A semiconductor chip test socket processing positioning device

Abstract

The utility model provides a kind of semiconductor chip test socket processing positioning device, comprising: base, the top of the base is provided with long slot, the side of the base is fixedly connected with motor, the one end of the motor is fixedly connected with bidirectional screw rod, the outer surface of the bidirectional screw rod is penetrated in base and extends to the outside of base, the inside of the long slot is slidably connected with moving block, the inside of the moving block is threadedly connected with the outer surface of bidirectional screw rod, the top of the moving block is fixedly connected with concave test box, the utility model provides a kind of semiconductor chip test socket processing positioning device, by base support device, long slot helps moving block precision sliding, motor drives bidirectional screw rod to adjust concave test box position. First electric push rod, second electric push rod and first rubber plate, second rubber plate positive and negative clamping socket, round groove, round rubber block, threaded rod, fixed block and the structure of screwing head auxiliary fine adjustment positioning.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor test socket manufacturing and processing technology, and in particular to a semiconductor chip test socket processing and positioning device. Background Technology

[0002] A semiconductor chip test socket is a specially designed electronic component used during the semiconductor chip manufacturing process to provide electrical connections and mechanical fixation for the chip, enabling various performance tests. It acts as a bridge between the chip and the testing equipment, ensuring accurate signal transmission during testing and allowing for precise detection of the chip's functionality and performance.

[0003] Currently, semiconductor chip test sockets come in a variety of specifications, and traditional positioning methods are difficult to accurately adapt to sockets of different sizes and shapes, which can easily lead to positioning deviations and affect the quality of subsequent processing.

[0004] Therefore, it is necessary to provide a semiconductor chip test socket processing and positioning device to solve the above-mentioned technical problems. Utility Model Content

[0005] This invention provides a semiconductor chip testing socket processing and positioning device, which solves the problem that traditional positioning methods are difficult to adapt to various sockets.

[0006] To solve the above-mentioned technical problems, the present invention provides a semiconductor chip test socket processing and positioning device, comprising: a base, the top of which has an elongated groove; a motor fixedly connected to one side of the base; a bidirectional lead screw fixedly connected to one end of the motor; the outer surface of the bidirectional lead screw penetrating the base and extending to the outside of the base; a movable block slidably connected inside the elongated groove; the interior of the movable block being threadedly connected to the outer surface of the bidirectional lead screw; a concave test box fixedly connected to the top of the movable block; and a first electric push rod fixedly connected to the front of the concave test box, the outer surface of which penetrates the concave test box and extends to the interior of the concave test box. A first rubber plate is fixedly connected to the other end of the concave test box. A second electric push rod is fixedly connected to the back of the concave test box. The outer surface of the second electric push rod penetrates the concave test box and extends into the interior of the concave test box. A second rubber plate is fixedly connected to the other end of the second electric push rod. A circular groove is opened on one side of the concave test box. A circular rubber block is slidably connected inside the circular groove. A threaded screw rod is fixedly connected to one side of the circular rubber block. The outer surface of the threaded screw rod penetrates the concave test box and extends into the exterior of the concave test box. A fixed block is fixedly connected to the top of the moving block. The interior of the fixed block is threadedly connected to the outer surface of the threaded screw rod. A screwdriver is fixedly connected to the other end of the threaded screw rod.

[0007] Preferably, a circular sleeve is fixedly connected to the bottom of the base, a spring is provided inside the circular sleeve, a circular block is slidably connected inside the circular sleeve, an extension rod is fixedly connected to the bottom of the circular block, the outer surface of the extension rod passes through the circular sleeve and extends to the outside of the circular sleeve, a screw cylinder is threadedly connected inside the circular sleeve, the outer surface of the screw cylinder passes through the circular sleeve and extends to the outside of the circular sleeve, a hexagonal nut is fixedly connected to the bottom of the screw cylinder, the outer surface of the extension rod is slidably connected to the inside of the hexagonal nut, and a rubber pad is fixedly connected to the bottom of the extension rod.

[0008] Preferably, a triangular block is fixedly connected to the front of the base, and a control panel is fixedly connected to the top of the triangular block.

[0009] Preferably, a spare parts repair box is fixedly connected to one side of the base.

