A fixing unit and a fixing device for chip detection

Abstract

The utility model provides a kind of for chip detection's fixed unit and fixing device, the fixed unit is three-layer structure, including tray, array card slot disc and cover plate sequentially matched from bottom to top;The tray is frame structure, the frame is formed with the limiting area for placing array card slot disc;Array card slot disc is equipped with the card slot position for limiting and fixing chip arranged in array;The cover plate is used to cover on array card slot disc, and its formed with through-hole array structure.The fixed unit and fixing device structure exquisite, light in weight, low in cost, not only can realize the simultaneous fixation to multiple different size chips, also can obviously improve fixing efficiency, reduce pollution and the risk of chip drop.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a fixing unit and fixing device for chip testing. Background Technology

[0002] Various chip performance tests (such as temperature cycling tests, temperature shock tests, and high-temperature storage life tests) are conducted throughout the entire lifecycle of chip design, manufacturing, packaging, and application. Chip testing-related experiments play a crucial role in ensuring the correctness of chip functions, the reliability of applications, and the optimization of performance and power consumption, making them a vital link in the semiconductor industry chain.

[0003] In existing technologies, when conducting large-scale chip testing experiments, chip samples are typically fixed by attaching high-temperature conductive tape to the back of the chip and then fixing it to a stencil or carrier for the required chip testing. However, this fixation method relying on high-temperature conductive tape has the following drawbacks: 1) Risk of contamination: High-temperature volatiles from the tape may contaminate the test chamber; 2) Risk of detachment: The tape may experience adhesive attenuation during testing, leading to sample displacement or loss; 3) Inefficient operation: Using high-temperature tape requires operators to manually attach and fix large batches of chips one by one, with an average manual attachment time of ≥3 minutes per chip sample, which is highly inefficient; 4) Poor consistency: During manual attachment, variations in the force applied can easily damage the chip samples, resulting in a breakage rate >5%; 5) Stencils or carriers cannot accommodate multiple specifications: The storage and management costs of multi-specification fixtures are high.

[0004] Therefore, it is necessary to design a fixing device for chip testing that can be compatible with fixing chips of different specifications, while avoiding the use of high-temperature tape, so as to make chip testing fixing low-risk, high-efficiency and low-cost. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a fixing unit and fixing device for chip detection to solve the problems in the prior art.

[0006] To achieve the above-mentioned and other related objectives, this utility model is implemented by including the following technical solutions.

[0007] This utility model provides a first aspect of a fixing unit for chip testing, the fixing unit having a three-layer structure, including a tray, an array card slot, and a cover plate arranged sequentially from bottom to top;

[0008] The tray has a frame structure, and a limiting area for placing the array card slot is formed within the frame;

[0009] The array card slot disk has card slots arranged in an array for limiting and fixing chips; the cover plate is used to cover the array card slot disk and has a through-hole array structure.

[0010] In one embodiment, the tray frame is provided with a number of positioning holes around its perimeter for precise docking with the testing machine.

[0011] In one embodiment, the array card slot is an anti-static metal array card slot with a surface resistivity of 10. 4 Ω~10 6 Ω.

[0012] In one embodiment, the cover plate is an antistatic metal cover plate with a surface resistance of 10 Ω·cm. 4 Ω~10 6 Ω.

[0013] In one embodiment, the through-hole array structure of the cover plate is a honeycomb through-hole array structure.

[0014] In one embodiment, the fixing device further includes a plurality of locking elements for locking the cover plate, the array slot disc, and the tray.

[0015] In one embodiment, there are multiple array card slots, each array card slot has the same card slot size, and the card slot sizes of any two array card slots are different.

[0016] In one embodiment, the length of the slot is 2-10 mm and the width is 2-10 mm.

[0017] In one embodiment, the arbitrary card slot is provided with a snap-fit ​​structure to achieve snap-fit ​​fixation of the chip.

[0018] In one embodiment, the limiting area is further provided with a support edge extending from the tray frame toward the center to facilitate the placement of the array card slot.

[0019] In one embodiment, the shape and size of the limiting area contour are set to match the contour of any of the array card slots.

[0020] In one embodiment, the upper surface of the support edge is positioned below the upper surface of the pallet frame structure.

[0021] In one embodiment, the contour of the limiting area is further provided with a retrieval notch to facilitate the retrieval of the array card slot.

