A test apparatus suitable for dual-rank DDR testing

Abstract

This utility model belongs to the field of chip testing technology and discloses a testing device suitable for dual-rank DDR testing. It includes a test socket with a symmetrical structure to facilitate dual-rank testing. A PCB board is horizontally positioned at the center of the test socket. Multiple component clearance areas and DDR connection probes are spaced apart on the PCB board. Decoupling capacitors are placed within the component clearance areas. Corresponding to the positions of the component clearance areas on the test socket, slots are provided to accommodate the decoupling capacitors. Corresponding to the positions of the DDR connection probes, chip slots are provided to place the DDR chips. The DDR connection probes connect the DDR chips to the PCB board, ensuring that the distance between the decoupling capacitors and the DDR chips is less than the decoupling radius. This testing device, by setting chip slots, allows for simple replacement of the DDR chips to be tested, improving testing efficiency. Simultaneously, the spacing between the DDR chips and the decoupling capacitors is set to be less than the decoupling radius, allowing for accurate testing of DDR chip performance and meeting testing requirements.

Description

Technical Field

[0001] This utility model belongs to the field of chip testing technology, and mainly relates to a testing device suitable for dual-rank DDR testing. Background Technology

[0002] In testing Double Data Rate (DDR) synchronous dynamic random-access memory (DDR) chips, there are many testing schemes, such as chip testing, single-rank testing, and dual-rank testing. Chip testing refers to testing a single DDR chip. Single-rank testing involves grouping several DDR chips together for testing. Dual-rank testing involves combining two DDR chips into a larger group and connecting it to the chip select signal line of the controller chip, allowing the controller chip to select different ranks for DDR read / write testing. Compared to the other two structures, the dual-rank structure offers greater capacity and is more practically applicable.

[0003] The most traditional test structure uses a direct chip mounting method, which means that the DDR chip is directly soldered onto the PCB board, and then other electronic components are connected through the internal traces of the PCB for a series of tests. In this test structure, the decoupling capacitor is placed on the PCB board. Although the DDR chip is close to the decoupling capacitor and has good electrical characteristics, the soldering method makes it impossible to quickly and easily replace the DDR chip. Therefore, it is only suitable for situations with a small number of tests.

[0004] Traditional dual-rank testing involves loading multiple DDR chips into a DDR chip test socket to form a single rank, such as... Figures 1-2As shown, a similar test socket is then placed at the same corresponding position on the back of the PCB board. DDR chips are placed in the test socket, forming a front-to-back bonding structure. The DDR chips and the PCB board are connected by pressing the test socket together. Decoupling capacitors for the DDR are then placed around the DDR chip test socket, and the DDR chips and decoupling capacitors are connected via internal PCB traces. While this test structure allows for quick and simple replacement of DDR chips, the decoupling capacitors are far from the DDR chips in the middle of the test socket, and this distance increases with the number of DDR chips in the test socket. Because the decoupling capacitors are located at both ends of the PCB board, the DDR chips in the middle are extremely far from the decoupling capacitors at both ends. When there are few DDR chips, the decoupling capacitors in the traditional dual-rank test structure are close to the DDR chips and have no significant impact on their operation. However, as the number of DDR chips in the test socket increases, the distance between the decoupling capacitors and the DDR chips increases significantly. Ultimately, because the distance between the decoupling capacitors and the DDR chips exceeds the decoupling radius, the decoupling effect deteriorates or even fails, ultimately causing the DDR chips to malfunction and making it impossible to accurately evaluate chip performance. (Comparison) Figure 1 , 2 It can be seen that, Figure 2 The test socket for the 8 DDR chips compared to Figure 1 The test sockets for the four DDR chips show that the distance between the DDR chip in the middle and the decoupling capacitors at both ends is much greater than the distance between the DDR chip in the middle and the decoupling capacitors at both ends in the latter test sockets.

[0005] Therefore, there is an urgent need for a testing device suitable for dual-rank DDR testing, which can easily replace DDR chips to improve testing efficiency, and at the same time accurately test the performance of DDR chips to meet testing requirements. Utility Model Content

[0006] To address the problems in the prior art, this invention proposes a testing device suitable for dual-rank DDR testing. This device can easily replace DDR chips, improving testing efficiency, while accurately testing the performance of DDR chips to meet testing requirements.

