A line-up stand for an IBE ion beam etching apparatus

Abstract

The utility model provides a kind of line arrangement frame of IBE ion beam etching equipment, line arrangement frame includes first layer board, second layer board sequentially arranged from bottom to top;First layer board is equipped with liquid supply component;Second layer board is equipped with gas supply component, realize the complete isolation of liquid path and gas path in space, even if liquid leakage, also can not permeate gas path, significantly reduce cross contamination and security risk;While liquid inlet chamber and liquid outlet chamber are respectively connected to processing chamber equipment by manual ball valve parallel liquid supply and liquid return;With liquid flow detection meter, it can ensure that each chamber obtains stable, uniform process liquid, improve temperature control and etching uniformity;Compressed air component, nitrogen component are gathered by valve island, and the output end of valve island is respectively connected to each pneumatic actuating mechanism, to realize one-stop piping;Only need to operate at valve island when fault or maintenance, without disassembling one by one, can greatly shorten downtime.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and more specifically, to a circuit arrangement rack for an IBE ion beam etching device. Background Technology

[0002] Ion beam etching (IBE) is a high-precision, highly anisotropic dry etching process widely used in the fabrication of micro and nanostructures in semiconductor manufacturing, microelectromechanical systems (MEMS), optical devices, and magnetic storage materials. Traditional pipeline layouts have the following drawbacks:

[0003] (1) High risk of cross-contamination: The gas and liquid circuits are mixed, which can easily lead to leakage, pollution and safety hazards, affecting the etching quality and equipment safety.

[0004] (2) Complex and difficult maintenance: Various pipelines are mixed and the interfaces are not uniform, which makes maintenance operations such as inspection, replacement and upgrade time-consuming and laborious, and the equipment availability is low.

[0005] To address the aforementioned core defects, there is an urgent need for a circuit arrangement rack for IBE ion beam etching equipment that can effectively isolate gas and liquid and simplify maintenance. Utility Model Content

[0006] In view of this, in order to solve the above problems, this utility model proposes a circuit arrangement rack for an IBE ion beam etching equipment that can effectively isolate gas and liquid and simplify maintenance.

[0007] A circuit arrangement rack for an IBE (Ion Beam Etching) apparatus includes a circuit arrangement rack 10, which comprises a first layer plate 20 and a second layer plate 30 arranged sequentially from bottom to top. The first layer plate 20 is provided with a liquid supply assembly 40 for supplying process liquid to the processing chamber equipment 60 and conveying return liquid to an external recovery device. The second layer plate 30 is provided with a gas supply assembly 50 for supplying process gas and control compressed air to the processing chamber equipment 60. The liquid supply assembly 40 includes... The equipment includes an inlet assembly 401, an outlet assembly 404, and a liquid flow meter 405. Both the inlet assembly 401 and the outlet assembly 404 are connected to the liquid flow meter 405. The inlet assembly 401 includes an inlet chamber 402, and the outlet assembly 404 includes an outlet chamber 406. Multiple manual ball valves 403 are installed above the inlet chamber 402 and above the outlet chamber 406. The output of each manual ball valve 403 above the inlet chamber 402 is connected to a specific liquid input in the processing chamber equipment 60. The liquid output end of the processing chamber device 60 is connected to the output end of the manual ball valve 403 of each liquid outlet chamber 406, and the output end of the liquid outlet chamber 406 is connected to an external recovery device. The gas supply assembly 50 includes a process gas supply assembly 501 and a compressed gas supply assembly 502. The process gas supply assembly 501 has multiple channels, and the output end of each process gas supply assembly 501 is connected to each gas input end of the processing chamber device 60. The gas assembly 501 includes a process gas supply pipe 5011, a process gas filter 5012, a process gas flow meter 5013, and a process gas pneumatic diaphragm valve 5014 connected in sequence; the compressed gas supply assembly 502 includes a compressed air assembly 503, a nitrogen assembly 504, and a valve island 505. The output ends of the compressed air assembly 503 and the nitrogen assembly 504 are connected to the input ends of the valve island 505, and the output ends of the valve island 505 are respectively connected to the input ends of each pneumatic control interface of the processing chamber equipment 60.

[0008] In some embodiments, the compressed air assembly 503 includes a compressed air supply pipe 5031, a compressed air manual diaphragm valve 5032, and a compressed air filter pressure reducing valve 5033 connected in sequence. The output end of the compressed air filter pressure reducing valve 5033 is connected to the input end of the valve island 505, and each output of the valve island 505 is connected to the input end of each pneumatic control interface of the processing chamber equipment 60.

