the solid arrow in the image), a first wire is electrically connected to a solenoid valve 3, used to control the opening of the solenoid valve 3 so that the corresponding nozzle 13 can pick up the wafer, or to control the closing of the solenoid valve 3 so that the corresponding nozzle 13 can release the wafer.

[0049] In this embodiment, the swing mechanism 1 includes a plurality of swing arms 12 arranged circumferentially along the rotating seat 11. Each swing arm 12 is provided with a suction nozzle 13 at one end away from the rotating seat 11. When the rotating seat 11 rotates, it can drive the plurality of suction nozzles 13 to move from the crystal supply position to the crystal pick-up position respectively. That is, the plurality of suction nozzles 13 are maintained between the crystal supply position and the crystal pick-up position. This can improve the efficiency of wafer transfer so that the die bonding device 300 can pick up the wafer in time and improve the die bonding efficiency.

[0050] Furthermore, each swing arm 12 is equipped with a solenoid valve 3 on one side, and the solenoid valve 3 is connected between the output end of the air path assembly 2 and the suction nozzle 13. Since the distance between the solenoid valve 3 and the suction nozzle 13 is relatively short, the pipeline between the solenoid valve 3 and the suction nozzle 13 can be designed to be relatively short. When the control board 4 controls a solenoid valve 3 to open via the first wire, the negative pressure gas in the air path assembly 2 can be quickly transferred to the suction nozzle 13 through the air path in the solenoid valve 3 and the short pipeline between the solenoid valve 3 and the suction nozzle 13 to adsorb the wafer; or, when the control board 4 controls a solenoid valve 3 to close via the first wire, the output end of the air path assembly 2 can quickly cut off the supply of negative pressure gas, and at the same time, there is less residual gas in the short pipeline between the solenoid valve 3 and the suction nozzle 13, which can be quickly discharged, causing the suction nozzle 13 to release the wafer due to insufficient adsorption force.

[0051] In other words, because the physical distance between the solenoid valve 3 and the nozzle 13 is relatively short, the amount of gas used in the pipeline can be reduced, the time for gas to fill the pipeline can be shortened, and the reaction time of the nozzle 13 can be shortened, which is beneficial to improving the crystal solidification efficiency.

[0052] The turret device 100 and die bonding equipment provided in this application, by correspondingly arranging multiple solenoid valves 3 on one side of multiple swing arms 12 of the swing mechanism 1, and connecting the solenoid valves 3 between the output end of the gas path assembly 2 and the suction nozzle 13, and controlling the opening or closing of each solenoid valve 3 through the first wire of the control board 4, so that the suction nozzle 13 of the corresponding swing arm 12 can adsorb or release the wafer. Compared with the related technology, which arranges the solenoid valves outside the turret device, this application can reduce the pipeline length between the solenoid valve 3 and the suction nozzle 13, shorten the reaction time of the suction nozzle 13, and improve the die bonding efficiency.

[0053] Figure 4 for Figure 2 The diagram shows the structure of the solenoid valve in the turret device. Figure 5 for Figure 2 The diagram shows the structure of the swing arm in the turret device. Figure 6 for Figure 5 The diagram shows a cross-sectional view of the swing arm along direction AA. Figure 7 for Figure 5 The diagram shows a cross-sectional view of the swing arm along direction BB.

[0054] In some embodiments, the solenoid valve 3 includes a valve chamber and an air inlet 31, an air outlet 32, and a vent 33 that are connected to and spaced apart from the valve chamber. The swing arm 12 is provided with a first port 121 connected to the air inlet 31, a second port 122 connected to the air outlet 32, and a third port 123 connected to the vent 33 on the side facing the solenoid valve 3. The swing arm 12 is provided with a fourth port 124 on the side facing the air circuit assembly 2. The fourth port 124 is connected to the first port 121. The output end of the air circuit assembly 2 is connected to the fourth port 124. The swing arm 12 is also provided with a fifth port 125 adjacent to the suction nozzle 13. The fifth port 125 is connected to the second port 122 and the suction nozzle 13.

[0055] See Figures 4 to 7 The solenoid valve 3 includes a valve chamber and an inlet 31, an outlet 32, and a vent 33 that are connected to and spaced apart from the valve chamber. The inlet 31 is used to connect to a working air source, the outlet 32 ​​is used to output gas to the downstream suction nozzle 13, and the vent 33 is used to release compressed air from the output pipeline and the suction nozzle 13 when the solenoid valve 3 switches states. The solenoid valve 3 also includes a valve core disposed in the valve chamber, which is movably disposed between the vent 33 and the inlet 31 to control the opening or closing of the solenoid valve 3.

