A mainboard temperature detection system

Abstract

This utility model relates to the field of motherboard temperature detection technology and discloses a motherboard temperature detection system, including a PCB board. A temperature sensor chip, a surface-mount capacitor, and a header are fixedly connected sequentially from left to right on the upper surface of the PCB board. The temperature sensor chip, surface-mount capacitor, and header are all electrically connected to the PCB board via traces. A header pin is fixedly connected to the top of the header pin. A reinforcing component and a positioning component are provided on the outer wall of the header pin. The reinforcing component includes a rectangular guide cone, which is fixedly connected to the outer wall of the header pin. Drainage grooves are formed around the rectangular guide cone. In this utility model, the design of the reinforcing component allows for a "mechanical engagement" between the solder and the rectangular guide cone, ensuring the solder is firmly attached to the outer wall of the rectangular guide cone. This improves the stability of the connection between the header pin and the motherboard socket, ensuring signal transmission stability and enhancing the PCB board's fixation effect.

Description

Technical Field

[0001] This utility model relates to the field of motherboard temperature detection technology, and in particular to a motherboard temperature detection system. Background Technology

[0002] The motherboard's temperature monitoring system uses a temperature sensor chip as its core component. This chip needs to be integrated onto a dedicated PCB board to form a functionally independent temperature monitoring module. Based on this, capacitors for filtering and voltage regulation, and headers for signal and power transmission, are added. Through the circuit connections and coordinated operation of these three components, a complete motherboard temperature monitoring chain can be constructed.

[0003] In temperature detection systems, headers are often referred to as pins. During actual assembly, headers need to be inserted into the pre-set sockets on the motherboard and then soldered to the motherboard sockets. The headers serve both to physically fix the temperature detection PCB board on the motherboard and to transmit the temperature signal output by the sensor chip and the operating power supplied by the motherboard. They are the key components connecting the two.

[0004] Currently, the pin headers of most temperature sensing systems on the market are cylindrical or rectangular in shape, and their surfaces are generally treated with a smooth metal plating. While this design reduces insertion resistance, the smooth surface makes it difficult for molten solder to adhere effectively, resulting in insufficient solder joint fullness. Even after soldering, long-term use can easily lead to solder joint cracking and detachment due to factors such as vibration and temperature changes. Both difficulty in soldering and desoldering cause poor contact between the pin header and the motherboard socket, which not only reduces the stability of the PCB board of the temperature sensing system on the motherboard, but also causes interruption of temperature signal transmission or noise interference, directly affecting the accuracy and reliability of motherboard temperature sensing. Therefore, a motherboard temperature sensing system is proposed to solve the above problems. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a motherboard temperature detection system, which aims to solve the problem mentioned in the prior art that "the PCB board pin surface of the temperature detection system is smooth, making it difficult to apply solder".

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a motherboard temperature detection system, including a PCB board, wherein a temperature sensor chip, a surface mount capacitor and a socket are fixedly connected from left to right on the upper surface of the PCB board, the temperature sensor chip, the surface mount capacitor and the socket are electrically connected to the PCB board through wiring, a pin header is fixedly connected to the top of the socket, and a reinforcement component and a positioning component are provided on the outer wall of the pin header; The reinforcement component includes a rectangular guide cone, which is fixedly connected to the outer wall of the pin header. Drainage grooves are provided around the rectangular guide cone, and positioning posts are fixedly connected inside the drainage grooves.

[0007] As a further description of the above technical solution: The inner wall of the positioning post has an axial through groove, and the cross-section of the through groove has a hexagonal structure.

[0008] As a further description of the above technical solution: The inner wall of the positioning post is radially provided with a through hole, and the through groove is connected to the interior of the drainage groove through the through hole.

[0009] As a further description of the above technical solution: The positioning component includes an arc-shaped protrusion, which is fixedly connected to the outer wall of the pin header. The cross-section of the pin header is a "square" structure. At least three sets of arc-shaped protrusions are provided and are equidistantly distributed around the outer wall of the pin header along its axial direction. The arc-shaped surface guides the pin header to be accurately inserted and aligned.