[0022] In one embodiment, in the region where the honeycomb through-hole array structure is provided, the density of the honeycomb through-holes is ≥80 holes / cm². 2 .

[0023] In one embodiment, the position of the honeycomb through-hole array structure area on the cover plate corresponds vertically to the position of the slot area in the array slot disk.

[0024] In one embodiment, each of the array card slots is provided with at least 3 to 5 first locking holes, which are located at the uniform force points of the array card slots and are used in conjunction with locking components.

[0025] In one embodiment, the tray is provided with a plurality of second locking holes; the cover plate is provided with a plurality of third locking holes, the positions of the second locking holes and the third locking holes are arranged corresponding to the positions of the first locking holes, for use in conjunction with locking components.

[0026] In one embodiment, the locking element includes one or more of screws, bolts, and self-locking nuts.

[0027] This utility model provides a second aspect of a fixing device for chip testing, the fixing device comprising a plurality of interconnected fixing units arranged in an array on the same horizontal plane as described above.

[0028] In one embodiment, the number of fixing units is 2 to 6. More preferably, it is 2 to 4.

[0029] In one embodiment, the fixing device has at least two fixing units with different slot sizes.

[0030] In one embodiment, the fixing device includes three fixing units connected in sequence, and the size of the slots in the three fixing units is different.

[0031] As described above, this utility model provides a fixing unit and fixing device for chip testing. The fixing device simultaneously fixes an array of card slots with different sized slots onto a tray, thereby enabling simultaneous testing of chips of different specifications and sizes, which not only improves testing efficiency but also reduces fixture costs.

[0032] Furthermore, this fixing device abandons the existing technology of fixing chips one by one by sticking them with tape. Instead, it uses a cover plate, array card slots, and trays for mechanical locking and fixing. This not only avoids the pollution caused by tape and ensures the purity of the test environment, but also improves the efficiency of fixing chips during testing and avoids the risk of inconsistency caused by manual operation.

[0033] In addition, the specific honeycomb-shaped through-hole array structure of the cover plate in this fixing device significantly reduces the overall weight of the device compared with a solid cover plate, while ensuring that the temperature and humidity transfer efficiency during the test is greater than 95%. Combined with the anti-static materials used in the device, this fixing device is very suitable for large-scale promotion and use.

[0034] The chip testing fixing device provided by this utility model has a compact structure, light weight, and low cost. It can not only fix chips of various sizes at the same time, but also significantly improve the fixing efficiency and reduce the risk of contamination and chip falling off. Attached Figure Description

[0035] Figure 1 The image shown is a front view of the fixed unit used for chip testing according to this invention.

[0036] Figure 2 The image shown is a top view of the fixed unit used for chip testing according to this invention.

[0037] Figure 3 The diagram shows a tray structure of the fixed unit for chip testing according to this invention.

[0038] Figure 4 This is one of the schematic diagrams of the array card slot structure of the fixed unit used for chip testing according to this utility model.

[0039] Figure 5 The second schematic diagram shows the array card slot structure of the fixed unit used for chip testing according to this utility model.

[0040] Figure 6 The diagram shows a cover plate structure of the fixing unit for chip testing according to this invention.

[0041] Figure 7 The image shown is a top view of the fixing device for chip testing according to this invention.

[0042] Figure 8 The diagram shows the tray structure of the fixing device for chip testing according to this utility model.

[0043] Figures 1 to 8 Explanation of the symbols in the attached icons

[0044] 10 Array Card Slots

[0045] 11 Card slots

[0046] 12 First locking hole

[0047] 20 pallets

[0048] 21 Limiting Zone

[0049] 22 Supporting edge

[0050] 23 Positioning holes

[0051] 24 Second locking hole

[0052] 25 Cross-shaped support frame

[0053] 26. Take the gap

[0054] 30 Cover plate

[0055] 31. Honeycomb-shaped through-hole array structure

[0056] 32 Third locking hole Detailed Implementation

[0057] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0058] Please see Figures 1 to 8 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this invention, should still fall within the scope of the disclosed technical content. Furthermore, the terms "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0059] like Figure 1 and Figure 2 As shown, this application embodiment provides a specific fixing unit for chip testing, which has a three-layer structure, including a tray 20, an array card slot disk 10, and a cover plate 30 arranged sequentially from bottom to top; the tray 20 is a frame structure, and a limiting area 21 for placing the array card slot disk 10 is formed within the frame structure; the array card slot disk 10 is provided with card slots 11 arranged in an array for limiting and fixing chips; the cover plate 30 is used to cover the array card slot disk 10, and it forms a through-hole array structure.