[0056] Optionally, the output end of the air path assembly 2 can be directly connected to the air inlet 31 of the solenoid valve 3, and the air outlet 32 ​​can be connected to the suction nozzle 13 through a hose to deliver the working air source to the suction nozzle 13. In this embodiment, since the multiple swing arms 12 rotate with the central axis of the rotating seat 11, the air path assembly 2 will also rotate accordingly. If the output end of the air path assembly 2 is directly connected to the air inlet 31 of the multiple solenoid valves 3, the placement of the output end pipeline of the air path assembly 2 will be relatively messy, and the output end pipeline of the air path assembly 2 may even become entangled with the swing arms 12 during rotation.

[0057] Therefore, as a preferred embodiment, in this embodiment, a first port 121, a second port 122, and a third port 123 are provided on the side of the swing arm 12 facing the solenoid valve 3. The first port 121 is connected to the air inlet 31 of the solenoid valve 3, the second port 122 is connected to the air outlet 32 ​​of the solenoid valve 3, one end of the third port 123 is connected to the air vent 33 of the solenoid valve 3, and the other end of the third port 123 is also connected to the exhaust pipe through the third connector 22 to discharge the gas outward. A fourth port 124 is provided on the side of the swing arm 12 facing the air passage assembly 2. The fourth port 124 is connected to the first port 121, and the output end of the air passage assembly 2 is connected to the fourth port 124. The swing arm 12 is also provided with a fifth port 125 connected to the second port 122, and the fifth port 125 is connected to the suction nozzle 13.

[0058] Thus, when the solenoid valve 3 is in the open state, the valve core moves to the vent 33 to form a closed inflation air path within the valve cavity. The working air source at the output end of the air path assembly 2 reaches the inlet 31 of the solenoid valve 3 via the fourth port 124 and the first port 121 of the swing arm 12. After flowing through the inflation air path inside the solenoid valve 3, it flows from the outlet 32 ​​through the second port 122 and the fifth port 125, and then enters the suction nozzle 13 through a hose. The suction nozzle 13 adsorbs the wafers through negative pressure gas. When the solenoid valve 3 switches to the closed state, the valve core moves to the inlet 31 and opens the vent 33, thereby connecting the valve cavity with the outside to form an exhaust air path, used to release the compressed air in the hose and the suction nozzle 13. The suction nozzle 13 releases the wafers due to insufficient adsorption force.

[0059] Since the output end of the air path assembly 2 only needs to be connected to the fourth port 124 of the swing arm 12, and the fifth port 125 of the swing arm 12 is connected to the nozzle 13 through a short hose, the working air source of the air path assembly 2 can be delivered to the nozzle 13 after flowing through the air path in the solenoid valve 3. Moreover, the output end pipe of the air path assembly 2 is close to the fourth port 124 of the swing arm 12, and the output end pipe of the air path assembly 2 can be neatly stored and organized, effectively reducing the possibility of the air path assembly 2 getting tangled with the swing arm 12 during the rotation of the rotating seat 11.

[0060] In some embodiments, the solenoid valve 3 is provided with a positioning hole adjacent to the valve cavity on the side facing the rocker arm 12, and the rocker arm 12 is provided with a threaded hole 126. The solenoid valve 3 is connected to the threaded hole 126 by passing through the positioning hole and fastening fastener 34.

[0061] like Figures 3 to 5 As shown, the solenoid valve 3 has two positioning holes spaced apart on the side facing the rocker arm 12, surrounding the circumference of the valve cavity. The rocker arm 12 has two corresponding threaded holes 126. Two fasteners 34 pass through the corresponding positioning holes and are connected to the threaded holes 126. The fasteners 34 may include screws and washers. The solenoid valve 3 is mechanically connected to the rocker arm 12 as a whole by the two fasteners. The arrangement of the two fasteners 34 around the circumference of the valve cavity can improve the sealing between the air inlet 31 of the solenoid valve 3 and the first port 121 of the rocker arm 12, between the air outlet 32 ​​of the solenoid valve 3 and the second port 122, and between the vent port 33 of the solenoid valve 3 and the third port 123, reducing the possibility of leakage.

[0062] Figure 8 for Figure 3 The diagram shows a cross-sectional view of the turret device along direction CC.

[0063] In some embodiments, the turret device 100 further includes a drive device 5 and a conductive slip ring 6 connected to the drive device 5 by a signal. The drive device 5 includes a rotating shaft 51 with an inner cavity. One end of the rotating shaft 51 is connected to the rotating seat 11 to drive the swing mechanism 1 to rotate about the central axis of the rotating seat 11. At least a portion of the gas path assembly 2 is disposed in the inner cavity of the rotating shaft 51. The conductive slip ring 6 is connected to the end of the rotating shaft 51 away from the swing mechanism 1. The control board 4 is electrically connected to the conductive slip ring 6 through a second wire.