[0010] As a further description of the above technical solution: The arc-shaped protrusion has a straight surface on the side near the rectangular guide cone, and the angle between the straight surface and the pin array is 85° to 90°.

[0011] As a further description of the above technical solution: The arc-shaped protrusion has an opening along the radial direction of the pin header on the side closest to the pin header, and has a hollow cavity inside. When the pin header is inserted into the motherboard socket, the hollow cavity is squeezed by the inner wall of the socket and generates radial elastic deformation, so that the arc-shaped protrusion tightly fills the socket gap. On the one hand, it enhances the mechanical connection stability between the pin header and the socket, and on the other hand, it increases the conductive contact area between the pin header and the socket.

[0012] As a further description of the above technical solution: The rectangular guide cone tapers from left to right, and its axial cross-section has an isosceles trapezoidal structure. With the guiding effect of the tapered cone surface, the pin insertion process is guided.

[0013] This utility model has the following beneficial effects: 1. In this utility model, the design of the reinforcing component enables the solder to form a "mechanical engagement" with the rectangular guide cone, thereby allowing the solder to be firmly attached to the outer wall of the rectangular guide cone. This improves the stability of the connection between the pin header and the motherboard socket, ensuring not only the stability of signal transmission but also the fixation effect of the PCB board.

[0014] 2. In this utility model, the positioning component is designed to "pre-fix" the pins after they are inserted into the motherboard socket, thereby providing a stable foundation for subsequent soldering operations and improving the soldering quality of the pins. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the overall structure of the pins of this utility model; Figure 3 This is a schematic diagram of the exploded structure of the arc-shaped protrusion of this utility model; Figure 4 This utility model Figure 3 A magnified structural diagram at point A.

[0016] Legend: 1. PCB board; 2. Temperature sensor chip; 3. Surface mount capacitor; 4. Socket header; 5. Pin header; 6. Reinforcing component; 61. Rectangular guide cone; 62. Drainage groove; 63. Positioning post; 64. Through groove; 65. Through hole; 7. Positioning component; 71. Arc-shaped protrusion; 72. Straight surface. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Reference Figure 1 - Figure 3 This utility model provides an embodiment of a motherboard temperature detection system, including a PCB board 1. A temperature sensor chip 2, a surface-mount capacitor 3, and a connector 4 are fixedly connected sequentially from left to right on the upper surface of the PCB board 1. The temperature sensor chip 2, surface-mount capacitor 3, and connector 4 are all electrically connected to the PCB board 1 via traces. The temperature sensor chip 2 is a DS18B20. Utilizing the built-in thermistor of the temperature sensor chip 2, it senses the temperature change of a target area on the motherboard in real time, converting the physical quantity of temperature into an electrical signal. The temperature electrical signal output by the temperature sensor chip 2 is transmitted to the signal processing area via the traces on the PCB board 1. The surface-mount capacitor 3, in conjunction with the traces on the PCB board 1, filters out signal noise. A pin header 5 is fixedly connected to the top of the connector 4. The processed temperature signal is transmitted to the connector 4 interface via the traces on the PCB board 1, and the signal is sent to the motherboard controller via the pin header 5 for real-time detection of the motherboard temperature. The outer wall of the pin header 5 is provided with a reinforcement component 6 and a positioning component 7.

