Circuit board processing device

Abstract

This utility model belongs to the field of circuit board processing technology and discloses a circuit board processing device, which includes a processing cylinder, a spray assembly, a vibrating plate, and a driving component. The processing cylinder has a processing space for containing processing liquid and a workpiece to be processed; the spray assembly is disposed within the processing space and is used to spray processing liquid toward the workpiece; the vibrating plate is movably connected between the spray assembly and the workpiece and has a through hole; the driving component is disposed on the vibrating plate and movably connected to the processing cylinder through a shock-absorbing assembly. The driving component drives the vibrating plate to vibrate, thereby promoting the flow of processing liquid within the processing space. Therefore, when this circuit board processing device is in use, the driving component can drive the vibrating plate to vibrate within a large amplitude range, providing a good stirring effect on the processing liquid, making the ion distribution in the processing liquid more uniform, and ensuring sufficient contact between the processing liquid and the workpiece, which is beneficial to improving the overall quality and performance of the workpiece.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a circuit board processing device. Background Technology

[0002] In the electronics manufacturing industry, circuit board processing is a crucial step in ensuring its performance and quality. As electronic products rapidly evolve towards higher precision, higher performance, and miniaturization, circuit board structures are becoming increasingly complex, placing ever more stringent demands on processing techniques. Whether it's cleaning, etching, or electroplating processes during circuit board production, or subsequent maintenance and repair, efficient, uniform, and reliable processing equipment is essential to ensure that the processing solution fully penetrates the circuit board surface and its internal microstructures, achieving ideal processing results and meeting the ever-increasing performance standards of electronic products.

[0003] In existing technologies, the processing tank mainly includes a tank body, a spray structure, and a vibration structure. The tank body provides a closed or semi-closed space for the entire processing, used to contain the processing liquid and place the circuit boards to be processed. The spray structure is installed at specific locations inside the tank body and typically consists of multiple nozzles and a corresponding piping system. It can uniformly spray the processing liquid onto the circuit board surface at a certain pressure and flow rate, ensuring sufficient contact between the processing liquid and the circuit board to achieve the initial processing effect. The vibration structure generally uses a vibration motor as a power source. The motor's vibration drives the processing tank or specific components within the tank to vibrate, thereby improving the coverage and uniformity of the processing liquid on various parts of the circuit board.

[0004] However, the stability of the processing cylinder itself needs to be considered during vibration. Therefore, the amplitude generated by this vibration structure is relatively small. The small amplitude cannot make the processing liquid flow fully and vigorously in the cylinder, resulting in insufficient relative movement between the processing liquid and the circuit board. This makes it difficult to penetrate into the tiny pores and complex structures of the circuit board, thus causing uneven processing and unsatisfactory processing effects in some areas, affecting the overall quality and performance stability of the circuit board. Utility Model Content

[0005] The purpose of this invention is to provide a circuit board processing device that solves the problem in the prior art where, during the processing of circuit boards, the vibration amplitude generated is small due to the need for the vibration structure to take into account the stability of the cylinder itself, resulting in the processing liquid being difficult to distribute evenly in the cylinder, insufficient contact between the processing liquid and the circuit board, poor processing effect, and reduced quality and performance of the circuit board.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] Circuit board processing apparatus, comprising:

[0008] A processing tank has a processing space that contains processing liquid and parts to be processed;

[0009] A spray assembly is disposed within the processing space and is used to spray processing liquid toward the workpiece to be processed;

[0010] A vibrating plate is movably connected between the spray assembly and the workpiece to be treated and has through holes;

[0011] A driving component is disposed on the vibrating plate and movably connected to the processing cylinder through a shock-absorbing assembly. The driving component is used to drive the vibrating plate to vibrate, thereby promoting the flow of the processing liquid in the processing space.

