Stator laser welding apparatus

Abstract

The application discloses a kind of stator laser welding equipment, belong to laser welding field, including pedestal and setting on pedestal rotating part, conveying part, taking and placing material unit, laser welding unit, detection unit, further include point tin paste unit, and point tin paste unit includes solid connection Y axial movement part one on pedestal, solid connection X axial movement part two on Y axial movement part one mobile end, solid connection Z axial movement part one on X axial movement part two mobile end, solid connection mounting plate on Z axial movement part one mobile end, solid connection point tin paste assembly and CCD camera one on mounting plate side;Two relatively moving blades are realized to the pinch-off of tin paste sharp portion, which can protect the form integrity and position stability of main tin paste body to some extent, leaving a relatively flat cross section;Laser can smoothly melt main tin paste body subsequently, avoid splashing when laser welding, greatly improve the cleanliness and reliability of product.

Description

Technical Field

[0001] This invention relates to the field of laser welding, and more specifically, to a stator laser welding device. Background Technology

[0002] Laser welding is a high-precision and high-efficiency modern welding method that uses a high-energy-density laser beam as a heat source to locally heat materials until they melt, thereby achieving material joining.

[0003] A laser welding machine is a device that can automate the laser welding process of materials. Existing technology (Chinese invention patent application with announcement number CN119566534A) discloses a device for automated laser welding of enameled wire, which integrates multiple unit modules to achieve automated material handling, soldering, laser welding and inspection of workpieces.

[0004] Although automated laser welding of workpieces is possible, current laser welding machines require solder paste application before laser welding. When solder paste is discharged from the needle and flows onto the workpiece surface, the needle lifts up, carrying away the solder paste and forming a sharp tail, a phenomenon known as solder spikes. This is especially problematic when enameled wire is placed parallel to the workpiece surface, creating a tiny, irregular gap between the wire and the workpiece surface. When solder paste is applied to this area, it is immediately drawn in and fills the gap through capillary action, causing a rapid decrease in the amount of solder paste below the needle. When the needle lifts up, the solder paste is "stretched," forming a solder spike. When solder paste spikes, the sharp tail is easily vaporized first under the instantaneous heating of the laser, causing solder balls to splatter. These micron-sized solder balls may fall onto other pads, causing short circuits. Summary of the Invention

[0005] In view of the problems existing in the prior art, the purpose of this invention is to provide a stator laser welding device.

[0006] To solve the above problems, the present invention adopts the following technical solution:

[0007] The stator laser welding equipment includes a base and a rotating part, a conveying part, a material handling unit, a laser welding unit, and a detection unit disposed on the base. It also includes a solder paste dispensing unit, which includes a Y-axis moving part 1 fixed to the base, an X-axis moving part 2 fixed to the moving end of the Y-axis moving part 1, a Z-axis moving part 1 fixed to the moving end of the X-axis moving part 2, a mounting plate fixed to the moving end of the Z-axis moving part 1, a solder paste dispensing assembly fixed to one side of the mounting plate, and a CCD camera 1.

[0008] The mounting plate is also connected to a leveling assembly on one side, and the leveling assembly includes a bracket fixed to one side of the mounting plate, a lifting part fixed to the bracket, a lifting seat fixed to the telescopic end of the lifting part, a movable groove opened inside the lifting seat, two movable seats sliding in the movable groove, a drive part connected inside the lifting seat to make the two movable seats move relative to each other, two extension ends fixed to the lower ends of the two movable seats respectively, and two blades fixed to the lower ends of the two extension ends respectively.

[0009] Furthermore, the lifting unit includes a guide plate integrally formed on the upper end of the support, a slide plate slidably connected to one side of the guide plate, and a cylinder fixedly connected to the upper end of the support. The telescopic end of the cylinder is fixedly connected to the upper end of the lifting seat, and the lower end of the slide plate is fixedly connected to the upper end of the lifting seat.

[0010] Furthermore, the drive unit includes a lead screw rotatably connected inside the movable slot and screwed inside the two movable seats. A motor is fixedly connected to one side of the lifting seat, and the output shaft of the motor is fixedly connected to one end of the lead screw.

[0011] Furthermore, both the extension end and the blade are made of metal, and a semiconductor cooling unit is fixed to one side of each blade.

