Spotting device

Abstract

The utility model discloses a kind of tin-pointing devices, tin-pointing device includes: lifting mechanism, including auxiliary plate, lifting plate and lifting driver, lifting plate is located at the bottom side of auxiliary plate, and is used for feeding card, auxiliary plate is opened with the through hole opposite to lifting plate, lifting driver is connected with lifting plate, and is used to drive lifting plate to drive card to be close to through hole;Tin-pointing mechanism, including movement module and pneumatic tin-pointing module, movement module is connected with pneumatic tin-pointing module, and is used to drive pneumatic tin-pointing module to extend into through hole, to carry out tin-pointing to card. Through lifting driver drive lifting plate to drive card to be close to through hole, so that pneumatic tin-pointing module in tin-pointing mechanism is driven under movement module, to carry out tin-pointing to the chip area of card with shorter distance, so that tin-pointing precision is higher, ensure the effect of tin-pointing, simultaneously, since pneumatic tin-pointing module is used, reduce equipment cost.

Description

Technical Field

[0001] This utility model relates to the field of smart card processing technology, and in particular to a soldering device. Background Technology

[0002] Smart cards are cards with embedded chips that can interact with readers to exchange data. They are widely used in hotel management, the financial industry, access control systems, and other fields. During the manufacturing process of smart cards, the chip area needs to be soldered. This soldering is performed with the assistance of an auxiliary board. Specifically, the auxiliary board has through-holes. The card feeds from the bottom side of the auxiliary board, with the chip area facing the through-holes. The soldering mechanism can then apply solder to the chip area through the through-holes, preventing solder from adhering outside the chip area.

[0003] Currently, there are two main types of soldering mechanisms on the market: piezoelectric and pneumatic. While piezoelectric soldering mechanisms offer higher precision, they are also more expensive, while pneumatic soldering mechanisms are cheaper but have relatively lower precision. In related technologies, to ensure effective soldering, the more precise piezoelectric soldering mechanism is typically used, leading to excessively high equipment costs. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a soldering device that, while ensuring the soldering effect, can reduce equipment costs.

[0005] This utility model provides a soldering device, which includes: a lifting mechanism, comprising an auxiliary plate, a lifting plate, and a lifting driver, wherein the lifting plate is located on the bottom side of the auxiliary plate and is used for feeding cards; the auxiliary plate has a through hole opposite to the lifting plate; the lifting driver is connected to the lifting plate and is used to drive the lifting plate to move the card closer to the through hole; and a soldering mechanism, comprising a motion module and a pneumatic soldering module, wherein the motion module is connected to the pneumatic soldering module and is used to drive the pneumatic soldering module to extend into the through hole to solder the card.

[0006] The soldering device provided by this embodiment of the invention has at least the following beneficial effects: By setting up a lifting plate and a lifting driver, the lifting plate is located on the bottom side of the auxiliary plate and is used for feeding cards. The lifting driver can drive the lifting plate to bring the card closer to the through hole, so that the pneumatic soldering module in the soldering mechanism can solder the chip area of ​​the card in a shorter distance under the drive of the motion module, which makes the soldering accuracy higher and ensures the soldering effect. At the same time, the use of a pneumatic soldering module reduces the equipment cost.

[0007] In one embodiment of this implementation, the auxiliary plate is provided with a positioning structure. When the lifting driver drives the lifting plate to bring the card closer to the through hole, the positioning structure abuts against the four sides of the card to correct the relative position of the card and the through hole.

[0008] In one embodiment of this implementation, the positioning structure includes a movable component, which includes a slider and an elastic element. The slider is slidably engaged with the auxiliary plate and connected to the auxiliary plate through the elastic element. The elastic element is used to make the slider elastically abut against the card.

[0009] In one embodiment of this implementation, the movable component includes a roller disposed on the slider and used to abut against the card.

[0010] In one embodiment of this implementation, the number of active components is two, and the two active components are used to abut against two adjacent sides of the card. The positioning structure includes two fixing blocks, and the two fixing blocks abut against the other two sides of the card.

[0011] In one embodiment of this implementation, the lifting mechanism includes a mounting plate, the auxiliary plate and the lifting driver are both fixed on the mounting plate, and the lifting plate is located between the auxiliary plate and the mounting plate.

[0012] In one embodiment of this implementation, the mounting plate is connected to the auxiliary plate via a guide post, and the lifting plate is provided with a guide sleeve that slides in cooperation with the guide post.

[0013] In one embodiment of this implementation, the motion module includes a horizontal driver and a vertical driver. The horizontal driver is used to drive the pneumatic soldering module to move to the top side of the through hole, and the vertical driver is used to drive the pneumatic soldering module to extend into the through hole.

