food processor

Abstract

This application relates to the technical field of food processing, and discloses a food processor including a first blending cup and a base. The first blending cup includes a first sensor module, which comprises: a first circuit board; a first microcontroller mounted on the first circuit board; and a first sensor connected to the first microcontroller for providing a first detection signal. The first blending cup is detachably mounted on the base and electrically connected to the base. The base includes a control module for providing power and controlling the power supply to power the first sensor module, and for receiving the first detection signal. The food processor of this application facilitates powering the first blending cup.

Description

Technical Field

[0001] This application relates to the technical field of food processing, and more particularly to a food processor. Background Technology

[0002] Existing food processors typically have heating and blending functions, and mainly include: a base with a rotary drive function; a food jar supported by the base for holding food; a heating element located in the bottom area of ​​the food jar to heat the food inside the food jar; and blades installed inside the food jar and driven by the rotation of the base.

[0003] Typically, blending cups require the installation of electronic devices such as thermistors to detect the operating temperature of the cup's heating element. However, since the blending cup is detachable from the base and is not directly connected to a power source, providing power to the blending cup's electronic devices becomes a technical challenge that needs to be addressed. Utility Model Content

[0004] This application aims to provide a food processor to solve the technical problem of inconvenient power supply to the blending cup in current food processors.

[0005] This application solves its technical problem by adopting the following technical solution: a food processor, comprising a first blending cup and a base. The first blending cup includes a first sensor module, the first sensor module comprising: a first circuit board; a first microcontroller mounted on the first circuit board; and a first sensor connected to the first microcontroller for providing a first detection signal. The first blending cup is detachably mounted on the base and electrically connected to the base. The base includes: a control module for providing power and controlling the power supply to power the first sensor module, and receiving the first detection signal.

[0006] The first cooking cup includes: a first cup body for holding food; a first handle and a second handle, both mounted on the side of the first cup body; and a first cup body lid for snapping onto the first handle and the second handle to cover the first cup body. The first circuit board is mounted on the first handle.

[0007] Optionally, the number of the first sensor is one, which is installed on the first circuit board or the second handle, and the first cup lid is provided with a first magnet, and the first sensor is used to detect the magnetic field of the first magnet; or, the number of the first sensor is two, and the two first sensors are respectively installed on the first circuit board and the second handle, and the first cup lid is provided with two first magnets, and the two first sensors are respectively used to detect the magnetic field of the two first magnets.

[0008] Optionally, the first sensor is a magnetic field sensor.

[0009] Optionally, the number of the first sensors is three, wherein the first and second first sensors are respectively mounted on the first circuit board and the second handle, the first cup lid is provided with two first magnets, and the two first sensors are respectively used to detect the magnetic fields of the two first magnets; the bottom of the first cup is provided with a heating element, wherein the third first sensor is mounted on the bottom of the first cup and in contact with the heating element.

[0010] Optionally, the first and second first sensors are magnetic field sensors, and the third first sensor is a temperature sensing unit.

[0011] Optionally, the first circuit board is electrically connected to two first connection terminals disposed at the bottom of the first cup body; the base includes two second connection terminals, and the control module is electrically connected to the two second connection terminals; when the first blending cup is installed in place on the base, the two first connection terminals are electrically connected to the two second connection terminals respectively.

[0012] Optionally, the first sensor is a low-voltage driven element, and the first blending cup further includes at least one high-voltage driven element. The input voltage of the low-voltage driven element is less than or equal to 50V, and the input voltage of the high-voltage driven element is greater than or equal to 110V. The base is also provided with at least two third connection terminals, which are conductively connected to the control module. The bottom of the first cup body is also provided with at least two fourth connection terminals, and each pair of fourth connection terminals is conductively connected to one of the high-voltage driven elements. Furthermore, the at least two fourth connection terminals are used to conductively connect to the at least two third connection terminals in a one-to-one correspondence.

[0013] Optionally, the at least one high-voltage drive element may be at least two high-voltage drive elements, and the neutral wires of the at least two high-voltage drive elements share one of the fourth connection terminals.