[0060] In actual use, the fixing unit for chip testing provided in this application only requires the operator to fix the chip under test in the slot 11 of the array card slot disk 10, and then place the tray 20, the array card slot disk 10 containing the chip under test, and the cover plate 30 in sequence from bottom to top, and lock the three together to ensure the fixing of the chip under test for subsequent chip testing experiments.

[0061] The technical solution of this application abandons the existing technology of fixing chips one by one by using high-temperature tape, which eliminates any risk of contamination or chip falling off during testing.

[0062] The fixing device for chip testing provided in this application can be used for various types of chip testing, including but not limited to temperature cycling, thermal shock, low temperature storage life, unbiased high-accelerated stress, high temperature storage life, and accelerated moisture resistance-unbiased autoclave, etc.

[0063] like Figure 4 and Figure 5 As shown, in this application, there can be multiple array card slot disks 10, and the card slot positions 11 in each array card slot disk 10 are of the same size, while the card slot positions 11 in any two array card slot disks 10 are of different sizes. An array card slot disk 10 with matching card slot positions 11 can be selected according to the specific size and model of the chip under test.

[0064] It should be noted that each fixed unit contains only one array card slot disk 10.

[0065] Specifically, the length of the card slot 11 is 2–10 mm, and the width is 2–10 mm. For example, the dimensions of the card slot 11 can be 2×2 mm, 3×3 mm, 5×5 mm, or 10×10 mm. As an example, in a... Figure 4 In the specific embodiment shown, the card slot 11 is 2mm long and 2mm wide; in another embodiment, as shown... Figure 5 In the specific embodiment shown, the card slot 11 is 5mm long and 5mm wide. It is used to fix chips under test of different specifications and sizes.

[0066] Specifically, the slot 11 is provided with a snap-fit ​​structure to snap and fix the chip in place. The snap-fit ​​structure can be a guide groove or a limiting edge, thereby ensuring that the chip can be snapped and fixed stably in the slot 11 and will not fall out.

[0067] As an example, in one specific embodiment, the snap-fit ​​structure is a guide groove, which is symmetrically arranged on both sides of the snap-fit ​​slot 11. When the operator fixes the chip under test, the chip is inserted into the snap-fit ​​slot 11 along the inside of the guide groove, so that the chip under test is stably snapped and fixed in the snap-fit ​​slot 11 and does not fall off.

[0068] In a like Figure 3 In the specific embodiment shown, a support edge 22 extending from the tray frame towards the center is also formed in the limiting area 21 to facilitate the placement of the array card slot 10. Specifically, the upper surface of the support edge 22 is set lower than the upper surface of the tray 20 frame structure to better accommodate and limit the array card slot 10.

[0069] Specifically, the shape and size of the limiting area 21 are matched to the contour of the array card slot 10. Preferably, as shown in the figure... Figure 3 As shown, the contour of the limiting area 21 is also provided with a retrieval notch 26 to facilitate the retrieval of the array card slot 10.

[0070] This application does not specify the internal structure of the limiting area 21, as long as its outline matches the outline of the array card slot 10 and a supporting edge 22 is formed to achieve the purpose of placing and supporting the array card slot 10. For example, the interior of the limiting area 21 can be completely hollowed out, or a support frame can be provided, with the support frame connected to the supporting edge 22. In a preferred embodiment, such as... Figure 3 As shown, a cross-shaped support frame 25 is also provided inside the limiting area 21. The cross-shaped support frame 25 is connected to the support edge 22 and can be integrally formed. This further enhances the support force of the tray 20 for the array card slot tray 10.

[0071] In a like Figure 3 In the specific embodiment shown, the tray 20 has several positioning holes 23 around its frame for precise docking with the testing equipment. This facilitates connection to the testing equipment during subsequent chip testing experiments.

[0072] like Figure 6 As shown, in one specific embodiment, the through-hole array structure of the cover plate 30 is a honeycomb through-hole array structure 31. Specifically, in the region where the honeycomb through-hole array structure 31 is provided, the density of the honeycomb through-holes is ≥80 holes / cm². 2 .