[0012] Optionally, the shock absorption assembly includes:

[0013] The first connecting part is fixedly connected to the vibrating plate;

[0014] The second connecting part is fixedly connected to the processing cylinder;

[0015] An elastic connecting portion is connected to the first connecting portion and the second connecting portion respectively, so that the first connecting portion and the second connecting portion can move relative to each other.

[0016] Optionally, the shock absorption assembly further includes:

[0017] A guide portion is inserted through the first connecting portion and is floatingly connected to the first connecting portion;

[0018] A limiting part is fixedly connected to the processing cylinder and sleeved with the guide part, and the guide part is movably connected to the limiting part.

[0019] Optionally, multiple shock-absorbing components are arranged at intervals.

[0020] Optionally, the circuit board processing apparatus further includes:

[0021] A connecting seat, one end of which is fixedly connected to the vibrating plate, and the other end extending to the upper side wall of the processing cylinder; the driving component is disposed on the side of the connecting seat away from the vibrating plate; and the shock-absorbing assembly is fixedly connected to the connecting seat; and / or,

[0022] A fixed base is provided on the processing cylinder, and multiple shock-absorbing components are provided on the fixed base.

[0023] Optionally, the circuit board processing apparatus further includes:

[0024] A mounting base is disposed on the bottom wall of the processing space, and the top wall of the mounting base has a sliding groove, in which the lower side of the vibrating plate is slidably connected.

[0025] Optionally, the spray assembly has a plurality of nozzles for spraying liquid, and the vibrating plate has a through hole at the position corresponding to each of the nozzles.

[0026] Optionally, the spray assembly includes:

[0027] Multiple spray pipes spaced apart, each of which has multiple nozzles spaced apart;

[0028] A diversion pipe is connected to a plurality of the spray pipes to direct the treatment liquid into each of the spray pipes.

[0029] Optionally, two spraying assemblies are spaced apart, and the object to be treated is located between the two spraying assemblies.

[0030] Optionally, the circuit board processing apparatus further includes:

[0031] The inlet pipe has one end connected to the injection device and the other end provided with a distribution pipe, the two ends of which are respectively connected to one of the spray components.

[0032] The beneficial effects of this utility model are:

[0033] After the workpiece is placed into the processing space, the spray assembly sprays out the processing liquid. The processing liquid can be sprayed onto the workpiece through the through holes of the vibrating plate. During the spraying process, the drive unit drives the vibrating plate to vibrate back and forth. As the distance between the vibrating plate and the spray assembly changes, the amount of processing liquid that can pass through the through holes also changes. The movement of the vibrating plate itself further agitates the processing liquid, causing it to circulate within the processing space. This makes the ion distribution in the processing liquid more uniform, allowing the processing liquid to fully contact the workpiece. The vibration generated by the drive unit itself is directly transmitted to the damping assembly, which buffers the vibration so that it is not transmitted to the processing cylinder or the intensity of the vibration transmitted to the processing cylinder is low. Therefore, when using this circuit board processing device, compared to traditional small-amplitude vibration motors, the driving component can drive the vibrating plate to vibrate within a larger range. The stronger vibration impact can be buffered by the shock absorption component to ensure the stability of the processing cylinder itself. The large-amplitude movement of the vibrating plate, combined with the through-hole design, provides a better stirring effect for the processing liquid, thereby improving the circulation effect of the processing liquid in the processing space. This results in a more uniform ion distribution in the processing liquid and ensures that the processing liquid is in full contact with the workpiece to be processed. The processing liquid can then penetrate into the tiny pores and auxiliary structures inside the workpiece to be processed, ensuring uniform and satisfactory processing results. This effectively reduces the possibility of poor processing results in some areas and helps to improve the overall quality and performance of the workpiece to be processed. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the circuit board processing device in an embodiment of this utility model;

[0035] Figure 2 This is an exploded structural diagram of the circuit board processing device in an embodiment of this utility model;

[0036] Figure 3 This is a schematic diagram of the structure of the driving component and the shock absorption assembly in the embodiment of this utility model;

[0037] Figure 4 This is a front view of the vibrating plate of the circuit board processing device in an embodiment of this utility model;

[0038] Figure 5 This is a rear view of the vibrating plate of the circuit board processing device in an embodiment of this utility model;

[0039] Figure 6 This is a front view of the spray assembly of the circuit board processing device in an embodiment of this utility model;

[0040] Figure 7 This is a side view of the spray assembly of the circuit board processing device in an embodiment of this utility model.