[0014] Optionally, the first microcontroller includes a first pin, a second pin, and a third pin; the first pin and the first of two first connection terminals are connected by a first wire, and the first wire has a first resistor; the second pin and the first first connection terminal are connected by a second wire, and the second wire has a diode; the third pin and the second of two first connection terminals are connected by a third wire, and the third wire is grounded; a capacitor is connected to the third wire on the second wire between the diode and the second pin. The control module includes: a second circuit board; a second microcontroller mounted on the second circuit board, the second microcontroller including a fourth pin, a fifth pin, and a sixth pin; a transistor including an emitter, a collector, and a base; the fourth pin and the output terminal of the power supply are connected via a fourth wire, the fourth wire having a second resistor and a third resistor, the third resistor being close to the fourth pin; the fifth pin and the first of two second connection terminals are connected via a fifth wire, the fifth wire having a fourth resistor; the sixth pin and the second of two second connection terminals are connected via a sixth wire, the sixth wire being grounded; the emitter of the transistor is connected to the output terminal of the power supply, the collector is connected between the fourth resistor and the first second connection terminal, and the base is connected between the second resistor and the third resistor; wherein, the control module switches between a first stage and a second stage via the transistor. In the first stage, the control module turns on the transistor, so that the output terminal of the power supply provides DC power to the first first connection terminal through the transistor, the fifth wire, and the first second connection terminal. The first sensor module obtains DC power from the power supply through the diode and the capacitor. In the second stage, the control module turns off the transistor and sends a query frame to the first sensor module through the fifth wire. The first sensor module responds to the control module immediately during the second stage.

[0015] Optionally, the first microcontroller is equipped with an encryption code, which corresponds to the type of the first cooking cup. The type includes a cooking cup with heating and stirring functions, a cooking cup with vegetable cutting functions, or a cooking cup with air fryer functions.

[0016] Optionally, the food processor further includes a second food processor cup; when the first food processor cup is not installed on the base, the second food processor cup is detachably installed on the base and electrically connected to the base; the second food processor cup includes a second sensor module for providing a second detection signal; wherein the second sensor module includes a third microcontroller, the third microcontroller having an encryption code, the encryption code corresponding to the type of the second food processor cup.

[0017] The beneficial effects of this application are as follows: In the food processor of this embodiment, by mounting the first blending cup on the base and electrically connecting it to the base, the control module can control the power module to supply power to the first sensor module, thereby enabling the sensor in the first sensor module to be powered on and generate a first detection signal. Furthermore, the control module is also configured to receive the first detection signal and then control the operation of the food processor based on the first detection signal. Therefore, the food processor of this embodiment facilitates powering the first blending cup. Attached Figure Description

[0018] One or more embodiments are illustrated by way of example with reference to the accompanying drawings, which are not intended to limit the embodiments. Elements having the same reference numerals in the drawings represent similar elements. Unless otherwise stated, the figures in the drawings are not intended to be limited in scale.

[0019] Figure 1 This is a three-dimensional structural diagram of a food processor provided in an embodiment of this application, wherein the first food processor cup is of the first type; Figure 2 for Figure 1 A three-dimensional schematic diagram of the base of the food processor shown; Figure 3 for Figure 1 An exploded three-dimensional diagram of the first food processor cup shown. Figure 4 for Figure 2 An exploded three-dimensional diagram of the machine base shown; Figure 5 for Figure 3 The circuit diagram of the first sensor module of the first cooking cup is shown. Figure 6 for Figure 4 The circuit diagram of the control module of the base shown; Figure 7 This is a three-dimensional structural diagram of a food processor provided in an embodiment of this application, wherein the second food processor cup is of the second type; Figure 8 for Figure 7 An exploded three-dimensional diagram of the second food processor shown. Figure 9 for Figure 3 A schematic diagram showing the conductive connection relationship between the low-voltage drive element, the high-voltage drive element, and the connection terminal in the first food processor cup. Figure 10 This is a schematic diagram showing the conductive connection relationship between the low-voltage drive element, the high-voltage drive element, and the connection terminal in the first cooking cup of another embodiment of this application. Figure 11 This is a schematic diagram showing the conductive connection relationship between the low-voltage drive element, the high-voltage drive element, and the connection terminal in the first cooking cup of another embodiment of this application. Detailed Implementation

[0020] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only.

[0021] Additionally, to facilitate the description of the relationship between one component or component and another component or component shown in the accompanying drawings, spatially relative terms such as "lower," "upper," and similar terms may be used herein. It should be understood that spatially relative terms are intended to cover different orientations of the device in use and operation, other than those depicted in the accompanying drawings. For example, if the device in the accompanying drawings is inverted, a component described as "lower" of other components or components may then be oriented "upper" of other components or components.