[0014] In one embodiment of this implementation, the horizontal driver includes a first driver and a second driver, which are capable of driving the pneumatic soldering module to move along two vertical horizontal directions.

[0015] In one embodiment of this implementation, the pneumatic soldering module includes a container, a pneumatic valve, and a solder cylinder. The container is used to hold solder, the solder cylinder is disposed on the vertical actuator, the pneumatic valve is disposed on the horizontal actuator, and the container is connected to the solder cylinder through the pneumatic valve.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the soldering device according to one embodiment of the present invention; Figure 2 yes Figure 1 A schematic diagram of the soldering mechanism in a soldering device; Figure 3 yes Figure 1 A schematic diagram of the lifting mechanism in the soldering device; Figure 4 yes Figure 3 A schematic diagram of the auxiliary plate in the lifting mechanism; Figure 5 yes Figure 3 A schematic diagram of the lifting mechanism behind the hidden auxiliary plate.

[0018] Figure label: Soldering device 100; Lifting mechanism 10; auxiliary plate 11; through hole 1101; movable component 111; slider 1111; elastic element 1112; roller 1113; fixed block 112; lifting plate 12; guide block 121; clearance space 12101; guide sleeve 122; light sensor 123; lifting driver 13; mounting plate 14; guide column 141; Soldering mechanism 20; motion module 21; horizontal driver 211; first driver 2111; second driver 2112; vertical driver 212; pneumatic soldering module 22; container 221; pneumatic valve 222; solder cylinder 223. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0020] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0022] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0023] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0024] In conventional soldering equipment, a certain space is needed for loading the card, resulting in a gap between the card and the auxiliary board after loading. Due to interference and other issues, the soldering mechanism has difficulty passing through the through-holes on the auxiliary board, leading to a larger distance between the mechanism and the chip area of ​​the card during soldering. This excessive distance reduces soldering accuracy and thus diminishes the soldering effect. Therefore, to ensure better soldering results, a more precise piezoelectric soldering mechanism is typically used, which results in higher equipment costs.

[0025] Please see Figure 1 and Figure 3 , Figure 1 This is a schematic diagram of the soldering device 100 according to one embodiment of the present invention; Figure 3 yes Figure 1A schematic diagram of the lifting mechanism 10 in the soldering device 100. This utility model provides a soldering device 100, which includes a lifting mechanism 10 and a soldering mechanism 20. The lifting mechanism 10 includes an auxiliary plate 11, a lifting plate 12, and a lifting driver 13. The lifting plate 12 is located on the bottom side of the auxiliary plate 11 and is used for feeding cards. The auxiliary plate 11 has a through hole 1101 opposite to the lifting plate 12. The lifting driver 13 is connected to the lifting plate 12 and is used to drive the lifting plate 12 to move the card closer to the through hole 1101. The soldering mechanism 20 includes a motion module 21 and a pneumatic soldering module 22. The motion module 21 is connected to the pneumatic soldering module 22 and is used to drive the pneumatic soldering module 22 to extend into the through hole 1101 to perform soldering on the card.

[0026] Specifically, the through hole 1101 is constructed as a tapered hole. On the one hand, this facilitates the alignment of the pneumatic soldering module 22 with the area to be soldered on the card. On the other hand, the pneumatic soldering module 22 is less likely to interfere with the inner wall of the through hole 1101.

[0027] Specifically, the cards can be fed onto the lifting plate 12 via a conveyor belt or other conveyor mechanism.

[0028] By setting up a lifting plate 12 and a lifting driver 13, the lifting plate 12 is located on the bottom side of the auxiliary plate 11 and is used for feeding cards. The lifting driver 13 can drive the lifting plate 12 to move the card closer to the through hole 1101, so that the pneumatic soldering module 22 in the soldering mechanism 20 can perform soldering on the chip area of ​​the card at a shorter distance under the drive of the motion module 21, which makes the soldering accuracy higher and ensures the soldering effect. At the same time, the equipment cost is reduced due to the use of the pneumatic soldering module 22.

[0029] In one embodiment of this implementation, please refer to Figures 1 to 3 , Figure 2 yes Figure 1 A schematic diagram of the soldering mechanism 20 in the soldering device 100. To automate the soldering process of the pneumatic soldering module 22, the motion module 21 includes a horizontal driver 211 and a vertical driver 212. The horizontal driver 211 drives the pneumatic soldering module 22 to move to the top side of the through hole 1101, and the vertical driver 212 drives the pneumatic soldering module 22 to extend into the through hole 1101. With this configuration, the pneumatic soldering module 22, driven by the motion module 21, can align with the chip area of ​​the card and control the soldering distance to be small, thereby improving soldering accuracy and achieving automation.