[0007] To achieve the above objectives, this utility model is implemented through the following technical solution: A test device suitable for dual-rank DDR testing includes a test stand with a symmetrical structure to facilitate dual-rank testing. A PCB board is horizontally positioned at the center of the test stand. Multiple decoupling capacitors and DDR connection probes are spaced apart on the front and back surfaces of the PCB board. The test stand has a component clearance area for accommodating the decoupling capacitors at the corresponding positions, and a chip slot for placing DDR chips at the corresponding positions of the DDR connection probes. The DDR connection probes connect the DDR chips to the PCB board, ensuring that the distance between the decoupling capacitors and the DDR chips is less than the decoupling radius.

[0008] Furthermore, the test socket has flip covers on both its upper and lower surfaces, with the flip-open direction facing the outside of the PCB board.

[0009] Furthermore, it also includes a test control device, which is a main control chip mounted on the PCB board and located outside the test socket.

[0010] Furthermore, a heat dissipation device is provided at the main control chip.

[0011] Furthermore, the heat dissipation device is a heat sink or a fan.

[0012] Compared with the prior art, the present invention has the following beneficial effects: This invention provides a testing device suitable for dual-rank DDR testing. By setting chip slots, the DDR chip to be tested can be easily replaced, which can improve testing efficiency. At the same time, the distance between the DDR chip to be tested and the decoupling capacitor is set to meet the minimum decoupling radius requirement, which can accurately evaluate the performance of the DDR chip and meet the testing requirements. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of a traditional dual-rank DDR test structure containing four DDR chips.

[0014] Figure 2 This is a schematic diagram of a traditional dual-rank DDR test structure containing eight DDR chips.

[0015] Figure 3 This is a schematic diagram of the principle structure of the testing device of this utility model.

[0016] Figure 4 This is a three-dimensional structural diagram of the test stand of this utility model (only one side is shown).

[0017] Figure 5 This is a schematic diagram of the PCB board inside the test socket of this utility model.

[0018] Figure 6This is a schematic diagram of the dual-rank DDR test structure containing four DDR chips according to this utility model.

[0019] Figure 7 This is a schematic diagram of the dual-rank DDR test structure containing 8 DDR chips according to this utility model.

[0020] Figure 8 This is a traditional test socket circuit connection diagram.

[0021] Figure 9 This is a circuit connection diagram of the test socket of this utility model.

[0022] in: 1. Flip cover; 2. Heating rod; 3. Chip slot; 4. Screw; 5. PCB board; 6. Main control chip; 7. Heat dissipation device; 8. Screw hole; 9. Component clearance area; 10. DDR connection probe; 11. Decoupling capacitor. Detailed Implementation

[0023] The specific embodiments of this utility model will be further explained below with reference to the accompanying drawings.

[0024] like Figures 3-7 As shown, a test device suitable for dual-rank DDR testing includes a test socket and a test control device, which are connected by a PCB board 5. One end of the PCB board 5 is connected to the test socket, and the other end is connected to the test control device.

[0025] The test stand adopts a dual-rank test structure with a symmetrical top and bottom configuration. It includes a test stand with a PCB board 5 horizontally positioned at its center. The upper and lower surfaces of the test stand are symmetrically arranged with respect to the PCB board 5. Both the upper and lower surfaces of the test stand are equipped with openable flip covers 1. Figure 4 The test fixture shown only displays the upper flip cover 1. To ensure that flip cover 1 does not obstruct other components when opened, the flip cover 1 is opened towards the outside of the PCB board, as shown below. Figure 3 As mentioned above, in Figure 3 With this opening method, the flip cover 1 opens towards the outside of the PCB board, without contacting other components, making it easy to replace the DDR chips inside the test socket.

[0026] Multiple decoupling capacitors 11 and DDR connection probes 10 are spaced apart on the PCB board 5. A chip slot 3 for placing DDR chips is positioned on the test socket corresponding to the DDR connection probe 10. The DDR connection probe 10 is located below the chip slot 3, connecting the pins on the back of the DDR chip to the PCB board 5. A component clearance area 9 is provided on the test socket corresponding to the position of the decoupling capacitors 11 on the PCB board 5. The decoupling capacitors 11 are located within the component clearance area 9. In other words, the decoupling capacitors 11 and DDR chips are spaced apart on the PCB board 5 and connected via internal traces on the PCB board 5. Figure 3 and Figure 5 As shown.