[0022] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0023] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0024] See Figure 1 and Figure 2 As shown, Figure 1 This is a three-dimensional structural diagram of the food processor 100 provided in the embodiments of this application. Figure 2 for Figure 1 The diagram shows a perspective view of the base 30 of the food processor 100. The food processor 100 includes a first blending cup 10 and a base 30. The first blending cup 10 is detachably mounted on the base 30 and electrically connected to it. The first blending cup 10 is of a first type, for example, a blending cup with heating and blending functions. The first blending cup 10 can be used to hold food, such as water, rice, meat, etc., and its main body can be a stainless steel cup.

[0025] See Figure 3 As shown, Figure 3 for Figure 1 The above is an exploded perspective view of the first blending cup 10 of the food processor 100. The first blending cup 10 includes a first sensor module 11 for providing a first detection signal. The first detection signal may include at least one of signals such as temperature and magnetic field.

[0026] See Figure 4 As shown, Figure 4 for Figure 2 The diagram shows an exploded perspective view of the base. The base 30 includes a control module 31. The control module 31 provides power, can be connected to an external power source such as a 220-volt source, and converts the external power source into a suitable voltage for operation of the food processor 100. The control module 31 controls the power supply to power the first sensor module 11 and receives the first detection signal. The control module 31 may also be referred to as a main control board.

[0027] In the food processor 100 of the above embodiment, by mounting the first blending cup 10 on the base 30 and electrically connecting it to the base 30, the control module 31 can control the power supply to power the first sensor module 11, thereby enabling the sensor in the first sensor module 11 to be powered on and generate a first detection signal. Furthermore, the control module 31 is also configured to receive the first detection signal and control the operation of the food processor 100 based on the first detection signal. Therefore, the food processor 100 of this embodiment facilitates powering the first blending cup 10.

[0028] Furthermore, compared to directly powering the first food processor 10 through the control module 31, the food processor 100 of this embodiment can utilize the connection interface between the control module 31 and the first sensor module 11 to achieve power and signal transmission, thus reducing the use of interfaces and thereby reducing costs.

[0029] In some embodiments, combined with Figure 3As shown, the first blending cup 10 includes: a first cup body 108, a first handle 104, a second handle 111, and a first cup body lid 102. The first cup body 108 is an open container used to hold food. The first handle 104 and the second handle 111 are both installed on the sides of the first cup body 108, for example, on the left and right sides of the first cup body 108 respectively, to facilitate user operation of the first blending cup 10. The first cup body lid 102 is used to snap onto the first handle 104 and the second handle 111 to cover the first cup body 108. For example, the first cup body lid 102 may have two locking blocks, and the first handle 104 and the second handle 111 may each have locking slots, so that when the first cup body lid 102 is rotated to make the locking blocks into the locking slots, the first cup body lid 102 is snapped onto the first handle 104 and the second handle 111. When the first handle 104 and the second handle 111 are installed with screws, screw plugs 117 can also be provided to seal the openings on the first handle 104 and the second handle 111, thereby providing a waterproof function for the first sensor module 11 and the third circuit board 106 described below.

[0030] Combination Figure 3 and Figure 5 As shown, Figure 5 for Figure 3 The diagram shows a circuit diagram of the first sensor module 11 of the first blending cup 10. The first sensor module 11 includes: a first circuit board 109, a first microcontroller unit (MCU) 118, a first sensor 119, etc. The first circuit board 109 can be mounted on the first handle 104, for example. The first microcontroller 118 is mounted on the first circuit board 109. The first sensor 119 is connected to the first microcontroller 118 and is used to provide the first detection signal.

[0031] In this way, detection can be performed by the first sensor 119, and the detection results of the first sensor 119 can be collected by the first microcontroller 118. The corresponding data can be packaged to generate the first detection signal and then sent back to the control module 31.

[0032] In some embodiments, combined with Figure 3As shown, the number of the first sensors 119 can be three, with the first and second first sensors 119 respectively mounted on the first circuit board 109 and the second handle 111. The first cup lid 102 has two first magnets 103, and the two first sensors 119 are used to detect the magnetic fields of the two first magnets 103 respectively. The bottom of the first cup body 108 has a heating element 113, and the third first sensor 119 is mounted on the bottom of the first cup body 108 and in contact with the heating element 113. For example, the second first sensor 119 can be mounted on a third circuit board 106, which is then mounted on the second handle 111. A metal cap 114 can be welded to the bottom of the first cup body 108 and houses the third first sensor 119. The metal cap 114 also covers and protects the heating element 113.

