A dual-base island packaging unit with double-sided heat dissipation and its packaging structure

Abstract

This invention provides a dual-base island packaging unit and packaging structure with double-sided heat dissipation. The dual-base island packaging unit includes a frame body, a chip, a heat sink, and a package body. The frame body has base islands and first pins spaced apart. At least two base islands are provided, each base island is equipped with a first pin, and each base island has a working surface and a first heat dissipation surface arranged opposite each other. The chip is disposed on the working surface. The heat sink is located on the side of the chip away from the base islands, and the chip and the first pins are electrically connected through the heat sink. The side of the heat sink away from the chip has a second heat dissipation surface. The package body is used to cover the frame body, the chip, and the heat sink, and both the first and second heat dissipation surfaces are exposed outside the package body. By setting up dual base islands, it is beneficial to reduce the package volume, thereby reducing the board area occupied by the packaging unit. By setting the first and second heat dissipation surfaces on opposite sides of the chip, it is beneficial to improve the heat dissipation efficiency of the packaging unit.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a dual-base island packaging unit and packaging structure with double-sided heat dissipation. Background Technology

[0002] In recent years, with the rapid development of miniaturization and multifunctionality of various electronic products, semiconductor technology has also been continuously developing towards higher integration and higher density. This requires semiconductor devices to withstand greater current surges and have better heat dissipation performance in high-temperature environments to avoid chip failure due to insufficient heat dissipation, which would affect product reliability. With the increasing demands for product miniaturization and flattening, it is necessary to reduce the area occupied by devices on the PCB while ensuring adequate heat dissipation.

[0003] Therefore, a new solution is needed to address the aforementioned technical problems. Utility Model Content

[0004] This utility model provides a dual-base island packaging unit and packaging structure with double-sided heat dissipation to solve the technical problems of insufficient heat dissipation of dual-base island packaging units and excessive board area occupied by single base islands.

[0005] This utility model provides a dual-base island packaging unit with double-sided heat dissipation. The dual-base island packaging unit with double-sided heat dissipation includes: a frame body, a chip, a heat sink, and a package body. The frame body has base islands and first pins arranged at intervals. At least two base islands are provided, each base island is equipped with the first pin, and each base island has a working surface and a first heat dissipation surface arranged opposite to each other. The chip is disposed on the working surface of each base island. The heat sink is located on the side of the chip away from the base island. The chip and the first pin are electrically connected through the heat sink. The side of the heat sink away from the chip has a second heat dissipation surface. The package body is used to cover the frame body, the chip, and the heat sink, and both the first heat dissipation surface and the second heat dissipation surface are exposed in the package body.

[0006] In one embodiment of the present invention, a protrusion is provided on the side of the heat sink away from the chip, the protrusion and the heat sink forming a step, and the second heat dissipation surface is provided on the side of the protrusion away from the chip.

[0007] In one embodiment of the present invention, a locking groove is provided on the side of the heat sink facing the chip, and the locking groove is located at the junction of the heat sink and the chip.

[0008] In one embodiment of the present invention, the first heat dissipation surface and the second heat dissipation surface are flush with the outer surface of the package body.

[0009] In one embodiment of the present invention, an overflow groove is provided on the working surface, and the chip has the overflow groove on one opposite side.

[0010] In one embodiment of the present invention, the sidewall of the base island is provided with connecting ribs and grooves.

[0011] In one embodiment of the present invention, the frame body further has a second pin spaced apart from the base island, each base island is equipped with the second pin, and the second pin and the chip are connected by wire bonding.

[0012] In one embodiment of the present invention, one of the base islands is configured with a first pin and a second pin, the first pin and the second pin being located on the same side of the base island.

[0013] In one embodiment of the present invention, the soldering surfaces of the first pin and the second pin are flush with the outer surface of the package.

[0014] The present invention provides a packaging structure comprising: a lead frame and a dual-base island packaging unit with double-sided heat dissipation disposed on the lead frame, wherein the lead frame is provided with a plurality of frame units, and each frame unit is provided with a plurality of dual-base island packaging units with double-sided heat dissipation disposed therein.

