A tilt adjustment mechanism for a polishing table and a polishing table
Patent Information
- Application Number
- CN202521949116.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-10
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2035-09-10
AI Technical Summary
[0004]本实用新型实施方式的目的在于提供一种用于研磨工作台的倾斜调整机构及研磨工作台,旨在解决现有的研磨工作台倾斜角度调节精度不足的问题
[0016]本实用新型提供的用于研磨工作台的倾斜调整机构,通过设置第一安装座、传动轴、滑块和驱动组件,驱动组件动作时能够推动滑块移动,进而带动传动轴向上移动,以对转台的高度进行调节,提高了转台倾斜角度调节的精度,保证了转台平面处于水平面,避免了晶圆研磨时出现局部厚度过薄的问题,提高了研磨精度,优化了晶圆的加工品质。
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Figure CN224737918U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of grinding workbench technology, and in particular to a tilt adjustment mechanism for a grinding workbench and a grinding workbench. Background Technology
[0002] As advanced packaging technologies continue to evolve towards higher integration and smaller dimensions, back-side thinning processes in semiconductor wafer manufacturing have become a key technology for reducing chip package size and improving system performance. However, the trend towards larger single-wafer diameters exacerbates wafer warpage during the thinning process and significantly increases the technical difficulty of controlling its surface shape accuracy. Meanwhile, the continuous evolution of packaging substrate technologies using hard and brittle materials such as glass and ceramics places even more stringent demands on the ultra-thinning and precision thinning and polishing processes for these materials.
[0003] Diamond grinding wheel technology, widely used in the thinning of hard and brittle materials, generally suffers from insufficient precision in adjusting the platform tilt angle. This defect leads to uneven distribution of grinding forces, a significant decrease in the uniformity of the processed material thickness, an increased risk of localized excessive thinning, and structural fragility due to insufficient material rigidity, making it highly susceptible to microcrack propagation or even overall fracture during processing. These technical bottlenecks severely restrict the high-performance development of advanced packaging substrates and represent a critical problem that urgently needs to be solved. Utility Model Content
[0004] The purpose of this utility model is to provide a tilt adjustment mechanism for a grinding workbench and a grinding workbench, aiming to solve the problem of insufficient tilt angle adjustment accuracy of existing grinding workbenches.
[0005] To solve the above-mentioned technical problems, the present invention provides a tilt adjustment mechanism for a grinding worktable, comprising: a first mounting base for being disposed on one side of the central axis of the turntable of the grinding worktable, the first mounting base having a cavity, and a through hole provided on the side wall of the first mounting base, the through hole communicating with the cavity; a transmission shaft, the first end of the transmission shaft being connected to the turntable, the second end of the transmission shaft passing through the cavity, the end of the second end of the transmission shaft having a first inclined surface; a slider disposed in the cavity, the slider having a second inclined surface that slides in cooperation with the first inclined surface; and a drive assembly passing through the through hole and connected to the slider, the drive assembly being used to drive the slider to slide along a first direction, so that the transmission shaft moves in a direction perpendicular to the first direction, thereby adjusting the tilt height of the turntable.
[0006] Preferably, the device further includes a connector, wherein the slider has a through groove in a direction perpendicular to the first direction, and the connector is sequentially inserted through the first mounting base, the through groove, and the drive shaft; the diameter of the through groove is larger than the diameter of the connector, so that the slider can slide along the first direction.
[0007] Preferably, the driving assembly includes: a connecting ring connected to the slider, the connecting ring having an internal thread; a driving shaft, one end of the slider connected to the driving shaft having a threaded hole, the first end of the driving shaft being threadedly connected to the connecting ring and the slider in sequence; and a motor connected to the second end of the driving shaft, the motor being able to drive the driving shaft to rotate when it rotates, so that the connecting ring drives the slider to slide along the first direction.
[0008] Preferably, the end of the slider that connects to the connecting ring is provided with a groove, and the groove communicates with the interior of the connecting ring.
[0009] Preferably, the drive assembly further includes: a bearing, through which the drive shaft passes; and a bearing cap, sleeved on the outside of the drive shaft, one end of the bearing cap abutting against the bearing and the other end abutting against the side wall of the first mounting base.
[0010] Preferably, the drive assembly further includes a second mounting base, which is sleeved on the bearing and abuts against the bearing cover, and the motor is connected to the second mounting base.
[0011] Preferably, the drive assembly further includes a coupling, the two ends of which are connected to the drive shaft and the motor, respectively.
[0012] Preferably, the tilt adjustment mechanism for the grinding worktable further includes a bushing, which is sleeved outside the drive shaft and passes through the cavity, and the bushing is connected to the first mounting base.