[0030] In one embodiment of this implementation, please refer to Figure 1 and Figure 2With this configuration, the horizontal driver 211 can realize the dual-axis movement of the pneumatic soldering module 22 in order to meet the soldering requirements of the card. The horizontal driver 211 includes a first driving member 2111 and a second driving member 2112. The first driving member 2111 and the second driving member 2112 can drive the pneumatic soldering module 22 to move along two vertical horizontal directions.

[0031] In this embodiment, the first driving member 2111 is mounted on the support platform and connected to the second driving member 2112. The vertical driver 212 is mounted on the second driving member 2112, and the pneumatic soldering mechanism 20 is mounted on the vertical driver 212. The first driving member 2111 can drive the second driving member 2112 to move the vertical driver 212 and the pneumatic soldering mechanism 20 along one of the horizontal directions. The second driving member 2112 can drive the vertical driver 212 to move the pneumatic soldering mechanism 20 along another horizontal direction perpendicular to it. The vertical driver 212 can drive the pneumatic soldering mechanism 20 to move vertically.

[0032] In one embodiment of this implementation, please refer to Figure 1 and Figure 2 The pneumatic soldering module 22 includes a container 221, a pneumatic valve 222, and a solder cylinder 223. The container 221 holds solder, the solder cylinder 223 is mounted on a vertical actuator 212, and the pneumatic valve 222 is mounted on a horizontal actuator 211. The container 221 is connected to the solder cylinder 223 via the pneumatic valve 222. Specifically, the solder held in the container 221 can be solder paste, liquid solder, etc. The pneumatic valve 222 provides power for the flow of solder, allowing the solder in the container 221 to be ejected from the solder cylinder 223, thereby achieving the soldering action. It is understood that placing the pneumatic valve 222 on the horizontal actuator 211 can reduce the load on the vertical actuator 212, thus improving the soldering accuracy.

[0033] Specifically, the pneumatic valve 222 is mounted on the second drive component 2112. The container 221 is independently mounted from the motion module 21.

[0034] Specifically, there are two pneumatic soldering modules 22 and two lifting mechanisms 10. The two pneumatic soldering modules 22 respectively solder the cards on the corresponding lifting mechanisms 10, thereby improving the efficiency of soldering.

[0035] Specifically, both pneumatic soldering modules 22 are mounted on the vertical driver 212, and the two lifting mechanisms 10 are arranged side by side so that the two cards can be soldered simultaneously.

[0036] In one embodiment of this implementation, please refer to Figure 3 and Figure 4 , Figure 4 yes Figure 3A schematic diagram of the auxiliary plate 11 in the lifting mechanism 10 is shown. It is understood that during the lifting process, the relative position of the card and the auxiliary plate 11 may change, causing the chip area of ​​the card and the through hole 1101 to lose their expected correspondence. This results in a shift in the soldering position of the pneumatic soldering mechanism 20, reducing the soldering effect. To ensure accurate relative positioning between the card and the auxiliary plate 11, thereby improving soldering precision, the auxiliary plate 11 is equipped with a positioning structure. When the lifting driver 13 drives the lifting plate 12 to bring the card closer to the through hole 1101, the positioning structure abuts against the four sides of the card to correct the relative position between the card and the through hole 1101.

[0037] In one embodiment of this implementation, please refer to Figure 3 and Figure 4 The positioning structure includes a movable component 111, which includes a slider 1111 and an elastic element 1112. The slider 1111 is slidably engaged with the auxiliary plate 11 and connected to the auxiliary plate 11 via the elastic element 1112. The elastic element 1112 is used to elastically abut the slider 1111 against the card. This configuration allows the relative position of the card and the through hole 1101 to be corrected by the relative sliding of the slider 1111, reducing the risk of the card being crushed.

[0038] In this embodiment, the slider 1111 achieves sliding engagement with the auxiliary plate 11 through the cooperation of the guide rail and the guide block. The elastic element 1112 exerts an elastic force on the slider 1111 towards the card. The slider 1111 has a ramp for abutting against the card, so that the card can be guided to move through the ramp.

[0039] In one embodiment of this implementation, please refer to Figure 3 and Figure 4 The active component 111 includes a roller 1113, which is disposed on the slider 1111 and used to abut against the card. With this configuration, since the friction between the roller 1113 and the card is rolling friction, the friction is relatively small, which can reduce the risk of the card being crushed. At the same time, the circumferential surface of the roller 1113 can better guide the movement of the card.