[0019] Reference Figure 2 - Figure 3 The reinforcement component 6 includes a rectangular guide cone 61, which is fixedly connected to the outer wall of the pin header 5. The rectangular guide cone 61 tapers from left to right, and its axial cross-section is an isosceles trapezoidal structure. When the three pin headers 5 are inserted into the corresponding sockets on the motherboard, the tapering cone guides the insertion process of the pin headers 5, allowing the rectangular guide cone 61 to press firmly against the inside of the socket. Drainage grooves 62 are provided around the rectangular guide cone 61. Under the guidance of the drainage grooves 62, the molten solder can be guided into the inside of the motherboard socket, so that the solder covers the space between the pin header 5 and the socket. At the same time, the drainage grooves 62 can make the solder and the rectangular guide cone 61 form a "mechanical engagement", so that the solder can be firmly attached to the outer wall of the rectangular guide cone 61. A positioning post 63 is fixedly connected inside the drainage groove 62. Under the "engagement" between the positioning post 63 and the solder, the fixing effect of the solder on the rectangular guide cone 61 can be further improved.

[0020] Reference Figure 4 The inner wall of the positioning post 63 has an axially formed through groove 64 with a hexagonal cross-section. The inner wall of the positioning post 63 has a radially formed through hole 65. When the solder inside the through groove 64, through hole 65 and the drainage groove 62 cools and solidifies, it will form a continuous "envelope" that completely covers the positioning post 63 from the inside out. The through groove 64 is connected to the inside of the drainage groove 62 through the through hole 65. When the molten solder flows in along the drainage groove 62, it will naturally form two filling paths: one path directly pours into the through groove 64, and the other path penetrates into the inside of the through groove 64 through the through hole 65.

[0021] Reference Figure 2 - Figure 3 The positioning component 7 includes an arc-shaped protrusion 71, which is fixedly connected to the outer wall of the pin header 5. The arc-shaped protrusion 71 is made of copper foil, which can fully fill the motherboard socket by utilizing the excellent deformation capability of copper foil. The cross-section of the pin header 5 is a "square" structure. There are at least three sets of arc-shaped protrusions 71, which are equidistantly distributed on the outer wall of the pin header 5 along the axial direction. The arc-shaped surface guides the pin header 5 to be accurately inserted and aligned. A straight surface 72 is provided on the side of the arc-shaped protrusion 71 near the rectangular guide cone 61. The angle between the straight surface 72 and the pin header 5 is 85° to 90°. The straight surface 72 can suppress the deformation direction of the arc-shaped protrusion 71, so that it can deform radially along the pin header 5.

[0022] Reference Figure 3The arc-shaped protrusion 71 has an opening along the radial direction of the pin 5 on the side near the pin 5, and has a hollow cavity inside. When the pin 5 is inserted into the motherboard socket, the hollow cavity is squeezed by the inner wall of the socket and generates radial elastic deformation, so that the arc-shaped protrusion 71 tightly fills the socket gap. On the one hand, it enhances the mechanical connection stability between the pin 5 and the socket, and on the other hand, it increases the conductive contact area between the pin 5 and the socket. When the pin 5 is inserted into the motherboard socket, the arc-shaped surface of the arc-shaped protrusion 71 will first contact the inner wall of the socket. At this time, the arc-shaped protrusion 71 will be squeezed by the inner wall of the socket, causing the arc-shaped protrusion 71 to deform and compress its internal cavity. At this time, the deformed arc-shaped protrusion 71 can fill the motherboard socket, thereby "pre-fixing" the pin 5 inside the socket. Furthermore, the arc-shaped protrusion 71 made of copper foil can increase the conductive area between the pin 5 and the motherboard socket.

[0023] Working principle: When PCB board 1 needs to be installed, insert the three header pins 5 into the corresponding sockets on the motherboard, so that the rectangular guide cone 61 is pressed against the inside of the socket. Then, solder the rectangular guide cone 61 to the inside of the socket. At the same time, the molten solder will enter the inside of the motherboard socket under the guidance of the guide groove 62, so that the solder can cover the space between the header pins 5 and the socket. The guide groove 62 can also make the solder and the rectangular guide cone 61 form a "mechanical engagement", so that the solder can be firmly attached to the outer wall of the rectangular guide cone 61. This can improve the stability of the connection between the header pins 5 and the motherboard socket, ensuring the stability of signal transmission and improving the fixation effect of PCB board 1.