[0012] Furthermore, it also includes a desoldering assembly, which includes a bracket two fixed to the upper end of the guide plate, a cylinder two fixed to one side of the bracket two, a movable plate fixed to the telescopic end of the cylinder two, two scrapers fixed to one side of the movable plate, and a guide post one with one end fixed to one side of the movable plate and the other end passing through the bracket two and extending outward.

[0013] Furthermore, the two scrapers contact the upper and lower surfaces of the blade respectively, scraping away the solder paste on the blade's bevel and bottom respectively.

[0014] Furthermore, one side of the bracket has a groove for accommodating the movable plate and two scrapers.

[0015] Furthermore, a sliding groove is provided on one side of the mounting plate, and a slider is slidably connected in the sliding groove; a surface reshaping assembly is connected to one side of the mounting plate, and the surface reshaping assembly includes a laser fixed to one side of the slider, a cylinder three fixed to one side of the mounting plate, and two guide posts two fixed to the upper end of the slider, and the telescopic end of the cylinder three is fixed to the upper end of the slider.

[0016] Furthermore, the power of the laser is 3W-10W, and the energy of the laser beam output by the laser is controlled to be sufficient to vaporize the protrusions of the solder paste but not enough to cause the main body to melt.

[0017] Furthermore, a hollow tube cover is fixed to the lower end of the laser, and an interface communicating with the internal cavity is opened on the outer surface of the hollow tube cover. A negative pressure device is fixed to one side of the mounting plate, and the negative pressure end of the negative pressure device is connected to the interface on the outer surface of the hollow tube cover through a negative pressure pipeline.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] (1) This solution is equipped with a tipping and leveling component. Two relatively moving movable seats drive two blades to move relative to each other. The two relatively moving blades can clamp the tipped part of the solder paste, which can protect the shape integrity and position stability of the main solder paste to a certain extent, leaving a relatively flat cross-section. The laser can then smoothly melt the main solder paste, avoiding spatter during laser welding, which greatly improves the cleanliness and reliability of the product. The laser energy can be applied evenly and stably to the entire main solder paste, and the energy input is controllable and consistent, thus obtaining a highly predictable solder joint.

[0020] (2) This solution is equipped with a desoldering component. The temperature of the blade can be reduced by the semiconductor cooling part on the extension end, thereby reducing the temperature of the solder paste on the blade and keeping the solder paste brittle. The solder paste on the blade can be scraped off more easily by moving the scraper, which can prevent the solder paste from accumulating on the blade and thus maintain the cleanliness of the blade. It can be cleanly and neatly cut off at the root of the tip, effectively protecting the shape and volume of the main solder paste.

[0021] (3) This solution sets up a surface reshaping component, which uses a low-power laser to perform laser vaporization treatment on the original pull-point root area after the pinching treatment. The laser can slightly melt and reshape the contour of the outermost surface of the solder paste, making it smoother and flatter. It can not only improve the appearance, but also ensure that the surface tension of the molten solder can be uniformly applied during reflow soldering, forming a perfect solder joint, avoiding tombstone or displacement due to irregular shape. Under the premise of preserving the original good solder paste to the maximum extent, the removal and repair of pull-point defects are achieved, resulting in solder paste dots with clear contours and clean surfaces. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the solder paste application unit structure of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the tipping and leveling component of the present invention;

[0025] Figure 4 This is a schematic diagram of the lifting seat and movable groove structure of the present invention;

[0026] Figure 5 This is a schematic diagram of the lead screw and movable seat structure of the present invention;

[0027] Figure 6 This is a schematic diagram of the extension end and blade structure of the present invention;

[0028] Figure 7 This is a schematic diagram of the tin removal component structure of the present invention;

[0029] Figure 8 This is a schematic diagram of the groove and slider structure of the present invention;

[0030] Figure 9 This is a schematic diagram of the surface reshaping component structure of the present invention.