[0027] Compared to the traditional dual-rank test structure that places the decoupling capacitors at both ends of the PCB board 5, the advantage of this embodiment is that the distance between the DDR chip and the decoupling capacitor 11 is significantly closer, and this distance does not change with the increase of DDR chips. This also means that it can be applied to the testing requirements of multiple DDR chips, and has higher applicability.

[0028] like Figure 6 , 7 The diagrams shown are schematics of a structure with 4 DDR chips and a structure with 8 DDR chips, respectively. The DDR chip in the middle is still very close to the decoupling capacitor 11, so the superiority of this structure will continue to increase as the number of DDR chips increases.

[0029] The test control equipment includes a main control chip 6 mounted on a PCB board 5, used to control the testing of DDR chips. The main control chip 6 is usually a high-power CPU chip. In order to better dissipate heat from the main control chip 6, a heat dissipation device 7 is provided at the main control chip 6. The heat dissipation device 7 can be a heat sink or a fan.

[0030] The test socket is also provided with screw holes 8 around its perimeter. In use, the test socket is first installed on the PCB board using screws 4 and screw holes 8. Then, tweezers or a suction cup are used to remove the DDR chip or place it into the chip slot 3. Finally, the flip cover 1 is used to press the DDR chip together and connect the DDR chip to the PCB board through the DDR connection probe 10. Finally, the chip is connected to the decoupling capacitor in the component avoidance area 9 on the PCB board.

[0031] Meanwhile, in order to meet the high-temperature testing requirements of DDR chips, a heating rod 2 is installed inside the flip cover 1. The heating rod 2 is connected to an external power supply. The position of the heating rod 2 corresponds to the position of the chip slot 3. It can quickly heat the DDR chips in the test socket as needed to meet the requirements of high-temperature testing.

[0032] like Figure 8The diagram shown is a circuit diagram obtained from a traditional test socket design containing four DDR chips. Figure 8 As can be seen more clearly, due to spatial limitations, the DDR chips in the traditional test socket are far from the decoupling capacitor, requiring long PCB traces to connect to the decoupling capacitor. This causes the distance between electronic components to exceed the decoupling radius, and noise has a significant impact on the normal operation of the DDR chips in the test socket. This is especially evident in high and low temperature environment experiments in actual testing.

[0033] The circuit connection diagram of the improved test socket according to this embodiment is as follows: Figure 9 As shown, in Figure 9 It can be seen that after adding a component clearance area inside the test socket, the distance between the DDR chip and the decoupling capacitor is significantly shorter, and the decoupling effect of the circuit is better than before. Figure 8 The structure of a traditional test fixture is shown.

[0034] Finally, it should be noted that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A testing apparatus suitable for dual-rank DDR testing, characterized in that, The test stand has a symmetrical structure to facilitate dual-rank testing. A PCB board (5) is horizontally positioned at the center of the test stand. Multiple decoupling capacitors (11) and DDR connection probes (10) are spaced apart on the front and back of the PCB board (5). A component clearance area (9) is set at the position of the decoupling capacitor (11) to accommodate the decoupling capacitor (11). A chip slot (3) is set at the position of the DDR connection probe (10) to place the DDR chip. The DDR connection probe (10) connects the DDR chip to the PCB board (5). The distance between the decoupling capacitor (11) and the DDR chip is less than the decoupling radius.

2. The test apparatus for dual-rank DDR testing according to claim 1, characterized in that, The test stand is provided with a flip cover (1) on both the upper and lower surfaces, with the flip-open direction facing the outside of the PCB board (5).

3. The test apparatus for dual-rank DDR testing according to claim 2, characterized in that, It also includes a test control device, which is a main control chip (6) set on the PCB board (5) and located outside the test socket.

4. The test apparatus for dual-rank DDR testing according to claim 3, characterized in that, A heat dissipation device (7) is provided at the main control chip (6).

5. The test apparatus for dual-rank DDR testing according to claim 4, characterized in that, The heat dissipation device (7) is a heat sink or a fan.

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