[0033] The third circuit board 106 can be electrically connected to the first circuit board 109 via a wire to connect the second first sensor 119 to the first microcontroller 118. This wire can pass sequentially through the second handle 111, the cup bottom cover 115, and the first handle 104, and can be potted with adhesive at the relevant through-holes for waterproofing. Similarly, the third first sensor 119 can be connected to the first microcontroller 118 via a wire.

[0034] In this way, the operating temperature of the heating element 113 can be detected. Furthermore, the magnetic fields of the two first magnets 103 can be detected by the first and second first sensors 119 to accurately determine whether the first cup lid 102 is properly installed. Accordingly, the food processor 100 of this embodiment can be configured such that when the first and second first sensors 119 simultaneously detect the magnetic fields of the two first magnets 103, the first sensor module 11 feeds a signal back to the control module 31 of the base 30, and then the food processor 100 can start working.

[0035] In some embodiments, combined with Figure 3As shown, the first and second first sensors 119 can be magnetic field sensors, such as Hall sensors, and the third first sensor 119 can be a temperature sensing unit, such as a negative temperature coefficient thermistor (NTC). Magnetic field sensors are used for non-contact detection of the state (e.g., position, movement, or presence) of a target object. The term "magnetic field sensor" here refers to any sensing device capable of responding to a magnetic field and outputting a corresponding electrical signal. Magnetic field sensors can also be magnetoresistive sensors or employ any other sensing technology based on magnetic principles. The temperature sensing unit is used to collect temperature information of the monitored area and can also be: a positive temperature coefficient thermistor, a resistance temperature detector, a thermocouple, an integrated circuit temperature sensor, etc.

[0036] In some other embodiments, combined Figure 5 As shown, the number of the first sensors 119 can be five, including three Hall sensors Hall 1, Hall 2 and Hall 3, and two negative temperature coefficient thermistors NTC 1 and NTC 2.

[0037] In some other embodiments, there is one first sensor 119, which is mounted on the first circuit board 109 or the second handle 111, and a first magnet 103 is provided on the first cup lid 102. The first sensor 119 is used to detect the magnetic field of the first magnet 103.

[0038] In some other embodiments, there are two first sensors 119, which are respectively mounted on the first circuit board 109 and the second handle 111. The first cup lid 102 is provided with two first magnets 103, and the two first sensors 119 are used to detect the magnetic fields of the two first magnets 103.

[0039] In this way, by flexibly selecting the number of the first sensors 119, the working needs of different types of cooking cups can be met.

[0040] In some embodiments, combined with Figure 3 and Figure 5 As shown, the first circuit board 109 and two first connection terminals 116 located at the bottom of the first cup body 108 can be electrically connected via wires. The exposed portions of the two first connection terminals 116 at the connection points with the wires can be sealed with waterproof adhesive. Figure 4 and Figure 6 As shown, Figure 6 for Figure 4The circuit diagram of the control module of the base shown is illustrated. The base 30 includes two second connection terminals 305, and the control module 31 is electrically connected to the two second connection terminals 305. When the first blending cup 10 is installed on the base 30, the two first connection terminals 116 are electrically connected to the two second connection terminals 305 respectively.

[0041] In this way, the food processor 100 of this application embodiment can realize power and signal transmission by using two first connection terminals 116 and two second connection terminals 305 between the control module 31 and the first sensor module 11, thereby reducing the use of connection terminals and thus reducing costs.

[0042] In some embodiments, combined with Figure 3 As shown, the first sensor 119 can be a low-voltage driven element, the input voltage of which is less than or equal to 50V, such as 3.3V, 5V, 12V, 24V, etc. The first blending cup 10 may also include at least one high-voltage driven element, the input voltage of which is greater than or equal to 110V, such as 110V, 220V, 380V, etc.; the high-voltage driven element may be the heating element 113 mentioned above. The bottom of the first cup body 108 is also provided with at least two fourth connection terminals 120, and each pair of fourth connection terminals 120 is electrically connected to one of the high-voltage driven elements.

[0043] In some embodiments, combined with Figure 4 As shown, at least two third connection terminals 308 may also be provided on the base 30. The at least two third connection terminals 308 are electrically connected to the control module 31 and are used to receive a high-voltage power supply of, for example, greater than or equal to 110V output by the control module 31. The at least two fourth connection terminals 120 are used to be electrically connected to the at least two third connection terminals 308 in a one-to-one correspondence.