[0064] like Figure 2 and Figure 8 As shown, the drive device 5 can be a rotary motor or a rotary cylinder, used to drive the swing mechanism 1 to rotate around the central axis of the rotating seat 11. The conductive slip ring 6 is connected to the end of the rotating shaft 51 away from the swing mechanism 1, and the conductive slip ring 6 controls the rotation of the drive device 5 through signal transmission. The drive device 5 includes a rotating shaft 51 with an inner cavity. At least a portion of the air passage assembly 2 is disposed in the inner cavity of the rotating shaft 51, which facilitates the storage and organization of the air passage assembly 2, so that the air passage assembly 2 is placed in an orderly manner, further reducing the possibility of the air passage assembly 2 becoming entangled during the rotation of the swing arm 12. The control board 4 is electrically connected to the conductive slip ring 6 through a second wire. The second wire can also be disposed in the inner cavity of the rotating shaft 51, which facilitates the storage and organization of the second wire and reduces the possibility of the second wire becoming entangled during the rotation of the swing arm 12.

[0065] In some embodiments, the pneumatic assembly 2 includes a rigid tube 20, a first flexible tube 21, a plurality of second flexible tubes, and an adapter 23. One end of the rigid tube 20 is connected to a conductive slip ring 6, and the other end of the rigid tube 20 is connected to one end of the first flexible tube 21. The adapter 23 is disposed at the end of the rotating shaft 51 away from the conductive slip ring 6, and the adapter 23 is connected between the first flexible tube 21 and the plurality of second flexible tubes. The end of the second flexible tube away from the adapter 23 is connected to the air inlet 31 of the solenoid valve 3 through a swing arm 12.

[0066] like Figure 8 As shown, the rigid tube 20 can be made of stainless steel, aluminum, or copper, possessing high structural strength and rigidity. The rigid tube 20 is close to the vacuum system and can withstand the impact force of the working gas source. The first flexible tube 21 and multiple second flexible tubes (such as...) Figure 3(As indicated by the dashed arrow in the diagram) can be a rubber or silicone tube, possessing significant elastic deformation force. The first flexible tube 21 and multiple second flexible tubes are close to the swing arm 12, allowing them to elastically deform with the rotation of the swing arm 12 without affecting gas delivery. The output end of the gas path assembly 2 is the end of the second flexible tube furthest from the adapter 23, which connects to the air inlet 31 of the solenoid valve 3 via the fourth port 124 of the swing arm 12. The adapter 23 can connect one first flexible tube 21 to multiple second flexible tubes respectively, ultimately connecting to the gas path of multiple solenoid valves 3, simplifying the gas path design.

[0067] Figure 9 for Figure 8 The diagram shows the structure of the adapter in the gas path assembly.

[0068] In some embodiments, the adapter 23 includes a support plate 231 and a connecting shaft 232 disposed on one side of the support plate 231. The adapter 23 is connected to the end of the rotating shaft 51 away from the conductive slip ring 6 through the support plate 231. The connecting shaft 232 includes a first air hole 2321 extending along its own axial direction and a plurality of second air holes 2322 spaced apart along its own circumference. The second air holes 2322 communicate with the first air holes 2321. The end of the first flexible tube 21 away from the rigid tube 20 is connected to the first air hole 2321 through the first connector 24, and the end of the second flexible tube is connected to the second air hole 2322 through the second connector 25.

[0069] See Figure 9 The adapter 23 includes a support plate 231 and a connecting shaft 232 disposed on one side of the support plate 231. Support structures are spaced around the connecting shaft 232 on the circumference of the support plate 231. These support structures connect the adapter 23 to the end of the rotating shaft 51 away from the conductive slip ring 6. The support plate 231 also has multiple weight-reducing holes along its circumference to reduce the weight of the adapter 23, thereby reducing the centrifugal force on the adapter 23 during rotation and lowering the possibility of damage to the first flexible tube 21 and the second flexible tube.

[0070] In this embodiment, there are eight swing arms 12 and eight solenoid valves 3. The connecting shaft 232 includes a first air hole 2321 extending along its own axial direction and eight second air holes 2322 spaced apart along its own circumference. All eight second air holes 2322 are connected to one first air hole 2321. A first flexible tube 21 can be connected to eight second flexible tubes respectively through a first connector 24 and eight second connectors 25.

[0071] In some embodiments, a floating joint 26 is provided between the end of the rigid tube 20 away from the first flexible tube 21 and the pipeline of the vacuum system.