[0010] Preferably, a level is fixedly connected to the top of the base.

[0011] Preferably, a handle is fixedly connected to the front of the base.

[0012] Compared with related technologies, the semiconductor chip test socket processing and positioning device provided by this utility model has the following advantages:

[0013] This invention provides a semiconductor chip test socket processing and positioning device. A base support device and a long groove facilitate precise sliding of the moving block. A motor-driven bidirectional lead screw adjusts the position of the concave test box. A first electric push rod, a second electric push rod, and a first rubber plate and a second rubber plate clamp the socket in opposite directions. A structure consisting of a circular groove, a circular rubber block, a threaded screw rod, a fixing block, and a screw head assists in fine-tuning and positioning, improving the accuracy, stability, and flexibility of the processing and positioning. Attached Figure Description

[0014] Figure 1 A schematic diagram of a preferred embodiment of the semiconductor chip test socket processing and positioning device provided by this utility model;

[0015] Figure 2 for Figure 1 The diagram shown is a top view.

[0016] Figure 3 for Figure 1 The front sectional view shown is shown below;

[0017] Figure 4 for Figure 3 The enlarged schematic diagram of part A shown below;

[0018] Figure 5 for Figure 1 The diagram shows a side sectional view.

[0019] The following are the labels in the diagram: 1. Base, 2. Long slot, 3. Motor, 4. Two-way lead screw, 5. Moving block, 6. Concave test box, 7. First electric push rod, 8. First rubber plate, 9. Second electric push rod, 10. Second rubber plate, 11. Circular slot, 12. Circular rubber block, 13. Threaded screw rod, 14. Fixing block, 15. Tightening head, 16. Circular sleeve, 17. Spring, 18. Circular block, 19. Extension rod, 20. Threaded cylinder, 21. Hexagonal nut, 22. Rubber pad, 23. Triangular block, 24. Control panel, 25. Spare parts and repair box, 26. Level, 27. Handle. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in, Figure 1 A schematic diagram of a preferred embodiment of the semiconductor chip test socket processing and positioning device provided by this utility model; Figure 2 for Figure 1 The diagram shown is a top view. Figure 3 for Figure 1 The front sectional view shown is shown below; Figure 4 for Figure 3 The enlarged schematic diagram of part A shown below; Figure 5 for Figure 1The diagram shows a side sectional view. The semiconductor chip test socket processing and positioning device includes: a base 1, with an elongated groove 2 on the top of the base 1; a motor 3 fixedly connected to one side of the base 1; a bidirectional lead screw 4 fixedly connected to one end of the motor 3; the outer surface of the bidirectional lead screw 4 penetrating the base 1 and extending to the outside of the base 1; a moving block 5 slidably connected inside the elongated groove 2; the interior of the moving block 5 threadedly connected to the outer surface of the bidirectional lead screw 4; a concave test box 6 fixedly connected to the top of the moving block 5; a first electric push rod 7 fixedly connected to the front of the concave test box 6; the outer surface of the first electric push rod 7 penetrating the concave test box 6 and extending to the interior of the concave test box 6; and a first rubber plate 8 fixedly connected to the other end of the first electric push rod 7. A second electric push rod 9 is fixedly connected to the back of the concave test box 6. The outer surface of the second electric push rod 9 penetrates the concave test box 6 and extends into the interior of the concave test box 6. A second rubber plate 10 is fixedly connected to the other end of the second electric push rod 9. A circular groove 11 is opened on one side of the concave test box 6. A circular rubber block 12 is slidably connected inside the circular groove 11. A threaded screw rod 13 is fixedly connected to one side of the circular rubber block 12. The outer surface of the threaded screw rod 13 penetrates the concave test box 6 and extends into the exterior of the concave test box 6. A fixing block 14 is fixedly connected to the top of the moving block 5. The interior of the fixing block 14 is threadedly connected to the outer surface of the threaded screw rod 13. A screwdriver 15 is fixedly connected to the other end of the threaded screw rod 13.

