An integrated circuit chip socket

Abstract

The utility model discloses an integrated circuit chip socket, specifically relates to socket technical field, including socket main part, socket main part top is equipped with multiple equal interval distribution's connecting hole, socket main part one side is equipped with air inlet, the air inlet inner wall is connected with two heat dissipation holes, two heat dissipation holes all with multiple connecting hole intercommunication, the air inlet is equipped with heat dissipation subassembly inside, heat dissipation subassembly includes frame board, the frame board is fixed in air inlet, the frame board inner wall is fixed with two heat dissipation fans, socket main part top both sides all are equipped with recess. The utility model discloses through air inlet and heat dissipation hole realizes the air circulation of socket main part inside, can improve integrated circuit chip pin's heat dissipation effect with the help of heat dissipation fan simultaneously, avoids integrated circuit chip pin heat too high and influences normal use, and can improve use security further, and utilizes first dust screen and second dust screen filtration, can avoid dust impurity influence heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of socket technology, and more specifically to an integrated circuit chip socket. Background Technology

[0002] An integrated circuit chip socket is an electronic component mounted on a circuit board for connecting and securing integrated circuit (IC) chips. It provides a convenient and reliable connection method, allowing IC chips to be easily inserted and removed for replacement or testing. Since integrated circuit chips have multiple pins, these pins are used to connect to the socket, thus enabling the chip to be inserted.

[0003] For example, an integrated circuit chip socket with prior art disclosure number CN221977917U uses a design of a support plate, a threaded sleeve, and a threaded post to move the integrated circuit chip by moving the support plate, so that the pins of the integrated circuit chip are disengaged from the connection hole, and the integrated circuit chip can be removed for replacement.

[0004] However, the existing technology described above still has the following problems in use: When the pins of traditional integrated circuit chips are inserted into the socket, a large amount of heat is generated due to signal transmission. Relying solely on the socket itself for heat dissipation will not only damage the integrated circuit chip but also affect the lifespan of the socket. Based on this, the present invention provides an integrated circuit chip socket with high heat dissipation efficiency. Utility Model Content

[0005] To overcome the aforementioned deficiencies in the prior art, this utility model provides an integrated circuit chip socket. By combining an air inlet and a heat dissipation hole, air circulation is achieved inside the socket body. At the same time, the cooling fan can improve the heat dissipation effect of the integrated circuit chip pins, preventing the integrated circuit chip pins from overheating and affecting normal use, thereby improving safety. Furthermore, the use of a first dustproof mesh and a second dustproof mesh can prevent dust and impurities from affecting the heat dissipation effect, thus solving the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an integrated circuit chip socket, comprising a socket body, wherein the top of the socket body has a plurality of equally spaced connection holes, and one side of the socket body has an air inlet, the inner wall of which is connected to two heat dissipation holes, both of which are connected to the plurality of connection holes. A heat dissipation assembly is provided inside the air inlet, the heat dissipation assembly including a frame plate fixed inside the air inlet, and two cooling fans fixedly mounted on the inner wall of the frame plate. These two cooling fans draw in outside air, thereby greatly improving the heat dissipation effect inside the socket body. Grooves are provided on both sides of the top of the socket body, and each of the two grooves contains a lifting block for connecting to an integrated circuit chip.

[0007] In a preferred embodiment, each of the two lifting blocks has a threaded hole at its top, and a threaded rod is threadedly connected to the threaded hole. The socket body has a storage groove on the side away from the air inlet, and a rotating rod is rotatably installed inside the storage groove. The rotating rod is connected to the two threaded rods through a bevel gear set. The turntable, rotating rod and bevel gear set drive the two threaded rods to rotate synchronously, thereby realizing the automatic separation of the integrated circuit chip from the socket body.

[0008] In a preferred embodiment, a turntable is fixedly provided at one end of the rotating rod. The turntable abuts against the inner wall of the storage groove by fastening bolts. By fixing the turntable with fastening bolts, it is possible to prevent the turntable from shaking and affecting the stability of the integrated circuit chip.

[0009] In a preferred embodiment, a rubber sealing strip is fixedly provided on the inner wall of each connection hole to fill the gap between the inner wall of the connection hole and the pin of the integrated circuit chip. The rubber sealing strip is soft and can improve the sealing between the pin and the connection hole, and can prevent the pin from being corroded to a certain extent.