[0009] In some embodiments, the nitrogen assembly 504 includes a nitrogen supply pipe 5041, a nitrogen manual diaphragm valve 5042, and a nitrogen filter pressure reducing valve 5043 connected in sequence. The output end of the nitrogen filter pressure reducing valve 5043 is connected to the input end of the valve island 505, and each output of the valve island 505 is connected to the input end of each pneumatic control interface of the processing chamber equipment 60.

[0010] In some embodiments, the liquid flow meter 405 is a digital flow meter with a remote output interface, which facilitates connection to a monitoring system for data acquisition and anomaly detection.

[0011] In some embodiments, the manual ball valve 403 has a quick-opening valve body structure, used to realize independent control and rapid start-up and shutdown of the liquid path of each processing chamber of the processing chamber equipment 60.

[0012] In some embodiments, the process gas supply assembly 501 supplies at least one of argon, helium, and nitrogen.

[0013] In some embodiments, the output pressure of the compressed air assembly 503 is precisely adjusted by a corresponding filter pressure reducing valve to meet the operating pressure requirements of the pneumatic mechanisms of different chambers in the processing chamber equipment 60.

[0014] In some embodiments, the liquid inlet chamber 402 is further provided with a liquid distributor for isobaric diversion of the liquid from the liquid supply assembly 40, thereby improving the uniformity of liquid supply to each chamber of the processing chamber equipment 60.

[0015] In some embodiments, a third layer 70 is provided above the second layer 30. The third layer 70 is a reserved layer and serves as a backup structure.

[0016] The beneficial effects of this utility model are as follows: This utility model proposes a circuit arrangement frame for an IBE ion beam etching equipment. The circuit arrangement frame 10 includes a first layer plate 20 and a second layer plate 30 arranged sequentially from bottom to top. The first layer plate 20 is provided with a liquid supply assembly 40 for supplying process liquid to the processing chamber equipment 60 and transporting the return liquid to an external recovery device. The second layer plate 30 is provided with a gas supply assembly 50 for supplying process gas and control compressed air to the processing chamber equipment 60, achieving complete spatial isolation between the liquid path and the gas path. Even if the liquid leaks, it will not seep into the gas path. This significantly reduces cross-contamination and safety hazards. Simultaneously, the inlet chamber 402 and outlet chamber 406 are connected via manual ball valves 403 to supply and return liquid to multiple processing chamber devices 60 in parallel. Combined with a liquid flow meter 405, this ensures stable and uniform process liquid in each chamber, improving temperature control and etching uniformity. Compressed air assembly 503 and nitrogen assembly 504 are collected via valve island 505, with the valve island output connected to each pneumatic actuator, achieving one-stop piping. In case of fault or maintenance, operation is only required at valve island 505, eliminating the need to disconnect individual wires, thus significantly reducing downtime. Attached Figure Description

[0017] Figure 1 This is an overall structural diagram of the circuit arrangement frame of the IBE ion beam etching equipment of this utility model.

[0018] Figure 2This is a partially enlarged structural view of the circuit arrangement frame of the IBE ion beam etching equipment of this utility model.

[0019] Figure 3 This is a partially enlarged structural view of the circuit arrangement frame of the IBE ion beam etching equipment of this utility model.

[0020] Explanation of main component symbols

[0021] Line organizing rack 10, first shelf 20, second shelf 30, liquid supply assembly 40, liquid inlet assembly 401, liquid inlet chamber 402, manual ball valve 403, liquid outlet assembly 404, liquid flow meter 405, liquid outlet chamber 406, gas supply assembly 50, process gas supply assembly 501, process gas supply pipe 5011, process gas filter 5012, process gas flow meter 5013, process gas pneumatic diaphragm valve 5014, compressed gas supply assembly 502, compressed air assembly 503, compressed air supply pipe 5031, compressed air manual diaphragm valve 5032, compressed air filter pressure reducing valve 5033, nitrogen assembly 504, nitrogen supply pipe 5041, nitrogen manual diaphragm valve 5042, nitrogen filter pressure reducing valve 5043, valve island 505, processing chamber equipment 60, third shelf 70.

[0022] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0023] Example 1:

[0024] like Figure 1 The diagram shown is an overall structural diagram of the circuit arrangement frame of the IBE ion beam etching equipment of this utility model; as shown... Figure 2 The image shown is a partially enlarged structural diagram of the circuit arrangement frame of the IBE ion beam etching equipment of this utility model; as shown... Figure 3 The image shown is a partially enlarged structural diagram of the circuit arrangement frame of the IBE ion beam etching equipment of this utility model.