[0073] In one specific embodiment, the position of the honeycomb through-hole array structure 31 region on the cover plate 30 corresponds vertically to the position of the slot 11 region in the array slot disk 10. This is more conducive to improving the efficiency of temperature and humidity transfer to the chip in subsequent experiments.

[0074] The design of the cover plate 30 in this application not only further improves the fixation reliability of the chip under test, but also greatly reduces the weight of the cover plate 30 by the honeycomb through-hole array structure 31 on it. At the same time, the closely arranged through-holes are more conducive to the transfer efficiency of temperature and humidity to the chip during testing, thereby improving the testing efficiency of the chip.

[0075] This application does not impose specific limitations on the shape and size of the cover plate 30, as long as the cover plate 30 can completely cover all the array card slots 10 used for testing. As an example, in a preferred embodiment, the shape and size of the cover plate 30 are the same as the shape and size of the array card slots 10; in actual use, the cover plate 30 covers the upper surface of the array card slots 10, and the position of the honeycomb through-hole array structure 31 area corresponds vertically to the position of the card slot 11 area in the array card slots 10.

[0076] In one specific embodiment, the fixing device further includes a plurality of locking elements for locking the cover plate 30, the array card slot 10 and the tray 20.

[0077] More specifically, the array card slot 10 is provided with at least 3 to 5 first locking holes 12, which are located at uniformly stressed points on the array card slot 10 and are used in conjunction with locking components. Figure 4 and 5 As shown, the array card slot disk 10 is provided with 9 first locking holes 12.

[0078] In one specific embodiment, such as Figure 3 and Figure 6 As shown, the tray 20 is provided with a plurality of second locking holes 24; the cover plate 30 is provided with a plurality of third locking holes 32. The positions of the second locking holes 24 and the third locking holes 32 are corresponding to the positions of the first locking holes 12, and are used to cooperate with the locking components.

[0079] More specifically, the locking element includes threaded locking elements. It is detachable and tightens by torque. Examples include mating screws, bolts, self-locking nuts, etc.

[0080] In one specific embodiment, the array card slot 10 is an anti-static metal array card slot 10 with a surface resistivity of 10. 4 Ω~10 6 Ω. For example, it could be 10. 4 Ω, 10 5 Ω, 10 6 Ω. In a way like Figure 4 In the specific embodiment shown, the surface resistivity of the array card slot disk 10 is 10. 6 Ω.

[0081] In one specific embodiment, the cover plate 30 is an antistatic metal cover plate 30 with a surface resistance of 10. 4 Ω~10 6 Ω. For example, it could be 10. 4 Ω, 10 5 Ω, 10 6 Ω, in a way Figure 6 In the specific embodiment shown, the surface resistivity of the cover plate 30 is 10. 6 Ω.

[0082] In this application, the surfaces of the cover plate 30 and the array card slot 10 are anodized to form an anodized coating, thereby achieving an anti-static function. In actual use, the anti-static function of the fixing device can be further enhanced by using a grounded conductive path.

[0083] In practical use, the operator first selects an array card slot 10 with a corresponding slot 11 according to the size of the chip under test. Then, along the snap-fit ​​structure of the slot 11, the chip under test of the corresponding size is embedded into the corresponding array card slot 10. The array card slot 10 with the chip fixed is then placed in the limiting area 21 of the tray 20, and the array card slot 10 is snapped in place by the support edge 22. Finally, a cover plate 30 is placed on the upper surface of the array card slot 10, ensuring that the cover plate 30 completely covers the array card slot 10 and that the second locking hole 24, the first locking hole 12, and the third locking hole 32 are completely aligned. A locking element is then used to pass through the second locking hole 24, the first locking hole 12, and the third locking hole 32 to lock and fix the tray 20, the array card slot 10, and the cover plate 30, thereby securing the chip under test.

[0084] This application also provides a specific fixing device for chip testing, the fixing device comprising multiple interconnected fixing units arranged in an array on the same horizontal plane as described above.

[0085] In one specific embodiment, the number of fixing units is 2 to 6. For example, there can be 2, 3, or 4. Specifically, the fixing device has at least two fixing units with different card slot sizes 11. This enables synchronous detection of chips of different sizes.

[0086] In a way Figure 7 In the specific embodiment shown, the fixing device includes three sequentially connected fixing units, each with a different size slot 11. These slots are used to hold three different specifications and sizes of chips for simultaneous testing. This not only improves testing efficiency but also reduces the management of fixing fixtures.