[0041] In the picture:

[0042] 1. Processing cylinder; 11. Processing space; 2. Spray assembly; 21. Nozzle; 22. Spray pipe; 23. Diverter pipe; 24. Inlet pipe; 25. Diverter pipe; 3. Vibrating plate; 31. Through hole; 4. Drive component; 41. Connecting seat; 5. Mounting seat; 51. Slide groove; 6. Item to be processed; 7. Shock absorption assembly; 71. First connecting part; 72. Second connecting part; 73. Elastic connecting part; 74. Guide part; 75. Limiting part; 8. Fixing seat. Detailed Implementation

[0043] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0044] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0045] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0046] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0047] This utility model discloses a circuit board processing device.

[0048] Reference Figures 1 to 5 The circuit board processing device includes a processing cylinder 1, a spray assembly 2, a vibrating plate 3, and a driving component 4. The processing cylinder 1 has a processing space 11 for containing processing liquid and a workpiece 6 to be processed; the spray assembly 2 is disposed in the processing space 11 and is used to spray processing liquid toward the workpiece 6 to be processed; the vibrating plate 3 is disposed on the vibrating plate 3 and is movably connected to the processing cylinder 1 through a shock-absorbing assembly 7; the driving component 4 is used to drive the vibrating plate 3 to vibrate, thereby promoting the flow of processing liquid in the processing space 11.

[0049] Specifically, the processing cylinder 1 is hollow inside as a processing space 11, and a sealing plate (not shown in the figure) is provided on the outside to make the processing space 11 a sealed space to contain the processing liquid. The workpiece 6 to be processed can be a circuit board or other structures. The workpiece 6 to be processed can be clamped and fixed in the processing space 11 by a structure such as a robotic arm, or a positioning seat or other structure can be provided in the processing space 11 to fix the workpiece 6 to be processed.

[0050] The component 6 to be processed can be a circuit board or other products processed in a solution. Spray assemblies 2 can be installed on one or both sides of the component 6 to spray the corresponding processing liquid to treat it. The spray assembly 2 can extend vertically and be fixed within the processing space 11 to correspond to the component 6. Multiple drainage structures are provided on the spray assembly 2 to spray the processing liquid onto the component 6. The spray assembly 2 can also extend horizontally and slide vertically, also spraying the processing liquid onto the component 6. The specific arrangement of the spray assembly 2 can be designed according to the actual installation space.

[0051] A vibrating plate 3 is installed between the spray assembly 2 and the workpiece 6 to be treated. Multiple through holes 31 are formed on its surface to allow the treatment liquid to pass through. The vibrating plate 3 is not fixed within the treatment space 11, allowing it to move. The driving component 4 is a vibration motor, which is fixedly connected to the vibrating plate 3 and connected to the treatment cylinder 1 via a shock-absorbing assembly 7. The shock-absorbing assembly 7 can be an elastic pad, spring, or other structure with vibration buffering effect, allowing the driving component 4 to move the vibrating plate 3 during operation. The resulting vibration is mitigated by the shock-absorbing assembly 7, ensuring the stability of the treatment cylinder 1.