[0022] The base 1 provides support, the long groove 2 guides the sliding of the moving block 5, and the motor 3 drives the bidirectional lead screw 4 to move the moving block 5 and the concave test box 6 on top to adjust its position. The first electric push rod 7 on the front and the second electric push rod 9 on the back of the concave test box 6 push the first rubber plate 8 and the second rubber plate 10 made of silicone rubber, respectively, to clamp the socket from both sides to avoid damage and ensure insulation. Rotating the screw head 15 drives the threaded screw rod 13 to disengage the nitrile rubber round block 12 from the round groove 11 and press against the side of the socket, achieving multi-directional precise positioning and ensuring the stability of the socket during processing.

[0023] A circular sleeve 16 is fixedly connected to the bottom of the base 1. A spring 17 is provided inside the circular sleeve 16. A circular block 18 is slidably connected inside the circular sleeve 16. An extension rod 19 is fixedly connected to the bottom of the circular block 18. The outer surface of the extension rod 19 passes through the circular sleeve 16 and extends to the outside of the circular sleeve 16. A threaded cylinder 20 is threaded inside the circular sleeve 16. The outer surface of the threaded cylinder 20 passes through the circular sleeve 16 and extends to the outside of the circular sleeve 16. A hexagonal nut 21 is fixedly connected to the bottom of the threaded cylinder 20. The outer surface of the extension rod 19 is slidably connected to the inside of the hexagonal nut 21. A rubber pad 22 is fixedly connected to the bottom of the extension rod 19.

[0024] The circular sleeve 16 at the bottom of the base 1 plays a crucial role. The spring 17 and circular block 18 inside work together to effectively dampen vibrations. When vibration occurs, the spring 17 is compressed or stretched, absorbing and dispersing the vibration energy through elastic deformation. The circular block 18 slides within the sleeve 16, converting the vibration impact into the elastic potential energy of the spring, thus reducing the impact of vibration on the overall device. The extension rod 19, connected to the circular block 18, passes through the sleeve 16, transmitting force during the damping process and ensuring stability. The rubber pad 22 at the bottom of the extension rod 19 further enhances the damping effect and increases the friction between the device and the placement surface, preventing slippage. The threaded cylinder 20 connected to the inner thread of the sleeve 16 has a hexagonal nut 21 at its bottom. The operator can use a wrench to turn the hexagonal nut 21, moving the threaded cylinder 20 within the sleeve 16 to compress or release the spring 17, changing its elasticity. This allows for flexible adjustment of the damping performance according to different processing scenarios and vibration levels, meeting diverse processing needs.

[0025] A triangular block 23 is fixedly connected to the front of the base 1, and a control panel 24 is fixedly connected to the top of the triangular block 23.

[0026] The control panel 24 on the top is supported by a stable structure through the triangular block 23 on the front of the base 1. The control panel 24 serves as the core of operation, making it convenient for personnel to control components such as the motor 3 and the first electric push rod 7, thereby improving the ease of operation and processing positioning efficiency of the device.

[0027] A spare parts repair box 25 is fixedly connected to one side of the base 1.

[0028] The spare parts and maintenance box 25 on one side of the base 1 is used to store spare parts and maintenance tools for the device, so that it can be repaired in time when the device fails and its normal operation can be guaranteed.

[0029] A level 26 is fixedly connected to the top of the base 1.

[0030] The level of the device can be detected by the level 26 on the top of the base 1, which helps the operator to adjust the device and ensure accurate and reliable processing positioning.

[0031] A handle 27 is fixedly connected to the front of the base 1.

[0032] The handle 27 on the front of the base 1 makes it easy for operators to move and transport the entire device, enhancing the device's mobility and ease of operation.