[0013] Preferably, the tilt adjustment mechanism for the grinding worktable further includes a locking cover, wherein the first end of the drive shaft passes through the turntable and is connected to the turntable via the locking cover.
[0014] An embodiment of this utility model also provides a grinding worktable, comprising: a turntable for driving the wafer to rotate; and a tilt adjustment mechanism as described above, wherein the drive shaft of the tilt adjustment mechanism is connected to the turntable.
[0015] Compared with the prior art, the present invention has the following beneficial effects:
[0016] The tilt adjustment mechanism for a grinding worktable provided by this utility model, by setting a first mounting base, a transmission shaft, a slider and a drive assembly, can push the slider to move when the drive assembly is activated, thereby driving the transmission shaft to move upward, so as to adjust the height of the turntable, improve the accuracy of the turntable tilt angle adjustment, ensure that the turntable plane is on a horizontal plane, avoid the problem of local thickness being too thin during wafer grinding, improve grinding accuracy and optimize wafer processing quality. Attached Figure Description
[0017] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.
[0018] Figure 1 This is a schematic diagram of the tilt adjustment mechanism for a grinding worktable provided in an embodiment of the present invention.
[0019] Explanation of reference numerals in the accompanying drawings of this utility model:
[0020] First mounting base 10, cavity 11, protrusion 12, drive shaft 20, first inclined surface 21, bushing 30, slider 40, through groove 41, connector 50, wing nut 60, connecting ring 70, drive shaft 81, bearing 82, bearing cover 83, coupling 84, second mounting base 85, motor 86, locking cover 90, turntable 200, crossbeam 201.
[0021] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.
[0024] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0025] like Figure 1 As shown, in an embodiment of this utility model, the tilt adjustment mechanism for a grinding worktable includes: a first mounting base 10, a drive shaft 20, a slider 40, and a drive assembly. The first mounting base 10 is disposed on one side of the central axis of the turntable 200 of the grinding worktable. The first mounting base 10 has a cavity 11, and its side wall has a through hole communicating with the cavity 11. The first end of the drive shaft 20 is connected to the turntable 200, and the second end of the drive shaft 20 passes through the cavity 11. The end of the second end of the drive shaft 20 has a first inclined surface 21. The slider 40 is disposed within the cavity 11 and has a second inclined surface that slides in cooperation with the first inclined surface 21. The drive assembly passes through the through hole and is connected to the slider 40. The drive assembly drives the slider 40 to slide along a first direction, thereby moving the drive shaft 20 in a direction perpendicular to the first direction to adjust the tilt height of the turntable 200.
[0026] Specifically, in this embodiment, the first mounting base 10 is disposed below the turntable 200 and located on one side of the centerline of the turntable 200, while the other side of the turntable 200 can be disposed on an external component. The first end of the drive shaft 20 is connected to the turntable 200. When the drive assembly drives the slider 40 to slide along the first direction, the slider 40 slides along the first inclined surface 21 to push the drive shaft 20 upward. The drive shaft 20 lifts one side of the turntable 200, thereby adjusting the height of one side of the turntable 200 so that the surface of the turntable 200 is horizontal. Correspondingly, when the height of one side of the turntable 200 is high, the drive assembly can also drive the slider 40 to move in the opposite direction of the first direction. At this time, the drive shaft 20 moves downward, which can lower the height of one side of the turntable 200, thereby ensuring uniform thickness during wafer grinding and avoiding localized excessive thinness.
[0027] In this embodiment, the slider 40 is located in the cavity 11 of the first mounting base 10. The length of the slider 40 is less than the diameter of the cavity 11, so that the slider 40 has a certain sliding displacement. The sliding displacement of the slider 40 is positively correlated with the adjustment amount of the height of the turntable 200.
[0028] Optionally, in an embodiment of this invention, the driving assembly can be a drive shaft and a hydraulic cylinder. One end of the drive shaft passes through a through hole and is connected to the slider 40, while the other end of the drive shaft is connected to the hydraulic rod of the hydraulic cylinder. When the hydraulic rod extends, it drives the drive shaft to move along a first direction, thereby pushing the slider 40 to move along the first direction. When the hydraulic rod retracts, it drives the drive shaft to move in the opposite direction of the first direction, thereby driving the slider 40 to move in the opposite direction of the first direction. In this embodiment, by controlling the flow rate of hydraulic oil, the sliding amount of the slider 40 can be precisely controlled, thereby precisely controlling the adjustment height of the turntable 200 to improve the accuracy of wafer grinding.