[0052] After the workpiece 6 is placed into the processing space 11, the spray assembly 2 sprays out the processing liquid. The processing liquid can be sprayed onto the workpiece 6 through the through hole 31 of the vibrating plate 3. During the spraying process, the driving component 4 drives the vibrating plate 3 to vibrate back and forth. As the distance between the vibrating plate 3 and the spray assembly 2 changes, the amount of processing liquid that can pass through the through hole 31 also changes. The movement of the vibrating plate 3 further agitates the processing liquid, causing it to circulate within the processing space 11. This makes the ion distribution in the processing liquid more uniform, allowing the processing liquid to fully contact the workpiece 6. The vibration generated by the driving component 4 is directly transmitted to the damping component 7. The damping component 7 can buffer the vibration so that the vibration is not transmitted to the processing cylinder 1 or the intensity of the vibration transmitted to the processing cylinder 1 is low. Therefore, when this circuit board processing device is in use, compared with the traditional small-amplitude vibration motor, the driving component 4 can drive the vibrating plate 3 to vibrate within a larger range. The strong vibration impact can be buffered by the shock absorption component 7 to ensure the stability of the processing cylinder 1 itself. The large-amplitude movement of the vibrating plate 3, combined with the setting of the through hole 31, has a good stirring effect on the processing liquid, thereby improving the circulation effect of the processing liquid in the processing space 11, making the ion distribution in the processing liquid more uniform, and also ensuring that the processing liquid is in full contact with the workpiece 6 to be processed. Thus, the processing liquid can penetrate into the tiny pores and auxiliary structures inside the workpiece 6 to be processed, ensuring that the processing effect is uniform and meets the requirements, effectively reducing the possibility of poor processing effect in some areas, and helping to improve the overall quality and performance of the workpiece 6 to be processed.

[0053] Optionally, the shock absorption assembly 7 includes a first connecting portion 71, a second connecting portion 72, and an elastic connecting portion 73. The first connecting portion 71 is fixedly connected to the vibrating plate 3; the second connecting portion 72 is fixedly connected to the processing cylinder 1; and the elastic connecting portion 73 is connected to the first connecting portion 71 and the second connecting portion 72 respectively so that the first connecting portion 71 and the second connecting portion 72 can move relative to each other.

[0054] Specifically, both the first connecting part 71 and the second connecting part 72 are cubic in shape, such as a long strip plate, and their size is adapted to the corresponding connecting structure. The first connecting part 71 is located on the upper side of the second connecting part 72. The first connecting part 71 is fixedly connected to the vibrating plate 3 and the driving component 4, while the second connecting part 72 is fixed on the side wall of the processing cylinder 1. The fixing method can be bolt connection, bonding or welding, etc.

[0055] An elastic connecting portion 73 can be provided between the first connecting portion 71 and the second connecting portion 72. The elastic connecting portion 73 can be an elastic rod or a spring. In this embodiment, the elastic connecting portion 73 is a spring, and the spring extends along the length direction of the first connecting portion 71. Multiple connecting holes are spaced apart on both the first connecting portion 71 and the second connecting portion 72, and the spring passes through the multiple connecting holes in sequence to open the first connecting portion 71 and the second connecting portion 72. In other embodiments, the elastic connecting portion 73 can extend vertically or obliquely, and it can also open the first connecting portion 71 and the second connecting portion 72. This application does not limit this.

[0056] The second connecting part 72 is fixedly connected to the processing cylinder 1, and the first connecting part 71 is supported by the elastic connecting part 73, so that the two are separated. When the driving component 4 starts to run and generates vibration, the vibration is transmitted from the first connecting part 71 to the elastic connecting part 73. The elastic connecting part 73 can follow the vibration and generate a certain amplitude of elastic deformation, thereby buffering the vibration. The vibration intensity transmitted to the second connecting part 72 is small, thus ensuring that the processing cylinder 1 has good stability.

[0057] Optionally, the shock absorption assembly 7 further includes a guide portion 74 and a limiting portion 75. The guide portion 74 passes through the first connecting portion 71 and is floatingly connected to the first connecting portion 71; the limiting portion 75 is fixedly connected to the processing cylinder 1 and sleeved with the guide portion 74, and the guide portion 74 and the limiting portion 75 are movably connected.