[0044] See Figure 9 , Figure 9 for Figure 3 The diagram shows the conductive connections between the low-voltage drive element, the high-voltage drive element, and the connecting terminals in the first blending cup 10. In this embodiment, the low-voltage drive element in the first blending cup 10 includes, for example, a first sensor 119, a temperature sensing unit, and the high-voltage drive element is, for example, a heating element 113 of a heating film. The first sensor module 11 is conductively connected to two first connecting terminals 116. The heating element 113 is conductively connected to two fourth connecting terminals 120. The first connecting terminals 116 and the fourth connecting terminals 120 can be mounted on a support member, for example, by injection molding into a single integral component. The first blending cup 10 can be a blending cup with heating and stirring functions.

[0045] See Figure 10 , Figure 10 This is a schematic diagram showing the conductive connection relationship between the low-voltage drive element, the high-voltage drive element, and the connecting terminal in the first blending cup of another embodiment of this application. This embodiment is similar to... Figure 9 The embodiments shown are basically the same, except that: Figure 10 In the illustrated embodiment, the heating element 113 may be a heating tube, and there are two of them. The number of fourth connection terminals 120 is set to three. The neutral wires of the two heating elements 113 share one of the fourth connection terminals 120. In some other embodiments, at least two high-voltage drive elements may be used, and the neutral wires of the at least two high-voltage drive elements share one of the fourth connection terminals 120.

[0046] See Figure 11 , Figure 11 This is a schematic diagram showing the conductive connection relationship between the low-voltage drive element, the high-voltage drive element, and the connecting terminal in the first blending cup of another embodiment of this application. This embodiment is similar to... Figure 10 The embodiments shown are basically the same, except that: Figure 11 In the illustrated embodiment, the first cooking cup may be a cooking cup with an air fryer function, and the high-voltage drive element includes a heating element 113 and a fan motor 121. The neutral wires of the heating element 113 and the fan motor 121 share one of the fourth connection terminals 120.

[0047] In some embodiments, combined with Figure 3 As shown, the first blending cup 10 may further include a transparent measuring cup 101, a first tray 105, a front handle 107, a second tray 110, and a bottom lid 115. The transparent measuring cup 101 can be installed on the first cup body lid 102 and also serves to prevent spillage. The first tray 105 is used to house the second first sensor 119 and may be filled with waterproof glue to waterproof the second first sensor 119; similarly, the second tray 110 is used to house the first first sensor 119 and may also be filled with waterproof glue to waterproof the first first sensor 119. The front handle 107 is installed on the side of the first cup body 108 and is located between the first handle 104 and the second handle 111, allowing the user to hold it with one hand. The bottom lid 115 may be disposed on the outside of the metal lid 114 to support the first blending cup 10.

[0048] In some embodiments, combined with Figure 4As shown, the base 30 may further include a transmission cover 301, sealant 302, upper housing 303, middle housing 304, terminal bracket 309, terminal pad 310, motor 311, screen assembly 312, and lower housing 313. The upper housing 303, middle housing 304, and lower housing 313 are connected to form a support structure, creating an internal accommodating space. The screen assembly 312 is mounted on the upper housing 303 for user operation or display of working parameters. The motor 311 is mounted on the lower housing 313. The transmission cover 301 is mounted at the bottom of the upper housing 303 and is driven by the motor 311, which in turn drives the blade assembly 112. The terminal bracket 309 and terminal pad 310 support the second connecting terminals 305 and the third connecting terminals 308. The terminal bracket 309 has an insertion port on the side facing the first food preparation cup 10, allowing the first connecting terminal 116 to be inserted through these ports and make conductive contact with the second connecting terminals 305 and the third connecting terminals 308.

[0049] The sealant 302 can cover the upper part of the terminal bracket 309, and the sealant 302 has a self-sealing groove at the position aligned with the first connecting terminal 116. The self-sealing groove is a cross-shaped groove, or it can be a straight groove or a Y-shaped groove (i.e., a groove formed by three intersecting slits at 60 degrees to each other). The sealant 302 at the position aligned with the first connecting terminal 116 can be an outwardly convex arc shape. When the first blending cup 10 is installed on the base 30, the first connecting terminal 116 passes through the self-sealing groove and is inserted into the terminal bracket 309 to achieve a conductive connection. When the first blending cup 10 is removed from the base 30, the first connecting terminal 116 is dislodged from the self-sealing groove, and the self-sealing groove automatically resets itself elastically. Thus, the sealant 302 provides a waterproof function.