[0031] Explanation of the labels in the diagram:

[0032] 1. Base; 2. Rotating part; 3. Conveying part; 4. Material handling unit; 5. Solder paste application unit; 51. Y-axis moving part one; 52. X-axis moving part two; 53. Z-axis moving part one; 54. Mounting plate; 541. Slide groove; 55. Solder paste application assembly; 56. CCD camera one; 6. Laser welding unit; 7. Detection unit; 8. Pulling and leveling assembly; 81. Bracket one; 82. Guide plate; 83. Cylinder one; 84. Slide plate; 85. Lifting seat; 86. Motor 87. Movable slot; 88. Lead screw; 89. Movable seat; 891. Extension end; 892. Blade; 893. Semiconductor cooling unit; 9. Desoldering assembly; 91. Support 2; 92. Groove; 93. Guide post 1; 94. Cylinder 2; 95. Movable plate; 96. Scraper; 10. Surface reshaping assembly; 101. Slider; 102. Cylinder 3; 103. Guide post 2; 104. Laser; 105. Hollow tube cover; 106. Negative pressure pipeline; 107. Negative pressure equipment. Detailed Implementation

[0033] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0034] Please see Figures 1 to 9 The stator laser welding equipment includes a base 1 and a rotating part 2, a conveying part 3, a material handling unit 4, a laser welding unit 6, and a detection unit 7 disposed on the base 1. The rotating part 2, the conveying part 3, the material handling unit 4, the laser welding unit 6, and the detection unit 7 in this application are all the same in function and structure as the stator laser welding equipment disclosed in Chinese invention patent application with publication number CN119566534A, and belong to mature prior art.

[0035] This application also includes two solder paste application units 5 respectively disposed on the left and right sides of the base 1, and each of the two solder paste application units 5 includes a Y-axis moving part 51 fixed to the base 1, an X-axis moving part 52 fixed to the moving end of the Y-axis moving part 51, a Z-axis moving part 53 fixed to the moving end of the X-axis moving part 52, a mounting plate 54 fixed to the moving end of the Z-axis moving part 53, a solder paste application assembly 55 fixed to one side of the mounting plate 54, and a CCD camera 56.

[0036] By adopting the above technical solution, when the rotating part 2 rotates clockwise, it moves the fixture in the workpiece position and the unsoldered workpiece fixed in the fixture to below the solder paste application unit 5. The X-axis moving part 52 then moves the mounting plate 54, the solder paste application assembly 55, and the CCD camera 56 left and right. The Y-axis moving part 51 moves the mounting plate 54, the solder paste application assembly 55, and the CCD camera 56 back and forth, adjusting the XY-axis positions of the solder paste application assembly 55 and the CCD camera 56. First, the CCD camera 56... 6. Move the solder paste assembly 55 above the unsoldered workpiece to position the solder joints. Then, move the solder paste dispensing assembly 55 above the unsoldered workpiece. Finally, the Z-axis moving part 53 moves the solder paste dispensing assembly 55 down to apply solder to the unsoldered workpiece. The solder paste dispensing assembly 55 is a solder dispensing mechanism, an existing component in the soldering field, typically consisting of a solder paste supply section and a solder dispensing section. The solder paste supply section is usually a solder paste storage container, similar to a syringe or solder paste can, where the solder paste is extruded by air pressure or a spiral propulsion method. For example, in some automated solder dispensing equipment, the solder paste storage container is connected to an air pressure device, which precisely controls the air pressure to adjust the amount of solder paste extruded. The solder dispensing section is usually a solder dispensing head, the shape and size of which vary depending on the application. Common shapes include dot-shaped and needle-shaped. In some applications requiring liquid solder, the solder dispensing head also has a heating function, which is a mature existing technology and will not be elaborated here.

[0037] like Figures 2-6 As shown, a leveling assembly 8 is also connected to one side of the mounting plate 54. The leveling assembly 8 includes a bracket 81 fixed to one side of the mounting plate 54, a lifting part fixed to the bracket 81, a lifting seat 85 fixed to the telescopic end of the lifting part, a movable groove 87 opened inside the lifting seat 85, two movable seats 89 slidably connected in the movable groove 87, a drive part connected inside the lifting seat 85 to make the two movable seats 89 move relative to each other, two extension ends 891 fixed to the lower ends of the two movable seats 89 respectively, and two blades 892 fixed to the lower ends of the two extension ends 891 respectively.