[0058] Specifically, the limiting part 75 can be a bolt, which forms a threaded connection with the processing cylinder 1. The upper end of the limiting part 75 passes through the second connecting part 72 and the first connecting part 71 in sequence. A guide part 74 is sleeved on the part corresponding to the limiting part 75 and the first connecting part 71. The inner diameter of the guide part 74 is larger than the outer diameter of the limiting part 75, so that the guide part 74 and the limiting part 75 can move relative to each other, thereby forming a floating connection. A guide hole is provided on the first connecting part 71. The diameter of the guide hole is larger than the outer diameter of the guide part 74, so that the guide part 74 and the first connecting part 71 can also form a floating connection.

[0059] By providing guide portion 74 and limiting portion 75, when the first connecting portion 71 moves with the operation of the driving member 4, it can be limited by the cooperation of guide portion 74 and limiting portion 75, ensuring that the movement range of the first connecting portion 71 is kept within a certain range, reducing the possibility of the first connecting portion 71 disengaging from the elastic connecting portion 73. In order to improve the limiting effect, multiple guide portions 74 and limiting portions 75 can be provided at intervals on the first connecting portion 71. In this embodiment, a guide portion 74 and a limiting portion 75 are respectively provided at both ends of the first connecting portion 71 along the length direction.

[0060] Optionally, multiple shock-absorbing components 7 are arranged at intervals.

[0061] Specifically, multiple shock-absorbing components 7 are arranged at intervals according to the actual installation space to enhance the shock absorption effect. In this embodiment, two shock-absorbing components 7 can be arranged at intervals.

[0062] To provide sufficient installation space for the multiple shock absorbers 7, the circuit board processing device also includes a connecting seat 41 and a fixing seat 8. One end of the connecting seat 41 is fixedly connected to the vibrating plate 3, and the other end extends to the upper side wall of the processing cylinder 1. The driving component 4 is disposed on the side of the connecting seat 41 away from the vibrating plate 3, and the shock absorbers 7 are fixedly connected to the connecting seat 41. The fixing seat 8 is disposed on the processing cylinder 1, and the multiple shock absorbers 7 are disposed on the fixing seat 8.

[0063] Specifically, the connecting seat 41 is plate-shaped, and can be composed of multiple plate-shaped structures, or a single plate-shaped structure can be formed by bending a portion of it. One end of the connecting seat 41 is fixedly connected to the vibrating plate 3, and the other end extends horizontally to the top of the side wall of the processing cylinder 1. The driving component 4 is fixed to the top wall of the connecting seat 41. The first connecting portions 71 of the multiple shock-absorbing components 7 are all fixedly connected to the connecting seat 41.

[0064] The fixing seat 8 is located below the connecting seat 41, forming a space between them for installing multiple shock-absorbing components 7. The fixing seat 8 includes a fixing plate and a fixing block. The fixing plate is elongated, and the second connecting portions 72 of multiple shock-absorbing components 7 are fixedly connected to the fixing plate. The fixing block is fixed to the lower side of the fixing plate and is fixedly connected to the side wall of the processing cylinder 1. The fixed connections mentioned above can all be achieved by bolting, snap-fitting, welding, or bonding, etc., and this application does not specifically limit them.

[0065] Optionally, the circuit board processing device also includes a mounting base 5. The mounting base 5 is disposed on the bottom wall of the processing space 11, and the top wall of the mounting base 5 has a groove 51, in which the lower side of the vibrating plate 3 is slidably connected.

[0066] Specifically, the mounting base 5 can be fixed to the bottom wall of the treatment space 11 by welding or bolting. A U-shaped groove 51 is formed by recessing the top wall of the mounting base 5. The lower side of the vibrating plate 3 is inserted into the groove 51, and the bottom wall of the vibrating plate 3 is in surface contact with the bottom wall of the groove 51. To save space, two mounting bases 5 can be spaced apart, instead of being long and narrow. The two mounting bases 5 are located on opposite sides of the vibrating plate 3, and the mounting bases 5 are made of corrosion-resistant material to ensure they do not react with the treatment liquid.

