Spot welder for integrated circuit chip packaging

Abstract

The utility model provides a spot welder for integrated circuit chip package belongs to integrated circuit production technical field. The electric welding machine includes welding cabin, carrier fixed establishment, smoke removal mechanism and air pump, and the welding cabin is the open structure of front side, and carrier fixed establishment and smoke removal mechanism are connected with air pump through three -way head, and carrier fixed establishment provides suction force by air pump, carries out negative pressure adsorption positioning to the package carrier, and smoke removal mechanism provides suction force by air pump to remove welding fume, and carrier fixed establishment includes fixed adsorption column and movable adsorption column, and fixed adsorption column is fixedly arranged on the inner bottom wall of welding cabin, and movable adsorption column is configured to be adjustable relative to the position of fixed adsorption column. The utility model provides a spot welder for integrated circuit chip package which can perform negative pressure adsorption fixation on different size package carriers and can remove welding fume at the same time.

Description

Technical Field

[0001] This utility model belongs to the field of integrated circuit manufacturing technology, specifically a spot welding machine for integrated circuit chip packaging. Background Technology Spot welding, a critical process in integrated circuit chip packaging manufacturing, primarily employs resistance welding. The resistance heat generated by current flowing through the base material melts the metal locally, forming solder joints to connect thin metal parts or fix electronic components. This process directly affects the reliability of the electrical connection and mechanical stability between the chip and the packaging carrier (such as lead frames and substrates), making it a core element in ensuring chip packaging quality. Because integrated circuit packaging carriers come in a variety of sizes, the fixing devices of existing spot welding machines are difficult to be compatible with different sizes, often resulting in positioning deviations or unstable clamping, which reduces the yield of chip packaging. Furthermore, the harmful fumes generated during the welding process not only endanger the health of operators but may also adhere to the surface of the chip or solder joint, affecting electrical performance and long-term reliability. Utility Model Content

[0002] In view of the above situation and to overcome the defects of the prior art, this utility model provides a spot welding machine for integrated circuit chip packaging, so as to at least partially solve the problems mentioned in the background art.

[0003] This utility model provides the following technical solution: A spot welding machine for integrated circuit chip packaging, comprising a welding chamber, a carrier fixing mechanism, a fume removal mechanism, and an air pump. The welding chamber has a front-opening structure. The carrier fixing mechanism and the fume removal mechanism are connected to the air pump via a three-way connector. The carrier fixing mechanism uses the air pump to provide suction force for negative pressure adsorption and positioning of the packaging carrier. The fume removal mechanism uses the air pump to provide suction force to remove welding fumes. The carrier fixing mechanism includes a fixed adsorption column and a movable adsorption column. The fixed adsorption column is fixedly disposed on the inner bottom wall of the welding chamber, and the movable adsorption column is configured to be adjustable in position relative to the fixed adsorption column.

[0004] Furthermore, a position adjustment cavity is provided in the bottom wall of the welding chamber, and a moving groove is provided on the bottom wall of the welding chamber, which communicates with the position adjustment cavity; a moving motor is provided on the side wall of the welding chamber, and a bidirectional screw is provided in the position adjustment cavity. The bidirectional screw is connected to the output end of the moving motor, and two sets of nut seats are threaded to both ends of the bidirectional screw. The nut seats are engaged and slidably disposed in the moving groove, and the movable adsorption column is disposed on the nut seats.

[0005] Furthermore, the movable adsorption columns are provided in four sets at the four corners of the fixed adsorption columns, and the bidirectional screws are provided in two sets in the position adjustment cavity in an up-down position. Each set of bidirectional screws is connected to two sets of movable adsorption columns by threads. The movable adsorption columns and the fixed adsorption columns are connected by spring hoses, and the fixed adsorption columns are connected to the T-joint on the air pump by negative pressure adsorption tubes.

[0006] Furthermore, the fume removal mechanism includes a suction head, an air pipe, and a filter. The air pipe is located on the side wall of the welding chamber. The suction head is connected to the air pipe, and the air pipe is connected to the filter. The filter is connected to the T-joint of the air pump through an exhaust gas extraction pipe.