[0038] The lifting unit includes a guide plate 82 integrally formed on the upper end of the bracket 81, a slide plate 84 slidably connected to one side of the guide plate 82, and a cylinder 83 fixedly connected to the upper end of the bracket 81. The telescopic end of the cylinder 83 is fixedly connected to the upper end of the lifting seat 85, and the lower end of the slide plate 84 is fixedly connected to the upper end of the lifting seat 85.

[0039] The drive unit includes a lead screw 88 rotatably connected inside the movable slot 87 and screwed inside the two movable seats 89. A motor 86 is fixedly connected to one side of the lifting seat 85, and the output shaft of the motor 86 is fixedly connected to one end of the lead screw 88.

[0040] By adopting the above technical solution, after the solder paste dispensing assembly 55 applies solder to the solder joint, the Z-axis moving part 53 moves the solder paste dispensing assembly 55 a certain distance. When the dispensing needle is lifted, it will carry solder paste, forming a sharp tail. This shape is called a tip. Subsequently, the Y-axis moving part 51 and the X-axis moving part 52 move the tip leveling assembly 8 to move above the solder joint. At this time, the cylinder 83 extends and moves the lifting seat 85 down, so that the two blades 892 can be located on both sides of the solder paste at the solder joint. Then, the drive motor 86 drives the lead screw 88 to rotate. The rotation of the lead screw 88 drives the two movable seats 89 to move towards each other. The movement of the two movable seats 89 towards each other drives the two blades 892 to move towards each other, so that the two blades 892 come into contact with each other. The two blades 892 can clamp the solder paste tip at the solder joint. When the two blades 892 come into contact and fit together, the control cylinder 83 retracts and drives the lifting seat 85 and the blades 892 to rise. The solder paste clamped by the two blades 892 rises together with the two blades 892, completing the clamping process of the solder paste tip. To a certain extent, this can protect the shape integrity and positional stability of the main solder paste, leaving a relatively flat cross-section. The laser can then smoothly melt the main solder paste, avoiding spatter during laser welding, greatly improving the cleanliness and reliability of the product. This allows the laser energy to act evenly and stably on the entire main solder paste, with controllable and consistent energy input, resulting in highly predictable solder joint quality.

[0041] like Figure 5 and Figure 7 As shown, both the extension end 891 and the blade 892 are made of metal, and a semiconductor cooling unit 893 is fixed to one side of each of the two blades 892.

[0042] It also includes a desoldering assembly 9, which includes a bracket 2 91 fixed to the upper end of the guide plate 82, a cylinder 2 94 fixed to one side of the bracket 2 91, a movable plate 95 fixed to the telescopic end of the cylinder 2 94, two scrapers 96 fixed to one side of the movable plate 95, and a guide post 1 93 with one end fixed to one side of the movable plate 95 and the other end passing through the bracket 2 91 and extending outward.

[0043] The two scrapers 96 contact the upper surface and the lower surface of the blade 892 respectively, and scrape off the solder paste on the inclined surface and the bottom of the blade 892 respectively.

[0044] The bracket 91 has a groove 92 on one side for accommodating the movable plate 95 and two scrapers 96.

[0045] By adopting the above technical solution, when the solder paste clamped by the two blades 892 rises together with the two blades 892, the cooling end of the semiconductor cooling unit 893 is connected to the blades 892. When the semiconductor cooling unit 893 is working, it lowers the temperature of the blades 892, thereby accelerating the cooling and forming of the solder paste on the blades 892. By lowering the temperature of the solder paste on the blades 892, the solder paste is kept brittle. After the blades 892 rise to a certain height, the lifting and lowering action stops. Then, the Y-axis moving part 1 51 and the X-axis moving part 2 52 work to drive the tip-lifting and leveling assembly 8 to move, so that the two blades 892 are removed from above the workpiece, preventing the solder paste on the blades 892 from falling onto the workpiece during cleaning. Then, the cylinder 2 94 extends and drives the movable plate 95 to move towards the blades 892. After being removed from the groove 92, when the two scrapers 96 on one side of the movable plate 95 come into contact with the blade 892, the scrapers 96 can apply a force to the solder paste on the blade 892 and scrape it off. It should be noted that the scrapers 96 are two independent designs, one upper and one lower. When the scrapers 96 are cleaning the blade 892, the two blades 892 still remain in contact and in contact with each other. The upper scraper 96 can scrape the solder paste on the upper surface of the two blades 892, and the lower scraper 96 can scrape the solder paste on the lower surface of the two blades 892. The design of the solder removal component 9 and the semiconductor cooling unit 893 can prevent the solder paste from accumulating on the blade 892, thereby maintaining the cleanliness of the blade 892 and cutting it cleanly at the root of the tip, effectively protecting the shape and volume of the main solder paste.