[0025] A circuit arrangement rack for an IBE (Ion Beam Etching) apparatus includes a first layer plate 20 and a second layer plate 30 arranged sequentially from bottom to top. The first layer plate 20 is equipped with a liquid supply assembly 40 for supplying process liquid to the processing chamber equipment 60 and conveying return liquid to an external recovery device. The second layer plate 30 is equipped with a gas supply assembly 50 for supplying process gas and control compressed air to the processing chamber equipment 60. The liquid supply assembly 40 includes a liquid inlet assembly 401. The liquid inlet assembly 401 and the liquid outlet assembly 404 are both connected to the liquid flow meter 405. The liquid inlet assembly 401 includes an inlet chamber 402, and the liquid outlet assembly 404 includes an outlet chamber 406. Multiple manual ball valves 403 are provided above the inlet chamber 402 and the outlet chamber 406. The output end of each manual ball valve 403 above the inlet chamber 402 is connected to each liquid input end of the processing chamber equipment 60. Each liquid output terminal of the chamber device 60 is connected to the output terminal of the manual ball valve 403 of each liquid outlet chamber 406, and the output terminal of the liquid outlet chamber 406 is connected to an external recovery device; the gas supply assembly 50 includes a process gas supply assembly 501 and a compressed gas supply assembly 502. The process gas supply assembly 501 has multiple channels, and the output terminal of each process gas supply assembly 501 is connected to each gas input terminal of the processing chamber device 60. Component 501 includes a process gas supply pipe 5011, a process gas filter 5012, a process gas flow meter 5013, and a process gas pneumatic diaphragm valve 5014 connected in sequence; the compressed gas supply assembly 502 includes a compressed air assembly 503, a nitrogen assembly 504, and a valve island 505. The output ends of the compressed air assembly 503 and the nitrogen assembly 504 are connected to the input ends of the valve island 505, and the output ends of the valve island 505 are respectively connected to the input ends of each pneumatic control interface of the processing chamber equipment 60.

[0026] The compressed air assembly 503 includes a compressed air supply pipe 5031, a compressed air manual diaphragm valve 5032, and a compressed air filter pressure reducing valve 5033 connected in sequence. The output end of the compressed air filter pressure reducing valve 5033 is connected to the input end of the valve island 505. Each output of the valve island 505 is connected to the input end of each pneumatic control interface of the processing chamber equipment 60.

[0027] The nitrogen assembly 504 includes a nitrogen supply pipe 5041, a nitrogen manual diaphragm valve 5042, and a nitrogen filter pressure reducing valve 5043 connected in sequence. The output end of the nitrogen filter pressure reducing valve 5043 is connected to the input end of the valve island 505. Each output of the valve island 505 is connected to the input end of each pneumatic control interface of the processing chamber equipment 60.

[0028] The liquid flow meter 405 is a digital flow meter with a remote output interface, which facilitates connection to a monitoring system for data acquisition and anomaly detection.

[0029] The manual ball valve 403 has a quick-opening valve body structure and is used to realize independent control and rapid start and stop of the liquid path of each processing chamber of the processing chamber equipment 60.

[0030] The process gas supply component 501 supplies at least one of argon, helium, and nitrogen.

[0031] The output pressure of the compressed air assembly 503 is precisely adjusted by the corresponding filter pressure reducing valve to meet the operating pressure requirements of the pneumatic mechanism of different chambers in the processing chamber equipment 60.

[0032] The liquid inlet chamber 402 is also equipped with a liquid distributor, which is used to perform isobaric diversion of the liquid from the liquid supply component 40 to improve the uniformity of liquid supply to each chamber of the processing chamber equipment 60.

[0033] Above the second layer 30, there is a third layer 70, which is a reserved layer for backup structure.

[0034] The beneficial effects of this utility model are as follows: This utility model proposes a circuit arrangement frame for an IBE ion beam etching equipment. The circuit arrangement frame 10 includes a first layer plate 20 and a second layer plate 30 arranged sequentially from bottom to top. The first layer plate 20 is provided with a liquid supply assembly 40 for supplying process liquid to the processing chamber equipment 60 and transporting the return liquid to an external recovery device. The second layer plate 30 is provided with a gas supply assembly 50 for supplying process gas and control compressed air to the processing chamber equipment 60, achieving complete spatial isolation between the liquid path and the gas path. Even if the liquid leaks, it will not seep into the gas path. This significantly reduces cross-contamination and safety hazards. Simultaneously, the inlet chamber 402 and outlet chamber 406 are connected via manual ball valves 403 to supply and return liquid to multiple processing chamber devices 60 in parallel. Combined with a liquid flow meter 405, this ensures stable and uniform process liquid in each chamber, improving temperature control and etching uniformity. Compressed air assembly 503 and nitrogen assembly 504 are collected via valve island 505, with the valve island output connected to each pneumatic actuator, achieving one-stop piping. In case of fault or maintenance, operation is only required at valve island 505, eliminating the need to disconnect individual wires, thus significantly reducing downtime.