[0040] In one embodiment of this implementation, please refer to Figure 3 and Figure 4 The system comprises two movable components 111, which abut against two adjacent sides of the card. The positioning structure includes two fixed blocks 112, which abut against the other two sides of the card. With this configuration, the card's position in the width direction and its position in the length direction can be movably corrected by the corresponding fixed blocks 112 in conjunction with the movable components 111, thereby ensuring accurate relative positioning of the card.

[0041] For details, please refer to Figure 5 , Figure 5 yes Figure 3 The lifting mechanism 10 is shown in the structural diagram behind the hidden auxiliary plate 11. The lifting plate 12 is provided with two guide blocks 121, which are used to guide the card (the card is between the two guide blocks 121). The guide blocks 121 have a clearance space 12101 for the positioning structure to extend into.

[0042] For details, please refer to Figure 5 The lifting plate 12 is equipped with an optical fiber sensor that can detect whether a card has been received.

[0043] In one embodiment of this implementation, please refer to Figure 3 and Figure 5 In order to realize the installation of the lifting driver 13 and the auxiliary plate 11, the lifting mechanism 10 includes a mounting plate 14. The auxiliary plate 11 and the lifting driver 13 are both fixed on the mounting plate 14, and the lifting plate 12 is located between the auxiliary plate 11 and the mounting plate 14.

[0044] In one embodiment of this implementation, please refer to Figure 3 and Figure 5 The mounting plate 14 is connected to the auxiliary plate 11 via guide posts 141, and the lifting plate 12 is provided with a guide sleeve 122 that slides with the guide posts 141. This arrangement ensures the accurate relative position of the auxiliary plate 11 and the lifting plate 12, which helps to improve the precision of soldering.

[0045] Specifically, there are four guide posts 141 and four guide sleeves 122, and they are matched one-to-one.

[0046] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A soldering device, characterized in that, include: The lifting mechanism includes an auxiliary plate, a lifting plate, and a lifting driver. The lifting plate is located on the bottom side of the auxiliary plate and is used for feeding cards. The auxiliary plate has a through hole opposite to the lifting plate. The lifting driver is connected to the lifting plate and is used to drive the lifting plate to move the card closer to the through hole. The soldering mechanism includes a motion module and a pneumatic soldering module. The motion module is connected to the pneumatic soldering module and is used to drive the pneumatic soldering module to extend into the through hole to solder the card.

2. The soldering device according to claim 1, characterized in that, The auxiliary plate is provided with a positioning structure. When the lifting driver drives the lifting plate to move the card closer to the through hole, the positioning structure abuts against the four sides of the card to correct the relative position of the card and the through hole.

3. The soldering device according to claim 2, characterized in that, The positioning structure includes a movable component, which includes a slider and an elastic element. The slider slides in cooperation with the auxiliary plate and is connected to the auxiliary plate through the elastic element. The elastic element is used to make the slider elastically abut against the card.

4. The soldering device according to claim 3, characterized in that, The movable component includes a roller disposed on the slider and used to abut against the card.

5. The soldering device according to claim 3, characterized in that, The number of active components is two, and the two active components are used to abut against the two adjacent sides of the card. The positioning structure includes two fixing blocks, and the two fixing blocks abut against the other two sides of the card.

6. The soldering device according to claim 1, characterized in that, The lifting mechanism includes a mounting plate, and the auxiliary plate and the lifting driver are both fixed on the mounting plate. The lifting plate is located between the auxiliary plate and the mounting plate.

7. The soldering device according to claim 6, characterized in that, The mounting plate is connected to the auxiliary plate via guide posts, and the lifting plate is provided with guide sleeves that slide in cooperation with the guide posts.

8. The soldering device according to claim 1, characterized in that, The motion module includes a horizontal driver and a vertical driver. The horizontal driver is used to drive the pneumatic soldering module to move to the top side of the through hole, and the vertical driver is used to drive the pneumatic soldering module to extend into the through hole.

9. The soldering device according to claim 8, characterized in that, The horizontal actuator includes a first driving element and a second driving element, which are capable of driving the pneumatic soldering module to move along two vertical horizontal directions.

10. The soldering device according to claim 8, characterized in that, The pneumatic soldering module includes a container, a pneumatic valve, and a solder cylinder. The container is used to hold solder, the solder cylinder is mounted on the vertical actuator, and the pneumatic valve is mounted on the horizontal actuator. The container is connected to the solder cylinder through the pneumatic valve.

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