[0033] The working principle of the semiconductor chip test socket processing and positioning device provided by this utility model is as follows: First, the motor 3 is started, and the motor 3 drives the bidirectional lead screw 4 to rotate. Since the bidirectional lead screw 4 is threadedly connected to the moving block 5, and the moving block 5 slides in the long groove 2, the rotation of the bidirectional lead screw 4 will cause the moving block 5 to move linearly along the long groove 2, thereby adjusting the position of the concave test box 6 so that it reaches the appropriate processing and positioning point. Then, the semiconductor chip test socket to be processed and positioned is placed in the concave test box 6. The first electric push rod 7 and the second electric push rod 9 are started respectively. The first electric push rod 7 pushes the first rubber plate 8, and the second electric push rod 9 pushes the second rubber plate 10, clamping the socket from the front and back to achieve initial fixation. Finally, the operator rotates the screw head 15 to drive the threaded screw rod 13 to rotate. Because the threaded rod 13 is threadedly connected to the fixing block 14, when the threaded rod 13 rotates, the round rubber block 12 disengages from the round groove 11 and squeezes the side of the socket, making the socket more stable. This allows for further positioning and fine-tuning of the socket, ensuring that the socket is accurately positioned in the concave test box 6. This method is suitable for processing and positioning various types and specifications of semiconductor chip test sockets.

[0034] Compared with related technologies, the semiconductor chip test socket processing and positioning device provided by this utility model has the following advantages:

[0035] This utility model provides a semiconductor chip test socket processing and positioning device. A base 1 supports the device, a long groove 2 assists the moving block 5 in precise sliding, and a motor 3 drives a bidirectional lead screw 4 to adjust the position of the concave test box 6. A first electric push rod 7, a second electric push rod 9, a first rubber plate 8, and a second rubber plate 10 clamp the socket in both directions. A structure consisting of a circular groove 11, a circular rubber block 12, a threaded screw rod 13, a fixing block 14, and a screw head 15 assists in fine-tuning and positioning, improving the accuracy, stability, and flexibility of the processing and positioning.

[0036] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A semiconductor chip test socket processing and positioning device, characterized in that, include: A base has an elongated groove at its top. A motor is fixedly connected to one side of the base, and a bidirectional lead screw is fixedly connected to one end of the motor. The outer surface of the bidirectional lead screw penetrates the base and extends to the outside of the base. A movable block is slidably connected inside the elongated groove, and the interior of the movable block is threadedly connected to the outer surface of the bidirectional lead screw. A concave test box is fixedly connected to the top of the movable block. A first electric push rod is fixedly connected to the front of the concave test box, and the outer surface of the first electric push rod penetrates the concave test box and extends to the interior of the concave test box. A first rubber plate is fixedly connected to the other end of the first electric push rod. A second electric push rod is fixedly connected to the back of the test box. The outer surface of the second electric push rod penetrates through the concave test box and extends into the interior of the concave test box. A second rubber plate is fixedly connected to the other end of the second electric push rod. A circular groove is opened on one side of the concave test box. A circular rubber block is slidably connected inside the circular groove. A threaded screw rod is fixedly connected to one side of the circular rubber block. The outer surface of the threaded screw rod penetrates through the concave test box and extends into the exterior of the concave test box. A fixed block is fixedly connected to the top of the moving block. The interior of the fixed block is threadedly connected to the outer surface of the threaded screw rod. A screwdriver is fixedly connected to the other end of the threaded screw rod.

2. The semiconductor chip test socket processing and positioning device according to claim 1, characterized in that, A circular sleeve is fixedly connected to the bottom of the base. A spring is installed inside the circular sleeve. A circular block is slidably connected inside the circular sleeve. An extension rod is fixedly connected to the bottom of the circular block. The outer surface of the extension rod passes through the circular sleeve and extends to the outside of the circular sleeve. A screw cylinder is threadedly connected inside the circular sleeve. The outer surface of the screw cylinder passes through the circular sleeve and extends to the outside of the circular sleeve. A hexagonal nut is fixedly connected to the bottom of the screw cylinder. The outer surface of the extension rod is slidably connected to the inside of the hexagonal nut. A rubber pad is fixedly connected to the bottom of the extension rod.

3. The semiconductor chip test socket processing and positioning device according to claim 1, characterized in that, A triangular block is fixedly connected to the front of the base, and a control panel is fixedly connected to the top of the triangular block.

4. The semiconductor chip test socket processing and positioning device according to claim 1, characterized in that, A spare parts repair box is fixedly connected to one side of the base.

5. The semiconductor chip test socket processing and positioning device according to claim 1, characterized in that, A level is fixedly connected to the top of the base.

6. The semiconductor chip test socket processing and positioning device according to claim 1, characterized in that, A handle is fixedly connected to the front of the base.

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