[0050] In some embodiments, combined with Figure 5As shown, the first microcontroller 118 includes a first pin A1, a second pin A2, and a third pin A3. The first pin A1 is connected to the first of two first connection terminals 116 via a first wire B1, and a first resistor R1 is provided on the first wire B1. The second pin A2 is connected to the first first connection terminal 116 via a second wire B2, and a diode D1 is provided on the second wire B2. The third pin A3 is connected to the second of the two first connection terminals 116 via a third wire B3, and the third wire B3 is grounded (GND). A capacitor is connected to the third wire B3 via the second wire B2 between the diode D1 and the second pin A2. The number of capacitors can be one, and its capacitance range can be 47-220 microfarads; or it can be two, as shown in the figure, namely a first capacitor C1 and a second capacitor C2, which are connected in parallel, and the capacitance range of the first capacitor C1 and the second capacitor C2 can be 22-47 microfarads. For example, when the capacitance of the first capacitor C1 and the second capacitor C2 is 22 microfarads, the total capacitance after parallel connection is 44 microfarads.

[0051] In some embodiments, combined with Figure 4 and Figure 6 As shown, the control module 31 includes: a second circuit board 306; a second microcontroller 307 mounted on the second circuit board 306, the second microcontroller 307 including a fourth pin A4, a fifth pin A5 and a sixth pin A6; and a transistor Q1 including an emitter E, a collector C and a base B. The fourth pin A4 and the output terminal O of the power supply are connected via a fourth wire B4. A second resistor R2 and a third resistor R3 are mounted on the fourth wire B4, with the third resistor R3 close to the fourth pin A4. The fifth pin A5 and the first of the two second connection terminals 305 are connected via a fifth wire B5, with a fourth resistor R4 mounted on the fifth wire B5. The sixth pin A6 and the second of the two second connection terminals 305 are connected via a sixth wire B6, which is grounded. The emitter E of the transistor Q1 is connected to the output terminal O of the power supply. The collector C is connected between the fourth resistor R4 and the first second connection terminal 305, and the base B is connected between the second resistor R2 and the third resistor R3. The transistor Q1 can be a PNP or P-MOS, etc. The resistance value of the second resistor R2 can range from 10 kΩ to 100 kΩ, and the resistance value of the third resistor R3 can range from 1 kΩ to 10 kΩ. The first resistor R1 and the fourth resistor R4 are impedance matching resistors, typically ranging from tens to hundreds of ohms, for example, 33 ohms or 330 ohms.

[0052] The control module 31 switches between a first stage and a second stage via the transistor Q1. In the first stage, the control module 31 turns on the transistor Q1, allowing the power supply output terminal O to supply DC power to the first first connection terminal 116 via the transistor Q1, the fifth wire B5, and the first second connection terminal 305. The first sensor module 11 receives DC power from the power supply via the diode D1 and the capacitor. In the second stage, the control module 31 turns off the transistor Q1 and sends a query frame to the first sensor module 11 via the fifth wire B5. The first sensor module 11 responds to the control module 31 immediately during the second stage. The power supply output terminal O can output, for example, a voltage of 5V.

[0053] exist Figure 5 and Figure 6 In the illustrated embodiment, the control module 31 and the first sensor module 11 are connected only through two-pin connectors S1 and M1; one pin is the common ground, and the other pin is a power supply / data multiplexed line, which are the connection terminals mentioned above. The first sensor module 11 has no independent power supply and is powered entirely by the control module 31; it can also complete master-slave communication and measurement data feedback under two-pin conditions. The core of the solution in this embodiment is: using a transistor Q1 on the control module 31 side to control the power supply to the first sensor module 11; temporarily turning off the power supply switch during a specific "communication time slot" to switch the multiplexed line from "power-driven state" to "single-wire half-duplex UART communication bus".

[0054] In some embodiments, combined with Figure 5 As shown, the first microcontroller 118 has an encryption code, which corresponds to the type of the first blending cup 10. This type includes blending cups with heating and blending functions, blending cups with vegetable cutting functions, or blending cups with air fryer functions. In this way, when the first blending cup 10 is mounted on the base 30, the first connection terminal 116 is inserted into the second connection terminal 305. When the base 30 is connected to an external power source, it supplies power to the control module 31. The control module 31 can read the encryption code in the first microcontroller 118 to determine the type of the first blending cup 10.