[0087] This application does not specify the molding method for the tray 20 of multiple fixing units in the fixing device; it can be integrally molded or molded separately and then connected. In a... Figure 8 In the preferred embodiment shown, the tray 20 is integrally molded. In summary, the fixing device provided by this utility model has multiple array slots, capable of fixing chips of various specifications and sizes. This not only solves the storage and management problems of various types of fixing fixtures in the prior art, but also enables simultaneous measurement of chips of various specifications and sizes. The fixing device uses a three-layer structure of tray, array slots, and cover plate combined with mechanical locking to fix the chips. This not only avoids the pollution and risk of falling off associated with using high-temperature tape in the prior art, but also greatly improves chip fixing efficiency, significantly reducing the operation time for fixing chips per cycle. Furthermore, the fixing device is compact and lightweight, making it highly suitable for large-scale application in the semiconductor testing field.

[0088] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A fixing unit for chip detection, characterized in that, The fixing unit has a three-layer structure, including a tray (20), an array card slot (10), and a cover plate (30) that fit together from bottom to top; The tray (20) is a frame structure, and a limiting area (21) for placing the array card slot (10) is formed in the frame; The array card slot disk (10) is provided with card slots (11) arranged in an array for limiting and fixing chips; the cover plate (30) is used to cover the array card slot disk (10) and it forms a through-hole array structure.

2. The stationary unit according to claim 1, characterized in that The frame of the tray (20) is provided with several positioning holes (23) around it for docking with the test machine; And / or, the array card slot disc (10) is an anti-static metal array card slot disc (10), the surface resistance is 10 4 Ω~10 6 Ω; And / or, the cover plate (30) is an antistatic metal cover plate (30) with a surface resistance of 10. 4 Ω~10 6 Ω; And / or, the through-hole array structure of the cover plate (30) is a honeycomb through-hole array structure (31); And / or, the fixing unit further includes a plurality of locking elements for locking the cover plate (30), the array card slot (10) and the tray (20).

3. The fixing unit according to claim 1, characterized in that, There are multiple array card slots (10), and the card slots (11) of each array card slot (10) are the same size, while the card slots (11) of any two array card slots (10) are different in size; And / or, the length of the card slot (11) is 2-10 mm and the width is 2-10 mm; And / or, the arbitrary card slot (11) is provided with a card-connecting structure to achieve card-connecting and fixing of the chip.

4. The fixing unit according to claim 1, characterized in that, The limiting area (21) also has a support edge (22) extending from the tray frame to the center to realize the placement of the array card slot (10); and / or, the shape and size of the contour of the limiting area (21) are matched with the contour of the array card slot (10).

5. The fixing unit according to claim 4, characterized in that, The upper surface of the support edge (22) is set lower than the upper surface of the pallet (20) frame structure; And / or, the contour of the limiting area (21) is also provided with a retrieval notch (26) to facilitate the retrieval of the array card slot (10).

6. The fixture unit of claim 2, wherein In the region where the honeycomb through-hole array structure (31) is provided, the density of the honeycomb through-holes is ≥80 holes / cm². 2 ; And / or, the position of the honeycomb through-hole array structure (31) area on the cover plate (30) is set vertically to correspond to the position of the slot (11) area in the array slot disk (10); And / or, each of the array card slots (10) is provided with at least 3 to 5 first locking holes (12), the locking holes being located at the uniform force points of the array card slots (10) and used in conjunction with locking components; And / or, the locking element includes one or more of screws, bolts, and self-locking nuts.

7. The fixing unit according to claim 6, characterized in that, The tray (20) is provided with a plurality of second locking holes (24); the cover plate (30) is provided with a plurality of third locking holes (32), the positions of the second locking holes (24) and the third locking holes (32) are provided in correspondence with the position of the first locking hole (12), and are used to cooperate with the locking component.

8. A fixture for chip detection, characterized by The fixing device includes multiple connected fixing units arranged in an array on the same horizontal plane as described in claims 1 to 7.

9. The fixture of claim 8, wherein, The number of fixed units is 2 to 6.

10. The fixing device according to claim 9, characterized in that, The fixing device has at least two fixing units with different sizes of slots (11). And / or, the fixing device includes three fixing units connected in sequence, and the size of the slot (11) in the three fixing units is different.

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