[0007] Furthermore, the suction head is tilted downwards.

[0008] Furthermore, a placement rack is provided on the side wall of the welding chamber for temporarily placing the welding torch. The placement rack includes a placement plate and a protective cover. Both the placement plate and the protective cover are fixedly installed on the side wall of the welding chamber. A placement groove is provided on the placement plate, and a protective cavity is provided on the protective cover. Heat dissipation holes are provided on the side wall of the protective cavity.

[0009] Furthermore, the top wall of the welding chamber is equipped with an optical magnifying instrument, which can meet the welding requirements of small chips and packaging carriers.

[0010] The beneficial effects of this utility model by adopting the above structure are as follows: (1) By combining a fixed adsorption column with a movable adsorption column that can be adjusted in position, stable negative pressure adsorption and fixation of packaging carriers of different sizes can be achieved, which improves the applicability of the spot welding machine. (2) By connecting the air pump with the carrier fixing mechanism and the smoke removal mechanism, the negative pressure adsorption and fixing of the encapsulated carrier and the removal of welding smoke are realized at the same time, and the air pump can be used for multiple purposes. Attached Figure Description

[0011] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model. Figure 1 ; Figure 2 This is a schematic diagram of the overall structure of an embodiment of the present utility model. Figure 2 ; Figure 3 This is a three-dimensional cross-sectional view of an embodiment of the present utility model from a top view. Figure 4This is a three-dimensional cross-sectional view of an embodiment of the present invention.

[0012] The components are as follows: 1. Welding chamber; 2. Air pump; 3. T-joint; 4. Fixed adsorption column; 5. Movable adsorption column; 6. Position adjustment chamber; 7. Moving slot; 8. Moving motor; 9. Bidirectional screw; 10. Nut seat; 11. Spring hose; 12. Suction head; 13. Air pipe; 14. Filter; 15. Placement plate; 16. Protective cover; 17. Placement slot; 18. Protective chamber; 19. Heat dissipation hole; 20. Optical magnification instrument; 21. Negative pressure adsorption tube; 22. Exhaust gas extraction tube. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0014] It should be noted that the terms “front,” “back,” “left,” “right,” “up,” and “down” used in the following description refer to the directions shown in the attached diagram, while the terms “inside” and “outside” refer to the directions toward or away from the geometric center of a specific component, respectively.

[0015] See Figure 1 and Figure 2 This embodiment provides a spot welding machine for integrated circuit chip packaging, including a welding chamber 1, a carrier fixing mechanism, a fume removal mechanism, and an air pump 2. The welding chamber 1 has a front opening structure. The carrier fixing mechanism and the fume removal mechanism are connected to the air pump 2 through a three-way connector 3. The carrier fixing mechanism is provided with suction force by the air pump 2 to perform negative pressure adsorption and positioning on the packaging carrier. The fume removal mechanism is provided with suction force by the air pump 2 to remove welding fumes. The carrier fixing mechanism includes a fixed adsorption column 4 and a movable adsorption column 5. The fixed adsorption column 4 is fixed on the inner bottom wall of the welding chamber 1. The movable adsorption column 5 is configured to be adjustable in position relative to the fixed adsorption column 4. The movable adsorption column 5 and the fixed adsorption column 4 work together to complete the negative pressure adsorption positioning of the packaging carrier. Furthermore, by adjusting the position of the movable adsorption column 5, the negative pressure adsorption positioning requirements of packaging carriers of different sizes can be met.

[0016] It is understandable that both the fixed adsorption column 4 and the movable adsorption column 5 are hollow structures with negative pressure holes on their top walls.