[0072] See Figure 8As the multiple swing arms 12 of the swing mechanism 1 rotate with the rotating seat 11, the rigid tube 20 of the gas path assembly 2 will also rotate within a certain angle range. The floating joint 26 is equipped with a ball head, which allows for a movable connection between the rigid tube 20 and the pipeline of the vacuum system, preventing the rotation of the rigid tube 20 from causing the pipeline of the vacuum system to become entangled, improving the flexibility and adaptability of the entire gas path system, and thus improving the reliability of the turret device 100.

[0073] In some embodiments, the turret device 100 further includes a flow meter 7, one end of which is connected to the pipeline of the vacuum system, and the other end of which is connected to the end of the rigid tube 20 away from the first flexible tube 21; a fixing frame 8 is provided on the conductive slip ring 6, and the flow meter 7 is fixedly connected to the fixing frame 8.

[0074] like Figure 2 As shown, the flow meter 7 is connected in series between the pipeline of the vacuum system and the output end of the gas path assembly 2, so that the overall negative pressure gas flow of the gas path assembly 2 can be detected by only one flow meter 7, further simplifying the gas path design. In addition, the flow meter 7 is fixedly connected to the fixing bracket 8 set on the conductive slip ring 6 to prevent the flow meter 7 from rotating with the rigid tube 20, which would damage the pipeline of the flow meter 7 and affect the detection results.

[0075] Figure 10 for Figure 2 The diagram shows the structure of the conductive slip ring in the turret device.

[0076] In some embodiments, the conductive slip ring 6 includes a first coil assembly 61 and a second coil assembly 62 that are stacked and spaced apart. The first coil assembly 61 is located on the side of the second coil assembly 62 away from the swing mechanism 1. The second coil assembly 62 is fixedly connected to the end of the rotating shaft 51 away from the rotating seat 11. The control board 4 is electrically connected to the second coil assembly 62 through a second wire.

[0077] See Figure 10The conductive slip ring 6 is a wireless transmission slip ring. External current is transmitted to the conductive slip ring 6, which transmits the current to the driving device 5 through non-contact electromagnetic coupling of the first coil assembly 61 and the second coil assembly 62. The driving device 5 is charged and controlled by the control component, thereby driving the multiple swing arms 12 of the swing mechanism 1 to rotate. Specifically, the first coil assembly 61 includes a first coil and a first control module, and the second coil assembly 62 includes a second coil and a second control module. The first control module generates an electromagnetic field by transmitting electrical signals (such as charging current, control signals, etc.) through the first coil. This electromagnetic field passes through the second coil, inducing a current in the second coil, which is received by the second control module and then transmitted outward, thus completing the transmission and reception of electrical signals from the first control module to the second control module. Conversely, when the electrical signals of the second control module pass through the second coil, an electromagnetic field is also generated, inducing a current in the first coil, which is then received by the first control module, completing the transmission and reception of electrical signals from the second control module to the first control module.

[0078] Understandably, based on the working principle of bidirectional inductive coupling power transmission technology, the conductive slip ring 6 can also perform reverse transmission based on the above transmission steps. For example, the first control module controls the first coil to transmit electrical signals, and the second control module controls the second coil to receive electrical signals, thereby achieving bidirectional transmission. By setting up wireless transmission components and control components, electrical signals are transmitted in a non-contact electromagnetic coupling manner, replacing the traditional mechanical slip ring composed of carbon brushes and metal rings, avoiding wear between mechanical slip rings, and improving the stability of electrical signal transmission.

[0079] The conductive slip ring 6 in this embodiment uses non-contact electromagnetic coupling to transmit signals, which provides stronger signal transmission stability compared to traditional mechanical slip rings composed of carbon brushes and metal rings. Furthermore, the control board 4 is electrically connected to the second coil assembly 62 via a second wire to control the on / off state of the solenoid valve 3, simplifying circuit design and reducing manufacturing costs.

[0080] It should be understood that, in the embodiments of this application, unless otherwise expressly specified and limited, the terms "connection," "fixed connection," "contact," etc., should be interpreted broadly. Those skilled in the art can understand the specific meanings of the various terms in the embodiments of this application according to the specific circumstances.

[0081] For example, the "connection" can be a fixed connection, a rotating connection, a flexible connection, a sliding connection, a one-piece molding, an electrical connection, a contact connection, or other connection methods; it can be a direct connection, or an indirect connection through an intermediate medium, or a connection within two components or an interaction between two components.