[0010] In a preferred embodiment, a metal heat-conducting block is fixed inside each of the two heat dissipation holes. The metal heat-conducting block is in contact with the pins of the integrated circuit chip and conducts heat from the pins of the integrated circuit chip, thereby improving the heat dissipation effect of the integrated circuit chip.

[0011] In a preferred embodiment, a first dustproof net is fixedly installed inside the frame plate, and a second dustproof net is fixedly installed inside each of the two heat dissipation holes. The first dustproof net can filter the outside air to prevent dust and impurities from contaminating the metal heat-conducting block and affecting the heat dissipation effect, while the second dustproof net can play a filtering role in the heat dissipation holes to prevent dust and impurities from directly entering the heat dissipation holes.

[0012] The technical effects and advantages of this utility model are as follows:

[0013] 1. This utility model achieves air circulation inside the socket body by combining the air inlet and heat dissipation hole. At the same time, the air circulation speed is increased by the cooling fan, which can improve the heat dissipation effect of the integrated circuit chip pins, avoid the integrated circuit chip pins getting too hot and affecting normal use, and thus improve the safety of use. Furthermore, the first and second dustproof meshes can be used to filter dust and impurities to prevent them from affecting the heat dissipation effect.

[0014] 2. The turntable, rotating rod, and bevel gear set drive the two threaded rods to rotate synchronously. The lifting block slides upward from the groove under the drive of the threaded rod, and drives the integrated circuit chip to rise together, realizing the automatic separation of the integrated circuit chip pins from the socket body. This avoids the pins being offset and damaged when the integrated circuit chip is manually disassembled, thereby improving the service life of the integrated circuit chip pins. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram showing the separation of the integrated circuit chip and the socket body of this utility model;

[0017] Figure 3 This is a schematic diagram showing the separation of the frame plate and the socket body of this utility model;

[0018] Figure 4 This is a bottom view of the socket body of this utility model;

[0019] Figure 5 This is a cross-sectional view of the socket body of this utility model.

[0020] The attached diagram is labeled as follows: 1. Socket body; 2. Connection hole; 3. Air inlet; 4. Heat dissipation hole; 5. Heat dissipation component; 51. Frame plate; 52. Cooling fan; 6. Groove; 7. Integrated circuit chip; 8. Lifting block; 9. Threaded hole; 10. Threaded rod; 11. Storage slot; 12. Rotating rod; 13. Bevel gear set; 14. Turntable; 15. Fastening bolt; 16. Rubber sealing strip; 17. Metal heat-conducting block; 18. First dustproof net; 19. Second dustproof net. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Refer to the instruction manual appendix Figures 1-5This utility model provides an integrated circuit chip socket, including a socket body 1. The top of the socket body 1 has a plurality of equally spaced connection holes 2. The side of the socket body 1 has an air inlet 3. The inner wall of the air inlet 3 is connected to two heat dissipation holes 4, and both heat dissipation holes 4 are connected to the plurality of connection holes 2. The air inlet 3 is provided with a heat dissipation component 5. The heat dissipation component 5 includes a frame plate 51. The frame plate 51 is fixed in the air inlet 3 by bolts. The inner wall of the frame plate 51 is fixed with two cooling fans 52 by bolts. The two cooling fans 52 draw in outside air, thereby greatly improving the heat dissipation effect inside the socket body 1.

[0023] The frame plate 51 is fitted with a first dustproof net 18 by bolts, and the two heat dissipation holes 4 are fitted with second dustproof nets 19 by bolts. The first dustproof net 18 can filter the outside air to prevent dust and impurities from contaminating the metal heat-conducting block 17, while the second dustproof net 19 can filter the heat dissipation holes 4 to prevent dust and impurities from directly entering the heat dissipation holes 4.

[0024] In actual use, the motors in the two cooling fans 52 drive the fan blades to rotate, drawing in outside air. The outside air is filtered by the first dustproof mesh 18 inside the frame plate 51 and then delivered to the two heat dissipation holes 4 through the air inlet 3. It is then discharged from one end of the heat dissipation hole 4. When the air flows in the heat dissipation hole 4, it blows the heat on the metal heat-conducting block 17 to dissipate the heat. The heat of the integrated circuit chip 7 pins is conducted to the metal heat-conducting block 17 for heat dissipation. This can prevent the integrated circuit chip 7 and its pins from getting too hot and affecting normal use, thereby improving the safety of the integrated circuit chip 7 and the socket body 1. Furthermore, when it is necessary to disassemble the integrated circuit chip 7, the operator only needs to loosen the bolts between the integrated circuit chip 7 and the lifting block 8 to complete the disassembly of the integrated circuit chip 7, which is very quick and easy.