[0017] Specifically, see Figure 3 and Figure 4In this embodiment, a position adjustment cavity 6 is provided in the bottom wall of the welding chamber 1, and a moving groove 7 is provided on the bottom wall of the welding chamber 1, which is connected to the position adjustment cavity 6. A moving motor 8 is provided on the side wall of the welding chamber 1, and a bidirectional screw 9 is provided in the position adjustment cavity 6. The bidirectional screw 9 is connected to the output end of the moving motor 8. Two sets of nut seats 10 are threaded to both ends of the bidirectional screw 9. The nut seats 10 are engaged and slidably disposed in the moving groove 7. The movable adsorption column 5 is disposed on the nut seats 10. The position adjustment of the movable adsorption column 5 is realized by rotating the bidirectional screw 9 to drive the nut seats 10 to move.

[0018] It is understandable that when the bidirectional screw 9 drives the nut seat 10 to move, the moving groove 7 guides the movement of the nut seat 10, ensuring that the nut seat 10 can move stably along the moving groove 7.

[0019] Specifically, see Figures 1-3 In this embodiment, four sets of movable adsorption columns 5 are provided at the four corners of the fixed adsorption column 4. Two sets of bidirectional screws 9 are provided in the position adjustment cavity 6 in an up-down position. Two sets of movable adsorption columns 5 are connected to each set of bidirectional screws 9 by threads. The movable adsorption columns 5 and the fixed adsorption columns 4 are connected by spring hoses 11. The fixed adsorption column 4 is connected to the three-way head 3 on the air pump 2 through the negative pressure adsorption tube 21.

[0020] It is understandable that when the bidirectional screw 9 drives the movable adsorption column 5 to achieve position adjustment, the spring hose 11 and the movable adsorption column 5 undergo adaptive deformation.

[0021] Specifically, see Figure 1 , Figure 3 and Figure 4 In this embodiment, the smoke removal mechanism includes a suction head 12, an air pipe 13, and a filter 14. The air pipe 13 is located on the side wall of the welding chamber 1. The suction head 12 is connected to the air pipe 13, and the air pipe 13 is connected to the filter 14. The filter 14 is connected to the three-way connector 3 of the air pump 2 through the exhaust gas extraction pipe 22.

[0022] Specifically, see Figure 1 In this embodiment, the suction head 12 is tilted downwards. This structural design of the suction head 12 can better improve the smoke extraction effect.

[0023] Specifically, see Figure 2 In this embodiment, a placement rack is provided on the side wall of the welding chamber 1. The placement rack is used to temporarily place the welding torch. The placement rack includes a placement plate 15 and a protective cover 16. The placement plate 15 and the protective cover 16 are both fixedly installed on the side wall of the welding chamber 1. A placement groove 17 is provided on the placement plate 15, and a protective cavity 18 is provided on the protective cover 16. A heat dissipation hole 19 is provided on the side wall of the protective cavity 18.

[0024] When in use, place the welding torch that is not in use in the placement slot 17 and place the torch tip in the protective cavity 18 for convenient temporary storage of the welding torch.

[0025] Specifically, see Figure 1 In this embodiment, an optical magnifying instrument 20 is provided on the top wall of the welding chamber 1. The optical amplifier can meet the welding requirements of small chips and packaging carriers. It is understood that the optical amplifier can be a magnifying glass, microscope, etc. Optical amplifiers are existing technology, so they will not be described in detail.

[0026] It is understood that in this embodiment, a constant pressure valve is provided on the negative pressure adsorption pipe 21 and a flow regulating valve is provided on the exhaust gas extraction pipe 22. The constant pressure valve can ensure the stability of the negative pressure adsorption effect of the encapsulated carrier. The flow regulating valve can adjust the flow rate of smoke extraction according to the specific welding situation. The constant pressure valve and the flow regulating valve are existing technologies and are therefore not shown in the figure.

[0027] The working principle of this utility model is as follows: Start the moving motor 8, which drives the bidirectional screw 9 to rotate. Under the drive of the bidirectional screw 9 and the guiding sliding action of the moving groove 7, the nut seat 10 can be driven to move in position. The nut seat 10 drives the movable adsorption column 5 to move, and adjusts the position between the movable adsorption column 5 and the fixed adsorption column 4 to meet the negative pressure adsorption and fixation requirements of different sized packaging carriers. The encapsulated carrier is placed on the fixed adsorption column 4 and the movable adsorption column 5. The vacuum pump 2 is started. The vacuum pump 2 draws negative pressure from the fixed adsorption column 4 through the negative pressure adsorption tube 21, and draws negative pressure from the movable adsorption column 5 under the action of the spring hose 11. The movable adsorption column 5 and the fixed adsorption column 4 work together to perform negative pressure adsorption on the encapsulated carrier.