[0046] like Figure 8 and Figure 9 As shown, a sliding groove 541 is provided on one side of the mounting plate 54, and a slider 101 is slidably connected in the sliding groove 541; a surface reshaping assembly 10 is connected to one side of the mounting plate 54, and the surface reshaping assembly 10 includes a laser 104 fixed to one side of the slider 101, a cylinder 102 fixed to one side of the mounting plate 54, and two guide posts 103 fixed to the upper end of the slider 101, and the telescopic end of the cylinder 102 is fixed to the upper end of the slider 101.

[0047] The power of the laser 104 is 3W-10W, and the energy of the laser beam output by the laser 104 is controlled to be sufficient to vaporize the protrusions of the solder paste but not enough to cause the main body to melt.

[0048] By adopting the above technical solution, after the solder paste tipping and leveling component 8 pinches off the solder paste tip, the mounting plate 54 is moved by the Y-axis moving part 51 and the X-axis moving part 52, so that the laser 104 can be positioned above the original tip root area after the pinching treatment. To achieve the function of vaporizing the surface of the original tip root area after the pinching treatment, the laser 104 can be an ultraviolet laser or a green laser. Both ultraviolet lasers and green lasers are existing technologies and will not be described in detail here. Due to their high beam quality and small heat-affected zone, their power range is between 3W and 10W. Within this power range, with appropriate... The scanning speed and spot size allow for precise control of energy input, vaporizing only the protrusions of the solder paste without melting the main body, effectively vaporizing the surface layer of the solder paste without damaging the underlying pads; the laser can slightly melt and reshape the outermost contour of the solder paste, making it smoother and flatter; it not only improves the appearance but also ensures that the surface tension of the molten solder can be uniformly applied during reflow soldering, forming a perfect solder joint, avoiding tombstoning or displacement due to irregular shape, and removing and repairing spike defects while preserving the original good solder paste to the maximum extent, resulting in solder paste dots with clear contours and clean surfaces.

[0049] like Figure 8 and Figure 9 As shown, a hollow tube cover 105 is fixedly connected to the lower end of the laser 104, and an interface communicating with the internal cavity is opened on the outer surface of the hollow tube cover 105. A negative pressure device 107 is fixedly connected to one side of the mounting plate 54, and the negative pressure end of the negative pressure device 107 is connected to the interface on the outer surface of the hollow tube cover 105 through a negative pressure pipeline 106.

[0050] By adopting the above technical solution, when the laser 104 performs laser treatment on the surface of the solder paste after it has been clamped, the cylinder 102 extends and drives the laser 104 to descend, causing the hollow tube cover 105 at the lower end of the laser 104 to cover the upper surface of the workpiece. The negative pressure device 107 creates a negative pressure inside the hollow tube cover 105. When the laser 104 vaporizes the solder paste surface, the resulting nano- / micron-sized particles composed of metal vapor and flux volatiles enter the negative pressure pipeline 106 from the hollow tube cover 105. The gas then enters the negative pressure device 107. The negative pressure device 107 is a mature existing technology, and it must have gas processing function to filter and purify the gas before discharging it into the air. Through the design of the negative pressure device 107 and the hollow tube cover 105, the vaporization products can be forcibly removed the moment they are generated, so that they have no chance to diffuse and settle. This prevents these particles from escaping into the air and then re-condensing and settling in other areas of the PCB board, forming an imperceptible contamination film or tiny sludge.

[0051] The above description is merely a preferred embodiment of the present invention; however, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and its improved concepts, should be covered within the scope of protection of the present invention.