[0015] The beneficial effects of this utility model are as follows: This utility model proposes a dual-base island packaging unit and packaging structure with double-sided heat dissipation. The dual-base island packaging unit with double-sided heat dissipation has at least two base islands on the frame body, and each base island has a chip on its working surface, which helps to reduce the packaging volume, thereby reducing the board area occupied by the packaging unit and also helps with thermal management. Furthermore, the first heat dissipation surface of the base island and the second heat dissipation surface of the heat sink are both exposed to the packaging body, forming a dual-sided heat dissipation packaging unit, which helps to improve the heat dissipation efficiency and resistance to current surges of the packaging unit. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0017] In the attached diagram:

[0018] Figure 1 This is a dual-base island packaging unit with double-sided heat dissipation provided in one embodiment of the present invention;

[0019] Figure 2 This is another perspective of the dual-base island packaging unit for double-sided heat dissipation provided in one embodiment of the present invention;

[0020] Figure 3 This is a partial view of a dual-base island packaging unit with double-sided heat dissipation provided in one embodiment of the present invention.

[0021] The attached figures are labeled as follows:

[0022] 1-Chip;

[0023] 2-Heat sink; 21-Second heat dissipation surface; 22-Protrusion; 23-Fit groove;

[0024] 3-Package;

[0025] 4-Base island; 41-Working surface; 42-First heat dissipation surface; 43-Overflow groove; 44-Connecting rib; 45-Groove;

[0026] 5 - First pin;

[0027] 6 - Second pin. Detailed Implementation

[0028] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0029] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. The drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0030] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the present invention. However, it will be apparent to those skilled in the art that embodiments of the present invention may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the present invention.

[0031] Please see Figures 1 to 3This utility model provides a dual-base island packaging unit with double-sided heat dissipation, including a frame body, a chip 1, a heat sink 2, and a package 3, wherein the package 3 is used to cover the frame body, the chip 1, and the heat sink 2. The frame body has base islands 4 and first pins 5 arranged at intervals. At least two base islands 4 are provided, and the specific number of base islands 4 is adaptively set according to actual needs. In this embodiment, the number of base islands 4 is two.

[0032] Each base island 4 is equipped with a first pin 5, and each base island 4 has a working surface 41 and a first heat dissipation surface 42 arranged opposite to each other. The chip 1 is soldered onto the working surface 41 of each base island 4. When at least two base islands 4 are provided, at least two chips 1 are packaged in one packaging unit, which helps to reduce the package size, thereby reducing the board area occupied by the packaging unit, and also helps with thermal management. Furthermore, the first heat dissipation surface 42 of the base island 4 is exposed to the package body 3 to facilitate heat dissipation.

[0033] Heat sink 2 is located on the side of chip 1 facing away from base island 4, and chip 1 and first pin 5 are electrically connected through heat sink 2. Heat sink 2 also has a second heat dissipation surface 21 on the side facing away from chip 1, which is also exposed outside the package for heat dissipation. By providing a first heat dissipation surface 42 and a second heat dissipation surface 21 on opposite sides of chip 1, a double-sided heat dissipation package unit is formed, allowing the heat generated by chip 1 during operation to be transferred away more quickly, which is beneficial for improving heat dissipation efficiency and resistance to current surges.

[0034] For example, the first heat dissipation surface 42 and the second heat dissipation surface 21 are flush with the outer surface of the package body 3 to eliminate the height difference between the heat dissipation surface and the outer surface of the package body 3, which helps to reduce the complexity of subsequent assembly.

[0035] In one example, a protrusion 22 is provided on the side of the heat sink 2 facing away from the chip 1. This protrusion 22 forms a step with the heat sink 2, which helps to improve the stability of the connection between the heat sink 2 and the package 3. The second heat dissipation surface 21 is provided on the side of the protrusion 22 facing away from the chip 1. The heat generated by the chip 1 is transferred to the heat sink 2 by thermal conduction, and then to the protrusion 22 via the heat sink 2, and finally transferred out via the second heat dissipation surface 21 on the protrusion 22.

[0036] In some embodiments, a locking groove 23 is provided on the side of the heat sink 2 facing the chip 1. The locking groove 23 is located at the junction of the heat sink 2 and the chip 1 to confine the lead-tin-silver alloy solder between the heat sink 2 and the chip 1 within the locking groove 23. This helps to ensure the effective contact area between the heat sink 2 and the chip 1, and also prevents the thermal conductive adhesive from overflowing.

[0037] In one example, an overflow groove 43 is provided on the working surface 41 of the base island 4. In order to prevent the soldering material of the soldering chip 1 from overflowing and affecting the pins and other components around the chip 1, the chip 1 has an overflow groove 43 on one opposite side.