[0028] Meanwhile, the exhaust pump 2 removes welding exhaust gas from the welding chamber 1 through the exhaust pipe 22, the air pipe 13, and the suction head 12. During or after welding, the welding torch can be placed on the placement rack, the welding body can be placed in the placement slot 17, and the welding torch head can be placed in the protective cavity 18. The heat dissipation holes 19 can meet the heat dissipation requirements of the welding torch head.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, material, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, material, or apparatus.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A spot welder for integrated circuit chip packaging, characterized by comprising: The assembly includes a welding chamber (1), a carrier fixing mechanism, a fume removal mechanism, and an air pump (2). The welding chamber (1) has a front-opening structure. The carrier fixing mechanism and the fume removal mechanism are connected to the air pump (2) via a three-way connector (3). The carrier fixing mechanism is provided with suction force by the air pump (2) to perform negative pressure adsorption and positioning on the packaged carrier. The fume removal mechanism is provided with suction force by the air pump (2) to remove welding fumes. The carrier fixing mechanism includes a fixed adsorption column (4) and a movable adsorption column (5). The fixed adsorption column (4) is fixed on the inner bottom wall of the welding chamber (1), and the movable adsorption column (5) is configured to be adjustable in position relative to the fixed adsorption column (4).

2. The spot welder for integrated circuit chip packages according to claim 1, wherein The welding chamber (1) is provided with a position adjustment cavity (6) in the bottom wall and a moving groove (7) on the bottom wall of the welding chamber (1). The moving groove (7) is connected to the position adjustment cavity (6). The welding chamber (1) is provided with a moving motor (8) on the side wall. The position adjustment cavity (6) is provided with a bidirectional screw (9). The bidirectional screw (9) is connected to the output end of the moving motor (8). The two ends of the bidirectional screw (9) are connected to two sets of nut seats (10) by threads. The nut seats (10) are engaged and slidably disposed in the moving groove (7). The movable adsorption column (5) is disposed on the nut seat (10).

3. The spot welder for integrated circuit chip packages according to claim 2, wherein The movable adsorption column (5) is provided in four sets at the four corners of the fixed adsorption column (4). The bidirectional screw (9) is provided in two sets in the position adjustment cavity (6) in an up-down position. Each set of the bidirectional screw (9) is connected to two sets of movable adsorption columns (5) by threads. The movable adsorption column (5) and the fixed adsorption column (4) are connected by a spring hose (11). The fixed adsorption column (4) is connected to the three-way head (3) on the air pump (2) through a negative pressure adsorption tube (21).

4. The spot welder for integrated circuit chip packages according to claim 1, wherein The smoke removal mechanism includes a suction head (12), an air pipe (13) and a filter (14). The air pipe (13) is located on the side wall of the welding chamber (1). The suction head (12) is connected to the air pipe (13). The air pipe (13) is connected to the filter (14). The filter (14) is connected to the tee (3) of the air pump (2) through the exhaust gas extraction pipe (22).

5. The spot welder for integrated circuit chip packages as defined in claim 1, wherein The welding chamber (1) is provided with a placement rack on its side wall. The placement rack is used to temporarily place the welding torch. The placement rack includes a placement plate (15) and a protective cover (16). The placement plate (15) and the protective cover (16) are both fixed on the side wall of the welding chamber (1). The placement plate (15) is provided with a placement groove (17). The protective cover (16) is provided with a protective cavity (18). The protective cavity (18) is provided with heat dissipation holes (19) on its side wall.

6. The spot welder for integrated circuit chip packages according to claim 5, wherein An optical magnifying instrument (20) is provided on the top wall of the welding chamber (1).

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