[0082] For example, a "fixed connection" can be a component that can be directly or indirectly fixedly connected to another component; a fixed connection can include mechanical connection, welding, bonding or integral molding, etc., wherein mechanical connection can include riveting, bolting, threaded connection, keying, snap-fit ​​connection, locking connection, plugging, etc., and bonding can include adhesive bonding and solvent bonding, etc.

[0083] It should also be understood that the “parallel” or “perpendicular” described in the embodiments of this application can be understood as “approximately parallel” or “approximately perpendicular”.

[0084] It should also be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0085] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0086] It should also be understood that the terms “length,” “width,” “up,” “down,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship (if any) based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0087] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. In conclusion, the above description is merely a preferred embodiment of the technical solution of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A turret device, characterized in that, include: The swing mechanism includes a rotating base, multiple swing arms and multiple suction nozzles. The multiple swing arms are arranged at intervals along the circumference of the rotating base, and a suction nozzle is provided at the end of each swing arm away from the rotating base. The air path assembly has an input end connected to an external vacuum system and an output end connected to the suction nozzles of the plurality of swing arms, respectively. Multiple solenoid valves are disposed on one side of the swing arm and connected between the output end of the air path assembly and the nozzle; and A control board is connected to the rotating base. The control board is electrically connected to the solenoid valve through a first wire and is used to control the opening or closing of the solenoid valve so that the corresponding suction nozzle can adsorb or release the wafer.

2. The turret device as described in claim 1, characterized in that, The solenoid valve includes a valve chamber and an air inlet, an air outlet, and a vent that are communicated with and spaced apart from the valve chamber. The swing arm has a first port communicating with the air inlet, a second port communicating with the air outlet, and a third port communicating with the vent on the side facing the solenoid valve. The swing arm has a fourth port communicating with the air inlet on the side facing the air path assembly. The output end of the air path assembly is communicating with the fourth port. The swing arm also has a fifth port adjacent to the nozzle, which is communicating with the second port and the nozzle.

3. The turret device as described in claim 2, characterized in that, The solenoid valve is provided with a positioning hole adjacent to the valve cavity on the side facing the swing arm, and the swing arm is provided with a threaded hole accordingly. The solenoid valve is connected to the threaded hole by fasteners passing through the positioning hole.

4. The turret device as described in claim 2, characterized in that, The turret device further includes a drive device and a conductive slip ring connected to the drive device by a signal. The drive device includes a rotating shaft with an inner cavity. One end of the rotating shaft is connected to the rotating seat to drive the swing mechanism to rotate around the central axis of the rotating seat. The air passage assembly is disposed in the inner cavity of the rotating shaft, the conductive slip ring is connected to the end of the rotating shaft away from the swing mechanism, and the control board is electrically connected to the conductive slip ring through a second wire.

5. The turret device as described in claim 4, characterized in that, The pneumatic assembly includes a rigid tube, a first flexible tube, multiple second flexible tubes, and an adapter. One end of the rigid tube is connected to the conductive slip ring, and the other end of the rigid tube is connected to one end of the first flexible tube. The adapter is located at the end of the rotating shaft away from the conductive slip ring and is connected between the first flexible tube and the multiple second flexible tubes. The end of the second flexible tube away from the adapter is connected to the air inlet of the solenoid valve through the swing arm.

6. The turret device as described in claim 5, characterized in that, The adapter includes a support plate and a connecting shaft disposed on one side of the support plate. The adapter is connected to the end of the rotating shaft away from the conductive slip ring through the support plate. The connecting shaft includes a first air hole extending along its own axial direction and a plurality of second air holes spaced apart along its own circumference. The second air holes communicate with the first air holes. The end of the first flexible tube away from the rigid tube is connected to the first air hole through a first connector, and the end of the second flexible tube is connected to the second air hole through a second connector.

7. The turret device as described in claim 5, characterized in that, A floating joint is provided between the end of the rigid tube away from the first flexible tube and the pipeline of the vacuum system.

8. The turret device as described in claim 5, characterized in that, The turret device also includes a flow meter, one end of which is connected to the pipeline of the vacuum system, and the other end of which is connected to the end of the rigid tube away from the first flexible tube; a fixing frame is provided on the conductive slip ring, and the flow meter is fixedly connected to the fixing frame.

9. The turret device as described in claim 4, characterized in that, The conductive slip ring includes a first coil assembly and a second coil assembly stacked and spaced apart. The first coil assembly is located on the side of the second coil assembly away from the swing mechanism. The second coil assembly is fixedly connected to the end of the rotating shaft away from the rotating seat. The control board is electrically connected to the second coil assembly through the second wire.

10. A die bonding apparatus, characterized in that, Includes the turret device as described in any one of claims 1 to 9.

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