[0055] See Figure 7 and Figure 8 As shown, Figure 7 This is a three-dimensional structural diagram of the food processor 100 provided in an embodiment of this application, wherein the second food processor cup is of the second type; Figure 8 for Figure 7The diagram shows an exploded perspective view of the second blending cup of the food processor. The food processor 100 of this embodiment may include a second blending cup 20 and the aforementioned base 30, and may also include the aforementioned first blending cup 10. When the first blending cup 10 is not installed on the base 30, the second blending cup 20 is detachably mounted on the base 30 and electrically connected to the base 30. The second blending cup 20 includes a second sensor module 21 for providing a second detection signal. The second sensor module 21 includes a third microcontroller 22, which has an encryption code corresponding to the type of the second blending cup 20. In this way, when the second blending cup 20 is mounted on the base 30, the control module 31 can read the encryption code in the third microcontroller 22 to determine the type of the second blending cup 20. The first type can be selected from one of a cooking cup with heating and stirring functions, a cooking cup with a vegetable cutting function, and a cooking cup with an air fryer function, and the second type can be selected from another of a cooking cup with heating and stirring functions, a cooking cup with a vegetable cutting function, and a cooking cup with an air fryer function.

[0056] For example, the second type of second cooking cup 20 can be a cooking cup with a vegetable cutting function. The second cooking cup 20 may include a pusher 201, a transparent cup lid 202, a transparent cup 212, a blade 204, a blade holder 205, and a blade drive 207. The transparent cup lid 202 includes a feeding tube 218 for feeding vegetables to be chopped into the transparent cup 212 through the feeding tube 218. The pusher 201 can assist the user in pushing and pressing the vegetables. The blade 204 is mounted on the blade holder 205, and the blade holder 205 can be mounted on the blade drive 207. The blade drive 207 is rotatably mounted on the bottom of the transparent cup 212. The blade drive 207 is driven to rotate by the drive cover 301 of the base 30, which in turn drives the blade holder 205 and the blade 204 to rotate, thereby realizing the vegetable cutting function.

[0057] In some embodiments, combined with Figure 8 As shown, the second blending cup 20 may further include a second magnet 203, a front handle 206, a left handle 208, a right handle 215, a screw plug 209, a third board housing 210, a third circuit board 211, a fourth circuit board 213, a fourth board housing 214, a third connecting terminal 216, and a plastic bottom cover 217. These components in the second blending cup 20 may be the same as or similar to the corresponding components in the first blending cup 10, and will not be described in detail here.

[0058] It is readily understood that the food processor 100 of this application embodiment may include multiple different types of blending cups and the aforementioned base 30, thereby forming a system that can be selected and used by the user. When the food processor 100 senses different types of blending cups, it will make corresponding functional adjustments.

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this application as described above, which are not provided in detail for the sake of brevity; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A food processor, characterized in that... include: A first food processor (10) includes a first sensor module (11), which includes: First circuit board (109); The first microcontroller (118) is mounted on the first circuit board (109); and A first sensor (119), connected to the first microcontroller (118), is used to provide a first detection signal; and A base (30) is provided, on which the first food processor cup (10) is detachably mounted and electrically connected to the base (30), the base (30) comprising: The control module (31) is used to provide power and control the power supply to supply power to the first sensor module (11), and to receive the first detection signal.

2. The food processor according to claim 1, characterized in that, The first cooking cup (10) includes: The first cup (108) is used to hold food; The first handle (104) and the second handle (111) are both installed on the side of the first cup body (108); and The first cup body lid (102) is used to snap onto the first handle (104) and the second handle (111) to cover the first cup body (108). The first circuit board (109) is mounted on the first handle (104).

3. The food processor according to claim 2, characterized in that, The number of the first sensor (119) is one, which is installed on the first circuit board (109) or the second handle (111). The first cup lid (102) is provided with a first magnet (103), and the first sensor (119) is used to detect the magnetic field of the first magnet (103); or There are two first sensors (119). The two first sensors (119) are respectively installed on the first circuit board (109) and the second handle (111). The first cup lid (102) is provided with two first magnets (103). The two first sensors (119) are used to detect the magnetic field of the two first magnets (103).

4. The food processor according to claim 3, characterized in that, The first sensor (119) is a magnetic field sensor.

5. The food processor according to claim 2, characterized in that, There are three first sensors (119). The first and second first sensors (119) are respectively mounted on the first circuit board (109) and the second handle (111). The first cup lid (102) is provided with two first magnets (103). The two first sensors (119) are used to detect the magnetic fields of the two first magnets (103). The bottom of the first cup (108) is provided with a heating element (113). The third first sensor (119) is mounted on the bottom of the first cup (108) and is in contact with the heating element (113).