[0029] Optionally, in another embodiment of this invention, the drive assembly can also be a structure of a motor, a lead screw, and a nut. When the motor rotates, it drives the lead screw to rotate, which in turn drives the nut to move linearly along the lead screw. The nut is connected to the slider 40, which can drive the slider 40 to move in the first direction or the opposite direction. In this embodiment, precise control of the motor speed can accurately control the amount of movement of the slider 40, thereby precisely controlling the adjustment height of the turntable 200 to control different wafer morphologies.
[0030] In this embodiment, the first direction is the horizontal direction.
[0031] The tilt adjustment mechanism for a grinding worktable provided in this embodiment of the utility model, by setting a first mounting base, a transmission shaft, a slider, and a drive assembly, can push the slider to move when the drive assembly is activated, thereby driving the transmission shaft to move upward, so as to adjust the height of the turntable, improve the accuracy of the turntable tilt angle adjustment, ensure that the turntable plane is on a horizontal plane, avoid the problem of local thickness being too thin during wafer grinding, improve grinding accuracy, and can achieve small angle (5°~25°) self-locking, with better rigidity and more stable and reliable mechanism.
[0032] like Figure 1 As shown in the embodiment of this utility model, the tilt adjustment mechanism for the grinding worktable further includes a connector 50. The first mounting base 10 has a stepped through groove at one end facing away from the turntable 200, which communicates with the cavity 11. A wing nut 60 is provided inside the stepped through groove. The slider 40 is located on the stepped through groove, and the slider 40 has a through groove 41 perpendicular to the first direction. One end of the connector 50 passes through the wing nut 60 and the through groove 41 of the slider 40 in sequence, connecting to the drive shaft 20. The diameter of the through groove 41 of the slider 40 is larger than the diameter of the connector 50, so that the slider 40 has a certain amount of movement under the action of the drive assembly. In this embodiment, the slider 40 stops moving when the wall of the through groove 41 is in contact with the connector 50.
[0033] like Figure 1As shown in the embodiment of this utility model, the driving assembly includes a connecting ring 70, a driving shaft 81, and a motor 86. The connecting ring 70 is connected to the slider 40 and has an internal thread. The end of the slider 40 connected to the driving shaft 81 has a threaded hole. The first end of the driving shaft 81 is sequentially threaded to the connecting ring 70 and the slider 40. The motor 86 is connected to the second end of the driving shaft 81. When the motor 86 rotates, it can drive the driving shaft 81 to rotate, so that the connecting ring 70 drives the slider 40 to move along a first direction.
[0034] Specifically, in this embodiment, the connecting ring 70 is connected to the thicker end of the slider 40. Both the slider 40 and the connecting ring 70 are threadedly connected to the drive shaft 81. When the motor 86 rotates, it drives the drive shaft 81 to rotate, and the connecting ring 70 moves linearly along the drive shaft 81, thereby driving the slider 40 to move linearly, thus pushing the transmission shaft 20 upward. When one side of the turntable 200 is at a higher height, the motor 86 can also reverse, and the connecting ring 70 drives the slider 40 to move in the opposite direction of the first direction, so that the height of the turntable 200 is reduced.
[0035] Optionally, in an embodiment of this utility model, the motor 86 can be a stepper motor.
[0036] like Figure 1 As shown, in this embodiment of the present invention, the drive assembly further includes a bearing 82 and a bearing cap 83. The drive shaft 81 passes through the bearing 82 and is locked by a locking nut. The first end of the bearing cap 83 abuts against the bearing 82, and the second end of the bearing cap 83 abuts against the side wall of the first mounting base 10. In this embodiment, the outer wall of the first mounting base 10 is provided with a protrusion 12, and the bearing cap 83 is located below the protrusion 12. The protrusion 12 serves to position the bearing cap 83 during installation.
[0037] like Figure 1 As shown, the drive assembly also includes a second mounting base 85, which is sleeved on the outside of the bearing 82 and abuts against the bearing cover 83. The second mounting base 85 is used to mount the motor 86.
[0038] Furthermore, the drive assembly also includes a coupling 84, the two ends of which are connected to the drive shaft 81 and the motor shaft of the motor 86, respectively, so as to output the rotation of the motor 86 to the drive shaft 81 through the coupling.
[0039] like Figure 1 As shown in the embodiment of this utility model, the tilt adjustment mechanism for the grinding workbench also includes a bushing 30, which is sleeved outside the drive shaft 20. The first end of the bushing 30 has a flange, which is connected to the first mounting base 10. The second end of the bushing 30 is located in the cavity 11. In the initial state, the second end of the drive shaft 20 extends beyond the second end of the bushing 30.