[0067] By setting the mounting base 5 and the slide groove 51, the lower side of the vibrating plate 3 is inserted into the slide groove 51 to limit the sliding direction of the vibrating plate 3, ensure that the vibrating plate 3 remains stable during the sliding process, and reduce the possibility of the vibrating plate 3 becoming skewed.

[0068] Reference Figure 6 and Figure 7 Optionally, the spray assembly 2 has multiple nozzles 21 for spraying liquid, and the vibrating plate 3 has through holes 31 at the position corresponding to each nozzle 21.

[0069] Specifically, the vibrating plate 3 has a plate-like structure, the shape of which is adapted to the shape of the circuit board to be processed 6. Multiple through holes 31 are formed on its surface, and each through hole 31 corresponds to a nozzle 21. This allows at least a portion of the processing liquid sprayed by the nozzle 21 to be sprayed onto the workpiece 6 through the through hole 31. The arrangement of multiple through holes 31 and nozzles 21 ensures that a sufficient amount of processing liquid directly contacts each area of ​​the workpiece 6, thereby reducing the time spent in the processing and improving the processing efficiency.

[0070] Optionally, the spray assembly 2 includes a plurality of spray pipes 22 spaced apart. Each spray pipe 22 has a plurality of nozzles 21 spaced apart.

[0071] Specifically, the distribution of multiple spray pipes 22 can be determined according to the shape of the workpiece 6 to be treated. For example, they can be distributed at intervals along the length or width of the workpiece 6. Each spray pipe 22 can be connected to a liquid injection system to inject different types of treatment liquid according to the treatment requirements. Alternatively, multiple spray pipes 22 can be connected to a single liquid injection system to increase the spray volume of the treatment liquid. On each spray pipe 22, multiple nozzles 21 can be distributed at intervals along its axial direction to increase the spray range of the treatment liquid, allowing the treatment liquid to quickly cover the entire side of the workpiece 6 to be treated, thereby further improving the treatment efficiency and quality.

[0072] Optionally, the spray assembly 2 also includes a diversion pipe 23. The diversion pipe 23 is connected to a plurality of spray pipes 22 to guide the treatment liquid into each spray pipe 22.

[0073] Specifically, a diversion pipe 23 is provided at the lower end of multiple spray pipes 22. The diversion pipe 23 is connected to the liquid injection system. The liquid injection system first injects the treatment liquid into the diversion pipe 23 and gradually sends the treatment liquid into each spray pipe 22 so that the multiple spray pipes 22 can spray the treatment liquid evenly, thereby ensuring that each area of ​​the workpiece 6 to be treated can form sufficient contact with the treatment liquid.

[0074] Optionally, two spraying components 2 are spaced apart, with the object to be treated 6 located between the two spraying components 2.

[0075] Specifically, a spray assembly 2 is provided on both the front and back of the workpiece 6 to be treated. One or two vibrating plates 3 can be provided; this invention does not limit the specific installation. By providing two spray assemblies 2, the treatment liquid can be sprayed simultaneously from both sides of the workpiece 6, allowing the treatment liquid to quickly reach the specified amount, thereby further shortening the processing time.

[0076] Optionally, the circuit board processing device further includes a liquid inlet pipe 24, one end of which is connected to a liquid injection device, and the other end is provided with a liquid distribution pipe 25. Each end of the liquid distribution pipe 25 is connected to a spray assembly 2. The liquid distribution pipe 25 is connected to the middle of the spray assembly 2.