[0035] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A circuit arrangement rack for an IBE ion beam etching apparatus, comprising a circuit arrangement rack (10), characterized in that, The line arrangement rack (10) includes a first layer plate (20) and a second layer plate (30) arranged sequentially from bottom to top; the first layer plate (20) is provided with a liquid supply assembly (40) for supplying process liquid to the processing chamber equipment (60) and transporting the return liquid to an external recycling device; the second layer plate (30) is provided with an air supply assembly (50) for supplying process gas and control compressed air to the processing chamber equipment (60); wherein, the liquid supply assembly (40) includes a liquid inlet assembly (401), a liquid outlet assembly (404), and a liquid flow meter. (405), both the inlet assembly (401) and the outlet assembly (404) are connected to a liquid flow meter (405). The inlet assembly (401) includes an inlet chamber (402), and the outlet assembly (404) includes an outlet chamber (406). Multiple manual ball valves (403) are provided above the inlet chamber (402) and above the outlet chamber (406). The output end of the manual ball valve (403) above each inlet chamber (402) is connected to each liquid input end of the processing chamber equipment (60); the processing chamber equipment (60) Each liquid outlet is connected to the outlet chamber (406) via the output of a manual ball valve (403) of each outlet chamber (406). The outlet chamber (406) is connected to an external recovery device. The gas supply assembly (50) includes a process gas supply assembly (501) and a compressed gas supply assembly (502). The process gas supply assembly (501) has multiple outlets. The output of each process gas supply assembly (501) is connected to the gas input of the processing chamber device (60). Each process gas supply assembly (501) contains... The process gas supply pipe (5011), process gas filter (5012), process gas flow meter (5013), and process gas pneumatic diaphragm valve (5014) are connected in sequence. The compressed gas supply assembly (502) includes a compressed air assembly (503), a nitrogen assembly (504), and a valve island (505). The output ends of the compressed air assembly (503) and the nitrogen assembly (504) are connected to the input ends of the valve island (505). The output ends of the valve island (505) are respectively connected to the input ends of each pneumatic control interface of the processing chamber equipment (60).

2. The circuit arrangement rack of the IBE ion beam etching equipment as described in claim 1, characterized in that: The compressed air assembly (503) includes a compressed air supply pipe (5031), a compressed air manual diaphragm valve (5032), and a compressed air filter pressure reducing valve (5033) connected in sequence. The output end of the compressed air filter pressure reducing valve (5033) is connected to the input end of the valve island (505). Each output of the valve island (505) is connected to the input end of each pneumatic control interface of the processing chamber equipment (60).

3. The circuit arrangement rack of the IBE ion beam etching equipment as described in claim 1, characterized in that: The nitrogen assembly (504) includes a nitrogen supply pipe (5041), a nitrogen manual diaphragm valve (5042), and a nitrogen filter pressure reducing valve (5043) connected in sequence. The output end of the nitrogen filter pressure reducing valve (5043) is connected to the input end of the valve island (505). Each output of the valve island (505) is connected to the input end of each pneumatic control interface of the processing chamber equipment (60).

4. The circuit arrangement rack of the IBE ion beam etching equipment as described in claim 1, characterized in that: The liquid flow meter (405) is a digital flow meter with a remote output interface, which facilitates connection to the monitoring system for data acquisition and anomaly detection.

5. The circuit arrangement rack of the IBE ion beam etching equipment as described in claim 1, characterized in that: The manual ball valve (403) has a quick-opening valve body structure and is used to realize independent control and rapid start and stop of the liquid path of each processing chamber of the processing chamber equipment (60).

6. The circuit arrangement rack of the IBE ion beam etching equipment as described in claim 1, characterized in that: The process gas supply assembly (501) supplies at least one of argon, helium, and nitrogen.

7. The circuit arrangement rack of the IBE ion beam etching equipment as described in claim 1, characterized in that: The output pressure of the compressed air assembly (503) is precisely adjusted by the corresponding filter pressure reducing valve to meet the operating pressure requirements of the pneumatic mechanism of different chambers of the processing chamber equipment (60).

8. The circuit arrangement rack of the IBE ion beam etching equipment as described in claim 1, characterized in that: The liquid inlet chamber (402) is also equipped with a liquid distributor, which is used to perform isobaric diversion of the liquid from the liquid supply assembly (40) to improve the uniformity of liquid supply in each chamber of the processing chamber equipment (60).

9. The circuit arrangement rack of the IBE ion beam etching equipment as described in claim 1, characterized in that: Above the second layer (30) is a third layer (70), which is a reserved layer for backup structure.

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