[0038] In some embodiments, a connecting rib 44 is provided on the sidewall of the base island 4. The connecting rib 44 is located on the side of the two base islands 4 facing away from each other and on the side of the base island 4 facing away from the first pin 5. The two base islands 4 form a base island group, which is connected to or cut off from the adjacent base island group through the connecting rib 44.

[0039] The sidewalls of the base island 4 are also provided with grooves 45. Except for the two opposite sidewalls of the two base islands 4, all other sidewalls are provided with grooves 45. During the encapsulation process, the grooves 45 can improve the stability of the connection between the base island 4 and the package body 3.

[0040] In some embodiments, the frame body also has a second pin 6 spaced apart from the base island 4. Each base island 4 is configured with a second pin 6. The second pin 6 and the chip 1 are connected by wire bonding to realize the electrical connection between the chip 1 and the second pin 6.

[0041] In one example, a base island 4 is configured with a first pin 5 and a second pin 6, and the first pin 5 and the second pin 6 are located on the same side of the base island 4.

[0042] For example, the drain of chip 1 is connected to the working surface 41 of base island 4 by solder, the source of chip 1 is electrically connected to the first pin 5 through heat sink 2, and the gate of chip 1 is bonded to the second pin 6 through lead wire.

[0043] In some embodiments, the soldering surfaces of the first pin 5 and the second pin 6 are flush with the outer surface of the package body 3, so that the package unit can be soldered to other structural components through the soldering surfaces of the first pin 5 and the second pin 6.

[0044] An embodiment of this utility model also provides a packaging structure, including a lead frame and the aforementioned double-sided heat-dissipating dual-base island packaging unit, wherein the double-sided heat-dissipating dual-base island packaging unit is disposed on the lead frame. The lead frame has a plurality of frame units, and each frame unit contains a plurality of double-sided heat-dissipating dual-base island packaging units.

[0045] For example, the shape of the dual-base island package unit with double-sided heat dissipation can be DFN8*8, DFN5*6, or DFN3*3.

[0046] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A dual-base island packaged unit with double-sided heat dissipation, characterized in that, include: The frame body has base islands and first pins arranged at intervals. There are at least two base islands, each of which is equipped with the first pin, and each of which has a working surface and a first heat dissipation surface arranged opposite to each other. Chips are disposed on the working surface of each of the base islands; A heat sink is located on the side of the chip away from the base island. The chip and the first pin are electrically connected through the heat sink. The side of the heat sink away from the chip has a second heat dissipation surface. A package is used to cover the frame body, the chip and the heat sink, and both the first heat dissipation surface and the second heat dissipation surface are exposed outside the package.

2. The dual-base island packaging unit with double-sided heat dissipation according to claim 1, characterized in that: The heat sink has a protrusion on the side away from the chip, and the protrusion forms a step with the heat sink. The second heat dissipation surface is located on the side of the protrusion away from the chip.

3. The dual-base island packaging unit with double-sided heat dissipation according to claim 2, characterized in that: The heat sink has a locking groove on the side facing the chip, and the locking groove is located at the junction of the heat sink and the chip.

4. The dual-base island packaging unit with double-sided heat dissipation according to claim 2, characterized in that: The first heat dissipation surface and the second heat dissipation surface are flush with the outer surface of the package.

5. The dual-base island packaging unit with double-sided heat dissipation according to claim 1, characterized in that: An overflow groove is provided on the working surface, and the chip has an overflow groove on one opposite side.

6. The dual-base island packaging unit with double-sided heat dissipation according to claim 1, characterized in that: The sidewalls of the base island are provided with connecting ribs and grooves.

7. The dual-base island packaged unit with double-sided heat dissipation according to any one of claims 1-6, characterized in that: The frame body also has a second pin spaced apart from the base island, and each base island is equipped with the second pin. The second pin and the chip are connected by wire bonding.

8. The dual-base island packaged unit with double-sided heat dissipation according to claim 7, characterized in that: One of the base islands is configured with a first pin and a second pin, the first pin and the second pin being located on the same side of the base island.

9. The dual-base island packaging unit with double-sided heat dissipation according to claim 8, characterized in that: The solder surfaces of the first and second pins are flush with the outer surface of the package.

10. A packaging structure, characterized in that, include: The lead frame is composed of several frame units; The dual-base island packaging unit with double-sided heat dissipation as described in any one of claims 1-9 is disposed on the lead frame, and each of the frame units is provided with a plurality of the dual-base island packaging units with double-sided heat dissipation.

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