[0024] When the molten solder flows in along the channel 62, it naturally forms two filling paths: one path directly pours into the channel 64, and the other path penetrates into the channel 64 through the through hole 65. The solder fills the gaps around the positioning post 63 and fits tightly into the contours of the channel 64 and the through hole 65. When the solder in the channel 64, the through hole 65 and the channel 62 cools and solidifies, it forms a continuous "envelope" that completely covers the positioning post 63 from the inside out. The positioning post 63 restricts the deformation and displacement of the solder by its own structure. Under the "interlocking" action of the positioning post 63 and the solder, the fixing effect of the solder on the rectangular guide cone 61 can be further improved, thereby further strengthening the stability of the connection between the pin header 5 and the motherboard socket.

[0025] When the pin header 5 is inserted into the motherboard socket, the arc-shaped surface of the arc-shaped protrusion 71 will first contact the inner wall of the socket. At this time, the arc-shaped protrusion 71 will be squeezed by the inner wall of the socket, causing the arc-shaped protrusion 71 to deform and compress its internal cavity. The deformed arc-shaped protrusion 71 can fill the motherboard socket, thereby "pre-fixing" the pin header 5 inside the socket, providing a stable foundation for the subsequent soldering operation of the pin header 5, which is conducive to improving the soldering quality of the pin header 5.

[0026] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A motherboard temperature detection system, comprising a PCB board (1), characterized in that: The upper surface of the PCB board (1) is fixedly connected from left to right with a temperature sensor chip (2), a surface mount capacitor (3) and a header (4). The temperature sensor chip (2), the surface mount capacitor (3) and the header (4) are all electrically connected to the PCB board (1) through wiring. The top of the header (4) is fixedly connected with a header pin (5). The outer wall of the header pin (5) is provided with a reinforcing component (6) and a positioning component (7). The reinforcement component (6) includes a rectangular guide cone (61), which is fixedly connected to the outer wall of the pin header (5). Drainage grooves (62) are provided around the rectangular guide cone (61), and positioning posts (63) are fixedly connected inside the drainage grooves (62).

2. The motherboard temperature detection system according to claim 1, characterized in that: The inner wall of the positioning post (63) is provided with an axial through groove (64), and the cross-section of the through groove (64) is a "hexagonal" structure.

3. The motherboard temperature detection system according to claim 2, characterized in that: The inner wall of the positioning post (63) is radially provided with a through hole (65), and the through groove (64) is connected to the interior of the drainage groove (62) through the through hole (65).

4. The motherboard temperature detection system according to claim 1, characterized in that: The positioning component (7) includes an arc-shaped protrusion (71), which is fixedly connected to the outer wall of the pin header (5). The cross-section of the pin header (5) is a "square" structure. The arc-shaped protrusion (71) is provided in at least three sets and is distributed equidistantly on its outer wall around the pin header (5) along the axial direction. The arc-shaped surface guides the pin header (5) to be accurately inserted and aligned.

5. The motherboard temperature detection system according to claim 4, characterized in that: The arc-shaped protrusion (71) has a straight surface (72) on the side near the rectangular guide cone (61), and the angle between the straight surface (72) and the pin header (5) is 85° to 90°.

6. The motherboard temperature detection system according to claim 4, characterized in that: The arc-shaped protrusion (71) has an opening on the side near the pin header (5) along the radial direction of the pin header (5), and has a hollow cavity inside. When the pin header (5) is inserted into the motherboard socket, the hollow cavity is squeezed by the inner wall of the socket and generates radial elastic deformation, so that the arc-shaped protrusion (71) tightly fills the socket gap. On the one hand, it enhances the mechanical connection stability between the pin header (5) and the socket, and on the other hand, it increases the conductive contact area between the pin header (5) and the socket.

7. The motherboard temperature detection system according to claim 1, characterized in that: The rectangular guide cone (61) gradually tapers from left to right, and its axial cross-section has an "isosceles trapezoid" structure. With the guidance of the tapered cone surface, it guides the insertion process of the pin header (5).

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