6. The food processor according to claim 5, characterized in that, The first and second of the first sensors (119) are magnetic field sensors, and the third of the first sensors (119) is a temperature sensing unit.

7. The food processor according to claim 2, characterized in that, The first circuit board (109) is electrically connected to two first connection terminals (116) disposed at the bottom of the first cup body (108); The base (30) includes two second connection terminals (305), and the control module (31) is electrically connected to the two second connection terminals (305); When the first cooking cup (10) is installed in place on the base (30), the two first connection terminals (116) are electrically connected to the two second connection terminals (305) respectively.

8. The food processor according to claim 7, characterized in that, The first sensor (119) is a low-voltage drive element, and the first cooking cup (10) also includes at least one high-voltage drive element. The input voltage of the low-voltage drive element is less than or equal to 50V, and the input voltage of the high-voltage drive element is greater than or equal to 110V. The base is also provided with at least two third connection terminals (308), which are electrically connected to the control module (31); The bottom of the first cup body (108) is also provided with at least two fourth connection terminals (120), each pair of the fourth connection terminals (120) being electrically connected to one of the high-voltage drive elements; and the at least two fourth connection terminals (120) are used to electrically connect one-to-one with the at least two third connection terminals (308).

9. The food processor according to claim 8, characterized in that, The at least one high-voltage drive element is at least two high-voltage drive elements, and the neutral wires of the at least two high-voltage drive elements share one of the fourth connection terminals (120).

10. The food processor according to claim 7, characterized in that, The first microcontroller (118) includes a first pin (A1), a second pin (A2), and a third pin (A3). The first pin (A1) and the first of the two first connection terminals (116) are connected by a first wire (B1), and a first resistor (R1) is provided on the first wire (B1). The second pin (A2) and the first first connection terminal (116) are connected by a second wire (B2), and a diode (D1) is provided on the second wire (B2). The third pin (A3) and the second first connection terminal (116) of the two first connection terminals (116) are connected by a third wire (B3), which is grounded; a capacitor is connected to the third wire (B3) on the second wire (B2) between the diode (D1) and the second pin (A2); The control module (31) includes: Second circuit board (306); A second microcontroller (307) is mounted on the second circuit board (306), and the second microcontroller (307) includes a fourth pin (A4), a fifth pin (A5), and a sixth pin (A6); and A transistor (Q1) includes an emitter (E), a collector (C), and a base (B). The fourth pin (A4) and the output terminal (O) of the power supply are connected by a fourth wire (B4). A second resistor (R2) and a third resistor (R3) are provided on the fourth wire (B4), and the third resistor (R3) is close to the fourth pin (A4). The fifth pin (A5) and the first of the two second connection terminals (305) are connected by a fifth wire (B5), on which a fourth resistor (R4) is provided. The sixth pin (A6) and the second of the two second connection terminals (305) are connected by a sixth wire (B6), which is grounded; The emitter (E) of the transistor (Q1) is connected to the output terminal (O) of the power supply, the collector (C) is connected between the fourth resistor (R4) and the first second connection terminal (305), and the base (B) is connected between the second resistor (R2) and the third resistor (R3). The control module (31) switches between the first stage and the second stage via the transistor (Q1); In the first stage, the control module (31) turns on the transistor (Q1) so that the output terminal (O) of the power supply provides DC power to the first first connection terminal (116) through the transistor (Q1), the fifth wire (B5) and the first second connection terminal (305). The first sensor module (11) obtains the DC power supply from the power supply through the diode (D1) and the capacitor. In the second stage, the control module (31) turns off the transistor (Q1) and sends a query frame to the first sensor module (11) through the fifth wire (B5). The first sensor module (11) responds to the control module (31) immediately during the second stage.

11. The food processor according to claim 2, characterized in that, The first microcontroller (118) is equipped with an encryption code, which corresponds to the type of the first cooking cup (10). The type includes a cooking cup with heating and stirring functions, a cooking cup with vegetable cutting functions, or a cooking cup with air fryer functions.

12. The food processor according to any one of claims 1-11, characterized in that, The food processor also includes a second food preparation cup (20); When the first cooking cup (10) is not installed on the base (30), the second cooking cup (20) is detachably installed on the base (30) and electrically connected to the base (30); The second cooking cup (20) includes: The second sensor module (21) is used to provide a second detection signal; The second sensor module (21) includes a third microcontroller (22), which has an encryption code that corresponds to the type of the second cooking cup (20).

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