[0025] Refer to the instruction manual appendix Figure 4 and Figure 5 The socket body 1 has grooves 6 on both sides of its top. Each groove 6 has a lifting block 8 for connecting to the integrated circuit chip 7. Each lifting block 8 has a threaded hole 9 on its top. A threaded rod 10 is threaded into the threaded hole 9. The socket body 1 has a storage groove 11 on the side away from the air inlet 3. A rotating rod 12 is rotatably installed inside the storage groove 11. The rotating rod 12 is connected to the two threaded rods 10 through a bevel gear set 13. A turntable 14 is fixed at one end of the rotating rod 12. The turntable 14 abuts against the inner wall of the storage groove 11 through a fastening bolt 15.

[0026] The operator rotates the turntable 14 and the rotating rod 12. The rotating rod 12 drives the two threaded rods 10 to rotate synchronously through two bevel gear sets 13. The lifting block 8 slides upward from the groove 6 under the drive of the threaded rod 10, and drives the integrated circuit chip 7 to rise together. This causes multiple pins at the bottom of the integrated circuit chip 7 to automatically separate from multiple connection holes 2, avoiding pin displacement damage when manually disassembling the integrated circuit chip 7, thereby improving the service life of the integrated circuit chip 7 pins.

[0027] And, as Figure 2 As shown, a rubber sealing strip 16 is fixedly provided on the inner wall of each connection hole 2 to fill the gap between the inner wall of the connection hole 2 and the pin of the integrated circuit chip 7. At the same time, the rubber sealing strip 16 is soft in texture. When the pin of the integrated circuit chip 7 is inserted into the connection hole 2, the pin can squeeze the rubber sealing strip 16 to keep it tightly fitted, thereby improving the sealing between the pin and the connection hole 2, and thus preventing the pin of the integrated circuit chip 7 from being corroded to a certain extent.

[0028] In conclusion, the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An integrated circuit chip socket, comprising a socket body (1), a plurality of equidistantly distributed connecting holes (2) are formed on the top of the socket body (1), characterized in that: The socket body (1) has an air inlet (3) on one side. The inner wall of the air inlet (3) is connected to two heat dissipation holes (4). Both heat dissipation holes (4) are connected to multiple connection holes (2). The air inlet (3) is provided with a heat dissipation component (5), which includes a frame plate (51). The frame plate (51) is fixed inside the air inlet (3), and two cooling fans (52) are fixedly provided on the inner wall of the frame plate (51). The socket body (1) has grooves (6) on both sides of the top, and each groove (6) has a lifting block (8) for connecting to the integrated circuit chip (7).

2. An integrated circuit chip socket according to claim 1, wherein: Both lifting blocks (8) have threaded holes (9) on their tops. Threaded rods (10) are threaded into the threaded holes (9). A storage groove (11) is provided on the side of the socket body (1) away from the air inlet (3). A rotating rod (12) is rotatably provided inside the storage groove (11). The rotating rod (12) is connected to the two threaded rods (10) through a bevel gear set (13).

3. An integrated circuit chip socket according to claim 2, wherein: One end of the rotating rod (12) is fixedly provided with a turntable (14), and the turntable (14) abuts against the inner wall of the storage groove (11) by fastening bolts (15).

4. The integrated circuit chip socket of claim 1, wherein: Each connection hole (2) is fixedly provided with a rubber sealing strip (16) on its inner wall to fill the gap between the inner wall of the connection hole (2) and the pin of the integrated circuit chip (7).

5. The integrated circuit chip socket of claim 1, wherein: Both heat dissipation holes (4) are fixedly provided with metal heat-conducting blocks (17), which are in contact with the pins of the integrated circuit chip (7).

6. The integrated circuit chip socket of claim 1, wherein: The frame plate (51) is fixedly provided with a first dustproof net (18), and the two heat dissipation holes (4) are both fixedly provided with a second dustproof net (19).

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