Claims

1. A stator laser welding equipment, comprising a base (1) and a rotating part (2), a conveying part (3), a material handling unit (4), a laser welding unit (6), and a detection unit (7) disposed on the base (1), characterized in that: It also includes a solder paste application unit (5), and the solder paste application unit (5) includes a Y-axis moving part one (51) fixed to the base (1), an X-axis moving part two (52) fixed to the moving end of the Y-axis moving part one (51), a Z-axis moving part one (53) fixed to the moving end of the X-axis moving part two (52), a mounting plate (54) fixed to the moving end of the Z-axis moving part one (53), a solder paste application assembly (55) fixed to one side of the mounting plate (54), and a CCD camera one (56). The mounting plate (54) is also connected to a leveling assembly (8) on one side, and the leveling assembly (8) includes a bracket (81) fixed to one side of the mounting plate (54), a lifting part fixed to the bracket (81), a lifting seat (85) fixed to the telescopic end of the lifting part, a movable groove (87) opened inside the lifting seat (85), two movable seats (89) slidably connected in the movable groove (87), a drive part connected inside the lifting seat (85) to make the two movable seats (89) move relative to each other, two extension ends (891) fixed to the lower ends of the two movable seats (89) respectively, and two blades (892) fixed to the lower ends of the two extension ends (891) respectively.

2. The stator laser welding apparatus of claim 1, wherein: The lifting unit includes a guide plate (82) integrally formed on the upper end of the bracket (81), a slide plate (84) slidably connected to one side of the guide plate (82), and a cylinder (83) fixedly connected to the upper end of the bracket (81). The telescopic end of the cylinder (83) is fixedly connected to the upper end of the lifting seat (85), and the lower end of the slide plate (84) is fixedly connected to the upper end of the lifting seat (85).

3. The stator laser welding apparatus of claim 2, wherein: The drive unit includes a lead screw (88) rotatably connected inside the movable slot (87) and screwed inside the two movable seats (89). A motor (86) is fixedly connected to one side of the lifting seat (85), and the output shaft of the motor (86) is fixedly connected to one end of the lead screw (88).

4. The stator laser welding apparatus of claim 3, wherein: Both the extension end (891) and the blade (892) are made of metal, and a semiconductor cooling unit (893) is fixed to one side of each of the two blades (892).

5. The stator laser welding apparatus of claim 4, wherein: It also includes a desoldering assembly (9), and the desoldering assembly (9) includes a bracket two (91) fixed to the upper end of the guide plate (82), a cylinder two (94) fixed to one side of the bracket two (91), a movable plate (95) fixed to the telescopic end of the cylinder two (94), two scrapers (96) fixed to one side of the movable plate (95), and a guide post one (93) with one end fixed to one side of the movable plate (95) and the other end passing through the bracket two (91) and extending outward.

6. The stator laser welding apparatus of claim 5, wherein: The two scrapers (96) contact the upper surface and the lower surface of the blade (892) respectively, and scrape off the solder paste on the bevel and the bottom of the blade (892) respectively.

7. The stator laser welding apparatus of claim 6, wherein: The second bracket (91) has a groove (92) on one side for accommodating the movable plate (95) and two scrapers (96).

8. The stator laser welding apparatus of claim 7, wherein: A groove (541) is provided on one side of the mounting plate (54), and a slider (101) is slidably connected in the groove (541); a surface reshaping assembly (10) is connected to one side of the mounting plate (54), and the surface reshaping assembly (10) includes a laser (104) fixed to one side of the slider (101), a cylinder three (102) fixed to one side of the mounting plate (54), and two guide posts two (103) fixed to the upper end of the slider (101), and the telescopic end of the cylinder three (102) is fixed to the upper end of the slider (101).

9. The stator laser welding apparatus of claim 8, wherein: The power of the laser (104) is 3W-10W, and the energy of the laser beam output by the laser (104) is controlled to be sufficient to vaporize the protrusions of the solder paste but not enough to cause the main body to melt.

10. The stator laser welding apparatus of claim 9, wherein: The lower end of the laser (104) is fixedly connected to a hollow tube cover (105), and the outer surface of the hollow tube cover (105) is provided with an interface that communicates with the internal cavity. A negative pressure device (107) is fixedly connected to one side of the mounting plate (54), and the negative pressure end of the negative pressure device (107) is connected to the interface on the outer surface of the hollow tube cover (105) through a negative pressure pipeline (106).

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