[0077] Specifically, a vertically extending inlet pipe 24 is installed between the two spray components 2. The lower end of the inlet pipe 24 is connected to the injection device, and the upper end is provided with a distribution pipe 25. The middle part of the distribution pipe 25 is connected to the inlet pipe 24, and both ends of the distribution pipe 25 are connected to the diversion pipe 23 of one of the spray components 2, with the connection positions close to the middle of the diversion pipe 23. Therefore, when the treatment liquid is injected through the inlet pipe 24, it can be evenly separated in the distribution pipe 25 and flow into the corresponding diversion pipe 23, and then evenly injected into each spray pipe 22 by the diversion pipe 23. This allows the two spray components 2 to spray the treatment liquid evenly, ensuring that the treatment liquid is evenly distributed in the treatment space 11, thereby improving the treatment effect on the workpiece 6.

[0078] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A circuit board processing apparatus, characterized in that, include: The processing cylinder (1) has a processing space (11) for containing the processing liquid and the workpiece (6) to be processed; A spray assembly (2) is disposed within the processing space (11) and is used to spray processing liquid toward the workpiece (6) to be processed; A vibrating plate (3) is movably connected between the spray assembly (2) and the workpiece to be treated (6) and has a through hole (31); A drive member (4) is disposed on the vibrating plate (3) and is movably connected to the processing cylinder (1) through a shock-absorbing assembly (7). The drive member (4) is used to drive the vibrating plate (3) to vibrate, thereby promoting the flow of the processing liquid in the processing space (11).

2. The circuit board processing apparatus according to claim 1, characterized in that, The shock absorption assembly (7) includes: The first connecting part (71) is fixedly connected to the vibrating plate (3); The second connecting part (72) is fixedly connected to the processing cylinder (1); The elastic connecting part (73) is connected to the first connecting part (71) and the second connecting part (72) respectively so that the first connecting part (71) and the second connecting part (72) can move relative to each other.

3. The circuit board processing apparatus according to claim 2, characterized in that, The shock absorption assembly (7) also includes: The guide part (74) passes through the first connecting part (71) and is floatingly connected to the first connecting part (71); The limiting part (75) is fixedly connected to the processing cylinder (1) and sleeved with the guide part (74), and the guide part (74) is movably connected with the limiting part (75).

4. The circuit board processing apparatus according to claim 1, characterized in that, Multiple shock-absorbing components (7) are spaced apart.

5. The circuit board processing apparatus according to claim 4, characterized in that, The circuit board processing device further includes: A connecting seat (41) is fixedly connected at one end to the vibrating plate (3) and at the other end extends to the upper side wall of the processing cylinder (1). The driving member (4) is disposed on the side of the connecting seat (41) away from the vibrating plate (3). The damping assembly (7) is fixedly connected to the connecting seat (41); and / or, A fixed base (8) is provided on the processing cylinder (1), and multiple shock-absorbing components (7) are provided on the fixed base (8).

6. The circuit board processing apparatus according to claim 1, characterized in that, The circuit board processing device further includes: The mounting base (5) is disposed on the bottom wall of the processing space (11). The top wall of the mounting base (5) has a groove (51), and the lower side of the vibrating plate (3) is slidably connected to the groove (51).

7. The circuit board processing apparatus according to claim 1, characterized in that, The spray assembly (2) has a plurality of nozzles (21) for spraying liquid, and the vibrating plate (3) has a through hole (31) at the position corresponding to each of the nozzles (21).

8. The circuit board processing apparatus according to claim 1, characterized in that, The spray assembly (2) includes: Multiple spray pipes (22) are spaced apart, and each spray pipe (22) has multiple nozzles (21) spaced apart; A diversion pipe (23) is connected to a plurality of the spray pipes (22) to guide the treatment liquid into each of the spray pipes (22).

9. The circuit board processing apparatus according to claim 6, characterized in that, Two spraying components (2) are spaced apart, and the object to be processed (6) is located between the two spraying components (2).

10. The circuit board processing apparatus according to claim 1, characterized in that, The circuit board processing device further includes: The liquid inlet pipe (24) is connected at one end to the liquid injection device and at the other end to a liquid distribution pipe (25). The two ends of the liquid distribution pipe (25) are respectively connected to one of the spray components (2).

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