[0040] like Figure 1 As shown in the embodiment of this utility model, the tilt adjustment mechanism for the grinding workbench also includes a locking cover 90, and the first end of the transmission shaft 20 passes through the turntable 200 and is connected to the turntable 200 through the locking cover 90.
[0041] This utility model embodiment also provides a grinding worktable, including: a turntable 200 and a tilt adjustment mechanism, the turntable 200 is used to drive the wafer to rotate, and the drive shaft 20 of the tilt adjustment mechanism is connected to the turntable 200.
[0042] Specifically, the crossbeam 201 of the turntable 200 has a through hole through which the drive shaft 20 passes. The locking cover 90 is fitted over the drive shaft 20 and connected to the crossbeam 201 to connect the drive shaft 20 to the turntable 200. When the drive shaft 81 rotates, the slider 40 moves along the first direction to push the drive shaft 20 upward, thereby pushing one side of the turntable 200 upward to adjust the tilt height of the turntable 200, so that the surface of the turntable 200 is horizontal, thus ensuring consistent thickness during wafer grinding.
[0043] The grinding table provided in this embodiment of the utility model, by setting a tilt adjustment mechanism, can push the slider to move when the drive component is activated, thereby driving the transmission shaft to move upward, so as to adjust the height of the turntable, improve the accuracy of the turntable tilt angle adjustment, ensure that the turntable plane is on the horizontal plane, avoid the problem of local thickness being too thin during wafer grinding, improve grinding accuracy, and optimize the processing quality of wafers.
[0044] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.
Claims
1. A tilt adjustment mechanism for a grinding worktable, characterized in that, include: A first mounting base is used to be disposed on one side of the central axis of the turntable of the grinding worktable. The first mounting base has a cavity, and a through hole is provided on the side wall of the first mounting base, the through hole communicating with the cavity. A drive shaft, the first end of which is connected to the turntable, and the second end of which passes through the cavity, and the end of the second end of the drive shaft is provided with a first inclined surface; A slider is disposed within the cavity, and the slider is provided with a second inclined surface that slides in cooperation with the first inclined surface; A drive assembly is disposed through the through hole and connected to the slider. The drive assembly is used to drive the slider to slide along a first direction so that the transmission shaft moves in a direction perpendicular to the first direction, thereby adjusting the tilt height of the turntable.
2. The tilt adjustment mechanism for a grinding worktable according to claim 1, characterized in that, It also includes a connector, wherein the slider has a through groove in the direction perpendicular to the first direction, and the connector is sequentially inserted through the first mounting base, the through groove and the drive shaft; The diameter of the through groove is larger than the diameter of the connector, so that the slider can slide along the first direction.
3. The tilt adjustment mechanism for a grinding worktable according to claim 1, characterized in that, The driving component includes: A connecting ring, which is connected to the slider, has an internal thread; The drive shaft has a threaded hole at one end where the slider is connected to the drive shaft, and the first end of the drive shaft is threadedly connected to the connecting ring and the slider in sequence. A motor is connected to the second end of the drive shaft. When the motor rotates, it can drive the drive shaft to rotate, so that the connecting ring drives the slider to slide along the first direction.
4. The tilt adjustment mechanism for a grinding worktable according to claim 3, characterized in that, The end of the slider that connects to the connecting ring is provided with a groove, and the groove communicates with the interior of the connecting ring.
5. The tilt adjustment mechanism for a grinding worktable according to claim 3, characterized in that, The driving component also includes: The bearing, through which the drive shaft passes; A bearing cap is fitted onto the outside of the drive shaft. One end of the bearing cap abuts against the bearing, and the other end abuts against the side wall of the first mounting base.
6. The tilt adjustment mechanism for a grinding worktable according to claim 5, characterized in that, The drive assembly further includes a second mounting base, which is sleeved on the bearing and abuts against the bearing cover, and the motor is connected to the second mounting base.
7. The tilt adjustment mechanism for a grinding worktable according to claim 3, characterized in that, The drive assembly also includes a coupling, the two ends of which are connected to the drive shaft and the motor, respectively.
8. The tilt adjustment mechanism for a grinding worktable according to claim 1, characterized in that, It also includes a bushing, which is sleeved on the outside of the drive shaft and passes through the cavity, and the bushing is connected to the first mounting base.
9. The tilt adjustment mechanism for a grinding worktable according to claim 1, characterized in that, It also includes a locking cover, with the first end of the drive shaft passing through the turntable and connected to the turntable via the locking cover.
10. A grinding worktable, characterized in that, include: A turntable is used to rotate a wafer. The tilt adjustment mechanism according to any one of claims 1-9, wherein the drive shaft of the tilt adjustment mechanism is connected to the turntable.